XRT71D03IV-F [EXAR]
PCM Jitter Attenuator, 1-Func, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, LQFP-64;型号: | XRT71D03IV-F |
厂家: | EXAR CORPORATION |
描述: | PCM Jitter Attenuator, 1-Func, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, LQFP-64 衰减器 PC 电信 电信集成电路 |
文件: | 总24页 (文件大小:116K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
SEPTEMBER 2001
REV. 1.2.0
• Meets output jitter requirement as specified by
ETSI TBR24
GENERAL DESCRIPTION
The XRT71D03 is a three channel, single chip Jitter
Attenuator, that meets the Jitter transfer characteris-
tics requirements specified in the ETSI TBR-24,
Bellcore GR-499 and GR-253 standards.
• Meets the Jitter and Wander specifications
described in T1.105.03b,GR-253 and GR-499 stan-
dards.
• Selectable buffer size of 16 and 32 bits
• Jitter attenuator can be disabled
• Available in a 64 pin LQFP package.
• Single 3.3V or 5.0V supply.
In addition, the XRT71D03 also meets the Jitter and
Wander specifications described in the ANSI
T1.105.03b 1997, Bellcore GR-253 and GR-499 stan-
dards.
FEATURES
• Operates over - 40° C to 85° C temperature range.
• Meets the E3/DS3/STS-1 jitter requirements
• No external components required
APPLICATIONS
• E3/DS3 Access Equipment.
• DSLAMs
• Compliant with jitter transfer template outlined in
ITU G.751, G.752, G.755, GR-235-CORE, GR-
499-CORE,1995 standards
FIGURE 1. BLOCK DIAGRAM OF THE XRT71D03
MCLK_n
Timing Control Block
Phase locked Loop
STS1_n
ICT
DS3/E3_n
DJA_n
RRCLK_n
Write Clock
Read Clock
RClk_n
RRPOS_n
RRNEG_n
RClkES
RPOS_n
RNEG_n
FSS
16/32 Bit FIFO
FL_n
RRCLKES
Channel 0
Channel 1
Channel 2
MODE_CTRL
HOST
Reset
Microprocessor Serial
Interface
XRT71D03
n = 0, 1, 2
CS
SDI SDO SClk
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • (510) 668-7000 • FAX (510) 668-7017 • www.exar.com
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
FIGURE 2. PIN OUT OF THE XRT71D03
AGND
FL_2
STS1_2
DJA_2/CS
MCLK_2
GND
RCLK_2
VDD
RNEG_2
RPOS_2
GND
DJA_0/SCLK
DS3/E3_0
STS1_0
FL0
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
AGND
FL1
STS1_1
MCLK_1
GND
RCLK_1
RPOS_1
RNEG_1
VDD
RNEG_0
RPOS_0
RCLK_0
GND
XRT71D03
MCLK_0
DJA_1/SDI
AGND
AGND
ORDERING INFORMATION
PART NUMBER
PACKAGE
OPERATING TEMPERATURE RANGE
-40°C to +85°C
XRT71D03IV
64 Pin TQFP
2
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
TABLE OF CONTENTS
GENERAL DESCRIPTION .................................................................................................. 1
FEATURES ................................................................................................................................................... 1
APPLICATIONS ............................................................................................................................................. 1
Figure 1. Block Diagram of the XRT71D03 ........................................................................................... 1
Figure 2. Pin Out of the XRT71D03 ........................................................................................................ 2
ORDERING INFORMATION ..................................................................................................................... 2
TABLE OF CONTENTS...................................................................................................................................... I
PIN DESCRIPTIONS ........................................................................................................... 3
ELECTRICAL CHARACTERISTICS ................................................................................... 9
Figure 3. Input/Output Timing ................................................................................................................ 9
Figure 4. Timing Diagram for the Microprocessor Serial Interface .................................................. 10
SYSTEM DESCRIPTION ................................................................................................... 12
Figure 5. Illustration of a typical Channel_n of the XRT71D03 configured to operate in the Hardware
Mode ........................................................................................................................................ 12
Figure 6. Illustration of a typical Channel_n of the XRT71D03 (configured to operate in the Host
Mode) ....................................................................................................................................... 13
1.0 Jitter Attenuator PLL .............................................................................................................................. 13
1.1 BACKGROUND INFORMATION DEFINITION OF JITTER ....................................................................................................13
1.2 JITTER TRANSFER CHARACTERISTICS.........................................................................................................................13
Figure 7. Category 1 DS3 Jitter Transfer Mask .................................................................................. 14
1.2.1 Jitter Tolerance .............................................................................................................................................14
1.2.2 Jitter Generation............................................................................................................................................14
1.2.3 Jitter Attenuation ...........................................................................................................................................14
1.3 XRT71D03 JITTER TRANSFER AND TOLERANCE.........................................................................................................15
TABLE 1: XRT71D03 JITTER TRANSFER FUNCTION .................................................................................. 15
Figure 8. DS3 Jitter Transfer Characteristics ..................................................................................... 16
Figure 9. E3 Jitter Transfer Characteristics ........................................................................................ 16
Figure 10. STS-1 Jitter Transfer Characteristics ................................................................................ 17
TABLE 2: XRT71D03 MAXIMUM JITTER TOLERANCE ................................................................................. 18
2.0 Operating Modes .................................................................................................................................... 19
2.1 HARDWARE MODE.....................................................................................................................................................19
TABLE 3: FUNCTIONS OF DUAL MODE PINS IN HARDWARE MODE CONFIGURATION ...................................... 19
2.2 HOST MODE.............................................................................................................................................................19
TABLE 4: ADDRESS AND BIT FORMATS OF THE COMMAND REGISTERS ...................................................... 19
3.0 Microprocessor Serial Interface ............................................................................................................ 19
3.1 SERIAL INTERFACE OPERATION..................................................................................................................................19
3.1.1 Bit 1—R/W (Read/Write) Bit..........................................................................................................................19
3.1.2 Bits 2 through 5—A0, A1, A2, A3, and A4 ....................................................................................................19
3.1.3 Bit 7—A5.......................................................................................................................................................19
3.1.4 Bit 8—A6.......................................................................................................................................................19
3.1.5 Read Operation.............................................................................................................................................19
3.1.6 Write Operation.............................................................................................................................................20
Figure 11. Microprocessor Serial Interface Data Structure ............................................................... 20
3.1.7 Simplified Interface Option............................................................................................................................20
Figure 12. Timing Diagram for the Microprocessor Serial Interface ................................................ 21
ORDERING INFORMATION ............................................................................................. 22
PACKAGE DIMENSIONS ................................................................................................. 22
REVISION HISTORY ..................................................................................................................................... 23
I
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
PIN DESCRIPTIONS
PIN DESCRIPTION
PIN #
NAME
AVDD
TYPE
****
****
O
DESCRIPTION
Analog Power Supply = 5V±5% or 3.3V±5%
Digital Power Supply = 5V±5% or 3.3V±5%
1
2
3
GND
RRCLK_0
Received Recovered Output (De-jittered) Clock - channel 0:
Output the de-jittered or smoothed clock if the jitter attenuator is enabled. The
de-jittered data, RRPOS/RRNEG are clocked to this signal.
If RRCLKES is “low”, RRPOS/RRNEG will be updated at the falling edge of
RRCLK.
If RRCLKES is “high”, RRPOS/RRNEG will be updated at the rising edge of
RRCLK.
4
5
6
RRPOS_0
RRNEG_0
RRCLKES
O
O
I
Received Recovered Positive Data (De-Jittered) Output - channel
0:
De-jittered positive data output. Updated on the rising or falling edge of
RRCLK, depending upon the state of the RRCLKES input pin (or bit-field set-
ting).
Received Recovered Negative Data (De-Jittered) Output - channel
0:
De-jittered negative data output. Updated on the rising or falling edge of
RRCLK, depending upon the state of the RRCLKES input pin (or bit-field set-
ting).
Received Recovered Clock Edge Select Input:
Hardware Mode:
1. When RRCLKES = “0”, then RRPOS and RRNEG are updated on the fall-
ing edge of RRCLK
2. When RRCLKES = “1”, then RRPOS and RRNEG are updated on the rising
edge of RRCLK
NOTE: This applies to all channels.
Host Mode
Connect this pin to GND when the 71D03 is configured in the Host Mode.
Internal 50 K Ohm pull-down resistor.
7
8
NC
No Connection
Rest
I
I
Reset Input. (Active-Low):
A high-low transition will re-center the internal FIFO, and will clear the Com-
mand Registers (for Host Mode operation). Resetting this pin may corrupt data
within the device.
For normal operation, pull this pin to VDD.
Internal 50 K Ohm pull-up resistor.
9
DS3/E3_1
DS3/E3 Select Input - channel 1:
This pin along with the STS-1 mode select pin selects the operating mode. The
following table provides the configuration:
STS-1
DS3/E3
XRT71D04 Operating Mode
DS3 (44.736 MHz)
E3 (34.368 MHz)
STS-1 (51.84 MHz)
E3 (34.368 MHz)
0
0
1
1
0
1
0
1
Internal 50 K Ohm pull-down resistor.
10
VDD
****
Digital Power Supply = 5V±5% or 3.3V±5%
3
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
PIN DESCRIPTION
PIN #
NAME
TYPE
DESCRIPTION
11
MODE_CTRL
I
Mode Control:
When “High” in Multimode, all channels are independent. When “Low”, the
Master Channel (channel0) controls DS3/E3_n, STS1_n, RCLKES, FSS and
MCLKn. DJA is NOT affected.
Internal 50 K Ohm pull-up resistor.
12
13
ICT
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I
In Circuit Testing Input. (Active low):
With this pin tied to ground, all output pins will be in high impedance mode for
in-circuit-testing.
For normal operation this input pin should be tied to VDD.
Internal 50 K Ohm pull-up resistor.
HOST
Host/Hardware Mode Select:
An active-high input enables the Host mode. Data is written to the command
registers to configure the XRT71D04.
In the Host mode, the states of discrete input pins are inactive.
An active-low input enables the Hardware Mode.In this mode, the discrete
inputs are active.
Internal 50 K Ohm pull-down resistor.
14
FLRST
I
Fifo Limit Reset
Hardware Mode
Whenever the FIFO is within 2 bits of either underflow or overflow, the FLn) will
be set high.
This pin allows the user to reset the state of FL_n, (FIFO Limit) output pin.
This pin when pulsed “High”, resets the the FL_n output pin, (toggles to GND).
NOTE: The FL_n could be set “High” again if the FIFO is within 2 bits of either
underflow or overflow.
Host Mode
Reading the FL_n bits in the status registers clears the FL_n pin. Master
RESET also clears the FL_n output.
This pin is tied to GND. FLRST has no effect in this mode.
Internal 50 K Ohm pull-down resistor.
15
16
17
18
GND
NC
****
Digital Ground
No Connection
Analog Ground
AGND
FL_0
****
O
FIFO Limit - channel 0:
This output pin is driven high whenever the internal FIFO comes within two-bits
of being underflow or overflow.
19
STS1_0
I
SONET STS1 Mode Select - channel 0:
This pin along with the DS3/E3_0 select pin configures the XRT71D03 either in
E3, DS3 or STS-1 mode.
A table relating to the setting of the pins is given below:
STS-1
DS3/E3
XRT71D03 Operating Mode
DS3 (44.736 MHz)
0
0
1
1
0
1
0
1
E3 (34.368 MHz)
STS-1 (51.84 MHz)
E3 (34.368 MHz)
This input pin is active only in the Hardware Mode
4
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
PIN DESCRIPTION
PIN #
NAME
TYPE
DESCRIPTION
20
DS3/E3_0
I
DS3/E3 Select Input - channel 0:
See description pin 8.
Internal 50 K Ohm pull-down resistor.
21
DJA_0/SCLK
I
Hardware Mode
Disable Jitter Attenuator Input - Channel 0:
An active-high disables the Jitter Attenuator. The RPOS/RNEG and RCLK will
be passed through without jitter attenuation.
Host Mode
Microprocessor Serial Interface Clock Signal:
This signal will be used to sample the data on the SDI pin, on the rising edge
of this signal. Additionally, during “Read” operations, the Microprocessor Serial
Interface will update the SDO output on the falling edge of this signal.
Internal 50 K Ohm pull-down resistor.
22
23
GND
****
I
Digital Ground
RPOS_2
Received Positive Data (Jittery) Input: - channel 2:
Data that is input on this pin is sampled on either the rising or falling edge of
RCLK depending on the setting of the RCLKES pin (pin 10).
If RCLKES is “high”, then RPOS will be sampled on the falling edge of RCLK.
If RCLKES is “low”, then RPOS will be sampled on the rising edge of RCLK.
Internal 50 K Ohm pull-up resistor.
24
RNEG_2
I
Received Negative Data (Jittery) - channel 2:
The input jittery negative data is sampled either on the rising or falling edge of
RCLK depending on the setting of RCLKES.
If RCLKES is “high”, then RNEG will be sampled on the falling edge of RCLK.
If RCLKES is “low”, then RPOS will be sampled on the rising edge of RCLK.
This pin is typically tied to the “RNEG” output pin of the LIU.
Internal 50 K Ohm pull-up resistor.
25
26
VDD
****
I
Digital Power Supply = 5V±5% or 3.3V±5%
RCLK_2
Received Clock (Jittery) - channel 2:
Clock input RCLK2 should be connected to the recovered clock.
Internal 50 K Ohm pull-up resistor.
27
28
GND
****
I
Digital Ground
MCLK_2
Master Clock Input - channel 2:
Reference clock for internal PLL. 44.736MHz+/-20ppm or 34.368MHz+/-
20ppm. This clock must be continuous and jitter free with duty cycle between
30 to 70%.
It is permissible to use the EXCLK signal orSTS1 clock.
Internal 50 K Ohm pull-up resistor.
29
30
DJA_2/CS
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I
Hardware Mode
Disable Jitter Attenuator Input - Channel 2:
See description of pin 25
Host Mode
Chip Select Input:
An active-low input enables the serial interface.
Internal 50 K Ohm pull-down resistor.
STS1_2
SONET STS1 Mode Select - channel 2:
See description pin 19
5
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
PIN DESCRIPTION
PIN #
NAME
TYPE
DESCRIPTION
31
FL_2
O
FIFO Limit - channel 2:
See description pin 18
32
33
34
35
AGND
AVDD
****
****
****
O
Analog Ground
Analog Power Supply =5±5% or 3.3V±5%
Digital Ground
GND
RRCLK_2
Received Recovered Output (De-jittered) Clock - channel 2:
See description of pin 3
36
37
38
RRPOS_2
RRNEG_2
FSS
O
O
I
Received Recovered Positive Data (De-Jittered) Output - channel
2:
See description of pin 4
Received Recovered Negative Data (De-Jittered) Output - channel
2:
See description of pin 5
FIFO Size Select Input:
When “High”: Selects 32 bits FIFO.
When “Low”: Selects 16 bits FIFO.
Internal 50 K Ohm pull-down resistor.
39
40
SDO
O
Serial Data Output:
This pin will serially output the contents of the specified Command Register,
during “Read” Operations. The data, on this pin, will be updated on the falling
edge of the SCLK input signal. This pin will be tri-stated upon completion of
data transfer.
DS3/E3_2
I
DS3/E3 Select Input - channel 2:
See description pin 8
Internal 50 K Ohm pull-down resistor.
41
42
43
VDD
NC
****
I
Digital Power Supply = 5V±5% or 3.3V±5%
No Connection
RCLKES
Received Clock Edge Select Input:
Hardware Mode
1. When RCLKES = “0”, then RPOS and RNEG are updated on the falling
edge of RCLK
2. When RCLKES = “1”, then RPOS and RNEG are updated on the rising
edge of RCLK
NOTE: This applies to all channels.
Host Mode
Connect this pin to GND when the 71D03 is configured in the Host Mode.
Internal 50 K Ohm pull-down resistor.
44
45
RRNEG_1
RRPOS_1
O
O
Received Recovered Negative Data (De-Jittered) Output - channel
1:
See description of pin 5
Received Recovered Positive Data (De-Jittered) Output - channel
1:
See description of pin 4
6
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
PIN DESCRIPTION
PIN #
NAME
TYPE
DESCRIPTION
46
RRCLK_1
O
Received Recovered Output (De-jittered) Clock - channel 1:
See description of pin 3.
47
48
49
50
GND
AVDD
AGND
FL_1
****
****
****
O
Digital Ground
Analog Power Supply = 5 V±5% or 3.3V±5%
Analog Ground
FIFO Limit - channel 1:
See description pin 18
51
52
STS1_1
MCLK_1
I
I
SONET STS1 Mode Select - channel 1:
See description pin 19
Master Clock Input - channel 1:
See description pin 28.
Internal 50 K Ohm pull-up resistor.
53
54
GND
****
I
Digital Ground
RCLK_1
Received Clock (Jittery) - channel 1:
See description of pin 26.
Internal 50 K Ohm pull-up resistor.
55
56
RPOS_1
RNEG_1
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I
Received Positive Data (Jittery) Input: - channel 1:
See description of pin 23.
Internal 50 K Ohm pull-up resistor.
Received Negative Data (Jittery) - channel 1:
See description of pin 24.
Internal 50 K Ohm pull-up resistor.
57
58
VDD
****
I
Digital Power Supply = 5V±5% or 3.3V±5%
RNEG_0
Received Negative Data (Jittery) - channel 0:
See description of pin 24.
Internal 50 K Ohm pull-up resistor.
59
60
RPOS_0
RCLK_0
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I
Received Positive Data (Jittery) Input: - channel 0:
See description of pin 23.
Internal 50 K Ohm pull-up resistor.
Received Clock (Jittery) - channel 0:
See description of pin 26.
Internal 50 K Ohm pull-up resistor.
61
62
GND
****
I
Digital Ground
MCLK_0
Master Clock Input - channel 0:
See description pin 28.
Internal 50 K Ohm pull-up resistor.
7
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
PIN DESCRIPTION
PIN #
NAME
TYPE
DESCRIPTION
63
DJA_1/SDI
I
Hardware Mode
Disable Jitter Attenuator Input - Channel 1:
See description of pin 25
Host Mode
Serial Data Input
The address value (of the command registers) or the data value is either Read
or Written through this pin.
The input data will be sampled on the rising edge of the SCLK pin.
Internal 50 K Ohm pull-down resistor.
64
AGND
****
Analog Ground
8
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
ELECTRICAL CHARACTERISTICS
AC Electrical Characteristics
Electrical Characteristics (TA = 25°C, VDD = 3.3 V t0 5.0 V± 5% unless otherwise specified)
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS.
MClk
MClk
MClk
MClk
RClk
RClk
RClk
tsu
Duty Cycle
30
50
70
%
MHz
MHz
MHz
%
Frequency E3 + 20 ppm
34.368
44.736
51.84
50
Frequency DS3 + 20 ppm
Frequency STS-1 + 20 ppm
Duty Cycle
30
70
5
Rise Time
ns
Fall Time
5
ns
RPOS/RNEG to RClk rise time setup
3
1
2
2
3
3
ns
th
td
te
RPOS/RNEG to RClk rising hold time
RRPOS/RRNEG delay from RRClk rising
RRPOS/RRNEG delay from RRClk falling
ns
ns
ns
5
5
FIGURE 3. INPUT/OUTPUT TIMING
tsu
RCLK
RCLK
th
td
RPOS/RNEG
RPOS/RNEG
RClkES = 0
tsu
RCLK
RCLK
th
te
RPOS/RNEG
RPOS/RNEG
RClkES = 1
9
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
Microprocessor Serial Interface Timing ( see Figure 4 )
Electrical Characteristics (TA = 25°C, VDD = 3.3 V t0 5.0 V± 5 % unless otherwise specified)
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS.
t21
t22
t23
t24
t25
t26
t27
t28
t29
t30
t31
t32
CS Low to Rising Edge of SClk Setup Time
SClk to CS Hold Time
50
20
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
SDI to Rising Edge of SClk Setup Time
SDI to Rising Edge of SClk Hold Time
SClk “Low” Time
50
50
240
240
500
50
SClk “High” Time
SClk Period
SClk to CSB Hold Time
CS “Inactive” Time
250
Falling Edge of SClk to SDO Valid Time
Falling Edge of SClk to SDO Invalid Time
Falling Edge of SClk, or rising edge of CS to High Z
200
100
100
FIGURE 4. TIMING DIAGRAM FOR THE MICROPROCESSOR SERIAL INTERFACE
t29
t21
CS
SClk
SDI
t27
t28
t22
t25
t26
A1
t24
R/W
t23
A0
CS
SClk
t31
t30
Hi-Z
t33
t32
D0
D2
D7
SDO
SDI
D1
Hi-Z
10
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
DC Electrical Characteristics (TA = 25 °C, VDD = 3.3 V ± 5% unless otherwise specified)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Power Supply Voltage
Input High Voltage
Input Low Voltage
VDD
VIH
VIL
3.135
2.0
3.3
3.465
5.25
0.8
V
V
V
-0.5
Output High Voltage @ IOH=-5mA
Output Low Voltage @ IOL=5mA
VOH
VOL
Icc
Icc
Icc
IL
2.4
V
V
0.4
85
Supply Current (E3) @VDD = 3.465V
Supply Current (DS3) @VDD = 3.465V
Supply Current (STS-1) @VDD = 3.465V
Input Leakage Current (except Input pins with Pull-up resistor).
Input Capacitance
75
95
mA
mA
109
120
± 10
105
µA
pF
pF
CI
5.0
Output Load Capacitance
CL
25
DC Electrical Characteristics (TA = 25 °C, VDD = 5.0 V ± 5% unless otherwise specified)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Power Supply Voltage
Input High Voltage
Input Low Voltage
VDD
VIH
VIL
4.75
2.0
5.0
5.25
5.25
0.8
V
V
V
-0.5
Output High Voltage @ IOH=-5mA
Output Low Voltage @ IOL=5mA
Supply Current (E3) @VDD = 5.25V
Supply Current (DS3) @VDD = 5.25V
Supply Current (STS-1) @VDD = 5.25V
Input Leakage Current (except Input pins with Pull-up resistor).
Input Capacitance
VOH
VOL
Icc
Icc
Icc
IL
2.4
V
V
0.4
136
160
180
± 10
120
145
160
mA
mA
µA
pF
pF
CI
5.0
Output Load Capacitance
CL
25
ABSOLUTE MAXIMUM RATINGS:
Supply Range
ESD Rating
-0.5 V to + 6.0 V
> 2000 V on all pins
-400C to +850C
Operating Temperature
Storage Temperature
-65°C to + 150°C
11
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
The XRT71D03 also meets the DS3 wander specifi-
cation that apply to SONET and asynchronous inter-
faces as specified in the ANSI T1.105.03b 1997 stan-
dard.
SYSTEM DESCRIPTION
The XRT71D03 is an integrated 3-channel E3/DS3/
STS-1 jitter attenuator that attenuates the jitter from
the input clock and data. The jitter attenuation perfor-
mance meets the latest specifications such as Bellcore
GR-499 CORE,GR-253 CORE, ETSI TBR24,ITU-T
G.751,ITU-T G.752 and ITU-T G.755 standards.
Additionally, to support loop-timing applications, the
XRT71D03 can also be used to reduce and limit the
amount of jitter in the recovered line clock signal.
In addition, the XRT71D03 also meets both the map-
ping and pointer adjustment jitter generation criteria
for both Category I and Category II interfaces as
specified in Bellcore GR-253.
Figure 5 presents a simple block diagram of the
XRT71D03, when it is configured to operate in the
Hardware Mode and Figure 6 presents a simple block
diagram of the XRT71D03, when it is configured to
operate in the Host Mode.
FIGURE 5. ILLUSTRATION OF A TYPICAL CHANNEL_N OF THE XRT71D03 CONFIGURED TO OPERATE IN THE HARD-
WARE MODE
MCLK_n
Timing Control Block /
Phase locked Loop
Jittery
Clock
Smoothed
Clock
ICT
DJA_n
RRCLK_n
RClk_n
Write Clock
Read Clock
RRPOS_n
RRNEG_n
RCLKES
RPOS_n
RNEG_n
16/32 Bit FIFO
RRCLKES
FL_n
FSS
HOST
Rest
DS3/E3_n
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
FIGURE 6. ILLUSTRATION OF A TYPICAL CHANNEL_N OF THE XRT71D03 (CONFIGURED TO OPERATE IN THE HOST
MODE)
MClk_n
Timing Control Block /
Phase locked Loop
Smoothed
Clock
Jittery
Clock
ICT
RRCLK_n
Write Clock
Read Clock
RCLK_n
RRPOS_n
RRNEG_n
RRCLKES
FL_n
16/32 Bit FIFO
RPOS_n
RNEG_n
HOST
Reset
Microprocessor Serial
Interface
CS
SDI
SDO SClk
The XRT71D03 DS3/E3 Jitter Attenuator IC consists
of the following functional blocks:
from their ideal positions in time. Jitter can occur due
to any of the following:
• The Jitter-Attenuator PLL
• Timing Control Block
1) Imperfect timing recovery circuit in the system
2) Cross-talk noise
• The 2-Channel 16/32 Bit FIFO
• Serial Microprocessor Interface
3) Inter-symbol interference/Signal Distortion
1.2 JITTER TRANSFER CHARACTERISTICS
The primary purpose of jitter transfer requirements is
to prevent performance degradations by limiting the
accumulation of jitter through the system such that it
does not exceed the network interface jitter require-
ments. Thus, it is more important that a system meet
the jitter transfer criteria for relatively high input jitter
amplitudes. The jitter transferred through the system
must be under the jitter mask for any input jitter ampli-
tude within the range as shown in Figure 7
1.0 JITTER ATTENUATOR PLL
1.1 BACKGROUND INFORMATION DEFINITION OF JIT-
TER
One of the most important and least understood mea-
sures of clock performance is jitter. The International
Telecommunication Union defines jitter as short term
variations of the significant instants of a digital signal
13
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
FIGURE 7. CATEGORY 1 DS3 JITTER TRANSFER MASK
0.1
slope = -20 dB/decade
Acceptable
Range
40
Frequency (Hz)
1.2.1 Jitter Tolerance
FIFO is within 2 bits of being completely full, the FIFO
Limit (FL) will be set.
The jitter tolerance in the network element is defined
as the maximum amount of jitter in the incoming sig-
nal that it can receive in an error-free manner.
In Figure 5 and Figure 6, this de-jittered clock is la-
beled Smoothed Clock. This Smoothed Clock is now
used to Read Out the Recovered Data from the 16/32
bit FIFO. This Smoothed Clock will also be output to
the Terminal Equipment via the RRClk output pin.
Likewise, the Smoothed Recovered Data will output
to the Terminal Equipment via the RRPOS and
RRNEG output pins.
1.2.2 Jitter Generation
Jitter generation is defined in Section 7.3.3 of GR-
499-CORE. Jitter generation criteria exists for both
Category I and II interfaces, which consist of mapping
and pointer adjustment jitter generation.
Mapping jitter is the sum of the intrinsic payload map-
ping jitter and the jitter that is generated as a result of
the bit stuffing mechanisms used in all of the asyn-
chronous DSn mapping into STS SPE.
The XRT71D03 is designed to work as a companion
device with XRT73L03 (STS-1/DS3/E3) Line Inter-
face Unit.
ETSI TBR24 specifies the maximum output jitter in
loop timing must be no more than 0.4UIpp when mea-
sured between 100Hz to 800KHzwith up to 1.5UI in-
put jitter at 100Hz. This means a jitter attenuator with
bandwidth less than 100Hz is required to be compli-
ant with the standard. ITU G.751 is another applica-
tion where low bandwidth jitter attenuator is needed
to smooth the gapped clock output in the de-multi-
plexer system.
1.2.3 Jitter Attenuation
A digital Jitter Attenuation loop combined with the
FIFO provides Jitter attenuation. The Jitter Attenuator
requires no external components except for the refer-
ence clock.
Data is clocked into the FIFO with the associated
clock signal (TClk or RClk) and clocked out of the
FIFO with the dejittered clock and data. When the
14
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
1.3 XRT71D03 JITTER TRANSFER AND TOLERANCE
Table 2 summarizes the results of jitter tolerance test-
ing, performed on the XRT71D03.
Table 1 summarizes the results of jitter transfer char-
acteristics testing, performed on the XRT71D03.
Graphs of the measured Jitter Transfer are shown in
Figure 8, Figure 9 and Figure 10.
TABLE 1: XRT71D03 JITTER TRANSFER FUNCTION
DS3 E3
APPLICATION
STS-1
INPUT JITTER
FREQ. (HZ)
10
1UIPP
10UIPP
1UIPP
10UIPP
1UIPP
10UIPP
Jitter Gain (dB)
Jitter Gain (dB)
Jitter Gain (dB)
-0.10
-0.30
-2.24
-0.15
-0.22
-3.24
0.22
0.53
-1.09
20
-2.04
-3.63
-3.16
-5.51
-0.69
-5.92
30
-4.33
-5.93
-3.01
40
-5.98
-6.16
-7.68
-7.99
-8.10
-4.74
50
-7.55
-7.82
-10.36
-12.50
-15.20
-16.22
-17.38
-19.45
-20.36
-22.96
-23.78
-23.51
-9.61
-10.17
-11.24
-13.65
-14.78
-16.94
-17.38
-19.57
-21.96
-23.59
-25.76
-26.27
-27.41
-26.15
-6.33
60
-9.57
-9.17
-11.27
-13.59
-15.51
-17.07
-18.75
-21.11
-24.46
-28.84
-35.77
-7.64
80
-12.54
-14.67
-16.67
-17.32
-18.77
-21.43
-22.22
-25.42
-11.28
-13.36
-14.91
-16.78
-18.96
-21.81
-26.09
-33.44
-9.98
100
-11.92
-13.75
-15.23
-17.41
-21.69
-25.47
-32.99
-39.83
-41.95
-44.16
125
150
200
300
500
>1000
2000
3000
5000
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
FIGURE 8. DS3 JITTER TRANSFER CHARACTERISTICS
DS3 Jitter Transfer
10
100
1,000
5
0
-5
-10
-15
-20
-25
-30
-35
-40
1UIpp
10UIpp
Mask
Frequency (Hz)
FIGURE 9. E3 JITTER TRANSFER CHARACTERISTICS
E3 Jitter Transfer
10
100
1,000
5
0
-5
-10
-15
-20
-25
-30
-35
-40
1UIpp
10UIpp
Mask
Frequency (Hz)
16
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
FIGURE 10. STS-1 JITTER TRANSFER CHARACTERISTICS
STS-1 Jitter Transfer
10
100
1,000
10,000
5
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
1UIpp
10UIpp
Mask
Frequency (Hz)
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
TABLE 2: XRT71D03 MAXIMUM JITTER TOLERANCE
DS3 E3
APPLICATION
STS-1
FIFO SIZE
FREQ. (HZ)
10
16
32
16
32
16
32
UI (PEAK TO PEAK)
UI (PEAK TO PEAK)
UI (PEAK TO PEAK)
34.313
>64
26.689
53.313
37.438
33.938
32.688
32.063
31.689
31.314
31.189
31.064
31.064
30.939
30.939
30.939
30.939
38.938
>64
20
21.439
18.314
16.939
16.314
16.064
15.689
15.439
15.439
15.314
15.314
15.189
15.189
15.0189
43.188
36.813
34.313
33.188
32.563
31.814
31.439
31.314
31.189
31.064
30.939
30.939
30.939
18.564
16.689
16.064
15.689
15.564
15.314
15.314
15.189
15.189
15.189
15.064
15.064
15.189
22.689
18.939
17.439
16.814
16.439
16.064
15.814
15.689
15.689
15.564
15.564
15.564
15.439
15.439
15.439
15.439
44.813
37.688
34.938
33.563
32.813
32.063
31.814
31.564
31.439
31.314
31.189
31.189
31.189
31.189
26.189
16.189
30
40
50
60
80
100
125
150
200
300
500
>1000
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
2.0 OPERATING MODES
2.1 HARDWARE MODE
2.2 HOST MODE
In Host mode (connect the HOST pin to VDD), the se-
rial port interface pins are used to control configura-
tion and status report. In this mode, serial interface
pins, SDI, SDO,SCLK and CS are used.
The HOST pin is used to select the operating mode of
the XRT71D03. In Hardware mode (connect this pin
to ground), the serial processor interface is disabled
and hard-wired pins are used to control configuration
and report status.
A listing of these Command Registers, their Address-
es and their bit-formats are listed below in Table 4.
TABLE 3: FUNCTIONS OF DUAL MODE PINS IN
HARDWARE MODE CONFIGURATION
FUNCTION, WHILE IN THE
PIN #
PIN NAME
HARDWARE MODE
63
21
29
DJA_1/(SDI)
DJA_0/SCLK
DJA_2(CS)
DJA_1
DJA_0
DJA_2
TABLE 4: ADDRESS AND BIT FORMATS OF THE COMMAND REGISTERS
COMMAND
REGISTER
ADDR
TYPE
D7
D6
D5
D4
D3
D2
D1
D0
0X06
0x07
0x0E
0x0F
0x16
0x17
CR6
CR7
R/W
RO
***
***
***
***
***
***
***
***
***
***
***
***
STS-1_0
***
DS3/E3_0
***
DJA_0 RRClkES_0 RClkES_0 FSS_0
***
DJA_1 RRClkES_1 RClkES_1 FSS_1
*** *** FL_1
***
FL_0
CR14
CR15
CR22
CR23
R/W
RO
STS-1_1
***
DS3/E3_1
***
R/W
RO
STS-1_2
***
DS3/E3_2
***
DJA_2 RRClkES_2 RClkES_2 FSS_2
*** *** FL_2
3.0 MICROPROCESSOR SERIAL INTERFACE
The five (5) bit Address Values (labeled A0, A1, A2,
A3, and A4).
The serial interface for the XRT71D03 and the
XRT73L00 family of E3/DS3/STS-1 LIU’s are the
same, which makes it easy to configure both the
XRT71D03 and the LIU with a single CS, SDI, SDO
and SClk input and output pins.
The next five rising edges of the SClk signal will clock
in the 5-bit address value for this particular Read (or
Write) operation. The address selects the Command
Register for reading data from, or writing data to. The
address bits to the SDI input pin is applied in ascend-
ing order with the LSB (least significant bit) first.
3.1 SERIAL INTERFACE OPERATION.
Serial interface data structure and timings are provid-
ed in Figure 5 and 6 respectively.
3.1.3 Bit 7—A5
A5 must be set to “0”, as shown in Figure 11.
The clock signal is provided to the SClk and the CS is
asserted for 50 ns prior to the first rising edge of the
SClk.
3.1.4 Bit 8—A6
The value of A6 is a don’t care.
3.1.1 Bit 1—R/W (Read/Write) Bit
Once these first 8 bits have been written into the Seri-
al Interface, the subsequent action depends upon
whether the current operation is a Read or Write op-
eration.
This bit will be clocked into the SDI input, on the first
rising edge of SClk (after CS has been asserted).
This bit indicates whether the current operation is a
Read or Write operation.
3.1.5 Read Operation
A “1” in this bit specifies a Read operation, a “0” in
this bit specifies a Write operation.
Once the last address bit (A4) has been clocked into
the SDI input, the Read operation will proceed
through an idle period, lasting three SClk periods. On
3.1.2 Bits 2 through 5—A0, A1, A2, A3, and A4
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
the falling edge of SClk Cycle #8 (see Figure 11) the
serial data output signal (SDO) becomes active. At
this point the user can begin reading the data con-
tents of the addressed Command Register (at Ad-
dress [A4, A3, A2, A1, A0]) via the SDO output pin.
The Serial Interface will output this eight bit data word
(D0 through D7) in ascending order (with the LSB
first), on the falling edges of the SClk. The data (on
the SDO output pin) is stable for reading on the very
next rising edge of the SClk.
3.1.6 Write Operation
Once the last address bit (A4) has been clocked into
the SDI input, the Write operation will proceed
through an idle period, lasting three SClk periods. Pri-
or to the rising edge of SClk Cycle #9, the eight bit
data word is applied to SDI input. Data on SDI is
latched on the rising edge of SClk.
FIGURE 11. MICROPROCESSOR SERIAL INTERFACE DATA STRUCTURE
CS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
SClk
SDI
R/W
A0
A1
A2
A3
A4
0
A6
D0
D1
D2
D3
D4
D5
D6
D7
High Z
High Z
D0
D1
D2
D3
D4
D5
D6
D7
SDO
NOTES:
3.1.7 Simplified Interface Option
1. A5 is always “0”.
The user can simplify the design of the circuitry con-
necting to the Microprocessor Serial Interface by ty-
ing both the SDO and SDI pins together, and reading
data from and/or writing data to this combined signal.
This simplification is possible because only one of
2. R/W = “1” for Read Operations
3. R/W = “0” for Write Operations
4. Denotes a “don’t care” value (shaded areas)
20
XRT71D03
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3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
these signals are active at any given time. The inac-
tive signal will be tri-stated.
FIGURE 12. TIMING DIAGRAM FOR THE MICROPROCESSOR SERIAL INTERFACE
t29
t21
CS
SClk
SDI
t27
t28
t22
t25
t26
A1
t24
R/W
t23
A0
CS
SClk
t31
t30
Hi-Z
t33
t32
D0
D2
D7
SDO
SDI
D1
Hi-Z
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
ORDERING INFORMATION
PART #
PACKAGE
OPERATING TEMPERATURE RANGE
-40oC to +85oC
XRT71D03IV
64 Pin TQFP
Theta - JA = 38° C/W
Theta JC = 7° C/W
THERMAL INFORMATION
PACKAGE DIMENSIONS
64 Lead Thin Quad Flat Pack
(10 x 10 x 1.4 mm LQFP)
β
α
INCHES
MIN
MILLIMETERS
SYMBOL
MAX
0.063
0.006
0.057
0.011
0.008
0.480
0.398
MIN
1.40
0.05
1.35
0.17
0.09
11.80
9.90
MAX
1.60
0.15
1.45
0.27
0.20
12.20
10.10
A
A1
A2
B
C
D
0.055
0.002
0.053
0.007
0.004
0.465
0.390
D1
e
0.0020 BSC
0.05 BSC
L
α
0.018
0°
0.050
7°
0.45
0°
0.75
7°
β
7° typ
7° typ
aaa
-
0.003
-
0.08
Note: Control Dimensions are the Millimeter Column
22
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XRT71D03
3 CHANNEL E3/DS3/STS-1 JITTER ATTENUATOR
REV. 1.2.0
REVISION HISTORY
Rev. P1.0.1; Revised pull-up/pull-down resistors on various pins.
Rev. P1.0.2; Changed date and made minor edits to page 1.
Rev. P1.0.3; Corrected Pin List descriptions. Modified pin names to be consistent, ie MCLK0, RPOS0,
RNEG0, etc. changed to MCLK_0, RPOS_0, RNEG_0, etc. Changed VSS to GND. Changed figures to re-
flect pin name changes.
Rev. 1.1.0 Removed preliminary designation. Added electrical tables.
Rev. 1.1.1 Corrected Table 4 adding RRClkES_n as data D2, STS-1_n as D5, added D7. Corrected the
description of the section 3 Serial Microprocessor Interface. Moved figure 9 into Electrical Characteristics
Section. Moved Jitter Transfer/Tolerance tables into Jitter Attenuator Section 1. Edited electrical tables.
Rev. 1.1.2 Corrected ordering information from XRT71DO3 to 71D03IV.
Rev. 1.2.0 Removed all reference to STS-1 to DS3 desynchronizer.
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order
to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of
any circuits described herein, conveys no license under any patent or other right, and makes no represen-
tation that the circuits are free of patent infringement. Charts and schedules contained here in are only for
illustration purposes and may vary depending upon a user’s specific application. While the information in
this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where
the failure or malfunction of the product can reasonably be expected to cause failure of the life support sys-
tem or to significantly affect its safety or effectiveness. Products are not authorized for use in such applica-
tions unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury
or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corpo-
ration is adequately protected under the circumstances.
Copyright 2001 EXAR Corporation
Datasheet September 2001.
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
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