OM6012SA [ETC]

500V Single N-Channel Hi-Rel MOSFET in a TO-254AA package ; 500V单N沟道高可靠性MOSFET采用TO - 254AA封装
OM6012SA
型号: OM6012SA
厂家: ETC    ETC
描述:

500V Single N-Channel Hi-Rel MOSFET in a TO-254AA package
500V单N沟道高可靠性MOSFET采用TO - 254AA封装

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OM6009SA OM6011SA OM6109SA OM6111SA  
OM6010SA OM6012SA OM6110SA OM6112SA  
POWER MOSFETS IN HERMETIC ISOLATED  
TO-254AA PACKAGE  
100V Thru 500V, Up To 22 Amp, N-Channel  
MOSFET In Hermetic Metal Package, With  
Optional Zener Gate Clamp Protection  
FEATURES  
• Isolated Hermetic Metal Package  
• Fast Switching  
• Low RDS(on)  
• Available Hi-Rel Screened To MIL-S-19500, TX, TXV And S Levels  
• Bi-Lateral Zener Gate Protection (Optional)  
• Ceramic Feedthroughs Available  
DESCRIPTION  
This series of hermetically packaged products feature the latest advanced MOSFET  
and packaging technology. They are ideally suited for Military requirements where  
small size, high performance and high reliability are required, and in applications  
such as switching power supplies, motor controls, inverters, choppers, audio  
amplifiers and high energy pulse circuits. The MOSFET gates are protected using  
bi-lateral zeners in the OM6109SA series.  
MAXIMUM RATINGS  
PART NUMBER  
VDS  
RDS(ON)  
.095  
.18  
ID(MAX)  
22A  
18A  
10A  
8A  
OM6009SA, OM6109SA  
OM6010SA, OM6110SA  
OM6011SA, OM6111SA  
OM6012SA, OM6112SA  
100V  
200V  
400V  
500V  
3.1  
.55  
.85  
Note: OM61XX Series include gate protection circuitry.  
SCHEMATIC  
POWER RATING  
4 11 R3  
Supersedes 1 07 R2  
3.1 - 79  
ELECTRICAL CHARACTERISTICS: TC = 25° unless otherwise noted  
STATIC P/N OM6009SA / OM6109SA  
ELECTRICAL CHARACTERISTICS: TC = 25° unless otherwise noted  
STATIC P/N OM6010SA / OM6110SA  
Parameter  
Min. Typ. Max. Units Test Conditions  
Parameter  
Min. Typ. Max. Units Test Conditions  
BVDSS Drain-Source Breakdown  
Voltage  
100  
V
VGS = 0,  
BVDSS Drain-Source Breakdown  
Voltage  
200  
V
VGS = 0,  
ID = 250 mA  
ID = 250 mA  
VGS(th) Gate-Threshold Voltage  
2.0  
4.0  
V
VDS = VGS, ID = 250 mA  
VGS(th) Gate-Threshold Voltage  
2.0  
4.0  
V
VDS = VGS ID = 250 mA  
,
IGSSF  
IGSSR  
IGSS  
Gate-Body Leakage Forward  
Gate-Body Leakage Reverse  
Gate-Body Leakage (OM6109)  
Zero Gate Voltage Drain  
Current  
100 nA VGS = 20 V  
-100 nA VGS = - 20 V  
IGSSF  
IGSSR  
IGSS  
Gate-Body Leakage Forward  
Gate-Body Leakage Reverse  
Gate-Body Leakage (OM6110)  
Zero Gate Voltage Drain  
Current  
100 nA VGS = 20 V  
- 100 nA VGS = - 20 V  
± 500 nA VGS = ± 12.8 V  
± 500 nA VGS = ± 12.8 V  
IDSS  
0.1 0.25 mA VDS = Max. Rat., VGS = 0  
IDSS  
0.1 0.25 mA VDS = Max. Rat., VGS = 0  
0.2 1.0 mA VDS = 0.8 Max. Rat., VGS = 0,  
TC = 125° C  
0.2 1.0 mA  
VDS = 0.8 Max. Rat., VGS = 0,  
TC = 125° C  
ID(on)  
On-State Drain Current1  
22  
A
VDS 2 VDS(on), VGS = 10 V  
VGS = 10 V, ID = 15 A  
ID(on)  
On-State Drain Current1  
18  
A
V
VDS 2 VDS(on), VGS = 10 V  
VGS = 10 V, ID = 10 A  
VDS(on) Static Drain-Source On-State  
Voltage1  
1.275 1.425  
.085 .095  
.130 .155  
V
VDS(on) Static Drain-Source On-State  
Voltage1  
1.4 1.8  
0.14 0.18  
0.28 0.36  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 15 A  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 10 A  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 15 A,  
TC = 125 C  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 10 A,  
TC = 125 C  
DYNAMIC  
DYNAMIC  
) W (  
) W (  
gfs  
Forward Transductance1  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Rise Time  
10.0  
S(W) VDS 2 VDS(on), ID = 15 A  
pF VGS = 0  
gfs  
Forward Transductance1  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Rise Time  
6.0  
S(W) VDS 2 VDS(on), ID = 10 A  
pF VGS = 0  
Ciss  
Coss  
Crss  
Td(on)  
tr  
1275  
550  
160  
16  
Ciss  
Coss  
Crss  
Td(on)  
tr  
1000  
250  
100  
17  
pF VDS = 25 V  
pF VDS = 25 V  
pF f = 1 MHz  
pF f = 1 MHz  
ns VDD = 30 V, ID = 5 A  
ns Rg = 5 W, VGS = 10 V  
ns VDD = 75 V, ID @18 A  
ns Rg = 5 W, VGS = 10 V  
19  
52  
(MOSFET) switching times are  
(MOSFET) switching times are  
ns  
Td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
42  
ns  
Td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
36  
essentially independent of  
essentially independent of  
operating temperature.  
ns  
operating temperature.  
ns  
24  
30  
BODY-DRAIN DIODE RATINGS AND CHARACTERISTICS  
BODY-DRAIN DIODE RATINGS AND CHARACTERISTICS  
D
D
IS  
Continuous Source Current  
- 27  
- 108  
- 2.5  
A
A
V
Modified MOSPOWER  
IS  
Continuous Source Current  
- 18  
- 72  
- 2  
A
A
V
Modified MOSPOWER  
(Body Diode)  
Source Current1  
symbol showing  
(Body Diode)  
Source Current1  
symbol showing  
G
G
ISM  
the integral P-N  
ISM  
the integral P-N  
(Body Diode)  
Diode Forward Voltage1  
Junction rectifier.  
(Body Diode)  
Diode Forward Voltage1  
Junction rectifier.  
S
S
VSD  
trr  
TC = 25 C, IS = -24 A, VGS = 0  
VSD  
trr  
TC = 25 C, IS = -18 A, VGS = 0  
Reverse Recovery Time  
200  
ns TJ = 150 C,IF = IS,  
Reverse Recovery Time  
350  
ns TJ = 150 C,IF = IS,  
dlF/ds = 100 A/ms  
dlF/ds = 100 A/ms  
1 Pulse Test: Pulse Width 300msec, Duty Cycle 2%.  
1 Pulse Test: Pulse Width 300msec, Duty Cycle 2%.  
ELECTRICAL CHARACTERISTICS: TC = 25° unless otherwise noted  
STATIC P/N OM6011SA / OM6111SA  
ELECTRICAL CHARACTERISTICS: TC = 25° unless otherwise noted  
STATIC P/N OM6012SA / OM6112SA  
Parameter  
Min. Typ. Max. Units Test Conditions  
Parameter  
Min. Typ. Max. Units Test Conditions  
BVDSS Drain-Source Breakdown  
Voltage  
400  
V
VGS = 0,  
BVDSS Drain-Source Breakdown  
Voltage  
500  
V
VGS = 0,  
ID = 250 mA  
ID = 250 mA  
VGS(th) Gate-Threshold Voltage  
2.0  
4.0  
V
VDS = VGS, ID = 250 mA  
VGS(th) Gate-Threshold Voltage  
2.0  
4.0  
V
VDS = VGS ID = 250 mA  
,
IGSSF  
IGSSR  
IGSS  
Gate-Body Leakage Forward  
Gate-Body Leakage Reverse  
Gate-Body Leakage (OM6111)  
Zero Gate Voltage Drain  
Current  
100 nA VGS = 20 V  
-100 nA VGS = - 20 V  
IGSSF  
IGSSR  
IGSS  
Gate-Body Leakage Forward  
Gate-Body Leakage Reverse  
Gate-Body Leakage (OM6112)  
Zero Gate Voltage Drain  
Current  
100 nA VGS = 20 V  
- 100 nA VGS = - 20 V  
± 500 nA VGS = ± 12.8 V  
± 500 nA VGS = ± 12.8 V  
IDSS  
0.1 0.25 mA VDS = Max. Rat., VGS = 0  
IDSS  
0.1 0.25 mA VDS = Max. Rat., VGS = 0  
0.2 1.0 mA VDS = 0.8 Max. Rat., VGS = 0,  
TC = 125° C  
0.2 1.0 mA  
VDS = 0.8 Max. Rat., VGS = 0,  
TC = 125° C  
ID(on)  
On-State Drain Current1  
10  
A
VDS 2 VDS(on), VGS = 10 V  
VGS = 10 V, ID = 5 A  
ID(on)  
On-State Drain Current1  
8.0  
A
V
VDS 2 VDS(on), VGS = 10 V  
VGS = 10 V, ID = 4 A  
VDS(on) Static Drain-Source On-State  
Voltage1  
2.35 2.75  
0.47 0.55  
0.93 1.10  
V
VDS(on) Static Drain-Source On-State  
Voltage1  
3.2 3.4  
0.8 0.85  
1.50 1.65  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 5 A  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 4 A  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 5 A,  
TC = 125 C  
RDS(on) Static Drain-Source On-State  
Resistance1  
VGS = 10 V, ID = 4 A,  
TC = 125 C  
DYNAMIC  
DYNAMIC  
) W (  
) W (  
gfs  
Forward Transductance1  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Rise Time  
4.0  
S(W) VDS 2 VDS(on), ID = 5 A  
pF VGS = 0  
gfs  
Forward Transductance1  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Rise Time  
4.0  
S(W) VDS 2 VDS(on), ID = 4 A  
pF VGS = 0  
Ciss  
Coss  
Crss  
Td(on)  
tr  
1150  
165  
70  
Ciss  
Coss  
Crss  
Td(on)  
tr  
1275  
200  
85  
pF VDS = 25 V  
pF VDS = 25 V  
pF f = 1 MHz  
pF f = 1 MHz  
17  
ns VDD = 175 V, ID @5 A  
ns Rg = 5 W, VGS = 10 V  
17  
ns VDD = 200 V, ID =4 A  
ns Rg = 5 W, VGS = 10 V  
12  
5
(MOSFET) switching times are  
ns  
(MOSFET) switching times are  
ns  
Td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
45  
Td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
42  
essentially independent of  
essentially independent of  
operating temperature.  
ns  
operating temperature.  
ns  
30  
14  
BODY-DRAIN DIODE RATINGS AND CHARACTERISTICS  
BODY-DRAIN DIODE RATINGS AND CHARACTERISTICS  
D
D
IS  
Continuous Source Current  
- 10  
- 40  
- 2  
A
A
V
Modified MOSPOWER  
IS  
Continuous Source Current  
- 8  
- 32  
- 2  
A
A
V
Modified MOSPOWER  
(Body Diode)  
Source Current1  
symbol showing  
(Body Diode)  
Source Current1  
symbol showing  
G
G
ISM  
the integral P-N  
ISM  
the integral P-N  
(Body Diode)  
Diode Forward Voltage1  
Junction rectifier.  
(Body Diode)  
Diode Forward Voltage1  
Junction rectifier.  
S
S
VSD  
trr  
TC = 25 C, IS = -10 A, VGS = 0  
VSD  
trr  
TC = 25 C, IS = -18 A, VGS = 0  
Reverse Recovery Time  
530  
ns TJ = 150 C,IF = IS,  
Reverse Recovery Time  
700  
ns TJ = 150 C,IF = IS,  
dlF/ds = 100 A/ms  
dlF/ds = 100 A/ms  
1 Pulse Test: Pulse Width 300msec, Duty Cycle 2%.  
1 Pulse Test: Pulse Width 300msec, Duty Cycle 2%.  
OM6009SA - OM6112SA  
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise noted)  
OM6009  
OM6109  
OM6010  
OM6110  
OM6011  
OM6111  
OM6012  
OM6112 Units  
Parameter  
VDS  
Drain-Source Voltage  
Drain-Gate Voltage (RGS = 1 M )  
100  
100  
± 22  
± 17  
± 88  
± 20  
125  
50  
200  
200  
± 18  
± 11  
± 72  
± 20  
125  
50  
400  
400  
± 10  
± 6  
500  
500  
± 8  
V
V
VDGR  
2
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current  
A
2
Continuous Drain Current  
± 5  
A
1
Pulsed Drain Current  
± 40  
± 20  
125  
50  
± 32  
± 20  
125  
50  
A
VGS  
Gate-Source Volt. (Unclamped Gate)  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
V
PD @ TC = 25°C  
PD @ TC = 100°C  
Junction To Case  
W
W
1.0  
1.0  
1.0  
1.0  
W/°C  
W/°C  
Junction To Ambient Linear Derating Factor  
.020  
.020  
.020  
.020  
TJ  
Operating and  
Tstg  
Storage Temperature Range  
-55 to 150 -55 to 150 -55 to 150 -55 to 150  
°C  
°C  
Lead Temperature (1/16" from case for 10 secs.)  
300  
300  
300  
300  
1
2
Pulse Test: Pulse width 300 µsec. Duty Cycle 2%.  
Package Pin Limitation = 25 Amps  
THERMAL RESISTANCE  
RthJC  
RthJA  
Junction-to-Case  
Junction-to-Ambient  
1.0  
50  
°C/W  
°C/W  
Free Air Operation  
MECHANICAL OUTLINE  
.545  
.535  
.050  
.040  
.144 DIA.  
.940  
.740  
.260  
MAX  
.540  
.200  
.100  
2 PLCS.  
3.1  
.040  
.800  
.790  
.685  
.665  
.550  
.530  
.250  
.290  
.125 DIA.  
.540  
2 PLS.  
1
2
3
.125  
2 PLCS.  
1 2  
3
Pin 1: Drain  
Pin 2: Source  
Pin 3: Gate  
.550  
.510  
.500  
MIN.  
.005  
.045  
.035  
.150  
.300  
.040 DIA.  
3 PLCS.  
.150 TYP.  
.150  
.260  
.249  
.150 TYP.  
PACKAGE OPTIONS  
MOD PAK  
Z-TAB  
6 PIN SIP  
NOTE: Standard Products are supplied with glass feedthroughs. For ceramic feedthroughs, add the letter “C” to the part number.  
Example - OMXXXXCSA MOSFETs are also available in Z-Tab, dual and quad pak styles - Please call the factory for more information.  
205 Crawford Street, Leominster, MA 01453 USA (508) 534-5776 FAX (508) 537-4246  

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