FAN4860 [FAIRCHILD]
3MHz, 5V Output Synchronous TinyBoost⢠Regulator; 3MHz的, 5V输出同步TinyBoostâ ?? ¢稳压器型号: | FAN4860 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | 3MHz, 5V Output Synchronous TinyBoost⢠Regulator |
文件: | 总15页 (文件大小:808K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
April 2010
FAN4860
3MHz, 5V Output Synchronous TinyBoost™ Regulator
Features
Description
Operates with Very Small External Components:
1μH Inductor and 0402 Case Size Input and Output
Capacitors
The FAN4860 is a low-power boost regulator designed to
provide a regulated 5V output from a single cell Li-Ion
battery. The output voltage is fixed at 5.0V with a guaranteed
maximum load current of 200mA at VIN=2.3V and 300mA at
VIN=3.3V. Input current in shut-down mode is less than 1µA,
which maximizes battery life.
Input Voltage Range from 2.3V to 4.5V
Fixed 5.0V Output Voltage
Maximum Load Current 200mA at VIN=2.3V
Maximum Load Current 300mA at VIN=3.3V
Up to 92% Efficient
Light-load PFM operation is automatic and “glitch-free”. The
regulator maintains output regulation at no-load with 37µA
quiescent current.
The combination of built-in power transistors, synchronous
rectification, and low supply current make the FAN4860 ideal
for battery powered applications.
Low Operating Quiescent Current
True Load Disconnect During Shutdown
The FAN4860 is available in 6-bump 0.4mm pitch Wafer-
Level Chip Scale Package (WLCSP) and a 6-lead 2x2mm
ultra-thin MLP package.
Variable On-time Pulse Frequency Modulation (PFM) with
Light-Load Power-Saving Mode
Internal Synchronous Rectifier
(No External Diode Needed)
Thermal Shutdown and Overload Protection
6-Pin 2 x 2mm UMLP
6-Bump WLCSP, 0.4mm Pitch
Applications
USB “On the Go” 5V Supply
HDMI 5V Supply
5V Supply for H-Bridge Motor Drivers
Powering 5V Peripherals
Figure 1. Typical Application
Supply Source for WLED Torch and Flash Lighting
PDAs, Portable Media Players
Cell Phones, Smart Phones, Portable Instruments
Ordering Information
Part Number
Operating Temperature Range
Package
Packing Method
FAN4860UC5X
-40°C to 85°C
-40°C to 85°C
WLCSP, 0.4mm Pitch
UMLP-6, 2 x 2mm
Tape and Reel
Tape and Reel
FAN4860UMP5X
Please refer to tape and reel specifications at http://www.fairchildsemi.com/packaging.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
Block Diagrams
Figure 2. IC Block Diagram
Pin Configuration
Figure 3. WLCSP (Top View)
Figure 4. WLCSP (Bottom View)
Figure 5. 2X2mm UMLP (Top View)
Pin Definitions
Pin #
Name Description
WLCSP UMLP
Input Voltage. Connect to Li-Ion battery input power source and input capacitor (CIN).
Switching Node. Connect to inductor.
A1
B1
C1
C2
B2
6
5
4
3
2
VIN
SW
Enable. When this pin is HIGH, the circuit is enabled. This pin should not be left floating.
Feedback. Output voltage sense point for VOUT. Connect to output capacitor (COUT).
Output Voltage. This pin is both the output voltage terminal as well as an IC bias supply.
EN
FB
VOUT
Ground. Power and signal ground reference for the IC. All voltages are measured with
respect to this pin.
A2
1, P1
GND
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum
ratings are stress ratings only.
Symbol
VIN
Parameter
Min.
Max.
Units
VIN Pin
VOUT Pin
FB Pin
-0.3
–2
5.5
6
V
V
V
VOUT
VFB
–2
14
5.5
6.5
5.5
DC
-0.3
-1.0
-0.3
VSW
VEN
SW Node
EN Pin
V
V
Transient: 10ns, 3MHz
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
2.0
1.0
Electrostatic Discharge
Protection Level
ESD
kV
TJ
TSTG
TL
Junction Temperature
Storage Temperature
–40
–65
+150
+150
+260
°C
°C
°C
Lead Soldering Temperature, 10 Seconds
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Units
VIN
IOUT
TA
Supply Voltage
2.3
4.5
V
200
mA
Output Current
Ambient Temperature
Junction Temperature
–40
–40
+85
°C
°C
TJ
+125
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
TJ(max) at a given ambient temperate TA.
Symbol Parameter
Typical
130
Units
°C/W
°C/W
WLCSP
UMLP
Junction-to-Ambient Thermal Resistance
θJA
57
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
3
Electrical Specifications
Minimum and maximum values are at VIN=VEN=2.3V to 4.5V, TA=-40°C to +85°C; circuit of Figure 1, unless otherwise noted.
Typical values are at TA=25°C, VIN=VEN=3.6V.
Symbol
IIN
Parameter
VIN Input Current
Conditions
Quiescent: VIN=3.6V, IOUT=0, EN=VIN
Shutdown: EN=0, VIN=3.6V
VOUT=0, EN=0, VIN=4.2V
VOUT=5V, VIN=3.6V, EN=0
VIN Rising
Min.
Typ. Max. Units
37
0.5
10
45
μA
1.5
ILK_OUT
VOUT Leakage Current
nA
μA
V
ILK_RVSR VOUT to VIN Reverse Leakage
2.5
2.3
VUVLO
Under-Voltage Lockout
2.2
VUVLO_HYS Under-Voltage Lockout Hysteresis
190
mV
V
VENH
VENL
Enable HIGH Voltage
1.05
Enable LOW Voltage
0.4
1
V
ILK_EN
Enable Input Leakage Current
0.01
5.05
5.05
5.05
μA
VIN from 2.3V to 4.5V, IOUT≤200mA
VIN from 2.7V to 4.5V, IOUT≤200mA
VIN from 3.3V to 4.5V, IOUT≤300mA
Referred to VOUT
4.80
4.85
4.85
5.15
5.15
5.15
VOUT
VOUT Output Voltage Accuracy(1)
V
VREF
tOFF
Reference Accuracy
Off Time
4.975 5.050 5.125
V
VIN=3.6V, IOUT=200mA
VIN=2.3V, VOUT=5V
195
200
300
240
265
ns
IOUT
Maximum Output Current(2)
SW Peak Current Limit
VIN=3.3V, VOUT=5V
mA
VIN=3.6V, VOUT=5V
400
1100
850
ISW
ISS
VIN=3.6V, VOUT>VIN
930
1320
300
mA
mA
Soft-Start Input Peak Current Limit(2) VIN=3.6V, VOUT < VIN
VIN=3.6V, IOUT=200mA
Soft-Start Time
tSS
100
μs
Time=Rising EN until Regulated VOUT
N-Channel Boost Switch
P-Channel Sync Rectifier
Thermal Shutdown
VIN=3.6V
300
400
150
30
RDS(ON)
mΩ
VIN=3.6V
TTSD
ILOAD=10mA
°C
°C
TTSD_HYS Thermal Shutdown Hysteresis
Notes:
1. ILOAD from 0 to IOUT; also includes load transient response. VOUT measured from mid-point of output voltage ripple.
Effective capacitance of COUT > 1.5μF.
2. Guaranteed by design and characterization; not tested in production.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
4
Typical Characteristics
Unless otherwise specified, circuit per Figure 1, 3.6VIN, TA=25°C.
95
92
89
86
83
80
100
95
90
85
-40C
+25C
+85C
2.5 Vin
80
3.3 Vin
3.6 Vin
4.5 Vin
75
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Load Current (mA)
Load Current (mA)
Figure 6 Efficiency vs. VIN
Figure 7 Efficiency vs. Temperature, 3.6VIN
50
25
50
25
2.5 Vin
3.3 Vin
3.6 Vin
4.5 Vin
-40C
+25C
+85C
0
0
-25
-50
-75
-100
-25
-50
-75
-100
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Load Current (mA)
Load Current (mA)
Figure 8 Line and Load Regulation
Figure 9 Load Regulation vs. Temperature, 3.6VIN
4000
3200
2400
1600
800
2.5 Vin
3.6 Vin
4.5 Vin
0
0
50
100
150
200
250
300
Load Current (mA)
Figure 10 Switching Frequency
Figure 11 Quiescent Current
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
5
Typical Characteristics
Unless otherwise specified, circuit per Figure 1, 3.6VIN, TA=25°C.
Figure 12 Maximum DC Load Current
Figure 13 Peak Inductor Current
Figure 15 Output Ripple, 200mA PWM Load
Figure 17 50-200mA Load Transient, 100ns Step
Figure 14 Output Ripple, 10mA PFM Load
Figure 16 0-50mA Load Transient, 100ns Step
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN4860 • Rev. 1.0.3
6
Typical Characteristics
Unless otherwise specified, circuit per Figure 1, 3.6VIN, TA=25°C.
Figure 18 Line Transient, 5mA Load, 10µs Step
Figure 19 Line Transient, 200mA Load, 10µs Step
Figure 20 Startup, No Load
Figure 21 Startup, 33Ω Load
Figure 22 Shutdown, 1KΩ Load
Figure 23 Shutdown, 33Ω Load
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN4860 • Rev. 1.0.3
7
Typical Characteristics
Unless otherwise specified, circuit per Figure 1, 3.6VIN, TA=25°C.
Figure 24 Overload Protection
Figure 25 Short-Circuit Response
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN4860 • Rev. 1.0.3
8
Functional Description
Circuit Description
PFM Mode
FAN4860 is a synchronous boost regulator, typically operating
at 3MHz in continuous conduction mode (CCM), which occurs
at moderate to heavy load current and low VIN voltages.
If VOUT > VREF when the minimum off-time has ended, the
regulator enters PFM mode. Boost pulses are inhibited until
VOUT < VREF. The minimum on-time is increased to enable
the output to pump up sufficiently with each PFM boost
pulse. Therefore, the regulator behaves like a constant on-
time regulator, with the bottom of its output voltage ripple at
5.05V in PFM mode.
At light-load currents, the converter switches automatically to
power-saving PFM mode. The regulator automatically and
smoothly
transitions
between
quasi-fixed-frequency
continuous conduction PWM mode and variable-frequency
PFM mode to maintain the highest possible efficiency over
the full range of load current and input voltage.
Table 1. Operating States
Mode
Description
Invoked When:
PWM Mode Regulation
LIN
SS
Linear Startup
Boost Soft-Start
VIN > VOUT
VOUT < VREG
VOUT=VREG
The FAN4860 uses a minimum on-time and computed
minimum off-time to regulate VOUT. The regulator achieves
excellent transient response by employing current mode
modulation. This technique causes the regulator output to
exhibit a load line. During PWM mode, the output voltage
drops slightly as the input current rises. With a constant VIN,
this appears as a constant output resistance.
BST
Boost Operating Mode
Shutdown and Startup
If EN is LOW, all bias circuits are off and the regulator is in
shutdown mode. During shutdown, true load disconnect
between battery and load prevents current flow from VIN to
VOUT, as well as reverse flow from VOUT to VIN.
The “droop” caused by the output resistance when a load is
applied allows the regulator to respond smoothly to load
transients with negligible overshoot.
LIN State
When EN rises, if VIN > UVLO, the regulator first attempts to
bring VOUT within about 1V of VIN by using the internal fixed
current source from VIN (ILIN1). The current is limited to about
630mA during LIN1 mode.
If VOUT reaches VIN-1V during LIN1 mode, the SS state is
initiated. Otherwise, LIN1 times out after 16 CLK counts and
the LIN2 mode is entered.
In LIN2 mode, the current source is incremented to 850mA.
If VOUT fails to reach VIN-1V after 64 CLK counts, a fault
condition is declared.
SS State
Upon the successful completion of the LIN state (VOUT>VIN-
1V), the regulator begins switching with boost pulses current
limited to about 50% of nominal level, incrementing to full
scale over a period of 32 CLK counts.
Figure 26 Output Resistance (ROUT
)
If the output fails to achieve 90% of its setpoint within 96 CLK
counts at full-scale current limit, a fault condition is declared.
VOUT as a function of ILOAD can be computed when the
regulator is in PWM mode (continuous conduction) as:
BST State
VOUT = 5.05 − ROUT •ILOAD
EQ. 1
This is the normal operating mode of the regulator. The
regulator uses a minimum tOFF-minimum tON modulation
For example, at VIN=3.3V, and ILOAD=200mA, VOUT would
drop to:
V
IN
V
OUT
scheme. Minimum tOFF is proportional to
, which keeps
the regulator’s switching frequency reasonably constant in
CCM. tON(MIN) is proportional to VIN and is higher if the inductor
current reaches 0 before tOFF(MIN) during the prior cycle.
VOUT = 5.05 − 0.38 • 0.2 = 4.974V
EQ. 1A
At VIN=2.3V, and ILOAD=200mA, VOUT would drop to:
VOUT = 5.05 − 0.68 • 0.2 = 4.914V
EQ. 1B
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
9
To ensure that VOUT does not pump significantly above the
regulation point, the boost switch remains off as long as
The fault clock period as a function of VIN is shown in Figure 28.
FB > VREF
.
Fault State
The regulator enters the FAULT state under any of the
following conditions:
VOUT fails to achieve the voltage required to advance from
LIN state to SS state.
VOUT fails to achieve the voltage required to advance from
SS state to BST state.
Sustained (32 CLK counts) pulse-by-pulse current limit
during the BST state.
The regulator moves from BST to LIN state due to a short
circuit or output overload (VOUT < VIN-1V).
Figure 28. Fault Clock Period vs. VIN
Once a fault is triggered, the regulator stops switching and
presents a high-impedance path between VIN and VOUT. After
waiting 480 CLK counts, a re-start is attempted.
The VIN-dependent LIN mode charging current is illustrated
in Figure 29.
Soft-Start and Fault Timing
The soft-start timing for each state, and the fault times, are
determined by the fault clock, whose period is inversely
proportional to VIN. This allows the regulator more time to
charge larger values of COUT when VIN is lower. With higher
VIN, this also reduces power delivered to VOUT during each
cycle in current limit.
The number of clock counts for each state is illustrated in
Figure 27.
Figure 29. LIN Mode Current vs. VIN
Over-Temperature Protection (OTP)
The regulator shuts down when the thermal shutdown
threshold is reached. Restart, with soft-start, occurs when
the IC has cooled by about 30°C.
Figure 27. Fault Response into Short Circuit
Over-Current Protection (OCP)
During boost-mode operation, the FAN4860 employs a
cycle-by-cycle peak current limit to protect switching
elements. Sustained current limit, for 32 consecutive fault
CLK counts, initiates a fault condition.
During an overload condition, as VOUT collapses to
approximately VIN-1V, the synchronous rectifier is
immediately switched off and a fault condition is declared.
Automatic restart occurs once the overload/short is removed
and the fault timer completes counting.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
10
Application Information
External Component Selection
Table 3. Minimum CEFF Required for Stability
Operating Conditions
Table 2 shows the recommended external components for
the FAN4860:
CEFF(MIN) (μF)
VIN (V)
ILOAD (mA)
Table 2. External Components
2.3 to 4.5
2.7 to 4.5
2.3 to 4.5
0 to 200
0 to 200
0 to 150
1.5
1.0
1.0
REF Description
Manufacturer
Murata LQM21PN1R0MC0,
or equivalent
1.0µH, 0.8A, 190mΩ,
0805
L1
CEFF varies with manufacturer, dielectric material, case size,
and temperature. Some manufacturers may be able to
provide an X5R capacitor in 0402 case size that retains CEFF
>1.5μF with 5V bias; others may not. If this CEFF cannot be
economically obtained and 0402 case size is required, the IC
can work with the 0402 capacitor as long as the minimum VIN
is restricted to >2.7V.
Murata GRM155R60J225M
TDK C1005X5R0J225M
Kemet C0603C475K8PAC
TDK C1608X5R1A475K
2.2µF, 6.3V, X5R,
0402
CIN
4.7µF, 10V, X5R,
0603(3)
COUT
Note:
3. A 6.3V-rated 0603 capacitor may be used for COUT
such as Murata GRM188R60J225M. All datasheet
,
For best performance, a 10V-rated 0603 output capacitor is
recommended (Kemet C0603C475K8PAC, or equivalent).
Since it retains greater CEFF under bias and over
temperature, ouptut ripple can is reduced and transient
capability enhanced.
parameters are valid with the 6.3V-rated capacitor.
Due to DC bias effects, the 10V capacitor offers a
performance enhancement; particularly output ripple
and transient response, without any size increase.
Output Voltage Ripple
Output Capacitance (COUT
)
Output voltage ripple is inversely proportional to COUT
During tON, when the boost switch is on, all load current is
supplied by COUT
.
Stability
The effective capacitance (CEFF
ceramic capacitors decrease as their bias voltage increases,
as shown in Figure 30.
.
) of small, high-value,
ILOAD
VRIPPLE(P−P) = tON
•
EQ. 2
COUT
and
⎛
⎞
⎟
⎟
⎠
VIN
⎜
tON = tSW •D = tSW • 1−
⎜
EQ. 3
EQ. 4
VOUT
⎝
Therefore:
⎛
⎜
⎝
⎞
VIN
ILOAD
⎜
⎟
⎟
⎠
VRIPPLE(P−P) = tSW • 1−
•
VOUT
COUT
where:
1
tSW
=
EQ. 5
fSW
As can be seen from EQ. 4, the maximum VRIPPLE occurs
when VIN is minimum and ILOAD is maximum.
Startup
Figure 30. CEFF for 4.7μF, 0603, X5R, 6.3V
(Murata GRM188R60J475K)
Input current limiting is in effect during soft-start, which limits
the current available to charge COUT. If the output fails to
achieve regulation within the time period described in the
soft-start section above; a FAULT occurs, causing the circuit
to shut down, then restart after a significant time period. If
COUT is a very high value, the circuit may not start on the first
attempt, but eventually achieves regulation if no load is
present. If a high-current load and high capacitance are both
present during soft-start, the circuit may fail to achieve
FAN4860 is guaranteed for stable operation with the
minimum value of CEFF (CEFF(MIN)) outlined in Table 3.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
11
regulation and continually attempt soft-start, only to have
COUT discharged by the load when in the FAULT state.
COUT2 may be necessary to preserve load transient response
when the Schottky is used. When a load is applied at the FB
pin, the forward voltage of the D1 rapidly increases before
the regulator can respond or the inductor current can
change. This causes an immediate drop of up to 300mV,
depending on D1’s characteristics if COUT2 is absent. COUT2
supplies instantaneous current to the load while the regulator
adjusts the inductor current. A value of at least half of the
minimum value of COUT should be used for COUT2. COUT2
needs to withstand the maximum voltage at the FB pin as
the TVS is clamping.
The circuit can start with higher values of COUT under full
load if VIN is higher, since:
IRIPPLE
V
IN
⎛
⎞
⎟
IOUT = I
−
•
⎜
EQ. 6
LIM(PK)
2
VOUT
⎝
⎠
Generally, the limitation occurs in BST mode.
The FAN4860 starts on the first pass (without triggering a
FAULT) under the following conditions for CEFF(MAX)
:
The maximum DC output current available is reduced with
this circuit, due to the additional dissipation of D1.
Table 4. Maximum CEFF for First-Pass Startup
Operating Conditions
C
EFF(MAX) (μF)
VIN (V)
RLOAD(MIN)
Layout Guideline
2.3 to 4.5
2.7 to 4.5
2.7 to 4.5
25Ω
25Ω
33Ω
10
15
22
CEFF values shown in Table 4 typically apply to the lowest
VIN. The presence of higher VIN enhances ability to start into
larger CEFF at full load.
Transient Protection
To protect against external voltage transients caused by
ESD discharge events, or improper external connections,
some applications employ an external transient voltage
suppressor (TVS) and Schottky diode (D1 in Figure 31).
Figure 32 WLCSP Suggested Layout (Top View)
Figure 31 FAN4860 with External Transient Protection
The TVS is designed to clamp the FB line (system VOUT) to
+10V or –2V during external transient events. The Schottky
diode protects the output devices from the positive
excursion. The FB pin can tolerate up to 14V of positive
excursion, while both the FB and VOUT pins can tolerate
negative voltages.
The FAN4860 includes a circuit to detect a missing or
defective D1 by comparing VOUT to FB. If VOUT – FB > about
0.7V, the IC shuts down. The IC remains shut down until
Figure 33 UMLP Suggested Layout (Top View)
VOUT < UVLO and VIN < UVLO+0.7 or EN is toggled.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
12
Physical Dimensions
F
0.03 C
2X
E
A
0.40
B
D
A1
BALL A1
INDEX AREA
(Ø0.20)
Cu Pad
0.40
F
(Ø0.30)
Solder Mask
Opening
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
E
0.378±0.018
0.208±0.021
0.625
0.547
0.05 C
C
SEATING PLANE
D
SIDE VIEWS
Ø0.260±0.010
6X
NOTES:
0.40
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
0.005
C A B
C
B
A
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 1994.
(Y) +/-0.018
F
0.40
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
2
1
(X) +/-0.018
E. PACKAGE TYPICAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: UC006ACrev4.
Figure 33. 6-Lead, 0.4mm Pitch, WLCSP Package
Product-Specific Dimensions
Product
D
E
X
Y
FAN4860UC5X
1.230mm +/-0.030mm
0.880mm +/-0.030mm
0.240mm
0.215mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
13
Physical Dimensions
0.10 C
A
2.0
2X
B
1.45
2.0
(0.25)
PIN1
IDENT
0.10 C
0.80 1.80
2X
0.50
6X
TOP VIEW
0.65
0.35
6X
0.55 MAX
A
0.10 C
0.08 C
RECOMMENDED LAND PATTERN
(0.15)
C
0.05
0.00
SEATING
PLANE
SIDE VIEW
NOTES:
A. PACKAGE CONFORMS TO JEDEC MO-229
EXCEPT WHERE NOTED.
1.35
1.45
PIN1
IDENT
3
1
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
0.70
0.80
0.35
0.25
D. LANDPATTERN RECOMMENDATION IS BASED
ON FSC DESIGN ONLY.
6X
0.10 C A B
0.05 C
E. DRAWING FILENAME: MKT-UMLP06Erev2.
4
6
0.65
0.35
0.25
6X
BOTTOM VIEW
Figure 34. 6-Lead UMLP Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
14
© 2009 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.0.3
www.fairchildsemi.com
15
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