NTP75N06L/D [ETC]

Power MOSFET 75 Amps, 60 Volts, Logic Level ; 功率MOSFET 75安培, 60伏特,逻辑电平\n
NTP75N06L/D
型号: NTP75N06L/D
厂家: ETC    ETC
描述:

Power MOSFET 75 Amps, 60 Volts, Logic Level
功率MOSFET 75安培, 60伏特,逻辑电平\n

文件: 总8页 (文件大小:72K)
中文:  中文翻译
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NTP75N06L, NTB75N06L  
Power MOSFET  
75 Amps, 60 Volts, Logic Level  
2
N–Channel TO–220 and D PAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
Typical Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
75 AMPERES  
60 VOLTS  
R
= 11 m  
DS(on)  
N–Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol Value  
Unit  
Drain–to–Source Voltage  
Drain–to–Gate Voltage (R  
V
V
60  
60  
Vdc  
Vdc  
Vdc  
DSS  
= 10 M)  
G
GS  
DGR  
Gate–to–Source Voltage  
– Continuous  
4
V
V
"20  
"15  
GS  
GS  
S
– Non–Repetitive (t v10 ms)  
p
4
Drain Current  
1
2
– Continuous @ T = 25°C  
I
I
75  
50  
225  
Adc  
Apk  
A
D
D
– Continuous @ T = 100°C  
3
A
– Single Pulse (t v10 µs)  
I
p
DM  
P
2
D PAK  
TO–220AB  
CASE 221A  
STYLE 5  
Total Power Dissipation @ T = 25°C  
214  
1.4  
2.4  
W
W/°C  
W
A
D
CASE 418B  
STYLE 2  
Derate above 25°C  
1
Total Power Dissipation @ T = 25°C (Note 1.)  
A
2
3
Operating and Storage Temperature Range  
T , T  
stg  
–55 to  
+175  
°C  
J
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Single Pulse Drain–to–Source Avalanche  
E
AS  
844  
mJ  
4
Energy – Starting T = 25°C  
J
4
Drain  
(V  
I
= 50 Vdc, V  
= 75 A, V  
DS  
= 5.0 Vdc, L = 0.3 mH  
DD  
L(pk)  
GS  
= 60 Vdc)  
Drain  
Thermal Resistance  
– Junction–to–Case  
°C/W  
°C  
R
R
0.7  
62.5  
θJC  
θJA  
NTB75N06L  
LLYWW  
– Junction–to–Ambient (Note 1.)  
NTP75N06L  
LLYWW  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
260  
L
2
1
3
1
Gate  
3
1. When surface mounted to an FR4 board using minimum recommended pad  
Drain  
Gate  
Source  
Source  
2
size, (Cu Area 0.412 in ).  
2
NTx75N06L = Device Code  
Drain  
LL  
= Location Code  
= Year  
Y
WW  
= Work Week  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTP75N06L  
NTB75N06L  
NTB75N06LT4  
TO–220AB  
50 Units/Rail  
50 Units/Rail  
2
D PAK  
2
D PAK  
800/Tape & Reel  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
April, 2001 – Rev. 0  
NTP75N06L/D  
NTP75N06L, NTB75N06L  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–to–Source Breakdown Voltage (Note 2.)  
(V = 0 Vdc, I = 250 µAdc)  
V
Vdc  
(BR)DSS  
60  
72  
74  
GS  
D
Temperature Coefficient (Positive)  
mV/°C  
µAdc  
Zero Gate Voltage Drain Current  
I
DSS  
(V  
DS  
(V  
DS  
= 60 Vdc, V  
= 60 Vdc, V  
= 0 Vdc)  
= 0 Vdc, T = 150°C)  
10  
100  
GS  
GS  
J
Gate–Body Leakage Current (V  
= ±15 Vdc, V  
DS  
= 0 Vdc)  
I
±100  
nAdc  
Vdc  
GS  
GSS  
ON CHARACTERISTICS (Note 2.)  
Gate Threshold Voltage (Note 2.)  
V
GS(th)  
(V  
= V , I = 250 µAdc)  
1.0  
1.58  
6.0  
2.0  
DS  
GS  
D
Threshold Temperature Coefficient (Negative)  
mV/°C  
Static Drain–to–Source On–Resistance (Note 2.)  
R
V
mOhm  
DS(on)  
(V = 5.0 Vdc, I = 37.5 Adc)  
9.0  
11  
GS  
D
Static Drain–to–Source On–Voltage (Note 2.)  
Vdc  
DS(on)  
(V  
GS  
(V  
GS  
= 5.0 Vdc, I = 75 Adc)  
0.75  
0.61  
0.99  
D
= 5.0 Vdc, I = 37.5 Adc, T = 150°C)  
D
J
Forward Transconductance (Note 2.) (V  
= 15 Vdc, I = 37.5 Adc)  
g
FS  
55  
mhos  
pF  
DS  
D
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
3122  
1029  
276  
4370  
1440  
390  
iss  
(V  
DS  
= 25 Vdc, V  
= 0 Vdc,  
GS  
f = 1.0 MHz)  
Output Capacitance  
Transfer Capacitance  
C
oss  
C
rss  
SWITCHING CHARACTERISTICS (Note 3.)  
Turn–On Delay Time  
t
22  
265  
113  
170  
66  
32  
370  
160  
240  
92  
ns  
d(on)  
Rise Time  
t
r
(V  
DD  
GS  
= 30 Vdc, I = 75 Adc,  
D
V
= 5.0 Vdc, R = 9.1 ) (Note 2.)  
G
Turn–Off Delay Time  
Fall Time  
t
d(off)  
t
f
Gate Charge  
Q
T
Q
1
Q
2
nC  
(V  
DS  
= 48 Vdc, I = 75 Adc,  
D
= 5.0 Vdc) (Note 2.)  
9.0  
47  
V
GS  
SOURCE–DRAIN DIODE CHARACTERISTICS  
Forward On–Voltage  
(I = 75 Adc, V  
= 0 Vdc) (Note 2.)  
V
SD  
1.0  
0.9  
1.15  
Vdc  
ns  
S
GS  
(I = 75 Adc, V  
S
= 0 Vdc, T = 150°C)  
GS  
J
Reverse Recovery Time  
t
rr  
70  
43  
(I = 75 Adc, V  
= 0 Vdc,  
GS  
S
t
a
dI /dt = 100 A/µs) (Note 2.)  
S
t
b
27  
Reverse Recovery Stored Charge  
Q
0.16  
µC  
RR  
2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2%.  
3. Switching characteristics are independent of operating junction temperatures.  
http://onsemi.com  
2
NTP75N06L, NTB75N06L  
160  
140  
120  
160  
V
= 4.5 V  
V
DS  
w 10 V  
GS  
V
GS  
= 10 V  
140  
120  
V
= 5 V  
GS  
V
= 6 V  
GS  
V
= 4 V  
GS  
100  
80  
100  
80  
V
V
= 7 V  
= 8 V  
GS  
V
GS  
= 3.5 V  
GS  
60  
60  
40  
40  
T = 25°C  
J
V
= 3 V  
GS  
20  
0
20  
0
T = 100°C  
J
T = –55°C  
J
0
1
2
3
4
1.4  
1.8 2.2 2.6  
3
3.4  
3.8 4.2 4.6  
5
V , DRAIN–TO–SOURCE VOLTAGE (V)  
DS  
V , GATE–TO–SOURCE VOLTAGE (V)  
GS  
Figure 1. On–Region Characteristics  
Figure 2. Transfer Characteristics  
0.02  
0.02  
V
GS  
= 5 V  
V
GS  
= 10 V  
0.016  
0.016  
T = 100°C  
J
T = 100°C  
J
0.012  
0.008  
0.004  
0.012  
0.008  
0.004  
T = 25°C  
J
T = 25°C  
J
T = –55°C  
J
T = –55°C  
J
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
I , DRAIN CURRENT (AMPS)  
D
I , DRAIN CURRENT (AMPS)  
D
Figure 3. On–Resistance vs. Gate–to–Source  
Voltage  
Figure 4. On–Resistance vs. Drain Current and  
Gate Voltage  
2
1.8  
1.6  
1.4  
1.2  
1
100000  
10000  
I
V
= 37.5 A  
V
GS  
= 0 V  
D
= 5 V  
GS  
T = 150°C  
J
T = 125°C  
J
1000  
100  
10  
T = 100°C  
J
0.8  
0.6  
–50 –25  
0
25  
50  
75 100 125 150 175  
0
10  
20  
30  
40  
50  
60  
T , JUNCTION TEMPERATURE (°C)  
J
V , DRAIN–TO–SOURCE VOLTAGE (V)  
DS  
Figure 5. On–Resistance Variation with  
Temperature  
Figure 6. Drain–to–Source Leakage Current  
vs. Voltage  
http://onsemi.com  
3
NTP75N06L, NTB75N06L  
12000  
10000  
8000  
6000  
4000  
2000  
0
6
V
= 0 V  
V
= 0 V  
T = 25°C  
DS  
GS  
J
Q
Q
T
5
4
3
2
1
V
GS  
Q
1
C
iss  
2
C
rss  
C
iss  
C
oss  
I
= 75 A  
D
J
C
rss  
T = 25°C  
0
10  
5
V
GS  
0 V  
DS  
5
10  
15  
20  
25  
0
10  
20  
30  
40  
50  
60  
70  
GATE–TO–SOURCE OR DRAIN–TO–SOURCE (V)  
Q , TOTAL GATE CHARGE (nC)  
g
Figure 7. Capacitance Variation  
Figure 8. Gate–to–Source and  
Drain–to–Source Voltage vs. Total Charge  
1000  
100  
10  
80  
70  
60  
50  
40  
30  
20  
V
= 30 V  
DS  
V
= 0 V  
GS  
I
V
= 75 A  
T = 25°C  
J
D
= 5 V  
GS  
t
r
t
f
t
t
d(off)  
10  
0
d(on)  
1
10  
100  
0.6  
0.64 0.68 0.72 0.76 0.8 0.84 0.86 0.92 0.96  
, SOURCE–TO–DRAIN VOLTAGE (V)  
R
, GATE RESISTANCE ()  
V
SD  
G
Figure 9. Resistive Switching Time Variations  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
100  
10  
1000  
V
= 15 V  
I
D
= 75 A  
GS  
SINGLE PULSE  
= 25°C  
10 µs  
T
C
800  
600  
400  
200  
0
100 µs  
1 ms  
10 ms  
dc  
R
LIMIT  
DS(on)  
THERMAL LIMIT  
PACKAGE LIMIT  
1
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
175  
V , DRAIN–TO–SOURCE VOLTAGE (V)  
DS  
T , STARTING JUNCTION TEMPERATURE (°C)  
J
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Avalanche Energy vs.  
Starting Junction Temperature  
http://onsemi.com  
4
NTP75N06L, NTB75N06L  
1.0  
D = 0.5  
0.2  
0.1  
P
(pk)  
0.1  
0.05  
R
(t) = r(t) R  
θJC  
θJC  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
0.02  
t
READ TIME AT t  
1
1
0.01  
t
2
T
J(pk)  
– T = P  
R
(t)  
C
(pk) θJC  
DUTY CYCLE, D = t /t  
1 2  
SINGLE PULSE  
0.0001  
0.01  
0.00001  
0.001  
0.01  
t, TIME (µs)  
0.1  
1.0  
10  
Figure 13. Thermal Response  
http://onsemi.com  
5
NTP75N06L, NTB75N06L  
PACKAGE DIMENSIONS  
TO–220 THREE–LEAD  
TO–220AB  
CASE 221A–09  
ISSUE AA  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
–T–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
C
B
F
T
S
4
1
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.46  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
---  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
---  
A
K
Q
Z
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.018  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
---  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
---  
2
3
U
H
G
H
J
K
L
L
R
N
Q
R
S
T
V
J
G
D
U
V
Z
N
0.080  
2.04  
STYLE 5:  
PIN 1. GATE  
2. DRAIN  
3. SOURCE  
4. DRAIN  
http://onsemi.com  
6
NTP75N06L, NTB75N06L  
PACKAGE DIMENSIONS  
2
D PAK  
CASE 418B–03  
ISSUE D  
C
E
V
–B–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
4
2. CONTROLLING DIMENSION: INCH.  
INCHES  
DIM MIN MAX  
MILLIMETERS  
A
MIN  
8.64  
9.65  
4.06  
0.51  
1.14  
MAX  
9.65  
10.29  
4.83  
0.89  
1.40  
A
B
C
D
E
G
H
J
0.340  
0.380  
0.160  
0.020  
0.045  
0.380  
0.405  
0.190  
0.035  
0.055  
S
1
2
3
–T–  
SEATING  
PLANE  
K
0.100 BSC  
2.54 BSC  
0.080  
0.018  
0.090  
0.575  
0.045  
0.110  
0.025  
0.110  
0.625  
0.055  
2.03  
0.46  
2.79  
0.64  
J
G
K
S
V
2.29  
14.60  
1.14  
2.79  
15.88  
1.40  
H
D 3 PL  
M
M
T B  
0.13 (0.005)  
STYLE 2:  
PIN 1. GATE  
2. DRAIN  
3. SOURCE  
4. DRAIN  
http://onsemi.com  
7
NTP75N06L, NTB75N06L  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or  
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold  
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable  
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.  
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NTP75N06L/D  

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