MD2203-D224 [ETC]
Disk OnChip 2000 DIP; 磁盘片上2000 DIP
| 型号： | MD2203-D224 |
| 厂家： | 
ETC |
| 描述： | Disk OnChip 2000 DIP |
| 文件： | 总21页 (文件大小：893K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
January 2002
DiskOnChip 2000 DIP
MD2200/2/3
Features
Single-chip plug-n-play flash disk
Low power, single 3.3V or 5V power
supply
16MB to 576MB capacity (1GB in 2002)
Pinout and structure compatible with
DiskOnChip Millennium DIP 8MB
Simple, easy-to-integrate interface
32-pin DIP, JEDEC standard,
EEPROM-compatible pinout
8KB sized memory window
Boot OS capability
Embedded TrueFFS software provides:
Applications
Embedded systems
Internet access devices
Internet set-top boxes/ITV, Web browsers
WBT, thin clients, network computers
Routers, networking
Web phones, car PCs, DVD, HPC
Point of sale, industrial PCs
Telecom, medical
— Full hard disk read/write emulation
— Third-generation wear leveling
— Automatic block management
Operates with DiskOnChip SDK in
OS-less environments, ANSI-C source
code kit
Error Detection and Correction
(EDC/ECC) for higher data reliability
Low power consumption – Static
Operation
Broad OS support: DOS, Windows
NT4.0/5.0, Windows CE, BE, pSOS+,
QNX, VxWorks, and others
Compatible with major processors: x86,
MediaGX, Geode SCxxxx, PowerPC, 68K,
MIPS, SHx, StrongARM, and others
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DiskOnChip 2000 DIP
Table of Contents
1
General Description................................................................................................................... 4
2
Detailed Feature List.................................................................................................................. 5
TrueFFS Technology............................................................................................................................5
Low Power Consumption .....................................................................................................................5
Temperature Range .............................................................................................................................5
Easy to Integrate ..................................................................................................................................6
Robust Error Correction .......................................................................................................................6
High Reliability......................................................................................................................................6
High Speed...........................................................................................................................................6
Compatibility with 8MB DiskOnChip Millennium Series.......................................................................6
Broad Support for Operating Systems and Processors.......................................................................6
Portable Solution – Shorter Time to Market.........................................................................................7
Complete Solution................................................................................................................................7
3
4
Package Description and Pin List ............................................................................................ 8
Designing with the DiskOnChip 2000 Flash Disk ................................................................... 9
4.1 Hardware.............................................................................................................................. 9
4.2 Software ............................................................................................................................... 9
4.3 Designing DiskOnChip 2000 into PC Architecture ............................................................... 9
5
Disk Capacities and Contents ................................................................................................ 11
5.1 Low-Profile ......................................................................................................................... 11
5.2 High-Profile......................................................................................................................... 11
5.3 Media Contents .................................................................................................................. 11
6
7
Theory of Operation................................................................................................................. 12
6.1 Error Detection and Correction (EDC/ECC) ....................................................................... 12
Specifications .......................................................................................................................... 13
7.1 Absolute Maximum Ratings................................................................................................ 13
7.2 Capacitance ....................................................................................................................... 13
7.3 Temperature Ranges ......................................................................................................... 13
7.4 DiskOnChip Assembly........................................................................................................ 13
7.5 Humidity ............................................................................................................................. 13
7.6 EDC/ECC ........................................................................................................................... 13
7.7 DC Electrical Characteristics over Operating Range.......................................................... 14
7.7.1 Vcc = 5V Characteristics...........................................................................................................14
7.7.2 Vcc = 3.3V Characteristics........................................................................................................15
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DiskOnChip 2000 DIP
7.8 AC Operating Conditions.................................................................................................... 15
7.9 Timing Specifications ......................................................................................................... 16
7.9.1 Read Cycle Timing....................................................................................................................16
7.9.2 Write Cycle Timing....................................................................................................................17
8
9
Mechanical Dimensions .......................................................................................................... 18
Shock and Vibration ................................................................................................................ 19
10 Ordering Information............................................................................................................... 19
11 Additional Information............................................................................................................. 20
How to Contact Us .......................................................................................................................... 21
91-SR-002-42-8L Rev. 3.4
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DiskOnChip 2000 DIP
1
General Description
The DiskOnChip 2000 product line is the second-generation of M-Systems’ DiskOnChip series of
products. The 2000 series provides a small, single-chip, solid-state flash disk in a standard 32-pin
DIP package. Combining a disk controller with flash memory on a single chip, DiskOnChip 2000 is
the solution where minimal weight, space, and power consumption are essential. In consequence, the
2000 series finds use today in a wide range of products, such as information appliances, set-top
boxes, thin clients, thin servers, network computers, and embedded, portable computers.
By placing DiskOnChip 2000 in a standard socket, physical space requirements are reduced. Unlike
standard IDE drives, no cables or extra space are required. DiskOnChip 2000 has no moving parts,
resulting in significantly decreased power consumption and increased reliability. It is easy to use and
reduces integration overhead. DiskOnChip 2000 is therefore a very attractive alternative to
conventional hard and floppy disk drives.
Using TrueFFS technology, DiskOnChip 2000 delivers full hard disk emulation. As such, the design
and integration stages can be considerably reduced, thereby enabling very fast time-to-market and
ease of production. Combined with its very attractive cost structure, DiskOnChip 2000 is a superior
alternative to resident flash array (RFA).
DiskOnChip 2000 products are available in capacities ranging from 16MB to 576MB. In addition,
they are 100% pinout and software compatible with the DiskOnChip Millennium DIP 8MB package.
In future versions, the capacity will be dramatically increased (up to 1GB during 2002). Since the
same pinout will be retained, the socket on the target platform will not have to be changed to
accommodate the larger capacities.
DiskOnChip technology provides broad support for all major operating systems and processors in the
market, enabling it to be readily integrated with any architecture.
DiskOnChip 2000 is shipped as a plug-and-play device that is fully tested and formatted, and
programmed with a DOS driver. Future driver, software or content upgrades, or formatting, can be
made on-board or off-board using DiskOnChip utilities and accessories provided by M-Systems.
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DiskOnChip 2000 DIP
2
Detailed Feature List
TrueFFS Technology
For a flash disk to emulate a hard disk, a software management layer is required. TrueFFS is
M-Systems’ patented flash file system management technology that allows flash components to fully
emulate hard disks, so they can be written to and read from like any other hard disk.
TrueFFS software simplifies and enhances flash memories by:
• Using third-generation wear leveling, which ensures that all blocks are erased an equal number of
times. This increases the life of the flash media by orders of magnitude.
• Using virtual blocking of the flash device to make erasure of large blocks transparent to the
operator.
• Automatic block mapping.
• Implementing a robust power-loss recovery mechanism to guarantee absolute protection of data.
• Providing conventional address support for various architecture configurations.
• The TrueFFS driver supports 8-bit, 16-bit, and 32-bit bus architectures. Support for the 16-bit and
32-bit bus architectures, typically used in RISC processors, can be achieved by using the LSB of
the data bus as follows:
For 16-bit address boundary shifts, shift the address lines by one, so that the host address line
A1 connects to DiskOnChip 2000 address line A0, the host address line A2 connects to
DiskOnChip 2000 line A1, and so on.
For 32-bit address boundary shifts, shift the address lines by two, so that the host address line
A2 connects to DiskOnChip 2000 address line A0, the host address line A3 connects to
DiskOnChip 2000 line A1, and so on.
Refer to Application Note AP-DOC-030 for more details.
Low Power Consumption
The internal functions are synchronized with the CPU’s read and write strobes. This innovation
eliminates the need for an external clock and dramatically reduces power consumption.
DiskOnChip 2000 requires only a single 3.3V or 5V power supply, which helps simplify integration.
These features make DiskOnChip 2000 the best cost/performance solution for computers that require
minimal weight, space, and power consumption, providing a very attractive alternative to
conventional hard and floppy disk drives.
Temperature Range
DiskOnChip 2000 is available in both commercial (0 ºC to +70 ºC) and extended (-40 ºC to +85 ºC)
temperature ranges.
* DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.
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DiskOnChip 2000 DIP
Easy to Integrate
Fast integration is ensured by the following DiskOnChip 2000 features:
• Compatibility with standard EEPROM DIP pinout
• Support for local bus and ISA bus interface
• Small memory map window size – only 8KB
• Static operation – no clock required
• 16mA output drive (18mA at 3.3V)
Robust Error Correction
The DiskOnChip family utilizes a Reed-Solomon Error Detection Code (EDC) and Error Correction
Code (ECC), providing the following error immunity for each 512-byte block of data:
• Corrects up to two 10-bit symbols, including two random bit errors
• Corrects single bursts of up to 11 bits
• Detects single bursts of up to 31 bits, and double bursts of up to 11 bits
• Detects up to 4 random bit errors
High Reliability
DiskOnChip 2000 can be inserted into standard DIP sockets, eliminating the need for mechanical
disk drives, bulky ribbon cables and connectors. The design of DiskOnChip 2000 ensures high
reliability even when subjected to levels of shock, vibration, and temperature changes that would
destroy a conventional magnetic disk drive.
High Speed
DiskOnChip 2000 implements an integrated architecture for data transfers, which eliminates
bottlenecks typical in this area. Additionally, it doubles read performance and significantly improves
write performance, in comparison to competitive alternatives. DiskOnChip 2000 can sustain system
write speeds of over 550KB per second, read speeds of more than 1.4MB per second (measured in
ISA no wait state environment) and read/write burst transfer rates of nearly 5MB per second.
Compatibility with 8MB DiskOnChip Millennium Series
DiskOnChip 2000 is a 32-pin Dual Inline Package (DIP) that provides 100% pinout compatibility
with M-Systems' DiskOnChip Millennium DIP (8MB). DiskOnChip 2000 is fully software
compatible with M-Systems' DiskOnChip Millennium DIP (8MB), for version 1.21 and higher.
Broad Support for Operating Systems and Processors
The DiskOnChip family of products, supplied with TrueFFS firmware, supports a wide range of
operating systems (OS), including DOS, Windows 2000, Windows CE, Windows NT,
Windows Embedded NT, BE, QNX, VxWorks, pSOS, Linux, FreeBSD, PharLap ETS, VRTX and
more.
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DiskOnChip 2000 DIP
In addition, leading operating systems such as Windows CE and Tornado, offer native support for the
DiskOnChip family of products for easy integration.
For OS-less applications and customized solutions, M-Systems offers its DiskOnChip TrueFFS SDK,
an ANSI-C source code kit designed specifically to support these environments.
The DiskOnChip family of products is compatible with all major processors, supporting popular
processors such as x86, 68K, MediaGx, Geode SCxxxx, PowerPC, MIPS, SHx, StrongARM, and
many others.
Portable Solution – Shorter Time to Market
The development and integration time for implementing a flash disk is greatly reduced by
DiskOnChip’s standard software interface, which provides portability to other operating systems and
processors and thereby shortens your time to market.
Complete Solution
The DiskOnChip 2000 series offers a full flash disk solution that includes different voltage and
temperature options, software drivers tailored to your operating system, data sheets, application
support and online email support.
Using DiskOnChip evaluation boards (EVB), you can develop your software before the target
hardware is ready.
The DiskOnChip GANG Programmer reduces your production time, and facilitates fast response
time to application software changes during production stages.
In all, DiskOnChip offers a complete set of tools for delivering a complete solution whenever your
application can use a flash disk.
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DiskOnChip 2000 DIP
3
Package Description and Pin List
#
X
#
#
Figure 1: Package Description and Pinout
Pin Name
Description
Address bus
Data bus
Pin Number
Direction
A0 - A12
D0 – D7
CE#
4 to 12, 23, 25 to 27
Input
13 to 15, 17 to 21
I/O
Chip Enable, active low
Output Enable, active low
Write Enable, active low
22
24
31
Input
Input
Input
OE#
WE#
NC
Not Connected. These pins may be left 1, 2, 3, 28, 29, 30
floating, tied to Vcc, GND or logic
levels. Absolute Maximum Ratings
must be observed.
VCC
GND
Power
Ground
32
16
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DiskOnChip 2000 DIP
4
Designing with the DiskOnChip 2000 Flash Disk
4.1 Hardware
DiskOnChip 2000 should be connected as a standard memory device, using standard memory
interface signals. Typically, DiskOnChip 2000 can be mapped to any free 8KB memory space. In PC
architectures, if the memory window allocated to DiskOnChip 2000 is larger than 8KB, an automatic
anti-aliasing mechanism prevents the firmware from being loaded more than once. Figure 1
illustrates a typical interface between DiskOnChip 2000 and a system.
A[12:0]
D[7:0]
OE#
DiskOnChip 2000
Any Capacity
WE#
CE#
Figure 2: Simplified I/O Diagram
4.2 Software
DiskOnChip 2000, under control of TrueFFS, is accessed using standard file system calls like any
other block device. Applications can write to and read from any sector on DiskOnChip 2000, which
is compatible with all diagnostic utilities, applications and file systems.
The flash memory within DiskOnChip 2000 is accessed by TrueFFS through an 8KB window in the
CPU’s memory space. TrueFFS handles the paging of this window in the flash array, as well as
providing flash disk emulation that includes flash table management, wear leveling, mapping out bad
blocks, and background space reclamation of unused flash blocks.
The same 8KB address space will be retained in future versions of DiskOnChip 2000 that offer
greater capacities.
4.3 Designing DiskOnChip 2000 into PC Architecture
When used in PC-compatible architectures, DiskOnChip 2000 is allocated an 8KB memory window
in the BIOS expansion memory range, which is usually located between 0C8000h and 0EFFFFh.
Figure 3 illustrates the DiskOnChip 2000 memory window in relation to the PC memory map.
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DiskOnChip 2000 DIP
Extended
Memory
1MB
0FFFFFh
0F0000h
BIOS
8KB
DiskOnChip
0C8000h
0A0000h
Display
RAM
640KB
0
Figure 3: PC Memory Map
After reset, the BIOS executes the POST (Power On Self-Test), and then searches for all expansion
ROM devices. When DiskOnChip 2000 is found, the BIOS executes the Initial Program Loader
(IPL) code located in the boot-block area of DiskOnChip 2000. This code loads the TrueFFS driver
into system memory, installs DiskOnChip 2000 as a disk in the system, and then returns control back
to the BIOS code. The operating system subsequently attempts to identify disks that are available and
the DiskOnChip 2000 software (TrueFFS) responds by emulating a hard disk.
From this point onward, DiskOnChip 2000 is identified by the system as a standard disk drive. It is
assigned a drive letter and it can be used by any software application. No BIOS setup modifications,
autoexec.bat/config.sys modifications or external software are required.
• DiskOnChip 2000 can be used as the only disk in the system, in which case it will be accessed as
drive [C:].
• DiskOnChip 2000 can operate with or without a floppy drive, or with additional hard disks. When
working with a hard disk, DiskOnChip 2000 can be configured as the last drive (the default
configuration). In this case, the hard disk will be drive [C:] and DiskOnChip 2000 will be drive
[D:].
• DiskOnChip 2000 can also be configured as the first drive. In this case, the hard disk will be drive
[D:] and DiskOnChip 2000 will be drive [C:].
• DiskOnChip 2000 can be used as the boot device when configured as drive [C:]. In this
configuration, you must format DiskOnChip 2000 as a bootable device by copying the OS files
onto the disk. When running DOS, use the SYS command for this purpose.
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DiskOnChip 2000 DIP
5
Disk Capacities and Contents
The capacities for the various models are detailed in the following two tables.
5.1 Low-Profile
Model
Formatted
Capacity
(bytes)
Sectors
Formatted Capacity
under DOS 6.22
(bytes)
Sectors under DOS
6.22
MD2202-D16
MD2200-D24
MD2202-D32
MD2202-D48
MD2202-D64
MD2202-D96
MD2202-D192
16,375,808
24,592,384
32,800,768
49,233,920
65,683,456
98,566,144
197,279,744
31,984
48,032
64,064
96,160
128,288
192,512
381,300
16,324,608
24,516,608
32,724,992
49,092,608
65,525,760
98,390,016
103,829,024
31,884
47,884
63,916
95,884
127,980
192,168
385,280
5.2 High-Profile
Model
Formatted
Capacity
(bytes)
Sectors
Formatted Capacity
under DOS 6.22
(bytes)
Sectors under DOS
6.22
MD2203-D80
MD2203-D112
MD2203-D144
MD2203-D160
MD2203-D192
MD2203-D224
MD2203-D256
MD2203-D288
MD2203-D576
82,116,608
114,999,296
147,881,984
164,331,520
197,214,208
230, 031, 360
262, 930, 432
295, 796, 736
591, 790, 080
160,384
224,608
288,832
320,960
385,184
449, 280
513, 536
577,728
1,142,970
81, 989, 632
114, 786, 304
147, 578, 880
164, 151, 296
196, 980, 736
229, 584, 896
262, 647, 808
295, 624, 704
311, 427, 072
160,136
224,192
288,240
320,608
384,728
448, 408
512, 984
577,392
1,155,776
5.3 Media Contents
DiskOnChip 2000 products are shipped from M-Systems fully tested, already formatted, and come
with a DOS driver.
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DiskOnChip 2000 DIP
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Theory of Operation
VCC
GND
CE#
WE#
Flash
System
OE#
Interface
Control
Flash
D[0:7]
A[0:12]
Boot Block
(IPL ROM)
EDC/ECC
Figure 4: DiskOnChip 2000 Simplified Block Diagram
DiskOnChip 2000 appears to the system’s hardware as a standard EEPROM, via the System
Interface block. The host cycles are passed to the Flash Control block, to be written to or read from
the flash device.
To ensure the highest level of reliability, each cycle is monitored by the EDC/ECC (Error Detection
and Correction) block. In write cycles, the EDC/ECC block generates a syndrome for every sector
that contains data, which is stored in the flash together with the sector. When the sector is read, the
syndrome is regenerated for the data and compared with the original syndrome. When a mismatch is
detected, it is repaired.
The boot block is responsible for answering the BIOS expansion search in PC architectures. After the
BIOS identifies DiskOnChip 2000 as a valid BIOS expansion device, it executes the code stored in
the boot block. The BIOS then loads the TrueFFS software from the flash memory into the host
memory, delivering full disk capabilities to the operating system. This code is identical for all
DiskOnChip 2000 capacities, since TrueFFS automatically detects the memory capacity of
DiskOnChip 2000.
6.1 Error Detection and Correction (EDC/ECC)
DiskOnChip 2000 uses the Reed-Solomon EDC/ECC algorithm to ensure high data reliability. Each
time a block of data is written to the flash, a 6-byte checksum is also written. Each time the data is
read back from the flash, a new 6-byte code is computed. TrueFFS uses these checksums for error
detection and, if necessary, error correction.
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DiskOnChip 2000 DIP
7
Specifications
7.1 Absolute Maximum Ratings
Parameter
Symbol
3.3V Model Rating1
5V Model Rating1
Units
Notes
DC supply
VCCS
-0.5 to 4.6
-0.3 to 6.0
V
voltage
Input pin
voltage2
VIN
IIN
-0.5 to VCC + 0.3
Not Specified
-0.3 to VCC + 0.3
-10 to 10
V
Input pin
mA
+25 °C
current
Note 1: Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Note 2: The voltage on any pin may undershoot to -2.0V or overshoot to Vcc+2.0V for periods <20ns.
7.2 Capacitance
Symbol
CI/O
Parameter
Input/Output MD2200/2, VIN = 0V
Capacitance
Conditions
3.3V Model Rating
5V Model Rating
Unit
pF
pF
12
36
15
45
MD2203, VIN = 0V
Note: Capacitance is not 100% tested.
7.3 Temperature Ranges
Commercial operating temperature:
Extended operating temperature:
Storage temperature:
0 ºC to +70 ºC*
-40 ºC to +85 ºC
-50 ºC to +85 ºC
*DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.
7.4 DiskOnChip Assembly
The DiskOnChip 2000 DIP device is not hermetically sealed. Therefore, it must be assembled after
the PCB goes through its final rinse. Assembling DiskOnChip 2000 prior to the rinse phase may
cause it to absorb moisture. Failure to adhere to the above assembly instruction can lead to device
failures not covered by M-Systems' warranty.
Note: DiskOnChip 2000 DIP requires a DIP socket on the target platform. Due to its plastic shell and molding material, it
cannot be soldered directly to the platform.
7.5 Humidity
10% - 90% relative, non-condensing
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DiskOnChip 2000 DIP
7.6 EDC/ECC
Enhanced Reed-Solomon:
• Corrects up to two 10-bit symbols, including two random bit errors.
• Corrects single bursts of up to 11 bits.
• Detects single bursts of up to 31 bits and double bursts of up to 11 bits.
• Detects up to 4 random bit errors.
7.7 DC Electrical Characteristics over Operating Range
7.7.1 Vcc = 5V Characteristics
Symbol
VCCS
VIH
VIL
VOH
VOL
Parameter
Conditions
Min
4.5
2.0
Typ
5.0
Max
5.5
Unit
V
V
V
V
System Supply Voltage
High-level Input Voltage
Low-level Input Voltage
High-level Output Voltage
Low-level Output Voltage
Input Leakage Current
0.8
IOH = -16mA
IOL = 16mA
MD2200, MD2202
2.4
0.4
±10
±30
±10
V
µA
IIL
MD2203
MD2200, MD2202
MD2203
µA
µA
µA
IOZ
Output Leakage Current
±30
60
400
1200
IVCC
ISTDBY
Supply Current
Standby Current
200ns Cycle Time, Outputs open
MD2200, MD2202
MD2203
40
60
240
mA
µA
µA
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DiskOnChip 2000 DIP
7.7.2 Vcc = 3.3V Characteristics
Symbol
VCCS
VIH
VIL
VHYS
Parameter
Conditions
Min
3.0
2.7
Typ
3.3
Max
Unit
V
V
V
V
System Supply Voltage
High-level Input Voltage
Low-level Input Voltage
Input Voltage Hysteresis
3.6
0.6
1.5
1.1
IOH = -18mA
IOH = 0mA
IOL = 18mA
2.4
Vcc-0.1
V
V
V
V
VOH
VOL
High-level Output Voltage
Low-level Output Voltage
0.4
0.1
I
OL = 0mA
MD2200, MD2202
µA
±10
±30
±10
IIL
Input Leakage Current
Output Leakage Current
MD2203
µA
µA
µA
MD2200, MD2202
MD2203
IOZ
±30
60
400
IVCC
Supply Current
Standby Current
150ns Cycle Time, Outputs open
MD2200, MD2202
MD2203
30
70
mA
µA
µA
ISTDBY
300 1350
7.8 AC Operating Conditions
Timing specifications are based on the following conditions:
Parameter
3.3V Model
5V Model
Supply Voltage
VCC = 3.3V ±0.3V
0.2V to 2.9V
1ns
VCC = 5V ±0.5V
0.4V to 2.6V
5ns
0.8V and 2.0V
50 pF
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load
1.5V
100 pF
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DiskOnChip 2000 DIP
7.9 Timing Specifications
7.9.1 Read Cycle Timing
TSU(A)
A[0..12]
CE#
TSU(CE1)
TREC
THO(CE1)
OE#
TSU(CE0)
THO(CE0)
TACC
WE#
TDIS(D)
TEN(D)
D[0..7]
Figure 5: Read Cycle
Symbol
Description
3.3V
5V
Notes
Min (ns)
Max (ns)
Min (ns)
Max (ns)
TSU(A)
2
10
Address to OE# È setup
OE#È to Address hold
THO(A)
35
0
56
0
TSU(CE0)
THO(CE0)
THO(CE1)
TSU(CE1)
TREC
1
2
CE# È to OE# È setup
0
0
OE#Ç to CE# = 0 hold
8
42
42
59
OE# or WE#Ç to CE# = 1 hold
CE#Ç to WE# or OE#È setup time
8
20
OE#Ç to start of next cycle
Read access time
TACC
110
130
91
TEN(D)
15
75
7
OE#È to D active delay
TDIS(D)
13
44
OE#Ç to D Hi-Z delay
Note 1: CE# may be asserted any time before or after OE# is asserted. If CE# is asserted after OE#, all timing relative to
OE# asserted will be referenced instead to the time CE# was asserted.
Note 2: CE# may be negated any time before or after OE# is negated. If CE# is negated before OE#, all timing relative to
OE# negated will be referenced instead to the time CE# was negated.
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DiskOnChip 2000 DIP
7.9.2 Write Cycle Timing
TSU(A)
THO(A)
A[0..12]
THO(CE1)
CE#
OE#
TSU(CE1)
TREC
THO(CE0)
THO(CE0)
TW(WE)
WE#
THO(D)
TSU(D)
D[0..7]
Figure 6: Write Cycle
Symbol
Description
3.3V
5V
Notes
Min (ns) Max (ns)
Min (ns)
Max (ns)
TSU(A)
THO(A)
0
10
Address to WE#È setup time
35
56
WE#È to Address hold time
WE# asserted width
TW(WE)
TSU(CE0)
62
0
98
0
1
2
CE#È to WE#È setup time
THO(CE0)
THO(CE1)
TSU(CE1)
TREC
0
0
WE#Ç to CE# = 0 hold time
OE# or WE#Ç to CE# = 1 hold time
CE#Ç to WE# or OE#È setup time
WE#Ç to start of next cycle
D to WE#Ç setup time
8
8
42
42
59
48
40
22
50
0
TSU(D)
THO(D)
WE#Ç to D hold time
Note 1: CE# may be asserted any time before or after WE# is asserted. If CE# is asserted after WE#, all timing relative to
WE# asserted will be referenced instead to the time CE# was asserted.
Note 2: CE# may be negated any time before or after WE# is negated. If CE# is negated before WE#, all timing relative
to WE# negated will be referenced instead to the time CE# was negated.
91-SR-002-42-8L Rev. 3.4
17
DiskOnChip 2000 DIP
8
Mechanical Dimensions
Figure 7: MD220x Mechanical Dimensions
Low-Profile
MD2200
MD2202
Millimeters (max.)
Millimeters (max.)
A
B
C
D
E
F
41.9
18.05
2.54
15.24
5.7
43.95
18.3
2.54
15.24
6.0
4.0
4.0
G
H
0.51
38.2
0.51
38.2
High-Profile
MD2203
Millimeters (max.)
A
B
C
D
E
F
45.6
18.8
2.54
15.24
13.5
4.0
G
H
0.51
38.2
Note: The above dimensions are maximum values.
91-SR-002-42-8L Rev. 3.4
18
DiskOnChip 2000 DIP
9
Shock and Vibration
Reliability Test
Vibration
Test Conditions
100Hz~2000Hz, 15G peak, 3 cycles per axis (1hr.), 3 axes
Reference Standard
STD-202F,
Method 204D
Mechanical
Shock
Half sine shock 50G, 11msec, +/-3 shock per axis, 3 axes
STD-202F,
Method 213B
10 Ordering Information
MD2200-DCC-V-T (Low-Profile)
CC:
Capacity (MB)
24
V:
Supply Voltage
Blank
5V
V3
3.3V
T:
Temperature Range (optional) Blank
X
Commercial: 0 °C to +70 °C
Extended: -40 °C to +85 °C
MD2202-DCCC-V-T (Low-Profile)
CC:
Capacity (MB)
16, 32, 48, 64, 96, 192*
V:
Supply Voltage
Blank
5V
V3
3.3V
T:
Temperature Range (optional) Blank
X
Commercial: 0 °C to +70 °C
Extended: -40 °C to +85 °C
MD2203-DCCC-V-T (High-Profile)
CCC: Capacity (MB)
80, 112, 144, 160, 192, 224, 256, 288, 576*
V:
Supply Voltage
Blank
5V
V3
3.3V
T:
Temperature Range (optional) Blank
X
Commercial: 0 °C to +70 °C
Extended: -40 °C to +85 °C
* DiskOnChip 2000 DIP 192MB and 576MB capacities are available only for commercial temperature ranges.
91-SR-002-42-8L Rev. 3.4
19
DiskOnChip 2000 DIP
11 Additional Information
Document/Tool
Description
DiskOnChip Utilities
DiskOnChip Utilities User Manual
DiskOnChip Quick Installation Guide
DiskOnChip Quick Installation
Guide
AP-DOC-010
AP-DOC-016
AP-DOC-020
AP-DOC-030
Application Note: Designing with DiskOnChip DIP
Application Note: Using DiskOnChip with QNX
Application Note: DiskOnChip Boot Developers Kit
Application Note: Designing DiskOnChip Millennium in
RISC Environment
AP-DOC-031
AP-DOC-039
AP-DOC-047
IM-DOC-017
Application Note: Designing with DiskOnChip
Millennium in a PC Environment
Application Note: Onboard Programming of the
DiskOnChip Millennium
Application Note: Designing DiskOnChip as a Flash
Disk & Boot Device Replacement
Installation Manual: Using DiskOnChip with Windows
CE
IM-DOC-021
IM-DOC-022
Installation Manual: Using DiskOnChip with Linux O/S
Installation Manual: Using DiskOnChip with VxWorks
DiskOnChip TrueFFS SDK Product DiskOnChip TrueFFS SDK Product Brief
Brief
DiskOnChip DIP EVB
DiskOnChip DIP Evaluation Board
DiskOnChip GANG Programmer
DiskOnChip 1+8 DIP GANG Programmer
91-SR-002-42-8L Rev. 3.4
20
DiskOnChip 2000 DIP
How to Contact Us
Internet:
E-mail:
http://www.m-sys.com
info@m-sys.com
China Office:
USA Office:
25A International Business Commercial Bldg.
Nanhu Rd., Lou Hu District
Shenzhen, China 518001
M-Systems Inc.
8371 Central Ave, Suite A
Newark CA 94560
Phone: +1-510-494-2090
Fax: +1-510-494-5545
Phone: +86-755-519-4732
Fax: +86-755-519-4729
Europe and Israel Office:
M-Systems Ltd.
Taiwan Office:
7 Atir Yeda St.
Room B, 13 F, No. 133 Sec. 3
Kfar Saba 44425, Israel
Tel: +972-9-764-5000
Fax: +972-3-548-8666
Min Sheng East Road
Taipei, Taiwan
R.O.C.
Tel: +886-2-8770-6226
Fax: +886-2-8770-6295
Japan Office:
M-Systems Japan Inc.
Arakyu Bldg., 5F
2-19-2 Nishi-Gotanda Shinagawa-ku
Tokyo 141-0031
Phone: +81-3-5437-5739
Fax: +81-3-5437-5759
M-Systems assumes no responsibility for the use of the material described in this document.
Information contained herein supersedes previously published specifications on this device from
M-Systems. M-Systems reserves the right to change this document without notice.
91-SR-002-42-8L Rev. 3.4
21
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