74VCX08MTC [FAIRCHILD]

Low Voltage Quad 2-Input AND Gate with 3.6V Tolerant Inputs and Outputs; 低电压四2输入与门与3.6V容限输入和输出


型号：	74VCX08MTC
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	Low Voltage Quad 2-Input AND Gate with 3.6V Tolerant Inputs and Outputs 低电压四2输入与门与3.6V容限输入和输出栅极触发器逻辑集成电路光电二极管
文件：	总10页 (文件大小：411K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

July 1999

Revised February 2005

74VCX08

Low Voltage Quad 2-Input AND Gate with

3.6V Tolerant Inputs and Outputs

General Description

The VCX08 contains four 2-input AND gates. This product

Features

■ 1.2V to 3.6V V_CCsupply operation

is designed for low voltage (1.2V to 3.6V) V_CCapplications

■ 3.6V tolerant inputs and outputs

■ t_PD

with I/O compatibility up to 3.6V

The VCX08 is fabricated with an advanced CMOS technol-

ogy to achieve high-speed operation while maintaining low

CMOS power dissipation.

2.8 ns max for 3.0V to 3.6V V_CC

■ Power-off high impedance inputs and outputs

■ Static Drive (I_OH/I_OL

)

24 mA @ 3.0V V_CC

■ Uses patented Quiet Series noise/EMI reduction

circuitry

■ Latchup performance exceeds 300 mA

■ ESD performance:

Human body model 2000V

Machine model 250V

■ Leadless Pb-Free DQFN package

Ordering Code:

Package

Order Number

Package Description

Number

74VCX08M

(Note 1)

M14A

14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

74VCX08BQX

(Note 2)

MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC

MO-241, 2.5 x 3.0mm

74VCX08MTC

(Note 1)

MTC14

14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

74VCX08MTCX_NL

(Note 3)

MTC14

Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

Pb-Free package per JEDEC J-STD-020B.

Note 1: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Note 2: DQFN package available in Tape and Reel only.

Note 3: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.

Quiet Series is a trademark of Fairchild Semiconductor Corporation.

DS500165

www.fairchildsemi.com

Logic Symbol

Connection Diagrams

IEEE/IEC

Pin Assignments for SOIC and TSSOP

Pad Assignments for DQFN

Pin Descriptions

Pin Names

A_n, B_n

Description

Inputs

Outputs

O_n

(Top View)

www.fairchildsemi.com

Absolute Maximum Ratings(Note 4)

Recommended Operating

Conditions ^{(Note 6)}

0.5V to 4.6V

Supply Voltage (V_CC

)

DC Input Voltage (V_I)

Output Voltage (V_O)

HIGH or LOW State (Note 5)

V_CC0V

0.5V to 4.6V Power Supply

Operating

1.2V to 3.6V

0.3V to 3.6V

0.5V to V_CC0.5V

Input Voltage

0.5V to 4.6V Output Voltage (V_O)

HIGH or LOW State

DC Input Diode Current (I_IK

V_I0V

)

0V to V_CC

50 mA

Output Current in I_OH/I_OL

V_CC3.0V to 3.6V

DC Output Diode Current (I_OK

V_O0V

)

24 mA

18 mA

6 mA

50 mA

100 mA

V_CC2.3V to 2.7V

V_OV_CC

V_CC1.65V to 2.3V

V_CC1.4V to 1.6V

DC Output Source/Sink Current (I_OH/I_OL

DC V_CCor Ground Current per

Supply Pin (I_CCor Ground)

)

2 mA

V_CC1.2V

100 A

Free Air Operating Temperature (T_A)

40 C to 85 C

Storage Temperature Range (T_stg

)

65 C to 150 C Minimum Input Edge Rate ( t/ V)

V_in0.8V to 2.0V, V_CC3.0V

10 ns/V

Note 4: The Absolute Maximum Ratings are those values beyond which

the safety of the device cannot be guaranteed. The device should not be

operated at these limits. The parametric values defined in the Electrical

Characteristics tables are not guaranteed at the Absolute Maximum Rat-

ings. The “Recommended Operating Conditions” table will define the condi-

tions for actual device operation.

Note 5: I Absolute Maximum Rating must be observed.

Note 6: Floating or unused inputs must be held HIGH or LOW

DC Electrical Characteristics

Symbol

Parameter

Conditions

Min

Max

Units

(V)

HIGH Level Input Voltage

2.7 to 3.6

2.3 to 2.7

2.0

1.6

1.65 to 2.3 0.65 x V

1.4 to 1.6 0.65 x V

1.2

2.7 to 3.6

2.3 to 2.7

1.65 to 2.3

1.4 to 1.6

1.2

0.65 x V

LOW Level Input Voltage

HIGH Level Output Voltage

0.8

0.7

0.35 x V

0.05 x V

100

2.7 to 3.6

2.7

- 0.2

12 mA

18 mA

24 mA

2.2

3.0

2.4

2.2

3.0

100

2.3 to 2.7

2.3

- 0.2

6 mA

12 mA

18 mA

2.0

1.8

1.7

2.3

100

1.65 to 2.3

1.65

- 0.2

6 mA

100

1.25

- 0.2

1.4 to 1.6

1.4

2 mA

100

1.05

- 0.2

1.2

www.fairchildsemi.com

DC Electrical Characteristics (Continued)

Symbol

Parameter

Conditions

Min

Max

Units

(V)

2.7 to 3.6

2.7

LOW Level Output Voltage

100

0.2

0.4

0.55

0.2

0.4

0.6

0.2

0.35

0.05

5.0

12 mA

18 mA

24 mA

3.0

100

2.3 to 2.7

2.3

12 mA

18 mA

2.3

100

1.65 to 2.3

1.65

6 mA

100

1.4 to 1.6

1.4

2 mA

100

1.2

Input Leakage Current

3.6V

1.2 to 3.6

Power Off Leakage Current

Quiescent Supply Current

(V , V

)

3.6V

OFF

or GND

3.6V

1.2 to 3.6

2.7 to 3.6

Increase in I per Input

V 0.6V

750

AC Electrical Characteristics (Note 7)

40 C to 85 C

Figure

Symbol

Parameter

Propagation Delay

Conditions

Units

(V)

Min

0.6

0.8

1.0

1.5

Max

2.8

Number

30 pF, R

500

3.3 0.3

2.5 0.2

1.8 0.15

1.5 0.1

1.2

PHL

Figures

1, 2

3.7

PLH

7.4

15 pF, R

30 pF, R

14.8

37.0

0.5

Figures

3, 4

Output to Output Skew

(Note 8)

500

3.3 0.3

2.5 0.2

1.8 0.15

1.5 0.1

1.2

OSHL

OSLH

0.5

0.75

1.5

15 pF, R

1.5

Note 7: For C

pF, add approximately 300 ps to the AC maximum specification.

Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The

specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t ) or LOW-to-HIGH (t ).

OSHL

OSLH

www.fairchildsemi.com

Dynamic Switching Characteristics

25 C

Symbol

Parameter

Conditions

Units

(V)

1.8

2.5

3.3

1.8

2.5

3.3

1.8

2.5

3.3

Typical

0.25

0.6

Quiet Output Dynamic Peak V

30 pF, V

, V

OLP

0.8

Quiet Output Dynamic Valley V

0.25

0.6

OLV

0.8

1.5

OHV

1.9

2.2

Capacitance

25 C

Symbol

Parameter

Conditions

Units

Typical

6.0

Input Capacitance

Output Capacitance

Power Dissipation Capacitance

0V or V , V

1.8V, 2.5V or 3.3V

0V or V , V

7.0

OUT

0V or V , f 10 MHz, V

1.8V, 2.5V or 3.3V

20.0

AC Loading and Waveforms (V 3.3V r 0.3V to 1.8V r 0.15V)

FIGURE 1. AC Test Circuit

TEST

SWITCH

t_PLH, t_PHL

Open

FIGURE 2. Waveform for Inverting and Non-inverting Functions

V_CC

Symbol

3.3V 0.3V

1.5V

2.5V 0.2V

V_CC/2

1.8V 0.15V

V_CC/2

V_mi

V_mo

1.5V

V_CC/2

www.fairchildsemi.com

AC Loading and Waveforms (V 1.5 r 0.1V to 1.2V)

TEST

SWITCH

_PLH, t_PHL

Open

V_CCx 2 at V_CC1.5V 0.1V

GND

_PZL, t_PLZ

t_PZH, t_PHZ

FIGURE 3. AC Test Circuit

FIGURE 4. Waveform for Inverting and Non-Inverting Functions

V_CC

Symbol

1.5V 0.1V

V_mi

V_CC/2

V_mo

www.fairchildsemi.com

Tape and Reel Specification

Tape Format for DQFN

Package

Tape

Section

Number

Cavities

125 (typ)

3000

Cavity

Status

Empty

Filled

Cover Tape

Status

Designator

Leader (Start End)

Carrier

Sealed

BQX

Sealed

Trailer (Hub End)

75 (typ)

Empty

Sealed

TAPE DIMENSIONS inches (millimeters)

REEL DIMENSIONS inches (millimeters)

Tape Size

13.0

0.059

(1.50)

0.512

(13.00)

0.795

(20.20)

2.165

0.488

(12.4)

0.724

(18.4)

12 mm

(330.0)

(55.00)

www.fairchildsemi.com

Physical Dimensions inches (millimeters) unless otherwise noted

14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

Package Number M14A

www.fairchildsemi.com

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm

Package Number MLP014A

www.fairchildsemi.com

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Package Number MTC14

Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and

Fairchild reserves the right at any time without notice to change said circuitry and specifications.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the

body, or (b) support or sustain life, and (c) whose failure

to perform when properly used in accordance with

instructions for use provided in the labeling, can be rea-

sonably expected to result in a significant injury to the

user.

2. A critical component in any component of a life support

device or system whose failure to perform can be rea-

sonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

www.fairchildsemi.com

相关型号：