MXA6500EP [ETC]

Low Profile, Low Consumption 0.5 g Dual Axis Accelerometer with Absolute Analog Outputs; 薄型,低功耗0.5克双轴加速度计具有绝对模拟输出
MXA6500EP
型号: MXA6500EP
厂家: ETC    ETC
描述:

Low Profile, Low Consumption 0.5 g Dual Axis Accelerometer with Absolute Analog Outputs
薄型,低功耗0.5克双轴加速度计具有绝对模拟输出

文件: 总6页 (文件大小:88K)
中文:  中文翻译
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Low Profile, Low Consumption  
±0.5 g Dual Axis Accelerometer with  
Absolute Analog Outputs  
MXA6500E  
VDD  
FEATURES  
TEMP  
Low power consumption: typical 2mA@3V  
Resolution better than 1 milli-g  
Dual axis accelerometer fabricated on a monolithic  
CMOS IC  
On chip mixed signal processing  
No moving parts  
Temperature  
Internal  
VREF  
Sensor  
TP  
PD  
Oscillator  
TEMP  
No  
Connection  
CLK  
CLK  
Coarse  
Fine Gain  
Adj.  
Heater  
Control  
Gain Adj.  
Vref  
D/A  
No loose particle issues  
Low Pass  
Filter  
Temp  
Xout  
A/D  
Buf.  
Buf.  
>50,000 g shock survival rating  
5mm X 5mm X 1.55mm LCC package  
2.7V to 3.6V single supply continuous operation  
Ultra low initial Zero-g Offset  
No adjustment needed outside  
X aixs  
Comp.  
CLK TEMP  
CLK  
CLK  
CLK  
CLK  
Vref  
No  
Connection  
Coarse  
Fine Gain  
Adj.  
Gain Adj.  
Temp  
Low Pass  
Filter  
Y aixs  
Yout  
A/D  
D/A  
Comp.  
Acceleration  
Sensor  
CLK  
CLK  
CLK  
TEMP  
CLK  
CLK  
APPLICATIONS  
GND  
Tilt and motion sensing in cost-sensitive applications  
Smart handheld devices  
Computer security  
Input devices  
MXA6500E FUNCTIONAL BLOCK DIAGRAM  
Pedometers and activity monitors  
Gaming controllers  
Toys and entertainment products  
GENERAL DESCRIPTION  
The MXA6500E is a low cost; dual axis accelerometer  
fabricated on a standard, submicron CMOS process. It is a  
complete sensing system with on-chip mixed signal  
processing. The MXA6500E measures acceleration with a  
full-scale range of ±0.5 g and a sensitivity of 500mV/g @3V  
at 25°C. It can measure both dynamic acceleration (e.g.  
vibration) and static acceleration (e.g. gravity). The  
MXA6500E design is based on heat convection and requires  
no solid proof mass. This eliminates stiction and particle  
problems associated with competitive devices and provides  
shock survival greater than 50,000 g, leading to significantly  
lower failure rate and lower loss due to handling during  
assembly and at customer field application.  
The max noise floor is 1 mg/ Hz allowing signals below  
1 milli-g to be resolved at 1 Hz bandwidth. The  
MXA6500E is packaged in a hermetically sealed lowprofile  
LCC surface mount package (5 mm x 5 mm x 1.55 mm  
height). It is operational over a -40°C to +85°C temperature  
range.  
Information furnished by MEMSIC is believed to be accurate and reliable. However,  
no responsibility is assumed by MEMSIC for its use, nor for any infringements of  
patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of MEMSIC.  
©MEMSIC, Inc.  
800 Turnpike St., Suite 202, North Andover, MA 01845  
Tel: 978.738.0900  
www.memsic.com  
Fax: 978.738.0196  
MEMSIC MXA6500E Rev.B  
Page 1 of 6  
3/22/2005  
MXA6500E SPECIFICATIONS (Measurements @ 25°C, Acceleration = 0 g unless otherwise noted; VDD = 3.0V unless otherwise  
specified)  
MXA6500E  
Parameter  
Conditions  
Units  
Min  
Typ  
Max  
SENSOR INPUT  
Each Axis  
Measurement Range1  
g
±0.5  
Nonlinearity  
Best fit straight line  
X Sensor to Y Sensor  
Each Axis  
0.5  
±1.0  
0.01  
±2  
1.0  
% of FS  
degrees  
degrees  
%
Alignment Error2  
Alignment Error  
Cross Axis Sensitivity3  
SENSITIVITY  
Sensitivity,  
VDD = 3.0V  
475  
-50  
500  
525  
155  
mV/g  
%
Sensitivity Change over  
Temperature4  
Delta from 25°C at -40°C  
Delta from 25°C at +85°C  
Each Axis  
ZERO g BIAS LEVEL  
0 g Offset  
VDD = 3.0V  
1.20  
-0.10  
1.25  
0.00  
0.5  
1.30  
0.10  
V
g
mg/°C  
0 g Offset  
0 g Offset vs. Temperature4  
Delta from 25°C  
@25°C  
NOISE PERFORMANCE  
Noise Density, rms  
FREQUENCY RESPONSE  
3dB Bandwidth  
0.4  
17  
1.0  
19  
mg/ Hz  
15  
Hz  
POWER SUPPLY  
Operating Voltage Range  
Quiescent Supply Current  
OUTPUTS PERFORMANCE  
Output High Voltage  
Output Low Voltage  
Current  
2.7  
3.6  
V
mA  
@3.0V supply  
@3.0V supply  
2.0  
2.30  
-40  
V
V
uA  
0.20  
100  
Source or sink @ 3.0V-3.6V Supply  
@3.0V supply  
Turn-On Time5  
TEMPERATURE RANGE  
Operating Range  
75  
mS  
+85  
°C  
NOTES  
1
Guaranteed by measurement of initial offset and sensitivity.  
2
Alignment error is specified as the angle between the true and indicated axis of  
sensitivity.  
3
Cross axis sensitivity is the algebraic sum of the alignment and the inherent  
sensitivity errors.  
4 Defined as the output change from ambient to maximum temperature or ambient to  
minimum temperature.  
5 Output settled to within ±17mg.  
MEMSIC MXA6500E Rev.B  
Page 2 of 6  
3/22/2005  
ABSOLUTE MAXIMUM RATINGS*  
Supply Voltage (VDD ………………...-0.5 to +7.0V  
)
Storage Temperature ……….…………-65°C to +150°C  
Acceleration ……………………………………..50,000 g  
*Stresses above those listed under Absolute Maximum Ratings may cause permanent  
damage to the device. This is a stress rating only; the functional operation of the  
device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
Pin Description: LCC-8 Package  
Pin  
1
2
3
4
5
6
7
8
Name  
PD  
TP  
COM  
NC  
NC  
Yout  
Xout  
VDD  
Description  
Power Down Control  
Connect to ground  
Common  
Do Not Connect  
Do Not Connect  
Y Channel Output  
X Channel Output  
2.7V to 3.6V  
THEORY OF OPERATION  
The MEMSIC device is a complete dual-axis acceleration  
measurement system fabricated on a monolithic CMOS IC  
process. The device operation is based on heat transfer by  
natural convection and operates like other accelerometers  
having a proof mass. The proof mass in the MEMSIC  
sensor is a gas.  
Ordering Guide  
Model  
Package Style  
Temperature Range  
LCC8  
RoHS compliant  
A single heat source, centered in the silicon chip is  
suspended across a cavity. Equally spaced  
aluminum/polysilicon thermopiles (groups of  
MXA6500EP  
MXA6500EB  
-40 to 85°C  
-40 to 85°C  
LCC8, Pb-free  
thermocouples) are located equidistantly on all four sides of  
the heat source (dual axis). Under zero acceleration, a  
temperature gradient is symmetrical about the heat source,  
so that the temperature is the same at all four thermopiles,  
causing them to output the same voltage.  
All parts are shipped in tape and reel packaging.  
Caution: ESD (electrostatic discharge) sensitive device.  
Acceleration in any direction will disturb the temperature  
profile, due to free convection heat transfer, causing it to be  
asymmetrical. The temperature, and hence voltage output  
of the four thermopiles will then be different. The  
differential voltage at the thermopile outputs is directly  
proportional to the acceleration. There are two identical  
acceleration signal paths on the accelerometer, one to  
measure acceleration in the x-axis and one to measure  
acceleration in the y-axis. Please visit the MEMSIC  
website at www.memsic.com for a picture/graphic  
description of the free convection heat transfer principle.  
Note: The MEMSIC logo’s arrow indicates the -X sensing  
direction of the device. The +Y sensing direction is rotated 90°  
away from the +X direction following the right-hand rule. Small  
circle indicates pin one(1)  
MEMSIC MXA6500E Rev.B  
Page 3 of 6  
3/22/2005  
PIN DESCRIPTIONS  
DD – This is the supply input for the circuits and the  
sensor heater in the accelerometer. The DC voltage should  
be between 2.7 and 3.6 volts. Refer to the section on PCB  
layout and fabrication suggestions for guidance on external  
parts and connections recommended.  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
COM– This is the ground pin for the accelerometer.  
TP- This pin should be connected to the ground.  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (C)  
Thermal Accelerometer Sensitivity  
Xout – This pin is the output of the x-axis acceleration  
sensor. The user should ensure the load impedance is  
sufficiently high as to not source/sink >100µA. While the  
sensitivity of this axis has been programmed at the factory  
to be the same as the sensitivity for the y-axis, the  
accelerometer can be programmed for non-equal sensitivities  
on the x- and y-axes. Contact the factory for additional  
information.  
In gaming applications where the game or controller is  
typically used in a constant temperature environment,  
sensitivity might not need to be compensated in hardware  
or software. Any compensation for this effect could be  
done instinctively by the game player.  
For applications where sensitivity changes of a few percent  
are acceptable, the above equation can be approximated  
with a linear function. Using a linear approximation, an  
external circuit that provides a gain adjustment of –1.1%/°C  
would keep the sensitivity within 10% of its room  
temperature value over a 0°C to +50°C range.  
Yout This pin is the output of the y-axis acceleration  
sensor. The user should ensure the load impedance is  
sufficiently high as to not source/sink >100µA.  
While the sensitivity of this axis has been programmed at  
the factory to be the same as the sensitivity for the x-axis,  
the accelerometer can be programmed for non-equal  
sensitivities on the x- and y-axes. Contact the factory for  
additional information.  
For applications that demand high performance, a low cost  
micro-controller can be used to implement the above  
equation. A reference design using a Microchip MCU (p/n  
16F873/04-SO) and MEMSIC developed firmware is  
available by contacting the factory. With this reference  
design, the sensitivity variation over the full temperature  
range (-40°C to +85°C) can be kept below 3%. Please visit  
the MEMSIC web site at www.memsic.com for reference  
design information on circuits and programs including look  
up tables for easily incorporating sensitivity compensation.  
PD Pin 1 is the power down control pin. Pull this pin HIGH  
will put the accelerometer into power down mode. When the part  
goes into power down mode, the total current will be smaller than  
0.1uA at 3V.  
In normal operation mode, this pin should be connected to  
Ground.  
COMPENSATION FOR THE CHANGE IN  
SENSITIVITY OVER TEMPERATURE  
DISCUSSION OF TILT APPLICATIONS AND  
RESOLUTION  
All thermal accelerometers display the same sensitivity  
change with temperature. The sensitivity change depends  
on variations in heat transfer that are governed by the laws  
of physics. The sensitivity change is governed by the  
following equation (and shown in following figure in °C):  
Tilt Applications: One of the most popular applications of  
the MEMSIC accelerometer product line is in  
tilt/inclination measurement. An accelerometer uses the  
force of gravity as an input to determine the inclination  
angle of an object.  
Si x Ti3.40 = Sf x Tf3.40  
A MEMSIC accelerometer is most sensitive to changes in  
position, or tilt, when the accelerometer’s sensitive axis is  
perpendicular to the force of gravity, or parallel to the  
Earth’s surface. Similarly, when the accelerometer’s axis is  
parallel to the force of gravity (perpendicular to the Earth’s  
surface), it is least sensitive to changes in tilt.  
where Si is the sensitivity at any initial temperature Ti, and  
Sf is the sensitivity at any other final temperature Tf with  
the temperature values in °K.  
Following table and figure help illustrate the output  
changes in the X- and Y-axes as the unit is tilted from +90°  
to 0°. Notice that when one axis has a small change in  
output per degree of tilt (in mg), the second axis has a large  
change in output per degree of tilt. The complementary  
nature of these two signals permits low cost accurate tilt  
MEMSIC MXA6500E Rev.B  
Page 4 of 6  
3/22/2005  
sensing to be achieved with the MEMSIC device (reference  
application note AN-00MX-007).  
POWER SUPPLY NOISE REJECTION  
One capacitor is recommended for best rejection of power  
supply noise (reference figure below). The capacitor should  
be located as close as possible to the device supply pin  
(VDD). The capacitor lead length should be as short as  
possible, and surface mount capacitor is preferred. For  
typical applications, the capacitor can be ceramic 0.1 µF.  
Accelerometer Position Relative to Gravity  
X-Axis  
Y-Axis  
X-Axis  
Orientation  
Change  
Change  
To Earth’s  
X Output per deg. Y Output per deg.  
Surface  
(deg.)  
90  
(g)  
of tilt  
(mg)  
0.15  
1.37  
2.88  
(g)  
of tilt  
(mg)  
17.45  
17.37  
17.16  
16.35  
15.04  
12.23  
8.59  
5.86  
2.88  
1.37  
0.15  
1.000  
0.996  
0.985  
0.940  
0.866  
0.707  
0.500  
0.342  
0.174  
0.087  
0.000  
0.000  
0.087  
0.174  
0.342  
0.500  
0.707  
0.866  
0.940  
0.985  
0.996  
1.000  
Power Supply Noise Rejection  
85  
80  
70  
60  
45  
30  
20  
10  
5.86  
8.59  
PCB LAYOUT AND FABRICATION SUGGESTIONS  
12.23  
15.04  
16.35  
17.16  
17.37  
17.45  
1. It is best to solder a 0.1uF capacitor directly across VDD  
and COM pin.  
2. Robust low inductance ground wiring should be used.  
3. Care should be taken to ensure there is “thermal  
symmetry” on the PCB immediately surrounding the  
MEMSIC device and that there is no significant heat  
source nearby.  
5
0
Changes in Tilt for X- and Y-Axes  
Resolution: The accelerometer resolution is limited by  
noise. The output noise will vary with the measurement  
bandwidth. With the reduction of the bandwidth, by  
applying an external low pass filter, the output noise drops.  
Reduction of bandwidth will improve the signal to noise  
ratio and the resolution. The output noise scales directly  
with the square root of the measurement bandwidth. The  
maximum amplitude of the noise, its peak- to- peak value,  
approximately defines the worst case resolution of the  
measurement. With a simple RC low pass filter, the rms  
noise is calculated as follows:  
4. A metal ground plane should be added directly beneath  
the MEMSIC device. The size of the plane should be  
similar to the MEMSIC device’s footprint and be as  
thick as possible.  
5. Vias can be added symmetrically around the ground  
plane. Vias increase thermal isolation of the device  
from the rest of the PCB.  
Noise (mg rms) = Noise(mg/ Hz ) *  
(Bandwidth(Hz)*1.6)  
The peak-to-peak noise is approximately equal to 6.6 times  
the rms value (for an average uncertainty of 0.1%).  
MEMSIC MXA6500E Rev.B  
Page 5 of 6  
3/22/2005  
LCC-8 LOW PROFILE PACKAGE DRAWING  
Hermetically Sealed Package Outline  
MEMSIC MXA6500E Rev.B  
Page 6 of 6  
3/22/2005  

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