74LVT245WMX_NL_技术文档

February 2008

74LVT245, 74LVTH245

Low Voltage Octal Bidirectional Transceiver with 3-STATE

Inputs/Outputs

Features

General Description

■ Input and output interface capability to systems at

The LVT245 and LVTH245 contain eight non-inverting

bidirectional buffers with 3-STATE outputs and are

intended for bus-oriented applications. The Transmit/

Receive (T/R) input determines the direction of data flow

through the bidirectional transceiver. Transmit (active-

HIGH) enables data from A ports to B ports; Receive

(active-LOW) enables data from B ports to A ports. The

Output Enable input, when HIGH, disables both A and B

ports by placing them in a HIGH Z condition.

5V V

CC

■ Bushold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH245),

also available without bushold feature (74LVT245)

■ Live insertion/extraction permitted

■ Power Up/Down high impedance provides glitch-free

bus loading

■ Outputs source/sink, –32mA/+64mA

■ Latch-up performance exceeds 500mA

■ ESD performance:

The LVTH245 data inputs include bushold, eliminating

the need for external pull-up resistors to hold unused

inputs.

– Human-body model > 2000V

– Machine model > 200V

These transceivers are designed for low-voltage (3.3V)

V

applications, but with the capability to provide a TTL

CC

– Charged-device model > 1000V

interface to a 5V environment. The LVT245 and

LVTH245 are fabricated with an advanced BiCMOS

technology to achieve high speed operation similar to 5V

ABT while maintaining a low power dissipation.

Ordering Information

Package

Order Number

74LVT245WM

74LVT245SJ

Number

Package Description

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide

M20D

74LVT245MSA

74LVT245MTC

MSA20

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

74LVTH245WM

74LVTH245SJ

M20B

M20D

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

74LVTH245MSA

74LVTH245MTC

MSA20

MTC20

20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.

All packages are lead free per JEDEC: J-STD-020B standard.

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

Connection Diagram

Logic Symbols

IEEE/IEC

Pin Description

Names

Description

OE

T/R

A –A

Output Enable Input

Transmit/Receive Input

Side A Inputs or 3-STATE Outputs

Side B Inputs or 3-STATE Outputs

0

7

B –B

0

Truth Table

Inputs

OE

L

T/R

Outputs

L

H

X

Bus B Data to Bus A

Bus A Data to Bus B

HIGH-Z State

L

H

H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

2

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Rating

V

Supply Voltage

–0.5V to +4.6V

CC

V

DC Input Voltage

DC Output Voltage

Output in 3-STATE

–0.5V to +7.0V

I

V

O

–0.5V to +7.0V

–50mA

(1)

Output in HIGH or LOW State

I

DC Input Diode Current, V < GND

I

IK

I

DC Output Diode Current, V < GND

–50mA

OK

O

I

DC Output Current, V > V

O

CC

Output at HIGH State

Output at LOW State

64mA

128mA

I

DC Supply Current per Supply Pin

DC Ground Current per Ground Pin

Storage Temperature

64mA

CC

I

128mA

GND

T

–65°C to +150°C

STG

Note:

1. I Absolute Maximum Rating must be observed.

O

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min

2.7

0

Max

3.6

5.5

–32

64

Units

V

Supply Voltage

Input Voltage

CC

V

I

HIGH-Level Output Current

LOW-Level Output Current

Free-Air Operating Temperature

mA

°C

OH

I

OL

T

–40

0

85

A

∆t / ∆V

Input Edge Rate, V = 0.8V–2.0V, V = 3.0V

10

ns/V

IN

CC

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

3

DC Electrical Characteristics

T_A= –40°C to +85°C

Symbol

Parameter

Input Clamp Diode Voltage

Input HIGH Voltage

V_CC(V)

2.7

Conditions

Min.

Max.

Units

V

I = –18mA

–1.2

V

IK

IH

I

2.7–3.6

2.7

V

≤ 0.1V or

2.0

O

≥ V – 0.1V

V

Input LOW Voltage

O

CC

0.8

IL

V

Output HIGH Voltage

I

= –100µA

= – 8mA

= –32mA

= 100µA

= 24mA

= 16mA

= 32mA

= 64mA

V – 0.2

CC

V

OH

OL

2.4

2.0

3.0

V

Output LOW Voltage

2.7

0.2

0.5

OL

3.0

0.4

0.5

0.55

(2)

I

Bushold Input Minimum Drive

3.0

V = 0.8V

75

–75

500

–500

µA

I(HOLD)

I

V = 2.0V

I

(2)

(3)

I

Bushold Input Over-Drive,

Current to Change State

I(OD)

(4)

I

Input Current

Control Pins

Data Pins

3.6

V = 5.5V

10

1

I

V = 0V or V

I

CC

V = 0V

–5

1

I

V = V

I

CC

I

Power Off Leakage Current

0

0V ≤ V or V ≤ 5.5V

100

µA

OFF

I

O

I

Power Up/Down, 3-STATE Current

0–1.5V

V

= 0.5V to V

,

PU/PD

O

CC

V = GND to V

I

CC

I

3-STATE Output Leakage Current

Power Supply Current

3.6

V

= 0.5V

= 0.0V

= 3.0V

= 3.6V

–5

µA

OZL

(2)

O

I

OZL

O

I

5

µA

OZH

O

(2)

I

5

µA

OZH

O

I

+

< V ≤ 5.5V

10

µA

OZH

CC

O

I

Outputs HIGH

Outputs LOW

0.19

5

mA

CCH

I

Power Supply Current

CCL

I

Power Supply Current

Outputs Disabled

0.19

CCZ

I

+

Power Supply Current

V

≤ V ≤ 5.5V,

CC O

CCZ

Outputs Disabled

(5)

∆I

Increase in Power Supply Current

3.6

One Input at V – 0.6V,

0.2

mA

CC

Other Inputs at V or

CC

GND

Notes:

2. Applies to Bushold versions only (LVTH245).

3. An external driver must source at least the specified current to switch from LOW-to-HIGH.

4. An external driver must sink at least the specified current to switch from HIGH-to-LOW.

5. This is the increase in supply current for each input that is at the specified voltage level rather than V or GND.

CC

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

4

(6)

Dynamic Switching Characteristics

Conditions

C = 50 pF, R = 500Ω

T = 25°C

A

V

(V)

CC

Symbol

Parameter

Min.

Typ. Max. Units

L

(7)

V

Quiet Output Maximum

3.3

0.8

V

OLP

Dynamic V

OL

(7)

V

Quiet Output Minimum

Dynamic V

3.3

–0.8

V

OLV

OL

Notes:

6. Characterized in SOIC package. Guaranteed parameter, but not tested.

7. Max number of outputs defined as (n). n–1 data inputs are driven 0V to 3V. Output under test held LOW.

AC Electrical Characteristics

T = –40°C to +85°C,

A

C = 50 pF, R = 500Ω

L

V

= 3.3V 0.3V

V

= 2.7V

CC

Symbol

Parameter

Min.

1.2

1.3

1.7

2.0

Max.

3.6

3.5

5.5

5.7

5.9

5.0

1.0

Min.

1.2

1.3

1.7

2.0

Max.

Units

t

Propagation Delay

4.0

7.1

6.7

6.5

5.1

1.0

ns

PLH

PHL

PZH

t

Output Enable Time

Output Disable

ns

t

PZL

PHZ

t

PLZ

(8)

t

, t

Output to Output Skew

OSHL OSLH

Note:

8. Skew is defined as the absolute value of the difference between the actual propagation delay for any two

separate outputs of the same device. The specification applies to any outputs switching in the same direction,

either HIGH-to-LOW (t

) or LOW-to-HIGH (t

).

OSHL

OSLH

(9)

Capacitance

Symbol

Parameter

Conditions

Typical

Units

pF

C

Input Capacitance

Output Capacitance

V

= 0V, V = 0V or V

CC

4

8

IN

CC

I

C

= 3.0V, V = 0V or V

CC

pF

OUT

CC

O

Note:

9. Capacitance is measured at frequency f = 1MHz, per MIL-STD-883, Method 3012.

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

5

Physical Dimensions

13.00

12.60

A

11.43

20

11

B

9.50

10.65 7.60

10.00 7.40

2.25

1

PIN ONE

INDICATOR

10

0.65

0.51

0.35

1.27

M

0.25

C B A

LAND PATTERN RECOMMENDATION

SEE DETAIL A

2.65 MAX

0.33

0.20

C

0.10

C

0.30

0.10

SEATING PLANE

0.75

0.25

X 45°

NOTES: UNLESS OTHERWISE SPECIFIED

(R0.10)

A) THIS PACKAGE CONFORMS TO JEDEC

MS-013, VARIATION AC, ISSUE E

GAGE PLANE

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS DO NOT INCLUDE MOLD

FLASH OR BURRS.

0.25

8°

0°

D) CONFORMS TO ASME Y14.5M-1994

1.27

0.40

SEATING PLANE

E) LANDPATTERN STANDARD: SOIC127P1030X265-20L

F) DRAWING FILENAME: MKT-M20BREV3

(1.40)

DETAIL A

SCALE: 2:1

Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

6

Physical Dimensions (Continued)

Figure 2. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

7

Physical Dimensions (Continued)

Figure 3. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

8

Physical Dimensions (Continued)

Figure 4. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

9

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global

subsidiaries, and is not intended to be an exhaustive list of all such trademarks.

ACEx^®

PDP-SPM™

SupreMOS™

FPS™

Power220^®

SyncFET™

Build it Now™

CorePLUS™

CROSSVOLT™

CTL™

Current Transfer Logic™

EcoSPARK^®

EZSWITCH™ *

™

FRFET^®

POWEREDGE^®

Power-SPM™

PowerTrench^®

Programmable Active Droop™

QFET^®

®

Global Power Resource^SM

Green FPS™

Green FPS™e-Series™

GTO™

i-Lo™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

The Power Franchise^®

TinyBoost™

TinyBuck™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

µSerDes™

UHC^®

QS™

QT Optoelectronics™

Quiet Series™

RapidConfigure™

SMART START™

SPM^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

®

Fairchild^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

MicroPak™

MillerDrive™

Motion-SPM™

OPTOLOGIC^®

FAST^®

Ultra FRFET™

UniFET™

VCX™

OPTOPLANAR^®

FastvCore™

®

FlashWriter^{® *}

* EZSWITCH™ and FlashWriter^®are trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS

HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE

APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS

PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S

WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,

which, (a) are intended for surgical implant into the body or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

device, or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

This datasheet contains the design specifications for product

development. Specifications may change in any manner without notice.

Advance Information

Formative or In Design

This datasheet contains preliminary data; supplementary data will be

published at a later date. Fairchild Semiconductor reserves the right to

make changes at any time without notice to improve design.

Preliminary

First Production

Full Production

Not In Production

This datasheet contains final specifications. Fairchild Semiconductor

reserves the right to make changes at any time without notice to improve

the design.

No Identification Needed

Obsolete

This datasheet contains specifications on a product that has been

discontinued by Fairchild Semiconductor. The datasheet is printed for

reference information only.

Rev. I33

74LVT245, 74LVTH245 Rev. 1.4.0

www.fairchildsemi.com

10


型号：	74LVT245WMX_NL
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	Bus Transceiver, LVT Series, 1-Func, 8-Bit, True Output, BICMOS, PDSO20, 0.300 INCH, MS-013, SOIC-20 信息通信管理光电二极管逻辑集成电路
文件：	总10页 (文件大小：324K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

74LVT245WMX_NL [FAIRCHILD]

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