74VHCU04MTC [FAIRCHILD]
Hex Inverter; 六反相器
| 型号： | 74VHCU04MTC |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Hex Inverter |
| 文件： | 总8页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
July 1993
Revised February 2005
74VHCU04
Hex Inverter
General Description
Features
The VHCU04 is an advanced high speed CMOS Inverter
fabricated with silicon gate CMOS technology. It achieves
the high speed operation similar to equivalent Bipolar
Schottky TTL while maintaining the CMOS low power dissi-
pation.
■ High Speed: tPD 3.5 ns (typ) at VCC 5V
■ Low Power Dissipation: ICC A (Max) @ TA 25 C
2
■ High Noise Immunity: VNIH VNIL 28% VCC (Min)
■ Power down protection is provided on all inputs
■ Low Noise: VOLP 0.8V (Max)
Since the internal circuit is composed of a single stage
inverter, it can be used in analog applications such as crys-
tal oscillators. An input protection circuit ensures that 0V to
7V can be applied to the input pins without regard to the
supply voltage. This device can be used to interface 5V to
3V systems and two supply systems such as battery
backup. This circuit prevents device destruction due to mis-
matched supply and input voltages.
■ Pin and Function Compatible with 74HCU04
Ordering Code:
Package
Order Number
Package Description
Number
74VHCU04M
M14A
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHCU04MX_NL
(Note 1)
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHCU04SJ
M14D
MTC14
MTC14
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHCU04MTC
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74VHCU04MTCX_NL
(Note 1)
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74VHCU04N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS011626
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Logic Symbol
Connection Diagram
IEEE/IEC
Truth Table
Pin Descriptions
A
L
O
H
L
Pin Names
Description
Inputs
Outputs
An
H
On
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2
Absolute Maximum Ratings(Note 2)
Recommended Operating
Conditions (Note 3)
0.5V to 7.0V
Supply Voltage (VCC
DC Input Voltage (VIN
DC Output Voltage (VOUT
Input Diode Current (IIK
Output Diode Current (IOK
DC Output Current (IOUT
DC VCC/GND Current (ICC
)
)
0.5V to 7.0V Supply Voltage (VCC
0.5V to VCC 0.5V Input Voltage (VIN
20 mA
20 mA Operating Temperature (TOPR
)
2.0V to 5.5V
0V to 5.5V
0V to VCC
)
)
)
Output Voltage (VOUT
)
)
)
40 C to 85 C
Note 2: Absolute Maximum Ratings are values beyond which the device
may be damaged or have its useful life impaired. The databook specifica-
tions should be met, without exception, to ensure that the system design is
reliable over its power supply, temperature, and output/input loading vari-
ables. Fairchild does not recommend operation outside databook specifica-
tions.
)
25 mA
50 mA
)
Storage Temperature (TSTG
Lead Temperature (TL)
(Soldering, 10 seconds)
)
65 C to 150 C
Note 3: Unused inputs must be held HIGH or LOW. They may not float.
260 C
DC Electrical Characteristics
V
T
25 C
Typ
T
A
40 C to 85 C
Max
CC
A
Symbol
Parameter
Units
Conditions
(V)
Min
Max
Min
1.70
0.8 V
V
V
V
HIGH Level
2.0
1.70
IH
V
V
Input Voltage
LOW Level
3.0 5.5 0.8 V
2.0
CC
CC
0.30
0.30
IL
Input Voltage
HIGH Level
Output Voltage
3.0 5.5
0.20 V
0.20 V
CC
CC
2.0
3.0
4.5
3.0
4.5
2.0
3.0
4.5
3.0
4.5
1.8
2.0
3.0
4.5
1.8
2.7
V
V
I
50 A
OH
IN
IL
OH
2.7
4.0
V
V
V
V
4.0
2.58
3.94
2.48
3.80
V
V
GND
I
I
I
4 mA
8 mA
IN
OH
OH
OL
V
LOW Level
0.0
0.0
0.0
0.2
0.3
0.5
0.2
0.3
0.5
V
50 A
OL
IN
IH
Output Voltage
0.36
0.36
0.1
0.44
0.44
1.0
V
V
I
I
4 mA
8 mA
IN
CC
OL
OL
I
I
Input Leakage Current
0
5.5
5.5
A
A
V
V
5.5V or GND
V or GND
CC
IN
CC
IN
Quiescent Supply Current
2.0
20.0
IN
3
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Noise Characteristics
V
T
25 C
Limits
CC
A
Symbol
Parameter
Units
Conditions
(V)
Typ
V
V
V
V
Quiet Output Maximum
5.0
0.5
0.8
0.8
4.0
1.0
V
C
C
C
C
50 pF
50 pF
50 pF
50 pF
OLP
L
L
L
L
(Note 4) Dynamic V
OL
Quiet Output Minimum
(Note 4) Dynamic V
5.0
5.0
5.0
0.5
V
V
V
OLV
OL
Minimum HIGH Level
(Note 4) Dynamic Input Voltage
Maximum LOW Level
(Note 4) Dynamic Input Voltage
IHD
ILD
Note 4: Parameter guaranteed by design.
AC Electrical Characteristics
V
T
25 C
Typ
T
A
40 C to 85 C
CC
A
Symbol
Parameter
Units
Conditions
(V)
Min
Max
8.9
11.4
5.5
7.0
10
Min
Max
10.5
13.0
6.5
t
t
Propagation Delay
3.3 0.3
5.0
7.5
3.5
5.0
5
1.0
1.0
1.0
1.0
C
C
C
C
15 pF
50 pF
15 pF
50 pF
Open
PHL
PLH
L
ns
ns
L
5.0 0.5
L
8.0
L
C
C
Input Capacitance
Power Dissipation
Capacitance
10
pF
pF
V
CC
IN
9
(Note 5)
PD
Note 5: C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average
PD
operating current can be obtained by the equation: I (opr.)
CC
C
* V * f
I
/6 (per gate).
CC
PD
CC
IN
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4
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
5
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
7
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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8
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