SI-3025LUS [ETC]

Surface-Mount, Low Current Consumption, Low Dropout Voltage Dropper Type; 表面贴装,低消耗电流,低压差电压滴管式
SI-3025LUS
型号: SI-3025LUS
厂家: ETC    ETC
描述:

Surface-Mount, Low Current Consumption, Low Dropout Voltage Dropper Type
表面贴装,低消耗电流,低压差电压滴管式

调节器 输出元件
文件: 总4页 (文件大小:41K)
中文:  中文翻译
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SI-3000LUS Series  
SI-3000LUS Series  
Surface-Mount, Low Current Consumption, Low Dropout Voltage Dropper Type  
Features  
• Compact surface-mount package (SOT-89-3)  
• Output current: 250 mA  
• Low dropout voltage: VDIF 0.5 V (at IO = 250 mA)  
• 4 types of output voltages (1.8 V, 2.5 V, 3.3 V, 5.0 V) available  
• Built-in dropping type overcurrent, thermal protection circuits  
Applications  
• Auxiliary power supply for PC  
• Battery-driven electronic equipment  
Absolute Maximum Ratings  
(Ta=25°C)  
Parameter  
DC Input Voltage  
Symbol  
VIN  
Ratings  
18  
Unit  
V
DC Output Current  
IO  
250  
mA  
W
*1  
Power Dissipation  
PD  
0.75  
*2  
Junction Temperature  
Storage Temperature  
Thermal Resistance (Junction to Ambient Air)  
Tj  
–40 to +135  
–40 to +125  
146  
°C  
*2  
Top  
°C  
*1  
θj-a  
°C/W  
*1: When mounted on glass-epoxy board 40 × 40 mm (copper laminate area 2%)  
*2: Thermal protection circuits may operate if the junction temperature exceeds 135°C  
Recommended Operating Conditions  
Ratings  
Parameter  
Symbol  
Unit  
min.  
max.  
VO+2*1  
250  
*2  
Input Voltage  
VIN  
IO  
V
DC Output Current  
0
mA  
°C  
Ambient Operating Temperature  
Top  
–20  
85  
*1: VIN (max) and IO (max) are restricted by the relationship PD = (VIN - VO) × IO.  
Calculate these values referring to the reference data.  
*2: Refer to the dropout voltage section.  
SI-3000LUS Series  
Electrical Characteristics  
(Ta=25°C, VC=2V unless otherwise specified)  
Ratings  
(Under  
(Under  
(Under  
Parameter  
Symbol  
SI-3018LUS  
SI-3025LUS  
SI-3033LUS  
SI-3050LUS  
development)  
Unit  
V
development)  
development)  
min.  
typ.  
max.  
1.836  
min.  
typ.  
max.  
min.  
typ.  
max.  
min.  
4.900  
V
typ. max.  
VO  
1.764  
1.800  
2.450  
2.500  
2.550  
3.234  
V
3.300  
3.366  
0.3  
5.000  
IN=6V, I  
5.100  
Output Voltage  
Conditions  
VDIF  
V
IN=3.3V, I  
O
=10mA  
0.3  
VIN=3.3V, IO=10mA  
IN=5V, I  
O=10mA  
O
=10mA  
0.3  
0.3  
Conditions  
IO=100mA  
Dropout Voltage  
V
0.5  
10  
0.5  
0.5  
0.5  
Conditions  
VLINE  
IO=250mA  
10  
=10mA  
40  
10  
=10mA  
40  
10  
=10mA  
40  
Line Regulation  
Load Regulation  
mV  
mV  
Conditions  
VLOAD  
Conditions  
VO/Ta  
Conditions  
RREJ  
V
IN=3.3 to 5V, I  
O
=10mA  
V
IN=3.3 to 5V, I  
O
VIN=4.5 to 8V, I  
O
V
IN=6 to 10V, IO  
40  
VIN=3.3V, I  
O
=0 to 250mA  
V
IN=3.3V, I  
O
=0 to 250mA  
V
IN=5V, I  
O
=0 to 250mA  
V
IN=6V, IO=0 to 250mA  
Temperature Coeffi-  
±0.25  
±0.25  
±0.3  
±0.3  
mV/°C  
dB  
cient of Output Voltage  
Tj=0 to 100°C  
55  
IN=3.3V, f=100 to 120H  
250  
55  
55  
55  
Ripple Rejection  
Conditions  
Iq  
V
Z
V
IN=3.3V, f=100 to 120H  
Z
V
IN=5V, f=100 to 120H  
250  
=0mA  
Z
V
IN=6V, f=100 to 120H  
250  
=0mA  
Z
Quiescent Circuit  
Current  
250  
µA  
Conditions  
IS1  
V
IN=3.3V, I  
O
=0mA  
VIN=3.3V, IO=0mA  
V
IN=5V, I  
O
VIN=6V, IO  
Overcurrent Protection  
Starting Current*1  
260  
260  
260  
260  
mA  
Conditions  
VIN=3.3V  
VIN=3.3V  
VIN=5V  
VIN=6V  
*1: Is1 is specified as the 5% drop point of output voltage VO on the condition that VIN=3.3 V (5 V for SI-3033LUS, 6 V for SI-3050LUS),  
and IO=10 mA.  
External Dimensions  
(Unit : mm)  
4.5  
(1.7)  
1.6  
φ
1
2
3
Pin Arrangement  
q VIN  
0.54  
max.  
0.4  
0.49max.  
0.49max.  
w GND  
e VOUT  
Plastic Mold Package Type  
Flammability: UL94V-0  
Weight: Approx. 0.05g  
1.5  
1.5  
0.16  
SI-3000LUS Series  
Block Diagram  
V
IN  
1
3
VO  
TSD  
+
2
GND  
REF  
Standard External Circuit  
VIN  
VO  
1
3
CO: Output capacitor (10 µF or larger)  
The SI-3000LUS series can be operated on the circuit  
even if a low ESR ceramic capacitor is used as the  
output capacitor.  
CIN  
+
+
2
VIN  
CO  
GND  
CIN:Input capacitor (0.1 to 10 µF)  
This capacitor is required in the case of an inductive  
input line or long wiring.  
Reference Data  
Copper Laminate Area vs. Power Dissipation  
Tj=100°C PWB size 40 × 40  
1
Ta=25°C  
0.9  
• A monolithic IC is mounted. The inner frame stage is con-  
nected to the GND pin (pin 2). Therefore, enlarging the  
copper laminate area leading to the GND pin achieves a  
heat radiation effect.  
Ta=40°C  
Ta=60°C  
0.8  
Ta=85°C  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
• How to calculate the junction temperature  
Measure the temperature (TC) of the GND pin (pin 2) lead  
section using a thermistor, etc. Substitute this value in the  
following formula and calculate the junction temperature.  
Tj=PD×θj–c+Tc (θj–c=5°C/W)  
10  
100  
1000  
Copper Laminate Area (mm2)  
SI-3000LUS Series  
Typical Characteristics of SI-3033LUS  
(Ta=25°C)  
IO vs. VDIF Characteristics  
Output Voltage Characteristics  
Line Regulation  
3.34  
5
4
3
2
1
0.6  
lO=0mA  
3.32  
3.30  
3.28  
3.26  
3.24  
0.5  
0.4  
0.3  
0.2  
0.1  
lO=0mA  
lO=250mA  
lO=250mA  
3.220  
4
6
8
10  
0
50  
100  
150  
200  
250  
300  
0
2
4
6
8
10  
Input Voltage VIN (V)  
Output Current IO (mA)  
Input Voltage VIN (V)  
Load Regulation  
Overcurrent Protection Characteristics  
5
4
3
2
1
0
3.34  
3.32  
3.30  
3.28  
3.26  
3.24  
3.22  
V
IN=3.8V  
8V  
VIN=3.8V  
5V  
5V  
6V  
8, 10V  
0
50  
100  
150  
200  
250  
300  
0
100  
200  
300  
400  
Output Current IO (mA)  
Output Current IO (mA)  

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