LZ9-00WW00-0430 [ETC]

LED WARM WHITE 3000K 82CRI 24SMD;
LZ9-00WW00-0430
型号: LZ9-00WW00-0430
厂家: ETC    ETC
描述:

LED WARM WHITE 3000K 82CRI 24SMD

文件: 总21页 (文件大小:1410K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Luminous Efficacy  
Warm White LED Emitter  
LZ9-00WW00  
Key Features  
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High Luminous Efficacy, Warm White LED  
Can dissipate up to 20W  
Ultra-small foot print 7.0mm x 7.0mm  
Surface mount ceramic package with integrated glass lens  
Low Thermal Resistance (1.3°C/W)  
Very high Luminous Flux density  
JEDEC Level 1 for Moisture Sensitivity Level  
Autoclave complaint (JEDEC JESD22-A102-C)  
Lead (Pb) free and RoHS compliant  
Reflow solderable (up to 6 cycles)  
Emitter available on MCPCB (optional)  
Full suite of TIR secondary optics family available  
Part Number Options  
Base part number  
Part number  
Description  
LZ9-00WW00-xxxx  
LZ9-J0WW00-xxxx  
9-die emitter CRI 80 minimum  
9-die emitter CRI 80 minimum on Star MCPCB in 1x9 electrical configuration  
LZ9-M0WW00-xxxx 9-die emitter CRI 80 minimum on Star MCPCB in 3x3 electrical configuration  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Bin Kit Option Codes  
2700K CRI 80 Minimum  
Min  
Kit number  
flux  
Color Bin Ranges  
Description  
suffix  
Bin  
8A1, 8A2, 8B1, 8B2, 8A4, 8A3, 8B4, 8B3, 8D1, 8D2,  
8C1, 8C2, 8D4, 8D3, 8C4, 8C3  
0027  
0227  
0427  
X
X
X
full distribution flux; 2700K ANSI CCT bin  
full distribution flux; 2700K ANSI CCT half  
bin  
full distribution flux; 2700K ANSI CCT  
quarter bin  
8A2, 8B1, 8A3, 8B4, 8D2, 8C1, 8D3, 8C4  
8A3, 8B4, 8D2, 8C1  
3000K-3500K CRI 80 Minimum  
Min  
flux  
Bin  
Kit number  
Color Bin Ranges  
Description  
suffix  
0030  
0230  
7A1, 7A2, 7B1, 7B2, 7A4, 7A3, 7B4, 7B3, 7D1, 7D2,  
7C1, 7C2, 7D4, 7D3, 7C4, 7C3  
X
full distribution flux; 3000K ANSI CCT bin  
full distribution flux; 3000K ANSI CCT half  
bin  
full distribution flux; 3000K ANSI CCT  
quarter bin  
7A2, 7B1, 7A3, 7B4, 7D2, 7C1, 7D3, 7C4  
7A3, 7B4, 7D2, 7C1  
X
0430  
0035  
0235  
X
X
X
6A1, 6A2, 6B1, 6B2, 6A4, 6A3, 6B4, 6B3, 6D1, 6D2,  
6C1, 6C2, 6D4, 6D3, 6C4, 6C3  
full distribution flux; 3500K ANSI CCT bin  
full distribution flux; 3500K ANSI CCT half  
bin  
full distribution flux; 3500K ANSI CCT  
quarter bin  
6A2, 6B1, 6A3, 6B4, 6D2, 6C1, 6D3, 6C4  
6A3, 6B4, 6D2, 6C1  
0435  
X
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
4
2
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Warm White Chromaticity Groups  
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.  
Coordinates are listed below in the table.  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Warm White Bin Coordinates  
Bin code CIEx  
0.3889  
CIEy  
0.369  
0.3768  
0.38  
0.372  
0.369  
0.372  
0.38  
Bin code CIEx  
0.3915  
CIEy  
Bin code CIEx  
0.3941  
CIEy  
0.3848  
0.393  
Bin code CIEx  
0.3968  
CIEy  
0.393  
0.4015  
0.4052  
0.3966  
0.393  
0.3768  
0.3848  
0.3882  
0.38  
0.3768  
0.38  
0.3882  
0.3916  
0.3832  
0.38  
0.3832  
0.3916  
0.395  
0.3865  
0.3832  
0.3865  
0.395  
0.3984  
0.3898  
0.3865  
0.3898  
0.3984  
0.4006  
0.3919  
0.3898  
0.3919  
0.4006  
0.4028  
0.3939  
0.3919  
0.3939  
0.4028  
0.4049  
0.396  
0.3915  
0.3981  
0.3953  
0.3889  
0.3953  
0.3981  
0.4048  
0.4017  
0.3953  
0.4017  
0.4048  
0.4116  
0.4082  
0.4017  
0.4082  
0.4116  
0.4183  
0.4147  
0.4082  
0.4147  
0.4183  
0.4242  
0.4203  
0.4147  
0.4203  
0.4242  
0.43  
0.3941  
0.401  
0.3981  
0.3915  
0.3981  
0.401  
0.3968  
0.404  
0.401  
0.3941  
0.401  
0.404  
0.4113  
0.408  
0.401  
0.408  
0.4113  
0.4186  
0.415  
0.408  
0.415  
0.4186  
0.4259  
0.4221  
0.415  
0.4221  
0.4259  
0.4322  
0.4281  
0.4221  
0.4281  
0.4322  
0.4385  
0.4342  
0.4281  
0.4342  
0.4385  
0.4449  
0.4403  
0.4342  
0.4403  
0.4449  
0.4513  
0.4465  
0.4403  
0.4465  
0.4513  
0.4573  
0.4523  
0.4465  
0.4523  
0.4573  
0.4634  
0.4582  
0.4523  
0.4582  
0.4634  
0.4695  
0.4641  
0.4582  
0.4641  
0.4695  
0.4756  
0.47  
0.3996  
0.4071  
0.404  
6A1  
6A4  
6D1  
6D4  
7A1  
7A4  
7D1  
7D4  
8A1  
8A4  
8D1  
8D4  
6A2  
6A3  
6D2  
6D3  
7A2  
7A3  
7D2  
7D3  
8A2  
8A3  
8D2  
8D3  
6B1  
6B4  
6C1  
6C4  
7B1  
7B4  
7C1  
7C4  
8B1  
8B4  
8C1  
8C4  
0.3966  
0.3882  
0.3848  
0.3882  
0.3966  
0.4001  
0.3916  
0.3882  
0.3916  
0.4001  
0.4037  
0.395  
0.3916  
0.395  
0.4037  
0.4073  
0.3984  
0.395  
0.3984  
0.4073  
0.4096  
0.4006  
0.3984  
0.4006  
0.4096  
0.4119  
0.4028  
0.4006  
0.4028  
0.4119  
0.4141  
0.4049  
0.4028  
0.4049  
0.4141  
0.4164  
0.4071  
0.4049  
0.4071  
0.4164  
0.4178  
0.4085  
0.4071  
0.4085  
0.4178  
0.4193  
0.4099  
0.4085  
0.4099  
0.4193  
0.4207  
0.4112  
0.4099  
0.4112  
0.4207  
0.4221  
0.4126  
0.4112  
6B2  
6B3  
6C2  
6C3  
7B2  
7B3  
7C2  
7C3  
8B2  
8B3  
8C2  
8C3  
0.3968  
0.404  
0.4071  
0.4146  
0.4113  
0.404  
0.3966  
0.4052  
0.4089  
0.4001  
0.3966  
0.4001  
0.4089  
0.4127  
0.4037  
0.4001  
0.4037  
0.4127  
0.4165  
0.4073  
0.4037  
0.4073  
0.4165  
0.4188  
0.4096  
0.4073  
0.4096  
0.4188  
0.4212  
0.4119  
0.4096  
0.4119  
0.4212  
0.4236  
0.4141  
0.4119  
0.4141  
0.4236  
0.426  
0.3832  
0.3751  
0.372  
0.408  
0.4048  
0.3981  
0.4048  
0.408  
0.3751  
0.3832  
0.3865  
0.3782  
0.3751  
0.3782  
0.3865  
0.3898  
0.3814  
0.3782  
0.3814  
0.3898  
0.3919  
0.3833  
0.3814  
0.3833  
0.3919  
0.3939  
0.3853  
0.3833  
0.3853  
0.3939  
0.396  
0.4113  
0.4146  
0.4222  
0.4186  
0.4113  
0.4186  
0.4222  
0.4299  
0.4259  
0.4186  
0.4259  
0.4299  
0.4364  
0.4322  
0.4259  
0.4322  
0.4364  
0.443  
0.415  
0.4116  
0.4048  
0.4116  
0.415  
0.4221  
0.4183  
0.4116  
0.4183  
0.4221  
0.4281  
0.4242  
0.4183  
0.4242  
0.4281  
0.4342  
0.43  
0.4242  
0.43  
0.4342  
0.4403  
0.4359  
0.43  
0.4359  
0.4403  
0.4465  
0.4418  
0.4359  
0.4418  
0.4465  
0.4523  
0.4475  
0.4418  
0.4475  
0.4523  
0.4582  
0.4532  
0.4475  
0.4532  
0.4582  
0.4641  
0.4589  
0.4532  
0.4589  
0.4641  
0.47  
0.4259  
0.4203  
0.4259  
0.43  
0.4385  
0.4322  
0.4385  
0.443  
0.4359  
0.4316  
0.4259  
0.4316  
0.4359  
0.4418  
0.4373  
0.4316  
0.4373  
0.4418  
0.4475  
0.4428  
0.4373  
0.4428  
0.4475  
0.4532  
0.4483  
0.4428  
0.4483  
0.4532  
0.4589  
0.4538  
0.4483  
0.4538  
0.4589  
0.4646  
0.4593  
0.4538  
0.4496  
0.4449  
0.4385  
0.4449  
0.4496  
0.4562  
0.4513  
0.4449  
0.4513  
0.4562  
0.4624  
0.4573  
0.4513  
0.4573  
0.4624  
0.4687  
0.4634  
0.4573  
0.4634  
0.4687  
0.475  
0.3873  
0.3853  
0.3873  
0.396  
0.3939  
0.396  
0.4049  
0.4071  
0.3981  
0.396  
0.3981  
0.3893  
0.3873  
0.3893  
0.3981  
0.3994  
0.3906  
0.3893  
0.3906  
0.3994  
0.4008  
0.3919  
0.3906  
0.3919  
0.4008  
0.4021  
0.3931  
0.3919  
0.3931  
0.4021  
0.4034  
0.3944  
0.3931  
0.4164  
0.4141  
0.4164  
0.426  
0.3981  
0.4071  
0.4085  
0.3994  
0.3981  
0.3994  
0.4085  
0.4099  
0.4008  
0.3994  
0.4008  
0.4099  
0.4112  
0.4021  
0.4008  
0.4021  
0.4112  
0.4126  
0.4034  
0.4021  
0.4274  
0.4178  
0.4164  
0.4178  
0.4274  
0.4289  
0.4193  
0.4178  
0.4193  
0.4289  
0.4304  
0.4207  
0.4193  
0.4207  
0.4304  
0.4319  
0.4221  
0.4207  
0.4695  
0.4634  
0.4695  
0.475  
0.4813  
0.4756  
0.4695  
0.4646  
0.4589  
0.4641  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Luminous Flux Bins  
Table 1:  
Minimum  
Maximum  
Luminous Flux v)  
@ IF = 700mA[1,2]  
(lm)  
Luminous Flux v)  
@ IF = 700mA[1,2]  
(lm)  
Bin Code  
X
1085  
1357  
1357  
1696  
Y
Notes for Table 1:  
1.  
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.  
Forward Voltage Range per String  
Table 2:  
Minimum  
Maximum  
Forward Voltage (VF)  
Forward Voltage (VF)  
@ IF = 700mA[1,2]  
(V)  
Bin Code  
@ IF = 700mA[1,2]  
(V)  
0
9.0  
10.8  
Notes for Table 2:  
1.  
2.  
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.  
Forward Voltage per string of 3 LED dies connected in series.  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Absolute Maximum Ratings  
Table 3:  
Parameter  
Symbol  
Value  
Unit  
mA  
mA  
mA  
V
°C  
°C  
°C  
DC Forward Current at Tjmax=135°C[1]  
DC Forward Current at Tjmax=150°C[1]  
Peak Pulsed Forward Current[2]  
Reverse Voltage  
IF  
IF  
IFP  
VR  
Tstg  
TJ  
800  
700  
1000  
See Note 3  
-40 ~ +150  
150  
Storage Temperature  
Junction Temperature  
Soldering Temperature[4]  
Allowable Reflow Cycles  
Tsol  
260  
6
121°C at 2 ATM,  
100% RH for 168 hours  
Autoclave Conditions[5]  
> 8,000 V HBM  
Class 3B JESD22-A114-D  
ESD Sensitivity[6]  
Notes for Table 3:  
1.  
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current  
de-rating.  
2:  
3.  
4.  
5.  
6.  
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.  
LEDs are not designed to be reverse biased.  
Solder conditions per JEDEC 020c. See Reflow Soldering Profile Figure 3.  
Autoclave Conditions per JEDEC JESD22-A102-C.  
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ9-00Wx00 in an electrostatic protected area (EPA).  
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.  
Optical Characteristics @ TC = 25°C  
Table 4:  
Typical  
Parameter  
Symbol  
Unit  
2700K  
3000K 3500K  
Luminous Flux (@ IF = 700mA)[1]  
Luminous Efficacy (@ IF =350mA)  
Color Rendering Index (CRI)  
Viewing Angle[2]  
Φv  
1350  
79  
1430  
85  
lm  
lm/W  
Ra  
82  
110  
135  
2Θ  
Degrees  
Degrees  
½
Total Included Angle[3]  
Θ0.9  
Notes for Table 4:  
1.  
2.  
3.  
Luminous flux typical value is for all 9 LED dies operating concurrently at rated current.  
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.  
Total Included Angle is the total angle that includes 90% of the total luminous flux.  
Electrical Characteristics @ TC = 25°C  
Table 5:  
Parameter  
Symbol  
Typical  
Unit  
Forward Voltage per String (@ IF = 700mA)  
VF  
9.7  
V
Temperature Coefficient  
of Forward Voltage (per String)  
ΔVF/ΔTJ  
-6.0  
mV/°C  
°C/W  
Thermal Resistance  
(Junction to Case)  
J-C  
1.3  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
IPC/JEDEC Moisture Sensitivity Level  
Table 6 - IPC/JEDEC J-STD-20 MSL Classification:  
Soak Requirements  
Floor Life  
Conditions  
Standard  
Conditions  
Accelerated  
Level  
1
Time  
Time (hrs)  
Time (hrs)  
Conditions  
≤ 30°C/  
168  
+5/-0  
85°C/  
85% RH  
Unlimited  
n/a  
n/a  
85% RH  
Notes for Table 6:  
1.  
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag  
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.  
Average Lumen Maintenance Projections  
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for  
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original  
light output remaining at a defined time period.  
Based on accelerated lifetime testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen  
Maintenance at 65,000 hours of operation at a forward current of 700 mA per die. This projection is based on  
constant current operation with junction temperature maintained at or below 120°C.  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Mechanical Dimensions (mm)  
Emitter pin layout  
Emitter Emitter  
channel pin  
Die  
Color  
Ch1 -  
23, 24  
E
B
A
G
I
White  
White  
White  
White  
White  
White  
White  
White  
White  
Ch1  
Ch1 +  
Ch2 -  
Ch2  
17, 18  
2, 3  
Ch2 +  
Ch3 -  
Ch3  
14, 15  
5, 6  
C
D
H
F
Ch3+  
11, 12  
NC pins: 1, 4, 7, 8, 9, 10, 13, 16, 19, 20,  
21, 22  
DNC pins: none  
Notes:  
Figure 1: Package outline drawing.  
Notes for Figure 1:  
NC = Not internally Connected (Electrically isolated)  
DNC = Do Not Connect (Electrically Non isolated)  
1.  
2.  
Index mark indicates case temperature measurement point.  
Unless otherwise noted, the tolerance = ± 0.20 mm.  
Recommended Solder Pad Layout (mm)  
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.  
Note for Figure 2a:  
1.  
2.  
Unless otherwise noted, the tolerance = ± 0.20 mm.  
LED Engin recommends the use of pedestal MCPCB’s which allow the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such  
MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the  
metal core of the MCPCB, thus lowering the overall system thermal resistance.  
3.  
LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less  
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure  
rates due to thermal over stress.  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Recommended Solder Mask Layout (mm)  
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.  
Note for Figure 2b:  
1.  
Unless otherwise noted, the tolerance = ± 0.20 mm.  
Recommended 8mil Stencil Apertures Layout (mm)  
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad.  
Note for Figure 2c:  
1.  
Unless otherwise noted, the tolerance = ± 0.20 mm.  
COPYRIGHT © 2014 LED ENGIN. ALL RIGHTS RESERVED.  
LZ9-00WW00 (1.7-02/23/14)  
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com  
Reflow Soldering Profile  
Figure 3: Reflow soldering profile for lead free soldering.  
Typical Radiation Pattern  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
Angular Displacement (Degrees)  
Figure 4: Typical representative spatial radiation pattern.  
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Typical Relative Spectral Power Distribution  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
380  
430  
480  
530  
580  
630  
680  
730  
780  
830  
Wavelength (nm)  
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C, 3000K CRI 80  
Typical Chromaticity Coordinate Shift over Temperature  
0.02  
0.015  
Cx  
0.01  
Cy  
0.005  
3E-17  
-0.005  
-0.01  
-0.015  
-0.02  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Case Temperature (°C)  
Figure 6: Typical dominant wavelength shift vs. Case temperature.  
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Typical Relative Light Output  
140%  
120%  
100%  
80%  
60%  
40%  
20%  
0%  
0
200  
400  
600  
800  
1000  
IF - Forward Current (mA)  
Figure 7: Typical relative light output vs. forward current @ TC = 25°C  
Typical Normalized Radiant Flux over Temperature  
110  
100  
90  
80  
70  
60  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Case Temperature (°C)  
Figure 8: Typical relative light output vs. case temperature.  
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Typical Forward Voltage Characteristics per String  
1200  
1000  
800  
600  
400  
200  
0
6.0  
7.0  
8.0  
9.0  
10.0  
11.0  
VF - Forward Voltage (V)  
Figure 9: Typical forward current vs. forward voltage1 @ TC = 25°C.  
Note for Figure 9:  
1. Forward Voltage per string of 3 LED dies connected in series.  
Current De-rating  
1000  
800  
700  
(Rated)  
600  
400  
200  
R J-A = 4°C/W  
R J-A = 5°C/W  
R J-A = 6°C/W  
0
0
25  
50  
75  
100  
125  
150  
Maximum Ambient Temperature (°C)  
Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 150°C.  
Notes for Figure 10:  
1.  
2.  
3.  
Maximum current assumes that all 9 LED dice are operating concurrently at the same current.  
J-C [Junction to Case Thermal Resistance] for the LZ9-00Wx00 is typically 1.3°C/W.  
J-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].  
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Emitter Tape and Reel Specifications (mm)  
Figure 11: Emitter carrier tape specifications (mm).  
Figure 12: Emitter Reel specifications (mm).  
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LZ9 MCPCB Family  
Emitter + MCPCB  
Thermal Resistance  
(oC/W)  
Diameter  
(mm)  
Typical Vf Typical If  
Part number Type of MCPCB  
(V)  
(mA)  
LZ9-Jxxxxx  
1-channel  
3-channel  
19.9  
19.9  
1.3 + 0.2 = 1.5  
1.3 + 0.2 = 1.5  
29.1  
700  
LZ9-Mxxxxx  
9.7/ ch  
700/ ch  
Mechanical Mounting of MCPCB  
.
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to  
substrate cracking and subsequently LED dies cracking.  
.
To avoid MCPCB bending:  
o
o
Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.  
Care must be taken when securing the board to the heat sink. This can be done by tightening three M3  
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will  
increase the likelihood of board bending.  
o
o
It is recommended to always use plastics washers in combinations with the three screws.  
If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after  
tightening (with controlled torque) and then re-tighten the screws again.  
Thermal interface material  
.
.
.
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when  
mounting the MCPCB on to the heat sink.  
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal  
epoxies. An example of such material is Electrolube EHTC.  
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating  
conditions.  
Wire soldering  
.
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.  
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is  
recommended to use a solder iron of more than 60W.  
.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:  
24-7068-7601)  
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LZ9-Jxxxxx  
1 channel, Standard Star MCPCB (1x9) Dimensions (mm)  
Notes:  
.
.
.
Unless otherwise noted, the tolerance = ± 0.2 mm.  
Slots in MCPCB are for M3 or #4-40 mounting screws.  
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.  
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The  
emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,  
SinkPad, Bridge-Semiconductor.  
Components used  
MCPCB:  
ESD chips: BZX585-C47  
MHE-301 copper  
(Rayben)  
(NXP, for 9 LED die)  
Jumpers:  
CRCW06030000Z0 (Vishay)  
Pad layout  
MCPCB  
Pad  
Ch.  
String/die Function  
1
2
Cathode -  
Anode +  
1/ABCDEF  
GHI  
1
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LZ9-Mxxxxx  
3 channel, Standard Star MCPCB (3x3) Dimensions (mm)  
Notes:  
.
.
.
Unless otherwise noted, the tolerance = ± 0.2 mm.  
Slots in MCPCB are for M3 or #4-40 mounting screws.  
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.  
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.  
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W. This low thermal resistance is possible by utilizing a copper based MCPCB with pedestal design. The  
emitter thermal slug is in direct contact with the copper core. There are several vendors that offer similar solutions, some of them are: Rayben, Bergquist,  
SinkPad, Bridge-Semiconductor.  
Components used  
MCPCB:  
ESD chips: BZX884-C18  
MHE-301 copper  
(Rayben)  
(NXP, for 3 LED die)  
Pad layout  
MCPCB  
Pad  
4
3
5
2
6
1
Ch.  
1
String/die Function  
Cathode -  
Anode +  
Cathode -  
Anode +  
Cathode -  
Anode +  
1/ABE  
2/CGI  
3/DFH  
2
3
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LZ9 secondary TIR optics family  
LLxx-3T06-H  
Optical Specification  
Optical  
efficiency 4  
%
On-axis  
intensity 5  
cd/lm  
Beam angle 2  
degrees  
17  
Field angle 3  
Part number 1  
degrees  
LLSP-3T06-H  
LLNF-3T06-H  
LLFL-3T06-H  
36  
90  
90  
90  
5.4  
2.2  
1.2  
26  
39  
49  
83  
Notes:  
1.  
2.  
3.  
4.  
5.  
Lenses can also be ordered without the holder. Replace H with O for this option.  
Beam angle is defined as the full width at 50% of the max intensity (FWHM).  
Field angle is defined as the full width at 10% of the max intensity.  
Optical efficiency is defined as the ratio between the incoming flux and the outgoing flux.  
On-axis intensity is defined as the ratio between the total input lumen and the intensity in the optical center of the lens.  
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Typical Relative Intensity over Angle  
100%  
LZ9 emitter  
LLSP-3T06-H  
LLNF-3T06-H  
LLFL-3T06-H  
80%  
60%  
40%  
20%  
0%  
-90  
-60  
-30  
0
30  
60  
90  
Angle (degrees)  
General Characteristics  
Symbol  
Value  
Rating  
Unit  
Mechanical  
Height from Seating Plane  
Diameter  
19.2  
38.9  
Typical  
Typical  
mm  
mm  
Material  
Lens  
PMMA  
Holder  
Polycarbonate  
Optical  
Transmission1 (>90%)  
Environmental  
Storage Temperature  
Operating Temperature  
λ
410-1100  
Min-Max.  
nm  
Tstg  
Tsol  
-40 ~ +110  
-40 ~ +110  
Min-Max.  
Min-Max.  
°C  
°C  
Notes:  
1.  
It is not recommended to use a UV emitter with this lens due to lower transmission at wavelengths < 410nm.  
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Mechanical Dimensions  
Lens with Holder  
Lens  
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Company Information  
LED Engin, based in California’s Silicon Valley, develops, manufactures, and sells advanced LED emitters, optics and  
light engines to create uncompromised lighting experiences for a wide range of entertainment, architectural,  
general lighting and specialty applications. LuxiGen™ multi-die emitter and secondary lens combinations reliably  
deliver industry-leading flux density, upwards of 5000 quality lumens to a target, in a wide spectrum of colors  
including whites, tunable whites, multi-color and UV LEDs in a unique patented compact ceramic package. Our  
LuxiTuneTM series of tunable white lighting modules leverage our LuxiGen emitters and lenses to deliver quality,  
control, freedom and high density tunable white light solutions for a broad range of new recessed and  
downlighting applications. The small size, yet remarkably powerful beam output and superior in-source color  
mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is  
required.  
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.  
LED Engin reserves the right to make changes to improve performance without notice.  
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