XRT71D03IV-F [EXAR]

PCM Jitter Attenuator, 1-Func, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, LQFP-64;
XRT71D03IV-F
型号: XRT71D03IV-F
厂家: EXAR CORPORATION    EXAR CORPORATION
描述:

PCM Jitter Attenuator, 1-Func, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, LQFP-64

衰减器 PC 电信 电信集成电路
文件: 总24页 (文件大小:116K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
SEPTEMBER 2001  
REV. 1.2.0  
Meets output jitter requirement as specified by  
ETSI TBR24  
GENERAL DESCRIPTION  
The XRT71D03 is a three channel, single chip Jitter  
Attenuator, that meets the Jitter transfer characteris-  
tics requirements specified in the ETSI TBR-24,  
Bellcore GR-499 and GR-253 standards.  
Meets the Jitter and Wander specifications  
described in T1.105.03b,GR-253 and GR-499 stan-  
dards.  
Selectable buffer size of 16 and 32 bits  
Jitter attenuator can be disabled  
Available in a 64 pin LQFP package.  
Single 3.3V or 5.0V supply.  
In addition, the XRT71D03 also meets the Jitter and  
Wander specifications described in the ANSI  
T1.105.03b 1997, Bellcore GR-253 and GR-499 stan-  
dards.  
FEATURES  
Operates over - 40° C to 85° C temperature range.  
Meets the E3/DS3/STS-1 jitter requirements  
No external components required  
APPLICATIONS  
E3/DS3 Access Equipment.  
DSLAMs  
Compliant with jitter transfer template outlined in  
ITU G.751, G.752, G.755, GR-235-CORE, GR-  
499-CORE,1995 standards  
FIGURE 1. BLOCK DIAGRAM OF THE XRT71D03  
MCLK_n  
Timing Control Block  
Phase locked Loop  
STS1_n  
ICT  
DS3/E3_n  
DJA_n  
RRCLK_n  
Write Clock  
Read Clock  
RClk_n  
RRPOS_n  
RRNEG_n  
RClkES  
RPOS_n  
RNEG_n  
FSS  
16/32 Bit FIFO  
FL_n  
RRCLKES  
Channel 0  
Channel 1  
Channel 2  
MODE_CTRL  
HOST  
Reset  
Microprocessor Serial  
Interface  
XRT71D03  
n = 0, 1, 2  
CS  
SDI SDO SClk  
Exar Corporation 48720 Kato Road, Fremont CA, 94538 (510) 668-7000 FAX (510) 668-7017 www.exar.com  
 
 
 
 
XRT71D03  
áç  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
FIGURE 2. PIN OUT OF THE XRT71D03  
AGND  
FL_2  
STS1_2  
DJA_2/CS  
MCLK_2  
GND  
RCLK_2  
VDD  
RNEG_2  
RPOS_2  
GND  
DJA_0/SCLK  
DS3/E3_0  
STS1_0  
FL0  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
AGND  
FL1  
STS1_1  
MCLK_1  
GND  
RCLK_1  
RPOS_1  
RNEG_1  
VDD  
RNEG_0  
RPOS_0  
RCLK_0  
GND  
XRT71D03  
MCLK_0  
DJA_1/SDI  
AGND  
AGND  
ORDERING INFORMATION  
PART NUMBER  
PACKAGE  
OPERATING TEMPERATURE RANGE  
-40°C to +85°C  
XRT71D03IV  
64 Pin TQFP  
2
 
 
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
TABLE OF CONTENTS  
GENERAL DESCRIPTION .................................................................................................. 1  
FEATURES ................................................................................................................................................... 1  
APPLICATIONS ............................................................................................................................................. 1  
Figure 1. Block Diagram of the XRT71D03 ........................................................................................... 1  
Figure 2. Pin Out of the XRT71D03 ........................................................................................................ 2  
ORDERING INFORMATION ..................................................................................................................... 2  
TABLE OF CONTENTS...................................................................................................................................... I  
PIN DESCRIPTIONS ........................................................................................................... 3  
ELECTRICAL CHARACTERISTICS ................................................................................... 9  
Figure 3. Input/Output Timing ................................................................................................................ 9  
Figure 4. Timing Diagram for the Microprocessor Serial Interface .................................................. 10  
SYSTEM DESCRIPTION ................................................................................................... 12  
Figure 5. Illustration of a typical Channel_n of the XRT71D03 configured to operate in the Hardware  
Mode ........................................................................................................................................ 12  
Figure 6. Illustration of a typical Channel_n of the XRT71D03 (configured to operate in the Host  
Mode) ....................................................................................................................................... 13  
1.0 Jitter Attenuator PLL .............................................................................................................................. 13  
1.1 BACKGROUND INFORMATION DEFINITION OF JITTER ....................................................................................................13  
1.2 JITTER TRANSFER CHARACTERISTICS.........................................................................................................................13  
Figure 7. Category 1 DS3 Jitter Transfer Mask .................................................................................. 14  
1.2.1 Jitter Tolerance .............................................................................................................................................14  
1.2.2 Jitter Generation............................................................................................................................................14  
1.2.3 Jitter Attenuation ...........................................................................................................................................14  
1.3 XRT71D03 JITTER TRANSFER AND TOLERANCE.........................................................................................................15  
TABLE 1: XRT71D03 JITTER TRANSFER FUNCTION .................................................................................. 15  
Figure 8. DS3 Jitter Transfer Characteristics ..................................................................................... 16  
Figure 9. E3 Jitter Transfer Characteristics ........................................................................................ 16  
Figure 10. STS-1 Jitter Transfer Characteristics ................................................................................ 17  
TABLE 2: XRT71D03 MAXIMUM JITTER TOLERANCE ................................................................................. 18  
2.0 Operating Modes .................................................................................................................................... 19  
2.1 HARDWARE MODE.....................................................................................................................................................19  
TABLE 3: FUNCTIONS OF DUAL MODE PINS IN HARDWARE MODE CONFIGURATION ...................................... 19  
2.2 HOST MODE.............................................................................................................................................................19  
TABLE 4: ADDRESS AND BIT FORMATS OF THE COMMAND REGISTERS ...................................................... 19  
3.0 Microprocessor Serial Interface ............................................................................................................ 19  
3.1 SERIAL INTERFACE OPERATION..................................................................................................................................19  
3.1.1 Bit 1—R/W (Read/Write) Bit..........................................................................................................................19  
3.1.2 Bits 2 through 5—A0, A1, A2, A3, and A4 ....................................................................................................19  
3.1.3 Bit 7—A5.......................................................................................................................................................19  
3.1.4 Bit 8—A6.......................................................................................................................................................19  
3.1.5 Read Operation.............................................................................................................................................19  
3.1.6 Write Operation.............................................................................................................................................20  
Figure 11. Microprocessor Serial Interface Data Structure ............................................................... 20  
3.1.7 Simplified Interface Option............................................................................................................................20  
Figure 12. Timing Diagram for the Microprocessor Serial Interface ................................................ 21  
ORDERING INFORMATION ............................................................................................. 22  
PACKAGE DIMENSIONS ................................................................................................. 22  
REVISION HISTORY ..................................................................................................................................... 23  
I
 
XRT71D03  
áç  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
PIN DESCRIPTIONS  
PIN DESCRIPTION  
PIN #  
NAME  
AVDD  
TYPE  
****  
****  
O
DESCRIPTION  
Analog Power Supply = 5V±5% or 3.3V±5%  
Digital Power Supply = 5V±5% or 3.3V±5%  
1
2
3
GND  
RRCLK_0  
Received Recovered Output (De-jittered) Clock - channel 0:  
Output the de-jittered or smoothed clock if the jitter attenuator is enabled. The  
de-jittered data, RRPOS/RRNEG are clocked to this signal.  
If RRCLKES is “low”, RRPOS/RRNEG will be updated at the falling edge of  
RRCLK.  
If RRCLKES is “high”, RRPOS/RRNEG will be updated at the rising edge of  
RRCLK.  
4
5
6
RRPOS_0  
RRNEG_0  
RRCLKES  
O
O
I
Received Recovered Positive Data (De-Jittered) Output - channel  
0:  
De-jittered positive data output. Updated on the rising or falling edge of  
RRCLK, depending upon the state of the RRCLKES input pin (or bit-field set-  
ting).  
Received Recovered Negative Data (De-Jittered) Output - channel  
0:  
De-jittered negative data output. Updated on the rising or falling edge of  
RRCLK, depending upon the state of the RRCLKES input pin (or bit-field set-  
ting).  
Received Recovered Clock Edge Select Input:  
Hardware Mode:  
1. When RRCLKES = “0”, then RRPOS and RRNEG are updated on the fall-  
ing edge of RRCLK  
2. When RRCLKES = “1”, then RRPOS and RRNEG are updated on the rising  
edge of RRCLK  
NOTE: This applies to all channels.  
Host Mode  
Connect this pin to GND when the 71D03 is configured in the Host Mode.  
Internal 50 K Ohm pull-down resistor.  
7
8
NC  
No Connection  
Rest  
I
I
Reset Input. (Active-Low):  
A high-low transition will re-center the internal FIFO, and will clear the Com-  
mand Registers (for Host Mode operation). Resetting this pin may corrupt data  
within the device.  
For normal operation, pull this pin to VDD.  
Internal 50 K Ohm pull-up resistor.  
9
DS3/E3_1  
DS3/E3 Select Input - channel 1:  
This pin along with the STS-1 mode select pin selects the operating mode. The  
following table provides the configuration:  
STS-1  
DS3/E3  
XRT71D04 Operating Mode  
DS3 (44.736 MHz)  
E3 (34.368 MHz)  
STS-1 (51.84 MHz)  
E3 (34.368 MHz)  
0
0
1
1
0
1
0
1
Internal 50 K Ohm pull-down resistor.  
10  
VDD  
****  
Digital Power Supply = 5V±5% or 3.3V±5%  
3
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
PIN DESCRIPTION  
PIN #  
NAME  
TYPE  
DESCRIPTION  
11  
MODE_CTRL  
I
Mode Control:  
When “High” in Multimode, all channels are independent. When “Low”, the  
Master Channel (channel0) controls DS3/E3_n, STS1_n, RCLKES, FSS and  
MCLKn. DJA is NOT affected.  
Internal 50 K Ohm pull-up resistor.  
12  
13  
ICT  
I
I
In Circuit Testing Input. (Active low):  
With this pin tied to ground, all output pins will be in high impedance mode for  
in-circuit-testing.  
For normal operation this input pin should be tied to VDD.  
Internal 50 K Ohm pull-up resistor.  
HOST  
Host/Hardware Mode Select:  
An active-high input enables the Host mode. Data is written to the command  
registers to configure the XRT71D04.  
In the Host mode, the states of discrete input pins are inactive.  
An active-low input enables the Hardware Mode.In this mode, the discrete  
inputs are active.  
Internal 50 K Ohm pull-down resistor.  
14  
FLRST  
I
Fifo Limit Reset  
Hardware Mode  
Whenever the FIFO is within 2 bits of either underflow or overflow, the FLn) will  
be set high.  
This pin allows the user to reset the state of FL_n, (FIFO Limit) output pin.  
This pin when pulsed “High”, resets the the FL_n output pin, (toggles to GND).  
NOTE: The FL_n could be set “High” again if the FIFO is within 2 bits of either  
underflow or overflow.  
Host Mode  
Reading the FL_n bits in the status registers clears the FL_n pin. Master  
RESET also clears the FL_n output.  
This pin is tied to GND. FLRST has no effect in this mode.  
Internal 50 K Ohm pull-down resistor.  
15  
16  
17  
18  
GND  
NC  
****  
Digital Ground  
No Connection  
Analog Ground  
AGND  
FL_0  
****  
O
FIFO Limit - channel 0:  
This output pin is driven high whenever the internal FIFO comes within two-bits  
of being underflow or overflow.  
19  
STS1_0  
I
SONET STS1 Mode Select - channel 0:  
This pin along with the DS3/E3_0 select pin configures the XRT71D03 either in  
E3, DS3 or STS-1 mode.  
A table relating to the setting of the pins is given below:  
STS-1  
DS3/E3  
XRT71D03 Operating Mode  
DS3 (44.736 MHz)  
0
0
1
1
0
1
0
1
E3 (34.368 MHz)  
STS-1 (51.84 MHz)  
E3 (34.368 MHz)  
This input pin is active only in the Hardware Mode  
4
XRT71D03  
áç  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
PIN DESCRIPTION  
PIN #  
NAME  
TYPE  
DESCRIPTION  
20  
DS3/E3_0  
I
DS3/E3 Select Input - channel 0:  
See description pin 8.  
Internal 50 K Ohm pull-down resistor.  
21  
DJA_0/SCLK  
I
Hardware Mode  
Disable Jitter Attenuator Input - Channel 0:  
An active-high disables the Jitter Attenuator. The RPOS/RNEG and RCLK will  
be passed through without jitter attenuation.  
Host Mode  
Microprocessor Serial Interface Clock Signal:  
This signal will be used to sample the data on the SDI pin, on the rising edge  
of this signal. Additionally, during “Read” operations, the Microprocessor Serial  
Interface will update the SDO output on the falling edge of this signal.  
Internal 50 K Ohm pull-down resistor.  
22  
23  
GND  
****  
I
Digital Ground  
RPOS_2  
Received Positive Data (Jittery) Input: - channel 2:  
Data that is input on this pin is sampled on either the rising or falling edge of  
RCLK depending on the setting of the RCLKES pin (pin 10).  
If RCLKES is “high”, then RPOS will be sampled on the falling edge of RCLK.  
If RCLKES is “low”, then RPOS will be sampled on the rising edge of RCLK.  
Internal 50 K Ohm pull-up resistor.  
24  
RNEG_2  
I
Received Negative Data (Jittery) - channel 2:  
The input jittery negative data is sampled either on the rising or falling edge of  
RCLK depending on the setting of RCLKES.  
If RCLKES is “high”, then RNEG will be sampled on the falling edge of RCLK.  
If RCLKES is “low”, then RPOS will be sampled on the rising edge of RCLK.  
This pin is typically tied to the “RNEG” output pin of the LIU.  
Internal 50 K Ohm pull-up resistor.  
25  
26  
VDD  
****  
I
Digital Power Supply = 5V±5% or 3.3V±5%  
RCLK_2  
Received Clock (Jittery) - channel 2:  
Clock input RCLK2 should be connected to the recovered clock.  
Internal 50 K Ohm pull-up resistor.  
27  
28  
GND  
****  
I
Digital Ground  
MCLK_2  
Master Clock Input - channel 2:  
Reference clock for internal PLL. 44.736MHz+/-20ppm or 34.368MHz+/-  
20ppm. This clock must be continuous and jitter free with duty cycle between  
30 to 70%.  
It is permissible to use the EXCLK signal orSTS1 clock.  
Internal 50 K Ohm pull-up resistor.  
29  
30  
DJA_2/CS  
I
I
Hardware Mode  
Disable Jitter Attenuator Input - Channel 2:  
See description of pin 25  
Host Mode  
Chip Select Input:  
An active-low input enables the serial interface.  
Internal 50 K Ohm pull-down resistor.  
STS1_2  
SONET STS1 Mode Select - channel 2:  
See description pin 19  
5
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
PIN DESCRIPTION  
PIN #  
NAME  
TYPE  
DESCRIPTION  
31  
FL_2  
O
FIFO Limit - channel 2:  
See description pin 18  
32  
33  
34  
35  
AGND  
AVDD  
****  
****  
****  
O
Analog Ground  
Analog Power Supply =5±5% or 3.3V±5%  
Digital Ground  
GND  
RRCLK_2  
Received Recovered Output (De-jittered) Clock - channel 2:  
See description of pin 3  
36  
37  
38  
RRPOS_2  
RRNEG_2  
FSS  
O
O
I
Received Recovered Positive Data (De-Jittered) Output - channel  
2:  
See description of pin 4  
Received Recovered Negative Data (De-Jittered) Output - channel  
2:  
See description of pin 5  
FIFO Size Select Input:  
When “High”: Selects 32 bits FIFO.  
When “Low”: Selects 16 bits FIFO.  
Internal 50 K Ohm pull-down resistor.  
39  
40  
SDO  
O
Serial Data Output:  
This pin will serially output the contents of the specified Command Register,  
during “Read” Operations. The data, on this pin, will be updated on the falling  
edge of the SCLK input signal. This pin will be tri-stated upon completion of  
data transfer.  
DS3/E3_2  
I
DS3/E3 Select Input - channel 2:  
See description pin 8  
Internal 50 K Ohm pull-down resistor.  
41  
42  
43  
VDD  
NC  
****  
I
Digital Power Supply = 5V±5% or 3.3V±5%  
No Connection  
RCLKES  
Received Clock Edge Select Input:  
Hardware Mode  
1. When RCLKES = “0”, then RPOS and RNEG are updated on the falling  
edge of RCLK  
2. When RCLKES = “1”, then RPOS and RNEG are updated on the rising  
edge of RCLK  
NOTE: This applies to all channels.  
Host Mode  
Connect this pin to GND when the 71D03 is configured in the Host Mode.  
Internal 50 K Ohm pull-down resistor.  
44  
45  
RRNEG_1  
RRPOS_1  
O
O
Received Recovered Negative Data (De-Jittered) Output - channel  
1:  
See description of pin 5  
Received Recovered Positive Data (De-Jittered) Output - channel  
1:  
See description of pin 4  
6
XRT71D03  
áç  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
PIN DESCRIPTION  
PIN #  
NAME  
TYPE  
DESCRIPTION  
46  
RRCLK_1  
O
Received Recovered Output (De-jittered) Clock - channel 1:  
See description of pin 3.  
47  
48  
49  
50  
GND  
AVDD  
AGND  
FL_1  
****  
****  
****  
O
Digital Ground  
Analog Power Supply = 5 V±5% or 3.3V±5%  
Analog Ground  
FIFO Limit - channel 1:  
See description pin 18  
51  
52  
STS1_1  
MCLK_1  
I
I
SONET STS1 Mode Select - channel 1:  
See description pin 19  
Master Clock Input - channel 1:  
See description pin 28.  
Internal 50 K Ohm pull-up resistor.  
53  
54  
GND  
****  
I
Digital Ground  
RCLK_1  
Received Clock (Jittery) - channel 1:  
See description of pin 26.  
Internal 50 K Ohm pull-up resistor.  
55  
56  
RPOS_1  
RNEG_1  
I
I
Received Positive Data (Jittery) Input: - channel 1:  
See description of pin 23.  
Internal 50 K Ohm pull-up resistor.  
Received Negative Data (Jittery) - channel 1:  
See description of pin 24.  
Internal 50 K Ohm pull-up resistor.  
57  
58  
VDD  
****  
I
Digital Power Supply = 5V±5% or 3.3V±5%  
RNEG_0  
Received Negative Data (Jittery) - channel 0:  
See description of pin 24.  
Internal 50 K Ohm pull-up resistor.  
59  
60  
RPOS_0  
RCLK_0  
I
I
Received Positive Data (Jittery) Input: - channel 0:  
See description of pin 23.  
Internal 50 K Ohm pull-up resistor.  
Received Clock (Jittery) - channel 0:  
See description of pin 26.  
Internal 50 K Ohm pull-up resistor.  
61  
62  
GND  
****  
I
Digital Ground  
MCLK_0  
Master Clock Input - channel 0:  
See description pin 28.  
Internal 50 K Ohm pull-up resistor.  
7
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
PIN DESCRIPTION  
PIN #  
NAME  
TYPE  
DESCRIPTION  
63  
DJA_1/SDI  
I
Hardware Mode  
Disable Jitter Attenuator Input - Channel 1:  
See description of pin 25  
Host Mode  
Serial Data Input  
The address value (of the command registers) or the data value is either Read  
or Written through this pin.  
The input data will be sampled on the rising edge of the SCLK pin.  
Internal 50 K Ohm pull-down resistor.  
64  
AGND  
****  
Analog Ground  
8
XRT71D03  
áç  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
ELECTRICAL CHARACTERISTICS  
AC Electrical Characteristics  
Electrical Characteristics (TA = 25°C, VDD = 3.3 V t0 5.0 V± 5% unless otherwise specified)  
SYMBOL  
PARAMETER  
MIN  
TYP  
MAX  
UNITS.  
MClk  
MClk  
MClk  
MClk  
RClk  
RClk  
RClk  
tsu  
Duty Cycle  
30  
50  
70  
%
MHz  
MHz  
MHz  
%
Frequency E3 + 20 ppm  
34.368  
44.736  
51.84  
50  
Frequency DS3 + 20 ppm  
Frequency STS-1 + 20 ppm  
Duty Cycle  
30  
70  
5
Rise Time  
ns  
Fall Time  
5
ns  
RPOS/RNEG to RClk rise time setup  
3
1
2
2
3
3
ns  
th  
td  
te  
RPOS/RNEG to RClk rising hold time  
RRPOS/RRNEG delay from RRClk rising  
RRPOS/RRNEG delay from RRClk falling  
ns  
ns  
ns  
5
5
FIGURE 3. INPUT/OUTPUT TIMING  
tsu  
RCLK  
RCLK  
th  
td  
RPOS/RNEG  
RPOS/RNEG  
RClkES = 0  
tsu  
RCLK  
RCLK  
th  
te  
RPOS/RNEG  
RPOS/RNEG  
RClkES = 1  
9
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
Microprocessor Serial Interface Timing ( see Figure 4 )  
Electrical Characteristics (TA = 25°C, VDD = 3.3 V t0 5.0 V± 5 % unless otherwise specified)  
SYMBOL  
PARAMETER  
MIN  
TYP  
MAX  
UNITS.  
t21  
t22  
t23  
t24  
t25  
t26  
t27  
t28  
t29  
t30  
t31  
t32  
CS Low to Rising Edge of SClk Setup Time  
SClk to CS Hold Time  
50  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
SDI to Rising Edge of SClk Setup Time  
SDI to Rising Edge of SClk Hold Time  
SClk “Low” Time  
50  
50  
240  
240  
500  
50  
SClk “High” Time  
SClk Period  
SClk to CSB Hold Time  
CS “Inactive” Time  
250  
Falling Edge of SClk to SDO Valid Time  
Falling Edge of SClk to SDO Invalid Time  
Falling Edge of SClk, or rising edge of CS to High Z  
200  
100  
100  
FIGURE 4. TIMING DIAGRAM FOR THE MICROPROCESSOR SERIAL INTERFACE  
t29  
t21  
CS  
SClk  
SDI  
t27  
t28  
t22  
t25  
t26  
A1  
t24  
R/W  
t23  
A0  
CS  
SClk  
t31  
t30  
Hi-Z  
t33  
t32  
D0  
D2  
D7  
SDO  
SDI  
D1  
Hi-Z  
10  
 
XRT71D03  
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
DC Electrical Characteristics (TA = 25 °C, VDD = 3.3 V ± 5% unless otherwise specified)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
Power Supply Voltage  
Input High Voltage  
Input Low Voltage  
VDD  
VIH  
VIL  
3.135  
2.0  
3.3  
3.465  
5.25  
0.8  
V
V
V
-0.5  
Output High Voltage @ IOH=-5mA  
Output Low Voltage @ IOL=5mA  
VOH  
VOL  
Icc  
Icc  
Icc  
IL  
2.4  
V
V
0.4  
85  
Supply Current (E3) @VDD = 3.465V  
Supply Current (DS3) @VDD = 3.465V  
Supply Current (STS-1) @VDD = 3.465V  
Input Leakage Current (except Input pins with Pull-up resistor).  
Input Capacitance  
75  
95  
mA  
mA  
109  
120  
± 10  
105  
µA  
pF  
pF  
CI  
5.0  
Output Load Capacitance  
CL  
25  
DC Electrical Characteristics (TA = 25 °C, VDD = 5.0 V ± 5% unless otherwise specified)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
Power Supply Voltage  
Input High Voltage  
Input Low Voltage  
VDD  
VIH  
VIL  
4.75  
2.0  
5.0  
5.25  
5.25  
0.8  
V
V
V
-0.5  
Output High Voltage @ IOH=-5mA  
Output Low Voltage @ IOL=5mA  
Supply Current (E3) @VDD = 5.25V  
Supply Current (DS3) @VDD = 5.25V  
Supply Current (STS-1) @VDD = 5.25V  
Input Leakage Current (except Input pins with Pull-up resistor).  
Input Capacitance  
VOH  
VOL  
Icc  
Icc  
Icc  
IL  
2.4  
V
V
0.4  
136  
160  
180  
± 10  
120  
145  
160  
mA  
mA  
µA  
pF  
pF  
CI  
5.0  
Output Load Capacitance  
CL  
25  
ABSOLUTE MAXIMUM RATINGS:  
Supply Range  
ESD Rating  
-0.5 V to + 6.0 V  
> 2000 V on all pins  
-400C to +850C  
Operating Temperature  
Storage Temperature  
-65°C to + 150°C  
11  
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XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
The XRT71D03 also meets the DS3 wander specifi-  
cation that apply to SONET and asynchronous inter-  
faces as specified in the ANSI T1.105.03b 1997 stan-  
dard.  
SYSTEM DESCRIPTION  
The XRT71D03 is an integrated 3-channel E3/DS3/  
STS-1 jitter attenuator that attenuates the jitter from  
the input clock and data. The jitter attenuation perfor-  
mance meets the latest specifications such as Bellcore  
GR-499 CORE,GR-253 CORE, ETSI TBR24,ITU-T  
G.751,ITU-T G.752 and ITU-T G.755 standards.  
Additionally, to support loop-timing applications, the  
XRT71D03 can also be used to reduce and limit the  
amount of jitter in the recovered line clock signal.  
In addition, the XRT71D03 also meets both the map-  
ping and pointer adjustment jitter generation criteria  
for both Category I and Category II interfaces as  
specified in Bellcore GR-253.  
Figure 5 presents a simple block diagram of the  
XRT71D03, when it is configured to operate in the  
Hardware Mode and Figure 6 presents a simple block  
diagram of the XRT71D03, when it is configured to  
operate in the Host Mode.  
FIGURE 5. ILLUSTRATION OF A TYPICAL CHANNEL_N OF THE XRT71D03 CONFIGURED TO OPERATE IN THE HARD-  
WARE MODE  
MCLK_n  
Timing Control Block /  
Phase locked Loop  
Jittery  
Clock  
Smoothed  
Clock  
ICT  
DJA_n  
RRCLK_n  
RClk_n  
Write Clock  
Read Clock  
RRPOS_n  
RRNEG_n  
RCLKES  
RPOS_n  
RNEG_n  
16/32 Bit FIFO  
RRCLKES  
FL_n  
FSS  
HOST  
Rest  
DS3/E3_n  
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
FIGURE 6. ILLUSTRATION OF A TYPICAL CHANNEL_N OF THE XRT71D03 (CONFIGURED TO OPERATE IN THE HOST  
MODE)  
MClk_n  
Timing Control Block /  
Phase locked Loop  
Smoothed  
Clock  
Jittery  
Clock  
ICT  
RRCLK_n  
Write Clock  
Read Clock  
RCLK_n  
RRPOS_n  
RRNEG_n  
RRCLKES  
FL_n  
16/32 Bit FIFO  
RPOS_n  
RNEG_n  
HOST  
Reset  
Microprocessor Serial  
Interface  
CS  
SDI  
SDO SClk  
The XRT71D03 DS3/E3 Jitter Attenuator IC consists  
of the following functional blocks:  
from their ideal positions in time. Jitter can occur due  
to any of the following:  
The Jitter-Attenuator PLL  
Timing Control Block  
1) Imperfect timing recovery circuit in the system  
2) Cross-talk noise  
The 2-Channel 16/32 Bit FIFO  
Serial Microprocessor Interface  
3) Inter-symbol interference/Signal Distortion  
1.2 JITTER TRANSFER CHARACTERISTICS  
The primary purpose of jitter transfer requirements is  
to prevent performance degradations by limiting the  
accumulation of jitter through the system such that it  
does not exceed the network interface jitter require-  
ments. Thus, it is more important that a system meet  
the jitter transfer criteria for relatively high input jitter  
amplitudes. The jitter transferred through the system  
must be under the jitter mask for any input jitter ampli-  
tude within the range as shown in Figure 7  
1.0 JITTER ATTENUATOR PLL  
1.1 BACKGROUND INFORMATION DEFINITION OF JIT-  
TER  
One of the most important and least understood mea-  
sures of clock performance is jitter. The International  
Telecommunication Union defines jitter as short term  
variations of the significant instants of a digital signal  
13  
 
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XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
FIGURE 7. CATEGORY 1 DS3 JITTER TRANSFER MASK  
0.1  
slope = -20 dB/decade  
Acceptable  
Range  
40  
Frequency (Hz)  
1.2.1 Jitter Tolerance  
FIFO is within 2 bits of being completely full, the FIFO  
Limit (FL) will be set.  
The jitter tolerance in the network element is defined  
as the maximum amount of jitter in the incoming sig-  
nal that it can receive in an error-free manner.  
In Figure 5 and Figure 6, this de-jittered clock is la-  
beled Smoothed Clock. This Smoothed Clock is now  
used to Read Out the Recovered Data from the 16/32  
bit FIFO. This Smoothed Clock will also be output to  
the Terminal Equipment via the RRClk output pin.  
Likewise, the Smoothed Recovered Data will output  
to the Terminal Equipment via the RRPOS and  
RRNEG output pins.  
1.2.2 Jitter Generation  
Jitter generation is defined in Section 7.3.3 of GR-  
499-CORE. Jitter generation criteria exists for both  
Category I and II interfaces, which consist of mapping  
and pointer adjustment jitter generation.  
Mapping jitter is the sum of the intrinsic payload map-  
ping jitter and the jitter that is generated as a result of  
the bit stuffing mechanisms used in all of the asyn-  
chronous DSn mapping into STS SPE.  
The XRT71D03 is designed to work as a companion  
device with XRT73L03 (STS-1/DS3/E3) Line Inter-  
face Unit.  
ETSI TBR24 specifies the maximum output jitter in  
loop timing must be no more than 0.4UIpp when mea-  
sured between 100Hz to 800KHzwith up to 1.5UI in-  
put jitter at 100Hz. This means a jitter attenuator with  
bandwidth less than 100Hz is required to be compli-  
ant with the standard. ITU G.751 is another applica-  
tion where low bandwidth jitter attenuator is needed  
to smooth the gapped clock output in the de-multi-  
plexer system.  
1.2.3 Jitter Attenuation  
A digital Jitter Attenuation loop combined with the  
FIFO provides Jitter attenuation. The Jitter Attenuator  
requires no external components except for the refer-  
ence clock.  
Data is clocked into the FIFO with the associated  
clock signal (TClk or RClk) and clocked out of the  
FIFO with the dejittered clock and data. When the  
14  
XRT71D03  
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
1.3 XRT71D03 JITTER TRANSFER AND TOLERANCE  
Table 2 summarizes the results of jitter tolerance test-  
ing, performed on the XRT71D03.  
Table 1 summarizes the results of jitter transfer char-  
acteristics testing, performed on the XRT71D03.  
Graphs of the measured Jitter Transfer are shown in  
Figure 8, Figure 9 and Figure 10.  
TABLE 1: XRT71D03 JITTER TRANSFER FUNCTION  
DS3 E3  
APPLICATION  
STS-1  
INPUT JITTER  
FREQ. (HZ)  
10  
1UIPP  
10UIPP  
1UIPP  
10UIPP  
1UIPP  
10UIPP  
Jitter Gain (dB)  
Jitter Gain (dB)  
Jitter Gain (dB)  
-0.10  
-0.30  
-2.24  
-0.15  
-0.22  
-3.24  
0.22  
0.53  
-1.09  
20  
-2.04  
-3.63  
-3.16  
-5.51  
-0.69  
-5.92  
30  
-4.33  
-5.93  
-3.01  
40  
-5.98  
-6.16  
-7.68  
-7.99  
-8.10  
-4.74  
50  
-7.55  
-7.82  
-10.36  
-12.50  
-15.20  
-16.22  
-17.38  
-19.45  
-20.36  
-22.96  
-23.78  
-23.51  
-9.61  
-10.17  
-11.24  
-13.65  
-14.78  
-16.94  
-17.38  
-19.57  
-21.96  
-23.59  
-25.76  
-26.27  
-27.41  
-26.15  
-6.33  
60  
-9.57  
-9.17  
-11.27  
-13.59  
-15.51  
-17.07  
-18.75  
-21.11  
-24.46  
-28.84  
-35.77  
-7.64  
80  
-12.54  
-14.67  
-16.67  
-17.32  
-18.77  
-21.43  
-22.22  
-25.42  
-11.28  
-13.36  
-14.91  
-16.78  
-18.96  
-21.81  
-26.09  
-33.44  
-9.98  
100  
-11.92  
-13.75  
-15.23  
-17.41  
-21.69  
-25.47  
-32.99  
-39.83  
-41.95  
-44.16  
125  
150  
200  
300  
500  
>1000  
2000  
3000  
5000  
15  
 
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XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
FIGURE 8. DS3 JITTER TRANSFER CHARACTERISTICS  
DS3 Jitter Transfer  
10  
100  
1,000  
5
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
1UIpp  
10UIpp  
Mask  
Frequency (Hz)  
FIGURE 9. E3 JITTER TRANSFER CHARACTERISTICS  
E3 Jitter Transfer  
10  
100  
1,000  
5
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
1UIpp  
10UIpp  
Mask  
Frequency (Hz)  
16  
XRT71D03  
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
FIGURE 10. STS-1 JITTER TRANSFER CHARACTERISTICS  
STS-1 Jitter Transfer  
10  
100  
1,000  
10,000  
5
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
1UIpp  
10UIpp  
Mask  
Frequency (Hz)  
17  
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
TABLE 2: XRT71D03 MAXIMUM JITTER TOLERANCE  
DS3 E3  
APPLICATION  
STS-1  
FIFO SIZE  
FREQ. (HZ)  
10  
16  
32  
16  
32  
16  
32  
UI (PEAK TO PEAK)  
UI (PEAK TO PEAK)  
UI (PEAK TO PEAK)  
34.313  
>64  
26.689  
53.313  
37.438  
33.938  
32.688  
32.063  
31.689  
31.314  
31.189  
31.064  
31.064  
30.939  
30.939  
30.939  
30.939  
38.938  
>64  
20  
21.439  
18.314  
16.939  
16.314  
16.064  
15.689  
15.439  
15.439  
15.314  
15.314  
15.189  
15.189  
15.0189  
43.188  
36.813  
34.313  
33.188  
32.563  
31.814  
31.439  
31.314  
31.189  
31.064  
30.939  
30.939  
30.939  
18.564  
16.689  
16.064  
15.689  
15.564  
15.314  
15.314  
15.189  
15.189  
15.189  
15.064  
15.064  
15.189  
22.689  
18.939  
17.439  
16.814  
16.439  
16.064  
15.814  
15.689  
15.689  
15.564  
15.564  
15.564  
15.439  
15.439  
15.439  
15.439  
44.813  
37.688  
34.938  
33.563  
32.813  
32.063  
31.814  
31.564  
31.439  
31.314  
31.189  
31.189  
31.189  
31.189  
26.189  
16.189  
30  
40  
50  
60  
80  
100  
125  
150  
200  
300  
500  
>1000  
18  
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
2.0 OPERATING MODES  
2.1 HARDWARE MODE  
2.2 HOST MODE  
In Host mode (connect the HOST pin to VDD), the se-  
rial port interface pins are used to control configura-  
tion and status report. In this mode, serial interface  
pins, SDI, SDO,SCLK and CS are used.  
The HOST pin is used to select the operating mode of  
the XRT71D03. In Hardware mode (connect this pin  
to ground), the serial processor interface is disabled  
and hard-wired pins are used to control configuration  
and report status.  
A listing of these Command Registers, their Address-  
es and their bit-formats are listed below in Table 4.  
TABLE 3: FUNCTIONS OF DUAL MODE PINS IN  
HARDWARE MODE CONFIGURATION  
FUNCTION, WHILE IN THE  
PIN #  
PIN NAME  
HARDWARE MODE  
63  
21  
29  
DJA_1/(SDI)  
DJA_0/SCLK  
DJA_2(CS)  
DJA_1  
DJA_0  
DJA_2  
TABLE 4: ADDRESS AND BIT FORMATS OF THE COMMAND REGISTERS  
COMMAND  
REGISTER  
ADDR  
TYPE  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0X06  
0x07  
0x0E  
0x0F  
0x16  
0x17  
CR6  
CR7  
R/W  
RO  
***  
***  
***  
***  
***  
***  
***  
***  
***  
***  
***  
***  
STS-1_0  
***  
DS3/E3_0  
***  
DJA_0 RRClkES_0 RClkES_0 FSS_0  
***  
DJA_1 RRClkES_1 RClkES_1 FSS_1  
*** *** FL_1  
***  
FL_0  
CR14  
CR15  
CR22  
CR23  
R/W  
RO  
STS-1_1  
***  
DS3/E3_1  
***  
R/W  
RO  
STS-1_2  
***  
DS3/E3_2  
***  
DJA_2 RRClkES_2 RClkES_2 FSS_2  
*** *** FL_2  
3.0 MICROPROCESSOR SERIAL INTERFACE  
The five (5) bit Address Values (labeled A0, A1, A2,  
A3, and A4).  
The serial interface for the XRT71D03 and the  
XRT73L00 family of E3/DS3/STS-1 LIU’s are the  
same, which makes it easy to configure both the  
XRT71D03 and the LIU with a single CS, SDI, SDO  
and SClk input and output pins.  
The next five rising edges of the SClk signal will clock  
in the 5-bit address value for this particular Read (or  
Write) operation. The address selects the Command  
Register for reading data from, or writing data to. The  
address bits to the SDI input pin is applied in ascend-  
ing order with the LSB (least significant bit) first.  
3.1 SERIAL INTERFACE OPERATION.  
Serial interface data structure and timings are provid-  
ed in Figure 5 and 6 respectively.  
3.1.3 Bit 7—A5  
A5 must be set to “0”, as shown in Figure 11.  
The clock signal is provided to the SClk and the CS is  
asserted for 50 ns prior to the first rising edge of the  
SClk.  
3.1.4 Bit 8—A6  
The value of A6 is a don’t care.  
3.1.1 Bit 1—R/W (Read/Write) Bit  
Once these first 8 bits have been written into the Seri-  
al Interface, the subsequent action depends upon  
whether the current operation is a Read or Write op-  
eration.  
This bit will be clocked into the SDI input, on the first  
rising edge of SClk (after CS has been asserted).  
This bit indicates whether the current operation is a  
Read or Write operation.  
3.1.5 Read Operation  
A “1” in this bit specifies a Read operation, a “0” in  
this bit specifies a Write operation.  
Once the last address bit (A4) has been clocked into  
the SDI input, the Read operation will proceed  
through an idle period, lasting three SClk periods. On  
3.1.2 Bits 2 through 5—A0, A1, A2, A3, and A4  
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
the falling edge of SClk Cycle #8 (see Figure 11) the  
serial data output signal (SDO) becomes active. At  
this point the user can begin reading the data con-  
tents of the addressed Command Register (at Ad-  
dress [A4, A3, A2, A1, A0]) via the SDO output pin.  
The Serial Interface will output this eight bit data word  
(D0 through D7) in ascending order (with the LSB  
first), on the falling edges of the SClk. The data (on  
the SDO output pin) is stable for reading on the very  
next rising edge of the SClk.  
3.1.6 Write Operation  
Once the last address bit (A4) has been clocked into  
the SDI input, the Write operation will proceed  
through an idle period, lasting three SClk periods. Pri-  
or to the rising edge of SClk Cycle #9, the eight bit  
data word is applied to SDI input. Data on SDI is  
latched on the rising edge of SClk.  
FIGURE 11. MICROPROCESSOR SERIAL INTERFACE DATA STRUCTURE  
CS  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
SClk  
SDI  
R/W  
A0  
A1  
A2  
A3  
A4  
0
A6  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
High Z  
High Z  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
SDO  
NOTES:  
3.1.7 Simplified Interface Option  
1. A5 is always “0”.  
The user can simplify the design of the circuitry con-  
necting to the Microprocessor Serial Interface by ty-  
ing both the SDO and SDI pins together, and reading  
data from and/or writing data to this combined signal.  
This simplification is possible because only one of  
2. R/W = “1” for Read Operations  
3. R/W = “0” for Write Operations  
4. Denotes a “don’t care” value (shaded areas)  
20  
 
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
these signals are active at any given time. The inac-  
tive signal will be tri-stated.  
FIGURE 12. TIMING DIAGRAM FOR THE MICROPROCESSOR SERIAL INTERFACE  
t29  
t21  
CS  
SClk  
SDI  
t27  
t28  
t22  
t25  
t26  
A1  
t24  
R/W  
t23  
A0  
CS  
SClk  
t31  
t30  
Hi-Z  
t33  
t32  
D0  
D2  
D7  
SDO  
SDI  
D1  
Hi-Z  
21  
áç  
XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
ORDERING INFORMATION  
PART #  
PACKAGE  
OPERATING TEMPERATURE RANGE  
-40oC to +85oC  
XRT71D03IV  
64 Pin TQFP  
Theta - JA = 38° C/W  
Theta JC = 7° C/W  
THERMAL INFORMATION  
PACKAGE DIMENSIONS  
64 Lead Thin Quad Flat Pack  
(10 x 10 x 1.4 mm LQFP)  
β
α
INCHES  
MIN  
MILLIMETERS  
SYMBOL  
MAX  
0.063  
0.006  
0.057  
0.011  
0.008  
0.480  
0.398  
MIN  
1.40  
0.05  
1.35  
0.17  
0.09  
11.80  
9.90  
MAX  
1.60  
0.15  
1.45  
0.27  
0.20  
12.20  
10.10  
A
A1  
A2  
B
C
D
0.055  
0.002  
0.053  
0.007  
0.004  
0.465  
0.390  
D1  
e
0.0020 BSC  
0.05 BSC  
L
α
0.018  
0°  
0.050  
7°  
0.45  
0°  
0.75  
7°  
β
7° typ  
7° typ  
aaa  
-
0.003  
-
0.08  
Note: Control Dimensions are the Millimeter Column  
22  
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XRT71D03  
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR  
REV. 1.2.0  
REVISION HISTORY  
Rev. P1.0.1; Revised pull-up/pull-down resistors on various pins.  
Rev. P1.0.2; Changed date and made minor edits to page 1.  
Rev. P1.0.3; Corrected Pin List descriptions. Modified pin names to be consistent, ie MCLK0, RPOS0,  
RNEG0, etc. changed to MCLK_0, RPOS_0, RNEG_0, etc. Changed VSS to GND. Changed figures to re-  
flect pin name changes.  
Rev. 1.1.0 Removed preliminary designation. Added electrical tables.  
Rev. 1.1.1 Corrected Table 4 adding RRClkES_n as data D2, STS-1_n as D5, added D7. Corrected the  
description of the section 3 Serial Microprocessor Interface. Moved figure 9 into Electrical Characteristics  
Section. Moved Jitter Transfer/Tolerance tables into Jitter Attenuator Section 1. Edited electrical tables.  
Rev. 1.1.2 Corrected ordering information from XRT71DO3 to 71D03IV.  
Rev. 1.2.0 Removed all reference to STS-1 to DS3 desynchronizer.  
NOTICE  
EXAR Corporation reserves the right to make changes to the products contained in this publication in order  
to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of  
any circuits described herein, conveys no license under any patent or other right, and makes no represen-  
tation that the circuits are free of patent infringement. Charts and schedules contained here in are only for  
illustration purposes and may vary depending upon a user’s specific application. While the information in  
this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies.  
EXAR Corporation does not recommend the use of any of its products in life support applications where  
the failure or malfunction of the product can reasonably be expected to cause failure of the life support sys-  
tem or to significantly affect its safety or effectiveness. Products are not authorized for use in such applica-  
tions unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury  
or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corpo-  
ration is adequately protected under the circumstances.  
Copyright 2001 EXAR Corporation  
Datasheet September 2001.  
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.  
23  

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