PDM41256LA12T [ETC]

256K Static RAM 32K x 8-Bit; 256K静态RAM 32K ×8位
PDM41256LA12T
型号: PDM41256LA12T
厂家: ETC    ETC
描述:

256K Static RAM 32K x 8-Bit
256K静态RAM 32K ×8位

内存集成电路 静态存储器 光电二极管
文件: 总8页 (文件大小:76K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PDM41256  
256K Static RAM  
32K x 8-Bit  
1
2
Description  
Features  
The PDM41256 is a high-performance CMOS static  
RAM organized as 32,768 x 8 bits. This product is  
produced in Paradigms proprietary CMOS  
technology which offers the designer the highest  
speed parts. Writing to this device is accomplished  
when the write enable (WE) and the chip enable  
(CE) inputs are both LOW. Reading is accomplished  
when WE remains HIGH and CE and OE are both  
LOW.  
High-speed access times  
Coml: 7, 8, 10, 12, and 15 ns  
Indl: 8, 10, 12, and 15 ns  
Low power operation (typical)  
- PDM41256SA  
3
Active: 400 mW  
Standby: 150 mW  
- PDM41256LA  
Active: 350 mW  
Standby: 25 mW  
4
The PDM41256 operates from a single +5V power  
supply and all the inputs and outputs are fully TTL-  
compatible. The PDM41256 comes in two versions,  
the standard power version PDM41256SA and a low  
power version the PDM41256LA. The two versions  
are functionally the same and only differ in their  
power consumption.  
Single +5V (±10%) power supply  
TTL-compatible inputs and outputs  
Packages  
5
Plastic SOJ (300 mil) - TSO  
Plastic TSOP - T  
The PDM41256 is available in a 28-pin plastic TSOP  
and a 28-pin 300-mil plastic SOJ.  
6
Functional Block Diagram  
7
8
9
10  
11  
12  
Rev. 2.0 - 7/17/96  
3-33  
PDM41256  
SOJ  
Pin Configurations  
TSOP  
Pin Description  
Name  
Description  
A14-A0  
I/O7-I/O0  
OE  
Address Inputs  
Data Inputs/Outputs  
Output Enable Input  
Write Enable Input  
Chip Enable Input  
Power (+5V)  
WE  
CE  
VCC  
VSS  
Ground  
Truth Table  
OE  
WE  
CE  
I/O  
MODE  
X
L
X
H
L
H
L
L
L
Hi-Z  
DOUT  
DIN  
Standby  
Read  
X
H
Write  
H
Hi-Z  
Output Disable  
NOTE: 1. H = VIH, L = VIL, X = DON’T CARE  
(1)  
Absolute Maximum Ratings  
Symbol  
Rating  
Com’l.  
Ind.  
Unit  
VTERM  
TBIAS  
TSTG  
PT  
Terminal Voltage with Respect to Vss  
Temperature Under Bias  
Storage Temperature  
–0.5 to +7.0  
–55 to +125  
–55 to +125  
1.0  
–0.5 to +7.0  
–65 to +135  
–65 to +150  
1.0  
V
°C  
°C  
W
Power Dissipation  
IOUT  
DC Output Current  
50  
50  
mA  
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in the  
operational sections of this specification is not implied. Exposure to absolute maxi-  
mum rating conditions for extended periods may affect reliability.  
Recommended DC Operating Conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
VCC  
Supply Voltage  
4.5  
0
5.0  
0
5.5  
0
V
V
VSS  
Supply Voltage  
Commercial  
Industrial  
Ambient Temperature  
Ambient Temperature  
0
25  
25  
70  
85  
°C  
°C  
–40  
3-34  
Rev. 2.0 - 7/17/96  
PDM41256  
DC Electrical Characteristics (VCC = 5.0V ± 10%)  
PSM41256SA  
PSM41256LA  
Unit  
1
2
Symbol  
Parameter  
Test Conditions  
Min.  
Max.  
Min.  
Max.  
ILI  
Input Leakage Current  
VCC = MAX., VIN = Vss to VCC  
Com’l/  
Ind.  
–5  
5
–5  
5
µA  
µA  
ILO  
Output Leakage Current  
VCC= MAX.,  
CE = VIH, VOUT = Vss to VCC  
Com’l/  
Ind.  
–5  
5
–5  
5
VIL  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
–0.5(1)  
2.2  
0.8  
6.0  
–0.5(1)  
2.2  
0.8  
6.0  
V
V
V
VIH  
VOL  
3
IOL=8 mA, VCC = Min.  
IOL = 10 mA, VCC = Min.  
0.4  
0.5  
0.4  
0.5  
VOH  
Output High Voltage  
IOH = –4 mA, VCC = Min.  
2.4  
2.4  
V
NOTE: 1. VIL(min) = –3.0V for pulse width less than 20 ns.  
4
Power Supply Characteristics  
-7  
-8  
-10  
-12  
-15  
5
Symbol Parameter  
Power Com’l. Com’l. Ind. Com’l. Ind. Com’l. Ind. Com’l. Ind. Units  
ICC  
Operating Current  
SA  
LA  
210  
190  
200  
180  
210  
190  
190  
170  
200  
180  
180  
160  
190  
170  
170  
150  
180  
160  
mA  
mA  
CE = VIL  
f = fMAX = 1/tRC  
VCC = Max  
IOUT = 0 mA  
6
ISB  
Standby Current  
CE = VIH  
SA  
LA  
SA  
LA  
90  
90  
20  
5
80  
80  
20  
5
80  
80  
20  
10  
70  
70  
20  
5
70  
70  
20  
10  
60  
60  
20  
5
60  
60  
20  
10  
50  
50  
20  
5
50  
50  
20  
10  
mA  
mA  
mA  
mA  
7
f = fMAX = 1/tRC  
VCC = Max  
ISB1  
Full Standby Current  
CE VCC – 0.2V  
8
f = 0  
VCC = Max  
VIN VCC – 0.2V or 0.2V  
SHADED AREA = PRELIMINARY DATA  
NOTE:All values are maximum guaranteed values.  
9
(1)  
Capacitance (TA = +25°C, f = 1.0 MHz)  
10  
11  
12  
Symbol  
Parameter  
Max.  
Unit  
CIN  
Input Capacitance  
Output Capacitance  
8
8
pF  
pF  
COUT  
NOTE: 1. This parameter is determined by device characterization but is not production  
tested.  
Rev. 2.0 - 7/17/96  
3-35  
PDM41256  
AC Test Conditions  
Input pulse levels  
VSS to 3.0V  
Input rise and fall times  
Input timing reference levels  
Output reference levels  
Output load  
3 ns  
1.5V  
1.5V  
See Figures 1 and 2  
Figure 1. Output Load Equivalent  
Figure 2. Output Load Equivalent  
(for t  
, t  
, t  
, t  
, t  
,
LZCE HZCE LZWE HZWE LZOE  
t
)
HZOE  
Figure 3.  
3-36  
Rev. 2.0 - 7/17/96  
PDM41256  
(1)  
Read Cycle No. 1  
1
2
3
(2)  
Read Cycle No. 2  
4
5
6
7
AC Electrical Characteristics  
Description  
--7(6)  
--8(6)  
-10(6)  
-12  
-15  
8
READ Cycle  
Sym Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units  
READ cycle time  
tRC  
tAA  
tACE  
tOH  
7
8
10  
12  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address access time  
7
7
8
8
10  
10  
12  
12  
15  
15  
9
Chip enable access time  
Output hold from address change  
Chip enable to output in low Z(3, 4, 5)  
Chip disable to output in high Z(3, 4, 5)  
Chip enable to power up time(4)  
Chip disable to power down time(4)  
Output enable access time  
3
5
3
5
3
5
3
5
3
5
tLZCE  
tHZCE  
tPU  
5
6
6
6
6
10  
11  
12  
0
0
0
0
0
0
0
0
0
0
tPD  
7
5
8
5
10  
5
12  
6
15  
8
tAOE  
tLZOE  
tHZOE  
Output enable to output in low Z(4, 5)  
Output disable to output in high Z(4, 5)  
5
6
6
6
6
SHADED AREA = PRELIMINARY DATA.  
Notes referenced are after Data Retention Table.  
Rev. 2.0 - 7/17/96  
3-37  
PDM41256  
Write Cycle No. 1 (Write Enable Controlled)  
Write Cycle No. 2 (Chip Enable Controlled)  
AC Electrical Characteristics  
Description  
-7(6)  
-8(6)  
-10(6)  
-12  
-15  
WRITE Cycle  
Sym Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units  
WRITE cycle time  
tWC  
tCW  
tAW  
7
7
7
0
0
7
6
0
0
8
8
8
0
0
8
7
0
0
10  
10  
10  
0
12  
10  
10  
0
15  
12  
12  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Chip enable to end of write  
Address valid to end of write  
Address setup time  
tAS  
Address hold from end of write  
Write pulse width  
tAH  
0
0
0
tWP  
10  
7
10  
7
11  
7
Data setup time  
tDS  
Data hold time  
tDH  
0
0
0
Write disable to output in low Z(4, 5)  
Write enable to output in high Z(4, 5)  
tLZWE  
tHZWE  
0
0
0
3
3
3
3
3
SHADED AREA = PRELIMINARY DATA.  
3-38  
Rev. 2.0 - 7/17/96  
PDM41256  
Low V Data Retention Waveform  
CC  
1
2
3
Data Retention Electrical Characteristics (LA Version Only)  
4
Symbol Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VDR  
VCC for Retention Data  
2
95  
V
ICCDR  
Data Retention Current  
CE VCC – 0.2V  
IN VCC – 0.2V  
or 0.2V  
VCC = 2V  
VCC = 3V  
500  
750  
µA  
µA  
5
V
350  
tCDR  
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
ns  
(4)  
tR  
tRC  
6
NOTES: (For three previous Electrical Characteristics tables)  
1. The device is continuously selected. Chip Enable is held in its active state.  
2. The address is valid prior to or coincident with the latest occuring Chip Enable.  
3. At any given temperature and voltage condition, tHZCE is less than tLZCE  
4. This parameter is sampled.  
5. The parameter is tested with CL = 5 pF as shown in Figure 2.Transition is measured ±200 mV from steady state voltage  
6. Vcc = 5V ± 5%.  
.
7
8
9
10  
11  
12  
Rev. 2.0 - 7/17/96  
3-39  
PDM41256  
Ordering Information  
3-40  
Rev. 2.0 - 7/17/96  

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