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V2406A-C7-T
Intel 3rd Gen Core CPU, EN 50155 railway computer
MOXA
TI
10VK-426-R
High-density Signal Conditioners 10-RACK
MSYSTEM
5448556
Printed-circuit board connector - BCP-500F-13 GN
PHOENIX
WALSIN
MSYSTEM
ICT
VJ0603DR2RDXJATHT
Surface Mount Multilayer Ceramic Chip Capacitors for High Temperatures 175 °C / 200 °C
VISHAY
SMAJ48A
Excellent clamping capability
DYELEC
WALSIN
18KYC-AA-R
Rack-mounted DCS Signal Conditioners 18K-RACK
MSYSTEM
10VK-630-R
High-density Signal Conditioners 10-RACK
MSYSTEM
MURATA
TE
XPS628437YKAR
1.8-V to 5.5-V input, 600-mA ultra-low IQ step-down converter in WCSP | YKA | 6 | -40 to 125
TI
MURATA
TRACOPOWER
DONGYA
VJ0603DR2RBXKAPHT
Surface Mount Multilayer Ceramic Chip Capacitors for High Temperatures 175 °C / 200 °C
VISHAY
MURATA
MSYSTEM
WALSIN
KFS-H2-C
Plug-in Signal Conditioners K-UNIT
MSYSTEM
TDK
TE
DLP650LEFYL
0.65-inch, WXGA DLP® digital micromirror device (DMD) | FYL | 149 | 0 to 70
TI
VJ0603DR2RCXCAJHT
Surface Mount Multilayer Ceramic Chip Capacitors for High Temperatures 175 °C / 200 °C
VISHAY
ICT
WALSIN
TE
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KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
VISHAY
MSYSTEM
GLENAIR
ITT
MICROSEMI
YAGEO
ECLIPTEK
ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
PANASONIC
CTS
SCHURTER
KNOWLES
MURATA
TE
TOREX
SILICON
BOURNS
GOLLEDGE
STMICROELECTRONICS
RCD
BEL
NXP
MICROCHIP
TDK
KOA
INFINEON
FOXCONN
EUROQUARTZ
MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
RICOH
