74VHCU04SJX_NL [FAIRCHILD]
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| 型号： | 74VHCU04SJX_NL |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | 暂无描述 |
| 文件： | 总9页 (文件大小：286K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
February 2008
74VHCU04
Hex Inverter
Features
General Description
■ High Speed: t = 3.5ns (typ.) at V = 5V
The VHCU04 is an advanced high speed CMOS Inverter
fabricated with silicon gate CMOS technology. It
achieves the high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining the CMOS low
power dissipation.
PD
CC
■ Low Power Dissipation: I = 2µA (max.) @ T = 25°C
CC
A
■ High Noise Immunity: V
= V
= 28% V (min.)
NIH
NIL CC
■ Power down protection is provided on all inputs
■ Low Noise: V = 0.8V (max.)
OLP
Since the internal circuit is composed of a single stage
inverter, it can be used in analog applications such as
crystal oscillators. An input protection circuit ensures that
0V to 7V can be applied to the input pins without regard
to the supply voltage. This device can be used to inter-
face 5V to 3V systems and two supply systems such as
battery backup. This circuit prevents device destruction
due to mismatched supply and input voltages.
■ Pin and Function Compatible with 74HCU04
Ordering Information
Package
Order Number
Number
Package Description
74VHCU04M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
74VHCU04SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHCU04MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
Connection Diagram
Logic Symbol
IEEE/IEC
Truth Table
A
L
O
Pin Description
H
L
Pin Names
Description
H
A
Inputs
n
O
Outputs
n
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Rating
V
Supply Voltage
–0.5V to +7.0V
–0.5V to +7.0V
CC
V
DC Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current
IN
V
–0.5V to V + 0.5V
OUT
CC
I
–20mA
20mA
IK
I
OK
I
25mA
OUT
I
DC V /GND Current
50mA
CC
CC
T
Storage Temperature
–65°C to +150°C
260°C
STG
T
Lead Temperature (Soldering, 10 seconds)
L
(1)
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Rating
V
Supply Voltage
2.0V to +5.5V
0V to +5.5V
0V to V
CC
V
Input Voltage
IN
V
Output Voltage
OUT
CC
T
Operating Temperature
–40°C to +85°C
OPR
Note:
1. Unused inputs must be held HIGH or LOW. They may not float.
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
3
DC Electrical Characteristics
T = –40°C to
A
T = 25°C
+85°C
A
Symbol
Parameter
V
(V)
Conditions
Min.
Typ.
Max.
Min.
Max.
Units
CC
2.0
V
HIGH Level Input
Voltage
1.70
1.70
V
IH
3.0–5.5
2.0
0.8 x V
0.8 x V
CC
CC
V
LOW Level Input
Voltage
0.30
0.30
V
V
IL
3.0–5.5
2.0
0.2 x V
0.2 x V
CC
CC
V
HIGH Level
Output Voltage
V
= V
I
= –50µA
1.8
2.7
2.0
3.0
4.5
1.8
2.7
OH
IN
IL
OH
3.0
4.5
4.0
4.0
3.0
V
V
= GND
I
I
I
= –4mA
= –8mA
= 50µA
2.58
3.94
2.48
3.80
IN
IN
OH
OH
OL
4.5
V
LOW Level
Output Voltage
2.0
= V
= V
0.0
0.0
0.0
0.2
0.3
0.2
0.3
V
OL
IH
3.0
4.5
0.5
0.5
3.0
I
I
= 4mA
= 8mA
0.36
0.36
0.1
0.44
0.44
1.0
V
OL
OL
IN
CC
4.5
I
Input Leakage
Current
0–5.5
V
V
= 5.5V or GND
µA
µA
IN
IN
IN
I
Quiescent
5.5
= V or GND
2.0
20.0
CC
CC
Supply Current
Noise Characteristics
T = 25°C
A
Symbol
Parameter
V
(V)
Conditions
Typ.
Limits
Units
CC
(2)
V
Quiet Output Maximum
Dynamic V
5.0
C = 50pF
0.5
0.8
V
OLP
L
OL
(2)
V
Quiet Output Minimum
Dynamic V
5.0
5.0
5.0
C = 50pF
–0.5
–0.8
4.0
V
V
V
OLV
L
OL
(2)
V
V
Minimum HIGH Level
Dynamic Input Voltage
C = 50pF
L
IHD
(2)
Maximum LOW Level
Dynamic Input Voltage
C = 50pF
1.0
ILD
L
Note:
2. Parameter guaranteed by design.
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
4
AC Electrical Characteristics
T = –40°C
A
T = 25°C
to +85°C
A
Symbol
Parameter
V
(V) Conditions Min. Typ. Max. Min. Max. Units
CC
t
, t
Propagation Delay
3.3 0.3 C = 15pF
5.0
7.5
3.5
5.0
5
8.9
11.4
5.5
7.0
10
1.0
1.0
1.0
1.0
10.5
13.0
6.5
ns
ns
PHL PLH
L
C = 50pF
L
5.0 0.5 C = 15pF
L
C = 50pF
8.0
L
C
Input Capacitance
V
= Open
10
pF
pF
IN
CC
(3)
C
Power Dissipation
Capacitance
9
PD
Note:
3. C is defined as the value of the internal equivalent capacitance which is calculated from the operating
PD
current consumption without load. Average operating current can be obtained by the equation:
I
(opr.) = C • V • f + I / 6 (per gate).
CC
PD CC IN CC
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
5
Physical Dimensions
8.75
8.50
0.65
A
7.62
14
8
B
5.60
4.00
3.80
6.00
1.70
1.27
1
7
PIN ONE
INDICATOR
0.51
0.35
1.27
(0.33)
LAND PATTERN RECOMMENDATION
M
0.25
C B A
1.75 MAX
1.50
SEE DETAIL A
1.25
0.25
0.19
0.25
0.10
C
0.10
C
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
0.50
0.25
X 45°
R0.10
R0.10
GAGE PLANE
D) LANDPATTERN STANDARD:
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.36
8°
0°
0.90
0.50
SEATING PLANE
(1.04)
DETAIL A
SCALE: 20:1
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
6
Physical Dimensions (Continued)
Figure 2. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
7
Physical Dimensions (Continued)
0.43 TYP
0.65
1.65
6.10
0.45
12.00°
TOP & BOTTOM
R0.09 min
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
R0.09min
1.00
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
8
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global
subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
ACEx®
PDP-SPM™
SyncFET™
®
FPS™
Power220®
Build it Now™
CorePLUS™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EZSWITCH™ *
™
FRFET®
Power247®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
GTO™
i-Lo™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
The Power Franchise®
POWEREDGE®
Power-SPM™
PowerTrench®
Programmable Active Droop™
QFET®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
µSerDes™
UHC®
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC®
Ultra FRFET™
UniFET™
VCX™
FAST®
OPTOPLANAR®
FastvCore™
®
FlashWriter® *
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Advance Information
Formative or In Design
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
the design.
No Identification Needed
Obsolete
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I32
©1993 Fairchild Semiconductor Corporation
74VHCU04 Rev. 1.4.0
www.fairchildsemi.com
9
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