11-21/BHC-AP2R1/2T [EVERLIGHT]

Technical Data Sheet 1206 Package Chip LED with Inner lens; 技术数据表与潜望式镜头1206封装LED芯片


型号：	11-21/BHC-AP2R1/2T
厂家：	EVERLIGHT ELECTRONICS CO., LTD
描述：	Technical Data Sheet 1206 Package Chip LED with Inner lens 技术数据表与潜望式镜头1206封装LED芯片可见光LED 光电
文件：	总10页 (文件大小：261K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EVERLIGHT ELECTRONICS CO.,LTD.

Technical Data Sheet

1206 Package Chip LED with Inner lens

11-21/BHC-AP2R1/2T

Features

․Package in 8mm tape on 7〞diameter reel.

․Compatible with automatic placement equipment.

․Compatible with infrared and vapor phase reflow

solder process.

․Mono-color type.

․Pb-free.

․The product itself will remain within RoHS complaint version.

Descriptions

․The 11-21 SMD Taping is much smaller than lead

frame type components, thus enable smaller board

size, higher packing density, reduced storage space

and finally smaller equipment to be obtained.

․Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

․Automotive: backlighting in dashboard and switch.

․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.

․General use.

Device Selection Guide

Chip

Part No.

Lens Color

Material

Emitted Color

Blue

11-21/BHC-AP2R1/2T

InGaN

Water Clear

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Prepared date: 17-Aug-2005

Rev. 2

Page: 1 of 10

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Package Outline Dimensions

Notes: The tolerances unless mentioned are ±0.1, unit=mm.

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 2 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Absolute Maximum Ratings (Ta=25℃)

Parameter

Symbol

Rating

Unit

Reverse Voltage

℃

Forward Current

Operating Temperature

Storage Temperature

Electrostatic

Topr

Tstg

-40 ~ +85

-40 ~ +90

℃

ESD

150

110

100

Discharge(HBM)

Power Dissipation

Peak Forward Current

(Duty 1/10 @1KHz)

I^FP

Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

Soldering Temperature

Tsol

Electro-Optical Characteristics (Ta=25℃)

Parameter

Symbol

Min.

Typ.

-----

Max.

140

Unit

mcd

deg

Condition

I^F=20mA

Luminous Intensity

Viewing Angle

2θ1/2

λp

-----

Peak Wavelength

468

Dominant Wavelength

λd

464.5

-----

2.7

-----

476.5

-----

3.7

Spectrum Radiation

Bandwidth

△λ

Forward Voltage

3.3

V^R=5V

Reverse Current

-----

μA

Notes:

1.Tolerance of Luminous Intensity: ±10%

2.Tolerance of Dominant Wavelength: ±1nm

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 3 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Bin Range Of Dom. Wavelength

Group

Bin

Min

Max

467.5

470.5

473.5

476.5

Unit

Condition

464.5

467.5

470.5

473.5

A10

A11

A12

IF =20mA

Bin Range Of Luminous Intensity

Bin

Min

Max

Unit

Condition

I^F=20mA

mcd

112

140

112

Notes:

1.Tolerance of Luminous Intensity: ±10%

2.Tolerance of Dominant Wavelength: ±1nm

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Prepared date: 17-Aug-2005

Rev. 2

Page: 4 of 10

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Typical Electro-Optical Characteristics Curves

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 5 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Label explanation

xxxxxx

CAT: Luminous Intensity Rank

HUE: Dom. Wavelength Rank

REF: Forward Voltage Rank

RoHS

xxxxxxxxxxxx

xxxx

xxxxxxxx

Reel Dimensions

Note: The tolerances unless mentioned are ±0.1, Unit = mm.

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 6 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel

Note: The tolerances unless mentioned are ±0.1, Unit = mm.

Moisture Resistant Packaging

Aluminum moisture-proof bag

Label

Desiccant

Label

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 7 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.

Confidence level : 90 %

LTPD : 10 %

Test

Sample

Size

No.

Items

Test Condition

Ac/Re

0/1

Hours/Cycles

Temp. : 260℃±5℃

Reflow Soldering

22 PCS.

6 Min.

Min. 5sec.

H : +100℃ 15min

300 Cycles

Temperature Cycle

Thermal Shock

22 PCS.

0/1

∫ 5 min

L : -40℃ 15min

H : +100℃ 5min

22 PCS.

0/1

∫ 10 sec

L : -10℃ 5min

High Temperature

Storage

Low Temperature

Storage

1000 Hrs.

Temp. : 100℃

Temp. : -40℃

22 PCS.

0/1

DC Operating Life

IF = 20 mA

1000 Hrs.

High Temperature /

High Humidity

85℃/ 85%RH

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 8 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection , otherwise slight voltage shift will cause big

current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.(To fit the MSL-2 .)

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

Everlight Electronics Co., Ltd.

Device No:SZDSE-111-B03

http://www.everlight.com

Rev. 2

Page: 9 of 10

Prepared date: 17-Aug-2005

Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

11-21/BHC-AP2R1/2T

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds

within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do

soldering of each terminal. Be careful because the damage of the product is often started at the time of

the hand solder.

5.Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a

double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether

the characteristics of the LEDs will or will not be damaged by repairing.

EVERLIGHT ELECTRONICS CO., LTD.

Office: No 25, Lane 76, Sec 3, Chung Yang Rd,

Tucheng, Taipei 236, Taiwan, R.O.C

Tel: 886-2-2267-2000, 2267-9936

Fax: 886-2267-6244, 2267-6189, 2267-6306

http://www.everlight.com

Everlight Electronics Co., Ltd.

http://www.everlight.com

Prepared date: 17-Aug-2005

Rev. 2

Page: 10 of 10

Device No:SZDSE-111-B03

Prepared by: Meng Yali

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