FAN5340UCX [FAIRCHILD]
Synchronous Constant-Current Series Boost LED Driver with PWM Brightness Control and Integrated Load Disconnect; 同步恒流系列升压LED驱动器的PWM亮度控制和集成负载断开
| 型号： | FAN5340UCX |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Synchronous Constant-Current Series Boost LED Driver with PWM Brightness Control and Integrated Load Disconnect |
| 文件： | 总12页 (文件大小：931K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
April 2010
FAN5340
Synchronous Constant-Current Series Boost LED Driver
with PWM Brightness Control and Integrated Load
Disconnect
Features
Description
The FAN5340 is a synchronous constant-current LED driver
capable of efficiently delivering up to 500mW to a string of up
to four LEDs in series. Optimized for small form-factor
applications, the 1.2MHz fixed switching frequency allows
the use of chip inductors and capacitors.
Synchronous Current-Mode Boost Converter
Up to 500mW Output Power
Supports 2, 3, or 4 LEDs in Series
2.7V to 4.8V Input Voltage Range
1.2MHz Fixed Switching Frequency
1mA Maximum Quiescent Current
Soft-Start Capability
For safety, the device features integrated short-circuit
detection plus over-voltage and thermal shutdown
protections. In addition, input under-voltage lockout
protection is triggered if the battery voltage is low.
Brightness (dimming) control is implemented by applying a
PWM signal of 300Hz to 1kHz on the EN pin. During
shutdown, the FAN5340 disconnects the LED anodes from
the output of the boost regulator, which holds the boost
regulator’s voltage on COUT, reducing audible noise from the
PWM dimming and removing power from the LED string.
Input Under-Voltage Lockout (UVLO)
Output Over-Voltage Protection (OVP)
Short-Circuit Detection
Thermal Shutdown (TSD) Protection
8-Lead 3.00 x 3.00mm MLP
8-Bump 1.57 x 1.57mm WLCSP
GND
EN
VIN
1
2
3
4
8
7
6
5
CIN
COUT
VOUT
SW
2 – 4
LEDs
P1
GND
Applications
VLED
FB
PGND
Cellular Phones, Smart Phones
Pocket PCs
RSET
WLAN DC-DC Converter Modules
PDA, DSC, PMP, and MP3 Players
Figure 1.
Typical Application
Ordering Information
Operating
Part Number
Package
Packing
Temperature Range
8-Bump, 1.57 x 1.57mm Wafer Level Chip-Scale
Package (WLCSP)
FAN5340UCX
-40 to 85°C
-40 to 85°C
Tape and Reel
Tape and Reel
FAN5340MPX
(Prelminary)
8-Lead, 3.00 x 3.00mm Molded Leadless
Package (MLP)
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
Block Diagrams
L1
SW
VIN
CIN
Q1
Q2
D1
GATE
DRIVE
VOUT
VLED
PGND
COUT
Q3
BOOST
CONTROL
2 – 4
LEDs
EN
GND
FB
15 -
RSET
133Ω
Figure 2.
Block Diagram
Table 1. Recommended External Components
Component
Description
Vendor
Parameter
Min. Typ. Max.
Units
L(1)
22
1100
4.7
μH
mΩ
μF
Murata
LQH3NPN220MGOK
L1
22μH Nominal
DCR (Series R)
COUT
CIN
C
C
4.7μF X5R or Better
4.7μF X5R or Better
4.7
μF
Note:
1. Minimum L (inductance) incorporates tolerance, temperature, and DC bias effects (L decreases with increasing current).
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
2
Pin Configuration
GND
A1
EN
A2
VLED
A3
A3
B3
C3
A2
C2
A1
B1
C1
B1
C1
B3
C3
VIN
FB
C2
VOUT SW PGND
Figure 3.
WLCSP Package, Top View
Figure 4.
WLCSP Package, Bottom View
GND
EN
1
2
3
4
8 VIN
7 VOUT
6 SW
P1
GND
VLED
FB
5 PGND
Figure 5.
8-Pin 3 x 3mm MLP, Top View
Pin Definitions
Pin #
Name
Description
Analog Ground. All signals are referenced to this pin.
CSP
MLP
A1
1
GND
Enable / PWM Brightness Control. A logic LOW on this pin shuts down the IC,
disconnects the LEDs from VOUT, and reduces the current consumption of the IC. This
terminal has an internal pull-down resistor of 300kΩ.
A2
A3
B3
2
3
4
EN
VLED
FB
LED String Output. Connected to the anode of a series string of two to four LEDs.
Current Feedback. The boost regulator regulates this pin to 0.5V to control the LED string
current. Tie this pin via a current-setting resistor (RSET) to GND and the cathode of the LED
string.
Power Ground. The boost switch and gate drivers are grounded at this pin.
Switching Node. Tie inductor L1 from VIN to this pin.
Boost Output Voltage. Output of the boost regulator.
Input Voltage.
C3
C2
C1
B1
5
6
7
8
PGND
SW
VOUT
VIN
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
Min.
–0.3
–0.3
–0.3
–0.3
Max.
6.0
Units
VIN
VIN
V
V
V
V
VFB, VEN FB, EN Pins
VIN + 0.3
24.0
VSW
SW Pin
VOUT
VOUT Pin
24.0
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
4.0
1.5
Electrostatic Discharge
Protection Level
ESD
kV
TJ
TSTG
TL
Junction Temperature
Storage Temperature
–40
–65
+150
+150
+260
°C
°C
°C
Lead Soldering Temperature, 10 Seconds
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
VIN
Parameter
Min.
Typ.
Max.
Units
VIN Supply Voltage
VOUT Voltage
2.7
6.2
5
4.8
16.0
40
V
V
VOUT
IOUT
VOUT Load Current
mA
Hz
°C
°C
fEN_PWM EN pin PWM Dimming Frequency
100
–40
–40
300
1000
+85
+125
TA
TJ
Ambient Temperature
Junction Temperature
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p evaluation boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction
temperature TJ(max) at a given ambient temperate TA.
Symbol
Parameter
Typ.
110
49
Units
°C/W
°C/W
WLCSP Package
MLP Package
Junction-to-Ambient Thermal Resistance
θJA
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
4
Electrical Specifications
VIN = 2.7V to 4.8V and TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = 25°C and VIN = 3.6V.
Parameter
Conditions
Min.
Typ.
Max. Units
Symbol
Power Supplies
IQ
Quiescent Current
EN = VIN, Device Not Switching
EN = GND, VIN = 3.6V
1
mA
μA
V
ISD
Shutdown Supply Current
0.3
2.40
2.15
250
1.0
VIN Rising
2.30
2.00
2.50
2.25
VUVLO
Under-Voltage Lockout
VIN Falling
V
VUVHYST Under-Voltage Lockout Hysteresis
mV
EN: Enable Pin
VIH
VIL
HIGH-Level Input Voltage
LOW-Level Input Voltage
EN Pull-Down Resistance
EN Low to Shutdown Delay
1.2
V
V
0.4
400
80
REN
tSD
200
20
300
kΩ
ms
From Falling Edge of EN
VFB = 500mV
Feedback and Reference
VFB
IFB
Feedback Voltage
480
500
0.1
520
1.0
mV
Feedback Input Current
μA
Power Outputs
V
IN = 3.6V, VOUT = 10V, ISW = 100mA
600
850
2.0
2.8
RDS(ON)_Q1 Boost Switch On-Resistance
mΩ
VIN = 2.7V, VOUT = 10V, ISW = 100mA
RDS(ON)_Q2 Synchronous Rectifier On-Resistance VOUT = 10V, ISW = 100mA
Ω
Ω
RDS(ON)_Q3 Load Switch On-Resistance
ISW(OFF) SW Node Leakage(2)
VOUT = 10V, ILED = 10mA
EN = 0, VIN = VSW = VOUT = 5.5V,
VLED = 0
0.1
1.0
μA
ILIM-PK
Oscillator
fSW
Boost Switch Peak Current Limit
VIN = 3.6V
325
1.0
400
475
mA
Boost Regulator Switching Frequency
1.2
1.4
100
20.0
MHz
%
PWM Dimming
DPWM
PWM Duty Cycle(3)
PWM Dimming Frequency ≤1kHz
1.0
Output and Protection
VOVP
Boost Output Over-Voltage Protection
18.0
19.0
0.8
V
V
VOVPHYST OVP Hysteresis
V
OUT Falling
VIN – 1.5
VIN – 1.3
V
VTHSC
VLED Short-Circuit Detection Threshold
VOUT Rising
V
DMAX
DMIN
Maximum Boost Duty Cycle(3)
Minimum Boost Duty Cycle(3)
Thermal Shutdown
85
%
%
°C
°C
20
TSD
150
25
THYS
Thermal Shutdown Hysteresis
Notes:
2. SW leakage current includes the leakage current of three internal switches; SW to GND, VOUT to VLED, and SW to VOUT
3. Guaranteed by design.
.
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
5
Typical Characteristics
VIN = 3.6V, TA = 25°C, ILED = 20mA, L = 22µH, COUT = 4.7µF.
Figure 6.
Efficiency vs. LED Current: Two LEDs
Figure 7.
Efficiency vs. LED Current: Three LEDs
Figure 8.
Efficiency vs. LED Current: Four LEDs
Figure 9.
fSW vs. Input Voltage vs.Temperature
Figure 10. FB Voltage vs. Input Voltage
vs. Temperature
Figure 11. OVP vs. Input Voltage vs. Temperature
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
6
Typical Characteristics (Continued)
Figure 12. PWM Linearity Over Full Dimming Duty
Cycle Range, Four LEDs
Figure 13. PWM Linearity with Dimming Duty Cycle
<2.5%, Four LEDs
Figure 15. Line Transient with 10µs Line Step,
Four LEDs
Figure 14. Maximum Output Current at VOUT
Figure 16. Over-Voltage Protection: Soft-Start into
Open LED String
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
7
Typical Characteristics (Continued)
Figure 17. Cold-Start Waveform with 100% Duty
Cycle at 1ms/Div.
Figure 18. Cold-Start Waveform with 100% Duty
Cycle Showing Startup, Shutdown and
Startup at 10ms/Div
Figure 19. FAN5340 ILOAD Step from 20mA to 30mA
by Enabling FAN5640 at 10mA, Three LEDs
Figure 20. FAN5340 ILOAD Step from 30mA to 20mA
by Disabling FAN5640 at 10mA, Three LEDs
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
8
Circuit Description
Overview
Over-Voltage Protection
The FAN5340 is an inductive current-mode boost serial LED
driver that achieves LED current regulation by maintaining
If the LED string is open circuit, FB remains at 0V and the
output voltage continues to increase in the absence of an
Over-Voltage Protection (OVP) circuit. The FAN5340’s OVP
circuit disables the boost regulator when VOUT exceeds
19.0V and continues to keep the regulator off until VOUT
drops below 18.2V.
0.5V across RSET. The current through the LED string (ILED
)
is therefore:
0.5
ILED
=
(1)
RSET
Thermal Shutdown
If the die temperature exceeds 150°C, a reset occurs and
remains in effect until the die cools to 125°C, at which time
the circuit is allowed to begin the soft-start sequence.
While the forward-voltage across the LEDs determines VOUT
,
the FAN5340’s boost regulator output can also support
additional loads on VOUT (see Figure 21) provided its input
current limit is not exceeded.
Applications
Using VOUT to Drive Additional LED Strings
The VOUT pin can be used as a supply for simple current
sources (shown in Figure 22 using the FAN5640) or discrete
current sinks. To avoid dragging VOUT down when the EN pin
is LOW, the auxiliary strings should not be enabled unless
the EN pin is HIGH. The auxiliary strings can therefore be
PWM dimmed using either the same line as the EN line as
shown below or enabled separately, but within the on-time of
the FAN5340.
IOUT1
GND
IOUT2
VIN
1
2
3
6
5
4
FAN5640
R1
RSET
EN
Figure 21. Maximum Output Current
vs. Input Voltage
GND
VIN
1
8
CIN
COUT
UVLO and Soft-Start
EN
VLED
FB
VOUT
SW
2
3
4
7
6
5
FAN5340
If EN has been LOW for more than 20ms, the IC initiates a “cold
start” soft-start cycle when EN rises, provided VIN is above the
UVLO threshold. The soft-start circuit ramps the voltage
reference to the error amplifier to control inrush current.
PGND
R2
PWM Dimming
When EN goes LOW, the IC turns off a MOSFET (Q3 in
Figure 2), which disconnects the LED load, preventing COUT
from being discharged when EN is LOW. As long as EN is
low for less than 20ms, the regulator’s main regulation loop
quickly regains control when EN returns to a HIGH state.
Figure 22. Driving Additional LED Strings
If using VOUT to drive additional loads, care should be taken
not to exceed the input current limit. This limitation is shown in
Figure 21 for a typical IC. The total load (IOUT1 + IOUT2 + ILED
)
should always remain below 70% of the value in Figure 21.
Short-Circuit Detection
If VOUT falls below VIN – 1.5V, Q3 turns off and remains off
until VOUT recovers to at least VIN – 1.3V.
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
9
Physical Dimensions
Product-Specific Dimensions
Product
D
E
X
Y
FAN5340UC
1.570
1.570
0.285
0.285
Figure 23. 8-Bump, 1.57 x 1.57mm Wafer Level Chip-Scale Package (WLCSP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
10
Physical Dimensions (Continued)
Figure 24. 8-Pin, 3 x 3mm Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
11
© 2010 Fairchild Semiconductor Corporation
FAN5340 • Rev. 1.0.1
www.fairchildsemi.com
12
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