NUF4107FC/D [ETC]
Advance Information 4 Channel EMI Pi-Filter Array with Full USB Filter ; 与完整的USB过滤器超前信息4通道EMI丕滤波器阵列\n
| 型号： | NUF4107FC/D |
| 厂家： | 
ETC |
| 描述： | Advance Information 4 Channel EMI Pi-Filter Array with Full USB Filter
|
| 文件： | 总6页 (文件大小：54K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NUF4107FC
Advance Information
4 Channel EMI Pi−Filter
Array with Full USB Filter
This device is a 4 channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
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CIRCUIT DESCRIPTION
R
1
A1
A2
A3
A4
A5
A6
Features
C1
C2
C3
C4
C5
C6
C
1
2
3
D
D
D
D
D
1
2
• EMI Filtering and ESD Protection for Data Lines
• USB 1.1 Filtering Provided with Speed Detection
• Integration of 27 Discretes Offers Cost and Space Savings
• Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
R
7
B
1
R
R
R
R
R
2
3
4
C
B
2
• 350 mm Solder Spheres
• All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)
D
11
C
C
4
3
5
7
D
30 kV (Contact)
30 kV (Air)
4
6
8
B
3
• Low Profile Flip−Chip Packaging
• MSL 1
• ESD Ratings (Except Pins B1, C1 and C2):
Machine Model = C
C
C
C
5
6
8
D
D
B
4
5
6
Human Body Model = 3B
C
• ESD Ratings (Pins B1, C1 and C2):
Machine Model = C
7
B
5
Human Body Model = 2
Typical Applications
D
C
9
C
9
10
• EMI and USB Filtering and ESD Protection for Data Lines
• Cell Phones
D
10
• Handheld Portables
• Notebook Computers
• MP3 Players
FLIP−CHIP−17
CASE 499AD
STYLE TBD
A1
MAXIMUM RATINGS (T = 25°C)
A
Rating
Symbol
Value
Unit
DEVICE MARKING
ESD Discharge IEC61000−4−2 (Note 1)
− Air Discharge, Contact Discharge
Human Body Model
V
PP
kV
30
16
0.4
NUF4107
Machine Model
DC Power per Resistor
P
100
600
mW
mW
°C
R
ORDERING INFORMATION
DC Power per Package
P
T
J
Junction Temperature
T
150
Device
Package
Shipping†
Operating Temperature Range
Storage Temperature Range
1. This does not include Pins B1, C1 and C2
T
−40 to +85
−55 to +150
°C
op
NUF4107FCT1G
Flip−Chip 3000/Tape & Reel
T
stg
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
January, 2004 − Rev. P0
NUF4107FC/D
NUF4107FC
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Symbol
Characteristic
Min
6.0
−
Typ
6.8
−
Max
8.0
0.1
120
26
Unit
V
V
BR
I = 1 mA
R
I
R
V
RM
= 3.3 V per line
mA
W
R − R
EMI Filter Resistors
80
100
22
3
6
R , R
USB Resistors; Impedance Matching
USB Pull−up; Speed Detection Resistor
At 2.5 V Bias
18
W
1
2
R
1250
48
1500
60
1750
72
W
7
C
pF
pF
pF
line
C1, C2
At Pins A1 and A2; At 2.5 V Bias
At Pins B2; At 2.5 V Bias
29
36
43
C
54
68
82
power
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2
NUF4107FC
TYPICAL CHARACTERISTICS
110
108
106
104
102
100
98
25
24
23
22
21
20
19
96
94
92
90
−40
−20
0
20
40
60
80 85
−40
−20
0
20
40
60
80 85
TEMPERATURE °C
TEMPERATURE °C
Figure 1. USB 1.1 Resistors (R1, R2) vs. Temperature
Figure 2. Data Resistors (R3, R4, R5, R6)
vs. Temperature
1600
1580
1560
1540
1520
1500
1480
1460
1440
1420
1400
−40
−20
0
20
40
60
80 85
TEMPERATURE °C
Figure 3. Pull−up Resistor (R7) vs. Temperature
0
−5
0
−10
−20
−30
−40
−50
−60
−70
−10
−15
−20
−25
−30
−35
−40
−80
−90
−45
−50
1
10
100
1000
10,000
1
10
100
1000
10,000
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 4. Insertion Loss Curve
EMI Filter
Figure 5. Analog Crosstalk Curve
EMI Filter
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3
NUF4107FC
Printed Circuit Board Recommendations
500 mm Pitch
300 mm Solder Ball
Parameter
PCB Pad Size
250 mm +25
250 mm −0
Pad Shape
Pad Type
Round
NSMD
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
350 mm ±25
125 mm
250 x 250 mm sq.
50/50
No Clean Type 3 or Finer
OSP Cu
Trace Width
150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 6. Solder Mask versus Non−Solder Mask Definition
T = (15−30 sec)
p
280 −
270 −
260 −
250 −
240 −
230 −
210 −
200 −
190 −
180 −
170 −
160 −
150 −
140 −
130 −
120 −
110 −
100 −
90 −
T = 260°C − 5°C
p
RAMP−UP
T = 217
L
RAMP−DOWN
t
L
(60−90 sec)
80 −
PRE−HEAT
ZONE
70 −
60 −
50 −
40 −
30 −
20 −
10 −
0 −
TIME (seconds)
Figure 7. Typical Pb−Free Solder Heating Profile
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4
NUF4107FC
PACKAGE DIMENSIONS
FLIP−CHIP−17 CSP
CASE 499AD−01
ISSUE O
4 X
D
NOTES:
A
B
E
1. DIMEG TOLERANCING PER
ASME 5M, 199
CONTRING DIMENSION: MILLIMETER.
PLANTY APPLIES TO SPHERICAL
WNS F SOLDER BALLS.
0.10
C
TERMINAL A1
LOCATOR
MILLIMETERS
DIM
A
A1
A2
D
MIN
−−−
0.210
0.380
2.960 BSC
1.330 BSC
0.300 0.350
MAX
0.740
0.270
0.430
TOP VIEW
SIDE VW
A
E
b
0.10
0.05
C
C
e
0.500 BSC
0.435 BSC
2.500 BSC
0.870 BSC
C
e1
D1
E1
SEATING
PLANE
D1
e /2
e
C
B
A
7 X
b
E1
e1
0.05
0.03
C
C
A B
1
2
3
4
5
6
BOTTOM VIEW
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5
NUF4107FC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NUF4107FC/D
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