MI2020H27AH [ETC]

5mm X 7mm Ceramic SMD; 采用5mm x 7mm陶瓷贴片


型号：	MI2020H27AH
厂家：	ETC
描述：	5mm X 7mm Ceramic SMD 采用5mm x 7mm陶瓷贴片
文件：	总2页 (文件大小：318K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MIH Series

5mm X 7mm Ceramic SMD

• Ceramic SMD Package

• 5.0, 3.3, 2.5, and 1.8 Volt

• HCMOS/TTL Compatible Output

• Stability to ±10ppm

• Tape and Reel Packaging

Electrical Specifications

Frequency Range

5V and 3.3V

2.5V

1.8V

1.500MHz to 156.250MHz

1.500MHz to 70.000MHz

1.544MHz to 40.000MHz

Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging)

Operating Temperature Range

±100ppm to ±10ppm

0°C - 70°C to -40°C - 85°C

-55°C - 125°C

Storage Temperature Range

Supply Voltage (Vdd)

Supply Current

±5%

5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc

70mA max.

Vdd = 5V

Vdd = 3.3V

40mA max.

Vdd = 2.5V

35mA max.

Vdd = 1.8V

15mA max.

Output Voltage HCMOS

Logic 0

Logic 1

10% Vdd max.

90% Vdd min.

Duty Cycle

Load Drive Capability

50% of waveform

5V(less than 50MHz)

5V(greater than 50MHz)

3.3V(less than 50MHz)

3.3V(greater than 50MHz)

2.5V

40%/60% max. or 45%/55% max.

10 TTL Gates or 50pF

10 TTL Gates or 15pF

10 TTL Gates or 30pF

10 TTL Gates or 15pF

4nSec max.

1.8V

Rise / Fall Time

Start Up Time

Jitter

10mSec max.

10pSec max.*

RMS

*Please contact your MMD representative for up-to-date typical jitter information

Specifications subject to change without notice

www.mmdcomp.com

phone: 949-709-5075 / fax: 949-709-3536

OS11

Revision: 4/20/04 I

Part Numbering Guide

T&R

Frequency

5X7 Ceramic SMD

Packaging*

Frequency Stability

100 = ±100ppm

050 = ±50ppm

025 = ±25ppm

020 = ±20ppm

015 = ±15ppm

010 = ±10ppm**

Operating Temperature

Blank = 0°C to 70°C

27 = -20°C to 70°C**

48 = -40°C to 85°C**

Pin 1 Connection

Supply Voltage

Blank = 5 Volt

3 = 3.3 Volt

Blank = Bulk

H = Tri-state

T&R = Tape and Reel

2 = 2.5 Volt***

1 = 1.8 Volt****

Symmetry

Output

Blank = 40%/60%

A = 45%/55%

H = HCMOS

*See page VA4 for Tape Specifications

**Not available in 2.5V and 1.8V

*** Available to 70MHz only

**** Available to 40MHz only

Mechanical Dimensions

1.7 max

5.08 ±0.15

.200 ±.006

7.0 ±0.2

.067 max

.278 ±.008

Markings

3.68 ±0.15

.145 ±.006

1.4 ±0.1

.055 ±.004

Pad Connections

Suggested Solder Pad Layout

Tri-state Operation

Logic 1 or NC = Oscillation

2.88

.113

Solder Pad

(X4)

Logic 0 or GND = High Impedance

Pin 1: Tri-State

Pin 2: Ground / Case

Pin 3: Output

Pin 4: Supply Voltage

2.2

.087

Environmental / Mechanical

Markings

Shock: MIL-STD-883, Method 2002, Condition B

Solderability: MIL-STD-883, Method 2003

Solvent Resistance: MIL-STD-202, Method 215

Vibration: MIL-STD-883, Method 2007, Condition A

Gross Leak Test: MIL-STD-883, Method 1014, Condition C

Fine Leak Test: MIL-STD-883, Method 1014, Condition A2

Line 1: MMD “Date Code”

Line 2: Frequency

www.mmdcomp.com

phone: 949-709-5075 / fax: 949-709-3536

Specifications subject to change without notice

OS11

Revision: 4/20/04 I

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