QFBR-5241_技术文档

ATM Multimode Fiber

Transceivers for SONET

OC-3/SDH STM-1 in Low

Cost 1x9 Package Style

HFBR-5204/-5204P/-5204T

1300 nm 500 m

HFBR-5205/-5205A/

-5205AT/-5205P/-5205T/

-5205PE

Data Sheet

1300 nm 2 km

Features

These transceivers are all

supplied in the new industry

standard 1x9 SIP package style

with either a duplex SC or a

duplex ST* connector interface.

• Full Compliance with ATM

Forum UNI SONET OC-3

Multimode Fiber Physical

Layer Specification

• Multisourced 1 x 9 Package

Style with Choice of Duplex

SC or Duplex ST* Receptacle

ATM 2000 m Backbone Links

The HFBR-5205/-5205T are

1300 nm products with optical

performance compliant with the

SONET STS-3c (OC-3) Physical

Layer Interface Specification. This

physical layer is defined in the

ATM Forum User-Network Inter-

face (UNI) Specification Version

3.0. This document references the

ANSI T1E1.2 specification for the

details of the interface for 2000

meter multimode fiber backbone

links.

• Wave Solder and Aqueous

Wash Process Compatibility

• Manufactured in an ISO 9002

Certified Facility

ATM 500 m Backbone and

Desktop Links

The HFBR-5204/-5204T are 1300

nm products which are similar to

the HFBR-5205/5205T except

that they are intended to provide

a lower cost SONET OC-3 link to

distances up to 500 meters in

62.5/125 µm multimode fiber

optic cables.

Applications

• Multimode Fiber ATM

Backbone Links

• Multimode Fiber ATM Wiring

Closet to Desktop Links

• ATM 155 Mbps/194 MBd

Encoded Links (available

upon special request)

Selected versions of these

transceivers may be used to

implement the ATM Forum UNI

Physical Layer Interface at the

155 Mbps/194 MBd rate.

Transmitter Sections

The transmitter sections of the

HFBR-5204 and HFBR-5205

series utilize 1300 nm InGaAsP

LEDs. These LEDs are packaged

in the optical subassembly portion

of the transmitter section. They

are driven by a custom silicon IC

which converts differential PECL

logic signals, ECL referenced

(shifted) to a +5 Volt supply, into

an analog LED drive current.

Description

The HFBR-5200 family of trans-

ceivers from Agilent Technologies

provide the system designer with

products to implement a range of

solutions for multimode fiber

The ATM 100 Mbps/125 MBd

Physical Layer interface is best

implemented with the HFBR-5100

family of FDDI Transceivers

which are specified for use in this

4B/5B encoded physical layer per

the FDDI PMD standard.

SONET OC-3 (SDH STM-1) physical

layers for ATM and other services.

*ST is a registered trademark of AT&T Lightguide Cable Connectors.

2

Receiver Sections

Figures 2b and 2c show the

outline drawings for options that

include mezzanine height and

extended and flush shields

respectively.

connection to a ground plane on

the circuit board.

The receiver sections of the

HFBR-5204 and HFBR-5205

series utilize InGaAs PIN photo-

diodes coupled to a custom

silicon transimpedance preampli-

fier IC. These are packaged in the

optical subassembly portion of

the receiver.

The transceiver is attached to a

printed circuit board with the nine

signal pins and the two solder

posts which exit the bottom of the

housing. The two solder posts

provide the primary mechanical

strength to withstand the loads

imposed on the transceiver by

mating with the duplex or simplex

SC or ST connectored fiber

cables.

The optical subassemblies utilize

a high volume assembly process

together with low cost lens

elements which result in a cost

effective building block.

These PIN/preamplifier combina-

tions are coupled to a custom

quantizer IC which provides the

final pulse shaping for the logic

output and the Signal Detect

function. The data output is

differential. The signal detect

output is single-ended. Both data

and signal detect outputs are

PECL compatible, ECL referenced

(shifted) to a +5 volt power

supply.

The electrical subassembly con-

sists of a high volume multilayer

printed circuit board on which the

IC chips and various surface-

mounted passive circuit elements

are attached.

Note: The “T” in the product

numbers indicates a transceiver

with a duplex ST connector

receptacle. Product numbers

without a “T” indicate transceivers

with a duplex SC connector

receptacle.

The package includes internal

shields for the electrical and

optical subassemblies to insure

low EMI emissions and high

immunity to external EMI fields.

ApplicationInformation

Package

The overall package concept for

the Agilent transceivers consists

of three basic elements; the two

optical subassemblies, an

electrical subassembly, and the

housing as illustrated in the block

diagrams in Figure 1 and

Figure 1a.

The Applications Engineering

group in the Agilent Optical

Communication Division is

available to assist you with the

technical understanding and

design trade-offs associated with

these transceivers. You can con-

tact them through your Agilent

sales representative.

The outer housing including the

duplex SC connector or the

duplex ST ports is molded of filled

non-conductive plastic to provide

mechanical strength and electrical

isolation. The solder posts of the

Agilent design are isolated from

the circuit design of the

transceiver and do not require

The package outline drawing and

pin out are shown in Figures 2,

2a, and 3. The details of this

package outline and pin out are

compliant with the multisource

definition of the 1x9 SIP. The low

profile of the Agilent transceiver

design complies with the

ELECTRICAL SUBASSEMBLY

DIFFERENTIAL

DUPLEX SC

RECEPTACLE

DATA OUT

PIN PHOTODIODE

SINGLE-ENDED

maximum height allowed for the

duplex SC connector over the

entire length of the package.

SIGNAL

QUANTIZER IC

DETECT OUT

PREAMP IC

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

DATA IN

LED

DRIVER IC

TOP VIEW

Figure 1. SC Block Diagram.

3

ELECTRICAL SUBASSEMBLY

DUPLEX ST

RECEPTACLE

DIFFERENTIAL

DATA OUT

PIN PHOTODIODE

SINGLE-ENDED

SIGNAL

DETECT OUT

QUANTIZER IC

PREAMP IC

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

DATA IN

LED

DRIVER IC

TOP VIEW

Figure 1a. ST Block Diagram.

39.12

(1.540)

12.70

(0.500)

6.35

(0.250)

MAX.

AREA

RESERVED

FOR

PROCESS

PLUG

25.40

(1.000)

12.70

(0.500)

MAX.

HFBR-5XXX

DATE CODE (YYWW)

SINGAPORE

A

5.93 ± 0.1

(0.233 ± 0.004)

+ 0.08

0.75

- 0.05

3.30 ± 0.38

+ 0.003

10.35

(0.407)

)

(0.030

(0.130 ± 0.015)

MAX.

- 0.002

2.92

(0.115)

18.52

(0.729)

+ 0.25

- 0.05

1.27

0.46

+ 0.010

- 0.002

4.14

(0.163)

)

ø

(9x)

(0.018)

(0.050

NOTE 1

23.55

(0.927)

20.32

(0.800)

16.70

(0.657)

17.32 20.32 23.32

(0.682) (0.800) (0.918)

[8x(2.54/.100)]

0.87

(0.034)

23.24

(0.915)

15.88

(0.625)

NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.

DIMENSIONS ARE IN MILLIMETERS (INCHES).

Figure 2. SC Package Outline Drawing with Standard Height.

4

42

(1.654)

MAX.

5.99

(0.236)

24.8

(0.976)

12.7

(0.500)

25.4

(1.000)

MAX.

HFBR-5103T

DATE CODE (YYWW)

SINGAPORE

+ 0.08

- 0.05

+ 0.003

0.5

(0.020)

(

- 0.002

12.0

(0.471)

MAX.

3.2

(0.126)

3.3 ± 0.38

(0.130) (± 0.015)

± 0.38

20.32

(± 0.015)

0.46

(0.018)

NOTE 1

φ

2.6

φ

+ 0.25

- 0.05

1.27

(0.102)

+ 0.010

- 0.002

0.050

(

20.32

17.4

(0.685)

[(8x (2.54/0.100)]

(0.800)

20.32

(0.800)

22.86

21.4

(0.900)

(0.843)

3.6

(0.142)

1.3

(0.051)

23.38

(0.921)

18.62

(0.733)

NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS

WITH TIN LEAD OVER NICKEL PLATING.

DIMENSIONS IN MILLIMETERS (INCHES).

Figure 2a. ST Package Outline Drawing with Standard Height.

5

29.6

(1.16)

UNCOMPRESSED

39.6

(1.56)

12.70

(0.50)

4.7

(0.185)

MAX.

AREA

RESERVED

FOR

PROCESS

PLUG

25.4

(1.00)

12.7

(0.50)

MAX.

2.0 ± 0.1

(0.079 ± 0.004)

0.51

(0.02)

SLOT WIDTH

SLOT DEPTH

10.2

+0.1

0.25

2.09

(0.08)

9.8

(0.386)

UNCOMPRESSED

-0.05

MAX.

(0.40)

+0.004

-0.002

(

0.010

)

1.3

(0.05)

3.3 ± 0.38

(0.130 ± 0.015)

20.32

(0.80)

15.8 ± 0.15

(0.622 ± 0.006)

+0.25

0.46

-0.05

+0.25

1.27

9X

+0.010

-0.002

-0.05

2X

(0.018

)

+0.010

(

0.050

)

-0.002

2.54

8X

(0.100)

20.32

(0.800)

23.8

(0.937)

20.32

(0.800)

1.3

(0.051)

2X

DIMENSIONS ARE IN MILLIMETERS (INCHES).

ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.

Figure 2b. Package Outline Drawing with Mezzanine Height and Extended Shield.

6

39.6

(1.56)

12.7

(0.50)

MAX.

4.7

(0.185)

1.01

(0.40)

AREA

RESERVED

FOR

PROCESS

PLUG

25.4

(1.00)

29.7

(1.17)

12.7

(0.50)

MAX.

2.0 ± 0.1

SLOT WIDTH

(0.079 ± 0.004)

25.8

(1.02)

2.2

SLOT DEPTH

MAX.

10.2

(0.09)

+0.1

-0.05

0.25

MAX.

(0.40)

+0.004

-0.002

(0.010

)

14.4

(0.57)

9.8

MAX.

(0.386)

22.0

(0.87)

3.3 ± 0.38

(0.130 ± 0.015)

20.32

(0.800)

15.8 ± 0.15

(0.622 ± 0.006)

+0.25

0.46

-0.05

+0.25

9x

1.27

+0.010

-0.002

-0.05

2x

(0.018

)

+0.010

-0.002

(

0.050

)

AREA

RESERVED

20.32

(0.800)

23.8

(0.937)

20.32

(0.800)

2.54

8x

(0.100)

FOR

PROCESS

PLUG

1.3

(0.051)

2x

DIMENSIONS ARE IN MILLIMETERS (INCHES).

ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.

Figure 2c. Package Outline Drawing with Mezzanine Height and Flush Shield.

1 = V

EE

N/C

2 = RD

Rx

Tx

3 = RD

4 = SD

5 = V

CC

6 = V

CC

7 = TD

8 = TD

9 = V

N/C

EE

TOP VIEW

Figure 3. Pin Out Diagram.

7

The following information is

provided to answer some of the

most common questions about

the use of these parts.

Agilent LED technology has

produced 1300 nm LED devices

with lower aging characteristics

than normally associated with

these technologies in the industry.

The industry convention is 1.5 dB

aging for 1300 nm LEDs. The

1300 nm Agilent LEDs are

specified to experience less than

1 dB of aging over normal

commercial equipment mission

life periods. Contact your Agilent

sales representative for additional

details.

cable parameters used come from

the ISO/IEC JTC1/SC 25/WG3

Generic Cabling for Customer

Premises per DIS 11801 docu-

ment and the EIA/TIA-568-A

Commercial Building

Transceiver Optical Power

Budget versus Link Length

Optical Power Budget (OPB) is

the available optical power for a

fiber optic link to accommodate

fiber cable losses plus losses due

to in-line connectors, splices,

optical switches, and to provide

margin for link aging and

Telecommunications Cabling

Standard per SP-2840.

Transceiver Signaling

Operating Rate Range and BER

Performance

For purposes of definition, the

symbol (Baud) rate, also called

signaling rate, is the reciprocal of

the symbol time. Data rate (bits/

sec) is the symbol rate divided by

the encoding factor used to

encode the data (symbols/bit).

unplanned losses due to cable

plant reconfiguration or repair.

Figure 4 was generated for the

1300 nm transceivers with an

Agilent fiber optic link model

containing the current industry

conventions for fiber cable

specifications and the draft ANSI

T1E1.2. These optical parameters

are reflected in the guaranteed

performance of the transceiver

specifications in this data sheet.

This same model has been used

extensively in the ANSI and IEEE

committees, including the ANSI

T1E1.2 committee, to establish

the optical performance

Figure 4 illustrates the predicted

OPB associated with the three

transceivers series specified in

this data sheet at the Beginning of

Life (BOL). These curves repre-

sent the attenuation and chromatic

plus modal dispersion losses

associated with the 62.5/125 µm

and 50/125 µm fiber cables only.

The area under the curves

When used in 155 Mbps SONET

OC-3 applications the perform-

ance of the 1300 nm transceivers,

HFBR-5204/5205 is guaranteed

to the full conditions listed in

individual product specification

tables.

represents the remaining OPB at

any link length, which is available

for overcoming non-fiber cable

losses.

requirements for various fiber

optic interface standards. The

12

HFBR-5205, 62.5/125 µm

10

8

HFBR-5205,

50/125 µm

6

HFBR-5204,

62.5/125 µm

4

2

HFBR-5204,

50/125 µm

0

0.3 0.5

1.0

1.5

2.0

2.5

FIBER OPTIC CABLE LENGTH (km)

Figure 4. Optical Power Budget vs.

Fiber Optic Cable Length.

8

The transceivers may be used for

other applications at signaling

rates different than 155 Mbps

with some variation in the link

optical power budget. Figure 5

gives an indication of the typical

performance of these products at

different rates.

Table B1 of Annex B of the draft

ANSI T1E1.2 Revision 3 standard.

without violating the Annex B

allocation example. In practice,

the typical contribution of the

Agilent transceivers is well below

these maximum allowed amounts.

The Agilent 1300 nm transmitters

will tolerate the worst case input

electrical jitter allowed in Annex

B without violating the worst case

output optical jitter requirements.

Recommended Handling

Precautions

Agilent recommends that normal

static precautions be taken in the

handling and assembly of these

transceivers to prevent damage

which may be induced by

electrostatic discharge (ESD).

The HFBR-5200 series of

transceivers meet MIL-STD-883C

Method 3015.4 Class 2 products.

These transceivers can also be

used for applications which

require different Bit Error Rate

(BER) performance. Figure 6

illustrates the typical trade-off

between link BER and the

receivers input optical power

level.

The Agilent 1300 nm receivers

will tolerate the worst case input

optical jitter allowed in Annex B

without violating the worst case

output electrical jitter allowed.

The jitter specifications stated in

the following 1300 nm transceiver

specification tables are derived

from the values in Table B1 of

Annex B. They represent the

worst case jitter contribution that

the transceivers are allowed to

make to the overall system jitter

Care should be used to avoid

shorting the receiver data or

signal detect outputs directly to

ground without proper current

limiting impedance.

Transceiver Jitter

Performance

The Agilent 1300 nm transceivers

are designed to operate per the

system jitter allocations stated in

2.5

-2

1 x 10

2.0

1.5

1.0

-3

1 x 10

-4

1 x 10

HFBR-5204/5205

SERIES

-5

-6

1 x 10

CENTER OF SYMBOL

0.5

0

-7

-8

-9

-10

-11

-12

1 x 10

0.5

0

25

50

75 100 125 150 175 200

SIGNAL RATE (MBd)

-6

-4

-2

0

2

4

RELATIVE INPUT OPTICAL POWER – dB

CONDITIONS:

1. PRBS 2 -1

CONDITIONS:

1. 155 MBd

2. PRBS 2 -1

7

2. DATA SAMPLED AT CENTER OF DATA SYMBOL.

7

-6

3. BER = 10

3. CENTER OF SYMBOL SAMPLING.

4. T = 25° C

A

4. T = 25° C

A

5. V

= 5 V

CC

dc

5. V

= 5 V

CC

6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

dc

6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

Figure 6. Bit Error Rate vs. Relative Receiver Input

Optical Power.

Figure 5. Transceiver Relative Optical Power Budget

at Constant BER vs. Signaling Rate.

9

optical subassemblies during

wave solder and aqueous wash

processing and acts as a dust

cover during shipping.

Shipping Container

Solder and Wash Process

Compatibility

The transceiver is packaged in a

shipping container designed to

protect it from mechanical and

ESD damage during shipment or

storage.

The transceivers are delivered

with protective process plugs

inserted into the duplex SC or

duplex ST connector receptacle.

This process plug protects the

These transceivers are compatible

with either industry standard

wave or hand solder processes.

Rx

Tx

NO INTERNAL CONNECTION

HFBR-520X

TOP VIEW

Rx

Tx

V

RD

2

RD

3

SD

4

V

TD

7

TD

8

V

EE

1

CC

6

EE

5

9

C1

C2

V

CC

R2

R3

C5

L1

C3

L2

C4

TERMINATION

AT PHY

DEVICE

R1

R4

V

CC

INPUTS

R5

R7

V

FILTER

CC

AT V

CC

TRANSCEIVER

PINS

TERMINATION

AT TRANSCEIVER

INPUTS

C6

R9

R10

R6

R8

RD

SD

V

TD

CC

NOTES:

THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT

OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT

BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.

R1 = R4 = R6 = R8 = R10 = 130 OHMS.

R2 = R3 = R5 = R7 = R9 = 82 OHMS.

C1 = C2 = C3 = C5 = C6 = 0.1 µF.

C4 = 10 µF.

L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.

Figure 7. Recommended Decoupling and Termination Circuits.

10

ground plane be provided in the

circuit board directly under the

transceiver to provide a low

inductance ground for signal

return current. This recommen-

dation is in keeping with good

high frequency board layout

practices.

Transceiver Footprint” hole

pattern defined in the original

multisource announcement which

defined the 1x9 package style.

This drawing is reproduced in

Figure 8 with the addition of ANSI

Y14.5M compliant dimensioning

to be used as a guide in the

mechanical layout of your circuit

board.

Board Layout – Decoupling

Circuit and Ground Planes

It is important to take care in the

layout of your circuit board to

achieve optimum performance

from these transceivers. Figure 7

provides a good example of a

schematic for a power supply

decoupling circuit that works well

with these parts. It is further

recommended that a contiguous

Board Layout – Hole Pattern

The Agilent transceiver complies

with the circuit board “Common

1.9 ± 0.1

.075 ± .004

ø

(2X)

–A–

20.32

.800

Ø0.000

M

A

0.8 ± 0.1

.032 ± .004

ø

(9X)

20.32

.800

Ø0.000

M

A

2.54

.100

(8X)

TOP VIEW

Figure 8. Recommended Board Layout Hole Pattern.

11

duplex SC or a duplex ST con-

nector interface, while utilizing

the same pinout on the printed

circuit board, the ST port needs

to protrude from the chassis

panel a minimum of 9.53 nm for

sufficient clearance to install the

ST connector.

duplex SC and duplex ST

transceiver packages in relation

to the chassis panel.

Board Layout – Art Work

The Applications Engineering

group is developing Gerber file

art work for a multilayer printed

circuit board layout incorporating

the recommendations above.

Contact your local Agilent sales

representative for details.

For both shielded design options,

Figures 8b and 8c identify front

panel aperture dimensions.

Regulatory Compliance

Please refer to Figure 8a for a

mechanical layout detailing the

recommended location of the

These transceiver products are

intended to enable commercial

system designers to develop

equipment that complies with the

various international regulations

governing certification of Infor-

mation Technology Equipment.

See the Regulatory Compliance

Table for details. Additional

Board Layout – Mechanical

For applications interested in

providing a choice of either a

42.0

information is available from your

Agilent sales representative.

24.8

9.53

(NOTE 1)

12.0

0.51

Electrostatic Discharge (ESD)

There are two design cases in

which immunity to ESD damage is

important.

12.09

25.4

The first case is during handling

of the transceiver prior to

mounting it on the circuit board.

It is important to use normal ESD

handling precautions for ESD

sensitive devices. These precau-

tions include using grounded

wrist straps, work benches, and

floor mats in ESD controlled

areas.

39.12

11.1

6.79

0.75

The second case to consider is

static discharges to the exterior of

the equipment chassis containing

the transceiver parts. To the

extent that the duplex SC

25.4

connector is exposed to the

outside of the equipment chassis

it may be subject to whatever ESD

system level test criteria that the

equipment is intended to meet.

NOTE 1: MINIMUM DISTANCE FROM FRONT

OF CONNECTOR TO THE PANEL FACE.

Figure 8a. Recommended Common Mechanical Layout for ST and ST 1x9

Connectored Transceivers.

12

0.8

(0.032)

2x

0.8

(0.032)

2x

+ 0.5

– 0.25

10.9

+ 0.02

– 0.01

(

0.43

)

6.35

(0.25)

MODULE

PROTRUSION

27.4 ± 0.50

(1.08 ± 0.02)

9.4

(0.374)

PCB BOTTOM VIEW

DIMENSIONS ARE IN MILLIMETERS (INCHES).

ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.

Figure 8b. Dimensions Shown for Mounting Module with Extended Shield to Panel.

connectors to protrude through,

will provide 4.6 dB more

These products are suitable for

use in designs ranging from a

desktop computer with a single

transceiver to a concentrator or

switch product with large number

of transceivers.

Electromagnetic Interference

(EMI)

shielding than one 1.2" duplex SC

rectangular cutout. Thus, in a

well-designed chassis, the duplex

ST 1x9 transceiver emissions will

be identical to the duplex SC 1x9

transceiver emissions.

Most equipment designs utilizing

these high speed transceivers

from Agilent will be required to

meet the requirements of FCC in

the United States, CENELEC

EN55022 (CISPR 22) in Europe

and VCCI in Japan.

In all well-designed chassis, the

two 0.5" holes required for ST

13

200

180

160

140

120

100

5

4

3

2

1

0

3.0

1.0

1.5

HFBR-5204/-5205

SERIES

2.0

t

– TRANSMITTER

OUTPUT OPTICAL

RISE/FALL TIMES – ns

r/f

2.5

3.0

1260

1280

1300

1320

1340

1360

-3

-2

-1

0

1

2

3

λ

– TRANSMITTER OUTPUT OPTICAL

CENTER WAVELENGTH –nm

EYE SAMPLING TIME POSITION (ns)

CONDITIONS:

C

1.T = 25° C

A

HFBR-5205 TRANSMITTER TEST RESULTS

2. V

= 5 Vdc

OF λ , ∆λ AND t ARE CORRELATED AND

CC

C

r/f

3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

4. INPUT OPTICAL POWER IS NORMALIZED TO

CENTER OF DATA SYMBOL.

COMPLY WITH THE ALLOWED SPECTRAL WIDTH

AS A FUNCTION OF CENTER WAVELENGTH FOR

VARIOUS RISE AND FALL TIMES.

5. NOTE 16 AND 17 APPLY.

Figure 9. Transmitter Output Optical Spectral Width

(FWHM) vs. Transmitter Output Optical Center

Wavelength and Rise/Fall Times.

Figure 10. Relative Input Optical Power vs. Eye Sampling

Time Position.

Regulatory Compliance Table

Feature

Test Method

MIL-STD-883C

Method 3015.4

Performance

Electrostatic Discharge

(ESD) to the Electrical

Pins

Meets Class 2 (2000 to 3999 Volts)

Withstand up to 2200 V applied between electrical

pins.

Electrostatic Discharge

(ESD) to the Duplex SC

Receptacle

Variation of

IEC 801-2

Typically withstand at least 25 kV without damage

when the Duplex SC Connector Receptacle

is contacted by a Human Body Model probe.

Electromagnetic

Interference (EMI)

FCC Class B

Transceivers typically provide a 13 dB margin

(with duplex SC receptacle) or a 9 dB margin

(with duplex ST receptacles) to the noted

standard limits when tested at a certified test

range with the transceiver mounted to a circuit

card without a chassis enclosure.

CENELEC EN55022

Class B (CISPR 22B)

VCCI Class 2

Immunity

Variation of IEC 801-3

Typically show no measurable effect from a

10 V/m field swept from 10 to 450 MHz applied

to the transceiver when mounted to a circuit card

without a chassis enclosure.

14

1.98 THICKER PANEL WILL RECESS MODULE.

(0.078) THINNER PANEL WILL PROTRUDE MODULE.

1.27

(0.05)

OPTIONAL SEPTUM

30.2

(1.19)

KEEP OUT ZONE

0.36

(0.014)

10.82

14.73

(0.426) (0.58)

13.82

(0.544)

26.4

(1.04)

BOTTOM SIDE OF PCB

12.0

(0.47)

DIMENSIONS ARE IN MILLIMETERS (INCHES).

ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.

Figure 8c. Dimensions Shown for Mounting Module Flush to Panel.

15

These transceivers are

that direct connections to

industry standard fiber optic

test equipment can be

accomplished.

Immunity

Equipment utilizing these trans-

ceivers will be subject to radio-

frequency electromagnetic fields

in some environments. These

transceivers have a high immunity

to such fields.

manufactured at the Agilent

Singapore location which is an

ISO 9002 certified facility.

Applications Support

Materials

Accessory Duplex SC

Connectored Cable Assemblies

Agilent recommends for optimal

coupling the use of flexible-body

duplex SC connectored cable.

Contact your local Agilent

Component Field Sales Office for

information on how to obtain PCB

Layouts, Test Boards and demo

boards for the 1x9 transceivers.

For additional information regard-

ing EMI, susceptibility, ESD and

conducted noise testing proce-

dures and results on the 1x9

transceiver family, please refer to

Applications Note 1075, Testing

and Measuring Electro-

Accessory Duplex ST

Connectored Cable Assemblies

Agilent recommends the use of

Duplex Push-Pull ST connectored

cable for optimal repeatibility of

the optical power coupling.

Evaluation Kits

Agilent has available three

evaluation kits for the 1x9

transceivers. The purpose of these

kits is to provide the necessary

materials to evaluate the perform-

ance of the HFBR-520X family in

a pre-existing 1x13 or 2x11

pinout system design configura-

tion or when connectored to

various test equipment.

magnetic Compatibility

Performance of the HFBR-

510X/-520X Fiber Optic

Transceivers.

Transceiver Reliability

and Performance

Qualification Data

The 1 x 9 transceivers have

passed Agilent reliability and

performance qualification testing

and are undergoing ongoing

quality monitoring. Details are

available from your Agilent sales

representative.

1. HFBR-0319 – Evaluation Test

Fixture Board:

This test fixture converts +5 V

ECL 1x9 transceivers to –5 V

ECL BNC Coax Connections so

16

HFBR-5204, and -5205 Series

Absolute Maximum Ratings

Parameter

Storage Temperature

Lead Soldering Temperature

Lead Soldering Time

Supply Voltage

Symbol

T_S

Min.

Typ.

Max.

100

260

10

Unit

°C

Reference

-40

T_SOLD

t_SOLD

V_CC

°C

sec.

V

-0.5

7.0

V_CC

1.4

50

Data Input Voltage

V

I

V

Differential Input Voltage

Output Current

V_D

I_O

V

Note 1

mA

HFBR-5204, and -5205 Series

Recommended Operating Conditions

Parameter

Ambient Operating Temperature*

Supply Voltage

Symbol

Min.

0

Typ.

Max.

Unit

°C

V

Reference

T

A

70

V_CC

4.75

5.25

Data Input Voltage - Low

Data Input Voltage - High

Data and Signal Detect Output Load

V - V_CC

-1.810

-1.165

-1.475

-0.880

V

IL

V - V_CC

IH

V

R_L

50

Ω

Note 2

*Applies to HFBR-5204 and 5205 Series except for HFBR-5205A and HFBR-5205AT. Ambient Operating Temp. for HFBR-5205A

and HFBR-5205AT is Min. -40°C and Max. 85°C.

17

HFBR-5204 and -5205 Series

Transmitter Electrical Characteristics

(T_A= 0°C to 70°C, V_CC= 4.75 V to 5.25 V)*

Parameter

Supply Current

Symbol

I_CC

Min.

Typ.

145

0.76

0

Max.

185

Unit

mA

W

Reference

Note 3

Power Dissipation

P_DISS

I_IL

0.97

Data Input Current - Low

Data Input Current - High

-350

µA

I_IH

14

350

µA

*Applies to HFBR-5204 and 5205 Series except for HFBR-5205A and HFBR-5205AT. T_Afor HFBR-5205A and HFBR-5205AT

is -40°C and 85°C.

HFBR-5204 and -5205 Series

Receiver Electrical Characteristics

(T_A= 0°C to 70°C, V_CC= 4.75 V to 5.25 V)*

Parameter

Supply Current

Symbol

I_CC

Min.

Typ.

82

Max.

145

Unit

mA

W

Reference

Note 4

Note 5

Note 6

Note 7

Note 6

Note 7

Power Dissipation

P_DISS

0.3

0.5

Data Output Voltage - Low

Data Output Voltage - High

Data Output Rise Time

V_OL- V_CC

V_OH- V_CC

t_r

-1.840

-1.045

0.35

-1.620

-0.880

2.2

V

ns

V

Data Output Fall Time

t_f

0.35

2.2

Signal Detect Output Voltage - Low

V_OL- V_CC

-1.840

-1.045

0.35

-1.620

-0.880

2.2

Signal Detect Output Voltage - High V_OH- V_CC

V

Signal Detect Output Rise Time

Signal Detect Output Fall Time

t_r

t_f

ns

0.35

2.2

*Applies to HFBR-5204 and 5205 Series except for HFBR-5205A and HFBR-5205AT. T_Afor HFBR-5205A and HFBR-5205AT

is -40°C and 85°C.

18

HFBR-5204/-5204P/-5204T

Transmitter Optical Characteristics

(T_A= 0°C to 70°C, V_CC= 4.75 V to 5.25 V)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Reference

Output Optical Power

62.5/125 µm, NA = 0.275 Fiber EOL

BOL

P_O

-21

-22

-14

dBm avg.

Note 8

Output Optical Power

50/125 µm, NA = 0.20 Fiber

BOL

EOL

P_O

-24.5

-25.5

-14

dBm avg.

Note 8

Note 9

Note 10

Optical Extinction Ratio

0.03

-35

%

dB

Output Optical Power at

Logic “0” State

P_O(“0”)

-45

dBm avg.

Center Wavelength

λ_C

1270

1310

1380

nm

Spectral Width - FWHM

- nm RMS

∆λ

250

107

nm

nm RMS

Note 11

Optical Rise Time

Optical Fall Time

t_r

t_f

4

ns

Note 12

Note 13

Systematic Jitter Contributed

by the Transmitter

SJ

0.04

0

1.2

ns p-p

Random Jitter Contributed

by the Transmitter

RJ

0.52

ns p-p

Note 14

HFBR-5204/-5204P/-5204T

Receiver Optical and Electrical Characteristics

(T_A= 0°C to 70°C, V_CC= 4.75 V to 5.25 V)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Reference

Input Optical Power

P_{IN Min.}(W)

-29

dBm avg.

Note 15

Minimum at Window Edge

Figure 10

Input Optical Power

P_{IN Min.}(C)

-30

dBm avg.

Note 16

Minimum at Eye Center

Figure 10

Input Optical Power Maximum

P_{IN Max.}

SJ

-14

dBm avg.

ns p-p

Note 15

Note 17

Systematic Jitter Contributed

by the Receiver

0.2

1

1.2

Random Jitter Contributed

by the Receiver

RJ

1.91

ns p-p

Note 18

Operating Wavelength

Signal Detect - Asserted

Signal Detect - Deasserted

Signal Detect - Hysteresis

λ

1270

1380

-31

nm

dBm avg.

dB

P

A

P_D+ 1.5 dB

Note 19

Note 20

P_D

-45

1.5

0

P - P_D

A

Signal Detect Assert Time

(off to on)

55

100

350

µs

Note 21

Note 22

Signal Detect Deassert Time

(on to off)

0

110

µs

19

HFBR-5205/-5205A/-5205AT/-5205P/-5205T/-5205PE

Transmitter Optical Characteristics

(T_A= 0°C to 70°C, V_CC= 4.75 V to 5.25 V)*

Parameter

Symbol

Min.

Typ.

Max.

Unit

Reference

Output Optical Power

62.5/125 µm, NA = 0.275 Fiber EOL

BOL

P_O

-19

-20

-14

dBm avg.

Note 8

Output Optical Power

50/125 µm, NA = 0.20 Fiber

BOL

EOL

P_O

-22.5

-23.5

-14

dBm avg.

Note 8

Note 9

Note 10

Optical Extinction Ratio

0.001

-50

0.03

-35

%

dB

Output Optical Power at

Logic "0" State

P_O("0")

-45

dBm avg.

Center Wavelength

λ_C

∆λ

t_r

1270

1310

1380

nm

Note 23

Figure 9

Spectral Width – FWHM

– nm RMS

137

58

nm

nm RMS

Note 23

Figure 9

Optical Rise Time

0.6

1.0

2.1

0.04

0

3.0

ns

Note 11, 23

Figure 9

Optical Fall Time

t_f

Note 11, 23

Figure 9

Systematic Jitter Contributed

by the Transmitter

SJ

RJ

1.2

ns p-p

Note 13

Random Jitter Contributed

by the Transmitter

0.52

Note 14

*Applies to 5205 Series except for HFBR-5205A/-5205AT. T_Afor HFBR-5205A/-5205AT is -40°C and 85°C.

20

HFBR-5205/-5205A/-5205AT/-5205P/-5205T/-5205PE

Receiver Optical and Electrical Characteristics

(T_A= 0°C to 70°C, V_CC= 4.75 V to 5.25 V)*

Parameter

Symbol

Min.

Typ.

Max.

Unit

Reference

Input Optical Power

P_{IN Min.}(W)

-30

dBm avg.

Note 15

Minimum at Window Edge

Figure 10

Input Optical Power

P_{IN Min.}(C)

-31

dBm avg.

Note 16

Minimum at Eye Center

Figure 10

Input Optical Power Maximum

Operating Wavelength

P_{IN Max.}

-14

dBm avg.

nm

Note 15

λ

1260

1360

1.2

Systematic Jitter Contributed

by the Receiver

SJ

0.2

1

ns p-p

Note 17

Note 18

Random Jitter Contributed

by the Receiver

RJ

1.91

-31

ns p-p

Signal Detect - Asserted

Signal Detect - Deasserted

Signal Detect - Hysteresis

P

A

P_D+1.5 dB

dBm avg.

dB

Note 19

Note 20

P_D

-45

1.5

0

P - P_D

A

Signal Detect Assert Time

(off to on)

55

100

130

350

µs

Note 21

Note 22

Signal Detect Assert Time

(off to on)

Max

0

µs

Signal Detect Assert Time

(off to on) for -40°C to 0°C

55

Signal Detect Deassert Time

(on to off)

110

*Applies to 5205 Series except for HFBR-5205A. T_Afor HFBR-5205A is -40°C to 85°C.

Notes:

5. The power dissipation value is the

power dissipated in the receiver

itself. Power dissipation is calcu-

lated as the sum of the products of

supply voltage and currents, minus

the sum of the products of the

output voltages and currents.

6. This value is measured with respect

to V_CCwith the output terminated

into 50 Ω connected to V_CC-2 V.

7. The output rise and fall times are

measured between 20% and 80%

levels with the output connected to

V_CC-2 V through 50 Ω.

8. These optical power values are

measured with the following

conditions:

• The Beginning of Life (BOL) to

the End of Life (EOL) optical

power degradation is typically

1.5 dB per the industry conven-

tion for long wavelength LEDs.

The actual degradation observed

in Agilent’s 1300 nm LED

products is <1 dB, as specified in

this datasheet.

• Over the specified operating

voltage and temperature ranges.

• With 25 MBd (12.5 MHz square-

wave) input signal.

• At the end of one meter of noted

optical fiber with cladding modes

removed.

The average power value can be

converted to a peak power value

by adding 3 dB. Higher output

optical power transmitters are

available on special request.

1. This is the maximum voltage that

can be applied across the Differential

Transmitter Data Inputs to prevent

damage to the input ESD protection

circuit.

2. The outputs are terminated with

50 Ω connected to V_CC-2 V.

3. The power supply current needed to

operate the transmitter is provided

to differential ECL circuitry. This

circuitry maintains a nearly con-

stant current flow from the power

supply. Constant current operation

helps to prevent unwanted electrical

noise from being generated and

conducted or emitted to neighboring

circuitry.

4. This value is measured with the

outputs terminated into 50 Ω

connected to V_CC-2 V and an Input

Optical Power level of -14 dBm

average.

9. The Extinction Ratio is a measure of

the modulation depth of the optical

signal. The data “0” output optical

power is compared to the data “1”

21

peak output optical power and

expressed as a percentage. With the

transmitter driven by a 25 MBd

(12.5 MHz square-wave) input

signal, the average optical power is

measured. The data “1” peak power

is then calculated by adding 3dB to

the measured average optical power.

The data “0” output optical power is

found by measuring the optical

power when the transmitter is

driven by a logic “0” input. The

extinction ratio is the ratio of the

optical power at the “0” level

• Transmitter operating with a

155.52 MBd, 77.5 MHz square-

wave, input signal to simulate

any cross-talk present between

the transmitter and receiver

sections of the transceiver.

13. Systematic Jitter contributed by the

transmitter is defined as the com-

bination of Duty Cycle Distortion

and Data Dependent Jitter.

Systematic Jitter is measured at

50% threshold using a 155.52 MBd

(77.5 MHz square-wave), 2⁷- 1

psuedorandom data pattern input

signal.

16. All conditions of Note 15 apply except

that the measurement is made at

the center of the symbol with no

window time-width.

17. Systematic Jitter contributed by the

receiver is defined as the combina-

tion of Duty Cycle Distortion and

Data Dependent Jitter. Systematic

Jitter is measured at 50% threshold

using a 155.52 MBd (77.5 MHz

square-wave), 2⁷- 1 psuedorandom

data pattern input signal.

18. Random Jitter contributed by the

receiver is specified with a 155.52

MBd (77.5 MHz square-wave) input

signal.

19. This value is measured during the

transition from low to high levels of

input optical power.

20. This value is measured during the

transition from high to low levels of

input optical power.

21. The Signal Detect output shall be

asserted within 100 µs after a step

increase of the Input Optical Power

(130 µs for -40°C to 0°C).

22. Signal detect output shall be de-

asserted within 350 µs after a step

decrease in the Input Optical Power.

23. The HFBR-5205 transceiver

complies with the requirements for

the tradeoffs between center wave-

length, spectral width, and rise/fall

times shown in Figure 9. This figure

is derived from the FDDI PMD

standard (ISO/IEC 9314-3 : 1990

and ANSI X3.166 - 1990) per the

description in ANSI T1E1.2 Revision

3. The interpretation of this figure is

that values of Center Wavelength

and Spectral Width must lie along

the appropriate Optical Rise/Fall

Time curve.

14. Random Jitter contributed by the

transmitter is specified with a

155.52 MBd (77.5 MHz square-

wave) input signal.

15. This specification is intended to

indicate the performance of the

receiver section of the transceiver

when Input Optical Power signal

characteristics are present per the

following definitions. The Input

Optical Power dynamic range from

the minimum level (with a window

time-width) to the maximum level is

the range over which the receiver is

guaranteed to provide output data

with a Bit Error Ratio (BER) better

compared to the optical power at the

“1” level expressed as a percentage

or in decibels.

10. The transmitter will provide this low

level of Output Optical Power when

driven by a logic “0” input. This can

be useful in link troubleshooting.

11. The relationship between Full Width

Half Maximum and RMS values for

Spectral Width is derived from the

assumption of a Gaussian shaped

spectrum which results in a 2.35 X

RMS = FWHM relationship.

12. The optical rise and fall times are

measured from 10% to 90% when

the transmitter is driven by a 25

MBd (12.5 MHz square-wave) input

signal. The ANSI T1E1.2 committee

has designated the possibility of

defining an eye pattern mask for the

transmitter optical output as an

item for further study. Agilent will

incorporate this requirement into

the specifications for these products

if it is defined. The HFBR-5204 and

HFBR-5205 products typically

comply with the template require-

ments of CCITT (now ITU-T) G.957

Section 3.2.5, Figure 2 for the STM-

1 rate, excluding the optical receiver

filter normally associated with

single mode fiber measurements

which is the likely source for the

ANSI T1E1.2 committee to follow in

this matter.

than or equal to 1 x 10^-10

.

• At the Beginning of Life (BOL)

• Over the specified operating

temperature and voltage ranges

• Input is a 155.52 MBd, 2²³- 1

PRBS data pattern with 72 “1”s

and 72 “0”s inserted per the

CCITT (now ITU-T) recommenda-

tion G.958 Appendix I.

• Receiver data window time-width

is 1.23 ns or greater for the clock

recovery circuit to operate in. The

actual test data window time-

width is set to simulate the effect

of worst case optical input jitter

based on the transmitter jitter

values from the specification

tables. The test window time-

widths are as follows: HFBR-5205

and HFBR-5204 are 3.32 ns.

22

Ordering Information

The following 1300 nm

transceivers are available for

production orders through the

Agilent Component Field Sales

Offices and Authorized

Distributors world wide.

*For flush shield options, please

contact Field Sales Offices and

Authorized Distributors world

wide.

1300nm LED, ATM/SONET OC-3, 155MBd temperature range 0°C to +70°C

HFBR-5204 DuplesSC Connector1X9, 500M

HFBR-5204T Duplex ST Connector 1X9

HFBR-5204P Duplex SC Connector, Mezzanine Height

HFBR-5205

DUPLEX SC Connector 1X9, 2KM

HFBR-5205T Duplex ST Connector 1X9

HFBR-5205P Duplex SC Connector 1x9, Mezzanine Height

HFBR-5205PE Duplex SC Connector 1x9, Mezzanine Height with Extended Shield

1300nm LED, 155MBd temperature range -40°C to +85°C

HFBR-5205A ATM/SONET OC-3 DUPLEX SC Connector 1X9

HFBR-5205AT ATM/SONET OC-3 DUPLEX ST Connector1X9

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(408) 654-8675

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (+65) 6271 2451

India, Australia, New Zealand: (+65) 6271 2394

Japan: (+81 3) 3335-8152(Domestic/Interna-

tional), or 0120-61-1280(Domestic Only)

Korea: (+65) 6271 2194

Malaysia, Singapore: (+65) 6271 2054

Taiwan: (+65) 6271 2654

Data subject to change.

Obsoletes 5988-4379EN

April 6, 2002

5988-5710EN


型号：	QFBR-5241
厂家：	ETC
描述：	ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style ATM多模光纤收发器用于SONET OC - 3 / SDH STM - 1的低成本1X9封装形式\n 光纤异步传输模式 ATM
文件：	总23页 (文件大小：414K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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