RC0402JR1056RL [ETC]

GENERAL PURPOSE CHIP RESISTORS; 通用贴片电阻


型号：	RC0402JR1056RL
厂家：	ETC
描述：	GENERAL PURPOSE CHIP RESISTORS 通用贴片电阻
文件：	总10页 (文件大小：231K)
中文：	中文翻译
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DATA SHEET

GENERAL PURPOSE CHIP RESISTORS

RC0402 (Pb Free)

5%, 1%

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

SCOPE

This specification describes RC0402 series chip resistors with lead-free terminations made by thick film process.

ORDERING INFORMATION

Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and

resistance value.

YAGEO ORDERING CODE

CTC CODE

ORDERING EXAMPLE

The ordering code of a RC0402 chip resistor, value

56 X with ±1% tolerance, supplied in 7-inch tape reel

is: RC0402FR-0756RL.

RC0402 X X X XX XXXX L

( ) ( ) ( ) ( )

( )

1 TOLERANCE

NOTE

F = ±1%

J = ±5%

1. The “L” at the end of the code is only for ordering. On the reel

label, the standard CTC will be mentioned an additional stamp

“LFP”= lead free production.

( )

2 PACKAGING TYPE

2. Products with lead in terminations fulfil the same requirements

as mentioned in this datasheet.

R = Paper/PE taping reel

( )

3 TEMPERATURE COEFFICIENT OF RESISTANCE

3. Products with lead in terminations will be phased out in the

coming months (before July 1st, 2006)

– = Base on spec

( )

4 TAPING REEL

07 = 7 inch dia. Reel

10 = 10 inch dia. Reel (not preferred)

13 = 13 inch dia. Reel

( )

5 RESISTANCE VALUE

5R6, 56R, 560R, 56K, 10M.

(6) RESISTOR TERMINATIONS

L = Lead free terminations (pure Tin)

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Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

MARKING

RC0402

No marking

ynsc007

Fig. 1

CONSTRUCTION

The resistors are constructed out of

a high-grade ceramic body. Internal

metal electrodes are added at each

end and connected by a resistive

paste. The composition of the paste

is adjusted to give the approximate

required resistance and laser cutting

of this resistive layer that achieves

tolerance trims the value. The

resistive layer is covered with a

protective coat.

protective coat

handbook, 4 columns

resistor layer

inner electrode

end termination

ceramic substrate ^MBE940_a

Fig. 2 Chip resistor construction

Finally, the two external terminations (pure Tin) are added. See fig. 2.

DIMENSIONS

Table 1

protective coat

TYPE

RC0402

L (mm)

W (mm)

H (mm)

I₁(mm)

I₂(mm)

1.00 ±0.05

0.50 ±0.05

0.35 ±0.05

0.20 ±0.10

0.25 ±0.10

MBE940_a

For dimension see Table 1

Fig. 3 Chip resistor dimension

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Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

ELECTRICAL CHARACTERISTICS

FOOTPRINT AND SOLDERING

PROFILES

Table 2

For recommended footprint and

soldering profiles, please see the

special data sheet “Chip resistors

mounting”.

RC0402 1/16 W

CHARACTERISTICS

Operating Temperature Range

Maximum Working Voltage

Maximum Overload Voltage

Dielectric Withstanding Voltage

–55 °C to +155 °C

50 V

100 V

ENVIRONMENTAL DATA

5% (E24) 1 Ω to 10 MΩ

1% (E96) 1 Ω to 10 MΩ

For material declaration

information (IMDS-data) of the

products, please see the

separated info “Environmental

data”.

Resistance Range

Zero Ohm Jumper < 0.05 Ω

10 Ω < R ≤ 10 MΩ

±100 ppm/°C

±200 ppm/°C

1.0 A

Temperature Coefficient

Jumper Criteria

1 Ω < R ≤ 10 Ω

Rated Current

Maximum Current

2.0 A

PACKING STYLE AND PACKAGING QUANTITY

Table 3 Packing style and packaging quantity

PRODUCT TYPE

RC0402

PACKING STYLE

REEL DIMENSION

QUANTITY PER REEL

Paper / PE Taping Reel (R)

7" (178 mm)

10,000 units

20,000 units

50,000 units

10" (254 mm) / not preferred

13" (330 mm)

NOTE

1. For Paper/PE tape and reel specification/dimensions, please see the special data sheet “Packing” document.

www.yageo.com

Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

FUNCTIONAL DESCRIPTION

POWER RATING

MRA632

max

RC0402 rated power at 70°C is 1/16 W

RATED VOLTAGE

(%P

)

rated

100

The DC or AC (rms) continuous working voltage

corresponding to the rated power is determined by

the following formula:

V=√(P X R)

−55

50 70 100

155

(°C)

amb

Where

V=Continuous rated DC or

AC (rms) working voltage (V)

Fig. 4 Maximum dissipation (P ) in percentage of rated power

max

as a function of the operating ambient temperature (T

)

amb

P=Rated power (W)

R=Resistance value (X)

PULSE LOADING CAPABILITIES

CCB508

max

1.2/50 µs

10/700 µs

(V)

(Ω)

Fig. 5 Maximum permissible peak pulse voltage without failing to open circuit’ in accordance with DIN IEC 60040 (CO) 533 for type:

RC0402

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Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

CCB509

max

(V)

single pulse

−1

−6

−5

−4

−3

−2

−1

(s)

Fig. 6 Pulse on a regular basis for type: RC0402; maximum permissible peak pulse power as a function of pulse duration for single

pulse and repetitive pulse tp/ti = 1000

CCB507

200

max

(V)

150

100

−6

−5

−4

−3

−2

−1

(s)

Fig. 7 Pulse on a regular basis for type: RC0402; maximum permissible peak pulse voltage as a function of pulse duration

www.yageo.com

Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

TESTS AND REQUIREMENTS

Table 4 Test condition, procedure and requirements

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

MIL-STD-202F-method 304;

JIS C 5202-4.8

Temperature

At +25/–55 °C and +25/+125 °C

Refer to table 2

Coefficient of

Resistance

(T.C.R.)

Formula:

R₂–R₁

T.C.R= ------------------------- ×10⁶(ppm/°C)

R₁(t₂–t₁)

Where

t₁=+25 °C or specified room temperature

t₂=–55 °C or +125 °C test temperature

R₁=resistance at reference temperature in ohms

R₂=resistance at test temperature in ohms

MIL-STD-202F-method 107G;

IEC 60115-1 4.19

Thermal Shock

At –65 (+0/–10) °C for 2 minutes and at +155

(+10/–0) °C for 2 minutes; 25 cycles

±(0.5%+0.05 Ω) for 1% tol.

±(1.0%+0.05 Ω) for 5% tol.

MIL-R-55342D-Para 4.7.4

Low

Temperature

Operation

At –65 (+0/–5) °C for 1 hour; RCWV applied

for 45 (+5/–0) minutes

±(0.5%+0.05 Ω) for 1% tol .

±(1.0%+0.05 Ω) for 5% tol.

No visible damage

MIL-R-55342D-Para 4.7.5;

IEC 60115-1 4.13

Short Time

Overload

2.5 × RCWV applied for 5 seconds at room

temperature

±(1.0%+0.05 Ω) for 1% tol.

±(2.0%+0.05 Ω) for 5% tol.

No visible damage

MIL-STD-202F-method 302;

IEC 60115-1 4.6.1.1

Insulation

Resistance

RCOV for 1 minute

≥10 GΩ

RC0402

Type

Voltage (DC)

100 V

MIL-STD-202F-method 301;

IEC 60115-1 4.6.1.1

Dielectric

Withstand

Voltage

Maximum voltage (V_rms) applied for 1 minute

No breakdown or flashover

RC0402

Type

Voltage (AC)

100 V_rms

MIL-STD-202F-method 210C;

IEC 60115-1 4.18

Resistance to

Soldering

Heat

Unmounted chips; 260 ±5 °C for 10 ±1

seconds

±(0.5%+0.05 Ω) for 1% tol.

±(1.0%+0.05 Ω) for 5% tol.

No visible damage

MIL-STD-202F-method 108A;

IEC 60115-1 4.25.1

Life

At 70±2 °C for 1,000 hours; RCWV applied for

1.5 hours on and 0.5 hour off

±(1%+0.05 Ω) for 1% tol.

±(3%+0.05 Ω) for 5% tol.

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Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

TEST

Solderability

TEST METHOD

PROCEDURE

REQUIREMENTS

MIL-STD-202F-method 208A;

IEC 60115-1 4.17

Solder bath at 245±3 °C

Well tinned (≥95% covered)

Dipping time: 2±0.5 seconds

No visible damage

JIS C 5202.6.14;

Bending

Strength

±(1.0%+0.05 Ω) for 1% tol.

±(1.0%+0.05 Ω) for 5% tol.

No visible damage

Resistors mounted on a 90 mm glass epoxy

resin PCB (FR4)

IEC 60115-1 4.15

Bending: 5 mm

MIL-STD-202F-method 215;

IEC 60115-1 4.29

Resistance to

Solvent

lsopropylalcohol (C₃H₇OH) or dichloromethane No smeared

(CH₂Cl₂) followed by brushing

JIS C 5202 5.9;

Noise

Maximum voltage (V_rms) applied.

Value

Resistors range

IEC 60115-1 4.12

R < 100 Ω

10 dB

20 dB

30 dB

40 dB

46 dB

48 dB

100 Ω ≤ R < 1 KΩ

1 KΩ ≤ R < 10 KΩ

10 KΩ ≤ R < 100 KΩ

100 KΩ ≤ R < 1 MΩ

1 MΩ ≤ R ≤ 22 MΩ

JIS C 5202 7.5;

Humidity

(steady state)

1,000 hours; 40±2 °C; 93(+2/–3)% RH

±(0.5%+0.05 Ω) for 1% tol.

±(2.0%+0.05 Ω) for 5% tol.

IEC 60115-8 4.24.8

RCWV applied for 1.5 hours on and 0.5 hour off

EIA/IS 4.13B;

Leaching

Solder bath at 260±5 °C

No visible damage

IEC 60115-8 4.18

Dipping time: 30±1 seconds

JIS C 5202 5.8

On request

Intermittent

Overload

At room temperature; 2.5 × RCWV applied for

1 second on and 25 seconds off; total 10,000

cycles

±(1.0%+0.05 Ω) for 1% tol.

±(2.0%+0.05 Ω) for 5% tol.

Resistance to

Vibration

On request

MIL-STD-202F-method 106F;

IEC 60115-1 4.24.2

Moisture

Resistance

Heat

42 cycles; total 1,000 hours

Shown as Fig. 8

±(0.5%+0.05Ω) for 1% tol.

±(2.0%+0.05Ω) for 5% tol.

No visible damage

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Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

80 − 98%

90 − 98% RH

temperature

[°C]

initial drying

24 hours

rate of change of temperature is unspecified,

however, specimens shall not be subjected to

radiant heating from chamber conditioning processes

end of final cycle;

measurements

as specified in 2.7

+10 °C (+18 °F)

−2 °C (−3.6 °F)

initial measurements

as specified in 2.2

circulation of conditioning air shall be at a

minimum cubic rate per minute equivalent to

10 times the volume of the chamber

optional sub-cycle if specified

(2.3); sub-cycle performed during

any 5 of the first 9 cycles; humidity

uncontrolled during sub-cycle

temperature

tolerance

2 °C ( 3.6 °F)

unless otherwise

specified

voltage applied as specified in 2.4

STEP1

STEP2 STEP3

one cycle 24 hours; repeat as specified in 2.5

10 15

STEP4

STEP5 STEP6

STEP7

prior to first

cycle only

HBK073

time [h]

Fig. 8 Moisture resistance test requirements

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Sep 03, 2004 V.2

Product specification

SERIES

0402 (Pb Free)

Chip Resistor Surface Mount

REVISION HISTORY

REVISION DATE

CHANGE NOTIFICATION DESCRIPTION

Version 2

Sep 03, 2004

- Test method and procedure updated

- PE tape added (paper tape will be replaced by PE tape)

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Sep 03, 2004 V.2

RC0402JR1056RL [ETC]

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