M3D-95 [ETC]
3 STATE DUAL TONES WIRELESS DOOR BELL; 3 STATE双音无线门铃
| 型号： | M3D-95 |
| 厂家： | 
ETC |
| 描述： | 3 STATE DUAL TONES WIRELESS DOOR BELL |
| 文件： | 总2页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K.
: TEL : 852- 27569109
FAX : 852- 27566961
一華半導體股份有限公司
MOSDESIGN SEMICONDUCTOR CORP.
DOOR CHIME
3 態雙音
M3E.-H/M3D-95
3 STATE DUAL TONES
遙控門鈴 IC
WIRELESS DOOR BELL
FEATURES 功能敘述
BIT FORMAT
•Direct Data Transmit ( Switch to VDD ).
•38 =6561 security codes.
KEY SOUND
D0 Ding Dong - Ding Dong
D1 Ding Ding - Ding Ding
D2 WEST MINISTER
D3 For Alice
"0"
"1"
•3 door chime sound and 1 melody.
•VT : valid transmission active high.
"X"
APPLICATION 產品應用
•Door bell system. 門鈴系統.
ELECTRICAL CHARACTERISTICS 電氣規格
( @VDD=4.5V unless otherwise specified )
Characteristics
Sym.
Min.
2.4
Typ.
Max.
13
Unit
REMARKS
—
M3E.-H
M3D-95
工作電壓 Operating Voltage
VDD
V
2.4
4.5
5
―
—
―
1
0.3
—
1
1
No load M3E.-H
No load M3D-95
工作電流 Operating Current
IOP
mA
10
10
―
―
60
靜態電流 Quiescent Current
推動電流 Driving Current
μA
ISB
―
80
25
IOL
mA @ VDS=1.2V
振盪頻率 Oscillator Frequency
工作溫度 Operating Temperature
―
0
External± 30%, Rosc=240KΩ
FOSC
Temp.
KHz
℃
APPLICATION DIAGRAM 參考電路圖
VDD
M3E.-H
VDD
VDD
1
0
IR / RF
M3D-95
1
0
VDD
1
18
A0
A1
A2
A0
A1
A2
IR / RF
DO
1
16
X
Y
TEST3
Y
Rosc
Rosc
X
A3
A4
A5
VDD
A3
A4
A5
BZ
DIN
VDD
D3
1K
OUT
D2
A6
A6
A7
TEST
VSS
D1
D0
A7
8
9
VSS
9
10
* Rosc ~ M3E.-H : 240 KΩ; M3D-95 : 240 KΩ
* All specs and applications shown above subject to change without prior notice.
( 以㆖電路及規格僅供參考,本公司得逕行修正 )
1/2
2002-02-26
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K.
: TEL : 852- 27569109
FAX : 852- 27566961
一華半導體股份有限公司
MOSDESIGN SEMICONDUCTOR CORP.
DOOR CHIME
3 態雙音
M3E.-H/M3D-95
3 STATE DUAL TONES
遙控門鈴 IC
WIRELESS DOOR BELL
ASSIGNMENT & POSITION
15
14
13
UNIT : um
No. NAME
X
Y
1
2
3
4
5
6
7
8
9
TEST3
VDD
A0
A1
A2
A3
A4
A5
A6
-626.75
-626.75
-626.75
-626.75
-442.75
-227.75
252
467
627
627
627
-130
-290
-450
-610
-610
-610
-610
-610
-610
-395
-235
-75
16
(M3D-95)
Y
X
12
( 0,0 )
1
2
11
10
3
10 A7
11 VSS
12 TEST
13 BZ
627
627
604
4
5
6
7
8
9
14 DIN
15 OSC1
16 OSC2
-108
-323.75
-626.75
604
604
434.5
* CHIP SIZE ~ 1.5 x 1.46 mm2
* IC substrate should be connected to VDD in PCB (PCB ㆖ IC 必須接 VDD)
2/2
2002-02-26
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