MV04E240T2R5- [ETC]

Multilayer Chip Varistor for Surge;


型号：	MV04E240T2R5-
厂家：	ETC
描述：	Multilayer Chip Varistor for Surge
文件：	总9页 (文件大小：240K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Document No

Issued date

Page

TMVE-XXOS001C

2012/02/13

1/9

Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

1. Features

1.1 No polarity due to symmetrical current-voltage characteristics

1.2 Excellent electro static absorption capability

1.3 Variable capacitance

1.4 Working Voltage from 2.5 to 300 V_RMS;3.3 to 385 Vdc

1.5 Suitable for ESD Protection

2. Applications

2.1 USB 3.0 Power and Data lines I/O Port protection

2.2 Notebook and PC Computers

2.3 Monitors and Flat Panel Displays

2.4 IEEE 1394 Firewire Ports

2.5 Video Graphics Cards

2.6 SIM ports Mobile phone

2.7 Digital Camera

2.9 MP3/MP4 player

2.10 LCD Module

2.11 HUB/ Telecom/ Wireless LAN

2.12 Keyboard

3. Type Designation

050

MAX

Working

Voltage

Multilayer

Varistor

Size

Type Series

Packaging

T：Paper tape

0402：10K

Capacitance

Internal

Code

050：5(pF)

100：10(pF)

2R5：2.5(Pf)

04：0402

06：0603

050：5V

0603：4K

120：12V

240：24V

TA-I TECHNOLOGY CO., LTD

Document No

Issued date

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TMVE-XXOS001C

2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

4. Dimension

Type

0402

0603

1.0 ± 0.10

1.6 ± 0.15

0.5 ± 0.10

0.8 ± 0.15

0.6 max

0.9 max

0.25 ± 0.1

0.3 ± 0.1

TA-I TECHNOLOGY CO., LTD

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TMVE-XXOS001C

2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

5. Rating and Characteristics

Maximum

Working Voltage Clamping Voltage

Maximum

Part No.

(Unit)

Size

Leakage Current

(uA)

Capacitance

Cap. Tolerance

(VDC )

(V)

(pF)

(%)

MV04E050T101-

MV04E050T560-

MV04E050T330-

MV04E050T220-

MV04E050T100-

MV04E050T050-

MV04E120T101-

MV04E120T330-

MV04E120T220-

MV04E120T100-

MV04E120T050-

MV04E240T3R0-

MV04E240T2R5-

MV04E240T0R8-

MV06E050T101-

MV06E050T560-

MV06E050T330-

MV06E050T220-

MV06E050T100-

MV06E050T050-

MV06E120T101-

MV06E120T330-

MV06E120T220-

MV06E120T100-

MV06E120T050-

MV06E240T3R0-

MV06E240T2R5-

MV06E240T0R8-

< 1

100

±30%

+80%/-20%

±30%

100

0402

±30%

+80%/-20%

±30%

100

198

200

2.5

0.8

100

±30%

+80%/-20%

±30%

100

0603

±30%

+80%/-20%

240

198

200

2.5

0.8

TA-I TECHNOLOGY CO., LTD

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2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

6. Reliability Test

Environmental

Specification

Test Method and Description

The specimen shall be subjected to 150 ± 2℃ for 1000 ± 12 hours in a

thermostatic bath without load and then stored at room temperature and

humidity for 1 to 2 hours. Therefore, the change of varistor voltage shall be

measured.

High Temperature

Storage/ Dry Heat

Step

Temperature

-40±3

Period

30Min±3

1 hour

The temperature cycle of specified

temperature shall be repeated five

times and then stored at room

temperature and humidity for one or

two hours. The change of varistor

voltage and mechanical damage shall

be examined.

Room

Temperature

Temperature Cycle

125±3

30Min±3

1 hours

Room

Temperature

After being continuously applied the maximum allowable voltage at 85 ± 2℃

for 1000± 2 hours, the specimen shall be stored at room temperature and

humidity for one or two hours, Therefore the change of varistor voltage should

be measured.

High Temperature Load

Dry Heat Load

The specimen should be subjected to 40± 2℃, 90 to 95﹪ RH and the

maximum allowable voltage for 500 hours and then stored at room temperature

and humidity for one or two hours. Therefore the change of varistor voltage

should be measured.

Damp Heat Load/

Humidity Load

The specimen should be subjected to -50 ± 2℃, without load for 500 hours and

then stored at room temperature for one or two hours. Therefore the change of

varistor voltage should be measured.

Low Temperature

Storage/ Cold

1.Discharge: contact electrostatic discharge; 2.Voltage：8KV（Level4）

3.Polarity：+,- ; 4.Number: 10 times ; 5.Interval time：1sec

Direct contact

electrostatic discharge

1.Discharge: air electrostatic discharge; 2.Voltage：15KV（Level4）

3.Polarity：+,-; 4.Number: 10 times; 5.Interval time：1~ 3sec

Direct air electrostatic

discharge

TA-I TECHNOLOGY CO., LTD

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TMVE-XXOS001C

2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

7. Taping and Reel

7.1 Packaging

P₁

A₀

Symbol

B₀

0.10

K₀

0.10

D₀

P₁

P₂

P₀

±0.10

±0.10 ±0.10 ±0.05 ±0.05 ±0.20 ±0.10 ±0.05

0402

0603

0.85

1.08

1.25

1.88

0.65

0.95

1.50

3.00

4.00

2.00

4.00

8.00

1.75

3.50

7.2 Reel Dimensions

Symbol

0402

W₁

178.0 ± 1.0 60.0 ± 0.5 13.0 ± 0.2 21.1 ± 0.2

2.0± 0.5

9.0± 0.50 1.5± 0.15

0603

TA-I TECHNOLOGY CO., LTD

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2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

8. Recommended land patterns

8.1 Solder pad layout

(Unit : mm)

0402

0603

0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.2

0.8~1.2 2.2~2.8 0.6~1.0 0.9~1.5

8.2 The SIR test of the solder paste shall be done（Based on JIS-Z-3284）

8.3 Steel plate and foot distance printing

8.4 Reflow and temperature

TA-I TECHNOLOGY CO., LTD

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2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

8.5 IR reflow Pb Free Process suggestion profile

(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150µm

(2) Ramp-up rate (217℃ to Peak) + 3℃/second max

(3) Temp. maintain at 175 +/-25℃ 180 seconds max

(4) Temp. maintain above 217℃ 60-150 seconds

(5) Peak temperature range 245℃+20℃/-10℃ time within 5℃ of actually peak

temperature (tp) 10~20 seconds

(6) Ramp down rate +6 ℃/second max.

※ Perform adequate test in advance, as the reflow temperature profile will vary according to the

conditions of the manufacturing process, and the specification of the reflow furnace.

8.6 Resistance to soldering heat-High Temperature Resistance:

260℃,10sec-3times.

8.7 Hand Soldering

In hand soldering of the Varistors. Large temperature gradient between

preheated the Varistors and the tip of soldering iron may cause electrical failures and

mechanical damages such as cracking or breakings of the devices. The soldering

shall be carefully controlled and carried out so that the temperature gradient is kept

minimum with following recommended conditions for hand soldering.

8.7.1 Recommended Soldering Condition 1

(1) Solder:

0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core.

Rosin-based and non-activated flux is recommended.

(2) Preheating:

The Varistors shall be preheated so that Temperature Gradient between the

devices and the tip of soldering iron is 150℃ or below.

(3) Soldering Iron:

Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of

soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be

melted in advance on the soldering tip.)

(4) Cooling:

After soldering. The Varistors shall be cooled gradually at room ambient

temperature.

TA-I TECHNOLOGY CO., LTD

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TMVE-XXOS001C

2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

8.7.2 Recommended Soldering Condition 2（Without preheating）

(1) Solder iron tip shall not directly touch to ceramic dielectrics.

(2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to

the external electrode of Varistors.

8.8 Post Soldering Cleaning

8.8.1 Residues of corrosive soldering fluxes on the PC board after cleaning may

greatly have influences on the electrical characteristic and the reliability (such as

humidity resistance) of the Varistors which have been mounted on the board. It

shall be confirmed that the characteristic and the reliability of the devices are not

affected by the applied cleaning conditions

8.8.2 When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards.

Following conditions are recommended for preventing failures or damages of the

devices due to the large vibration energy and the resonance caused by the

ultrasonic waves.

(1) Frequency 29MHz max

(2) Radiated Power 20w/lithr max

(3) Period 5minuets max

9. Storage condition of products

9.1 Storage Conditions:

(1) Storage Temperature: -10℃~+40℃

(2) Relative humidity: ≦75%RH

(3) Varistor must be kept away from sunlight and stored in a non-corrosive

atmosphere.

9.2 Period of Storage: 1 year

10. ECN

Engineering Change Notice: The customer will be informed with ECN if there is

significant modification on the characteristics and materials described in Approval

Sheet.

TA-I TECHNOLOGY CO., LTD

Document No

Issued date

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TMVE-XXOS001C

2012/02/13

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Multilayer Chip Varistor for Surge and

ESD Protection – E Type Series

11. Manufacturing Country & City:

(1) TA-I TECHNOLOGY ( SU ZHOU ) CO., LTD. ( China – Su Zhou)

Tel :(+86) 512-63457879 Fax : (+86) 512-63457869

(2) TA-I TECHNOLOGY ELECTRONIC (DONGGUAN ) CO., LTD. ( China –Dongguan )

Tel : (+86) 769-8339-4790〜3 Fax : (+86) 769-8339-4794

(3) FORTUNE TASK RESISTOR FACTORY ( China – Dongguan )

Tel : (+86) 769-8339-4790〜3 Fax : (+86) 769-8339-4794

(4) TAI OHM ELECTRONICS ( M ) SDN. BHD. ( Malaysia – Penang )

Tel :(+60) 4- 3900480 Fax : (+60) 4-3901481

(5) P.T.TAI ELECTRONIC Indonesia ( Indonesia – Jakarta )

Tel :(+62) 21-44820254 Fax : (+62) 21-44820256

TA-I TECHNOLOGY CO., LTD

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