FDP5N50F_12 [FAIRCHILD]

N-Channel MOSFET, FRFET 500V, 4.5A, 1.55Ω; N沟道MOSFET , FRFET 500V , 4.5A , 1.55Î ©
FDP5N50F_12
型号: FDP5N50F_12
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel MOSFET, FRFET 500V, 4.5A, 1.55Ω
N沟道MOSFET , FRFET 500V , 4.5A , 1.55Î ©

文件: 总10页 (文件大小:466K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 2012  
UniFETTM  
tm  
FDP5N50F / FDPF5N50FT  
N-Channel MOSFET, FRFET  
500V, 4.5A, 1.55Ω  
Features  
Description  
RDS(on) = 1.25Ω ( Typ.)@ VGS = 10V, ID = 2.25A  
Low gate charge ( Typ. 11nC)  
Low Crss ( Typ. 5pF)  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pluse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power suppliesand active power factor-  
correction.  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
D
G
TO-220F  
FDPF Series  
TO-220  
FDP Series  
G D S  
G D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FDP5N50F FDPF5N50FT Units  
Drain to Source Voltage  
Gate to Source Voltage  
500  
±30  
V
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
4.5  
2.7  
18  
4.5*  
2.7*  
18*  
ID  
Drain Current  
A
IDM  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
233  
4.5  
8.5  
4.5  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
(TC = 25oC)  
- Derate above 25oC  
85  
28  
PD  
Power Dissipation  
0.67  
0.22  
W/oC  
oC  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
FDP5N50F FDPF5N50FT  
Units  
RθJC  
RθCS  
RθJA  
Thermal Resistance, Junction to Case  
1.4  
0.5  
4.5  
-
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2012 Fairchild Semiconductor Corporation  
FDP5N50F / FDPF5N50FT Rev. C1  
1
www.fairchildsemi.com  
Package Marking and Ordering Information TC = 25oC unless otherwise noted  
Device Marking  
FDP5N50F  
Device  
Package  
TO-220  
Reel Size  
Tape Width  
Quantity  
FDP5N50F  
FDPF5N50FT  
-
-
-
-
50  
50  
FDPF5N50FT  
TO-220F  
Electrical Characteristics  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250μA, VGS = 0V, TJ = 25oC  
500  
-
-
-
-
V
ΔBVDSS  
ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250μA, Referenced to 25oC  
0.6  
V/oC  
V
DS = 500V, VGS = 0V  
-
-
-
-
-
-
10  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
μA  
VDS = 400V, TC = 125oC  
100  
VGS = ±30V, VDS = 0V  
±100  
nA  
On Characteristics  
VGS(th)  
RDS(on)  
gFS  
Gate Threshold Voltage  
VGS = VDS, ID = 250μA  
VGS = 10V, ID = 2.25A  
VDS = 20V, ID = 2.25A  
3.0  
-
-
5.0  
1.55  
-
V
Ω
S
Static Drain to Source On Resistance  
Forward Transconductance  
1.25  
4.3  
(Note 4)  
-
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
490  
66  
5
650  
88  
7.5  
15  
-
pF  
pF  
pF  
nC  
nC  
VDS = 25V, VGS = 0V  
f = 1MHz  
Coss  
Crss  
Qg(tot)  
Qgs  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
11  
3
V
V
DS = 400V, ID = 5A  
GS = 10V  
Qgd  
Gate to Drain “Miller” Charge  
-
5
-
nC  
(Note 4, 5)  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
-
-
-
-
13  
22  
28  
20  
36  
54  
66  
50  
ns  
ns  
ns  
ns  
VDD = 250V, ID = 5A  
G = 25Ω  
R
(Note 4, 5)  
Drain-Source Diode Characteristics  
IS  
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
-
-
-
-
-
-
-
4.5  
18  
1.5  
-
A
A
ISM  
VSD  
trr  
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, ISD = 4.5A  
-
V
65  
120  
ns  
nC  
VGS = 0V, ISD = 5A  
dIF/dt = 100A/μs  
(Note 4)  
Qrr  
Reverse Recovery Charge  
-
Notes:  
1: Repetitive Rating: Pulse width limited by maximum junction temperature  
2: L =23 mH, I = 4.5A, V = 50V, R = 25Ω, Starting T = 25°C  
AS  
DD  
G
J
3:  
I
4.5A, di/dt 200A/μs, V BV , Starting T = 25°C  
SD  
DD  
DSS J  
4: Pulse Test: Pulse width 300μs, Duty Cycle 2%  
5: Essentially Independent of Operating Temperature Typical Characteristics  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
10  
20  
VGS = 15.0V  
10.0V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
10  
5.5 V  
150oC  
1
25oC  
1
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
*Notes:  
1. VDS = 20V  
0.1  
2. 250μs Pulse Test  
0.04  
0.1  
0.1  
1
10  
4
5
6
7
8
VDS,Drain-Source Voltage[V]  
VGS,Gate-Source Voltage[V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
2.2  
2.0  
50  
10  
150oC  
1.8  
VGS = 10V  
25oC  
VGS = 20V  
1.6  
1
1.4  
*Notes:  
1. VGS = 0V  
*Note: TJ = 25oC  
2. 250μs Pulse Test  
1.2  
0.2  
0.0  
0
4
8
12  
16  
20  
0.4  
0.8  
1.2  
1.6  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
1000  
10  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
VDS = 100V  
= C + C  
ds gd  
oss  
rss  
VDS = 250V  
= C  
gd  
8
6
4
2
0
VDS = 400V  
750  
500  
250  
0
*Note:  
1. VGS = 0V  
2. f = 1MHz  
Ciss  
Coss  
Crss  
*Note: ID = 5A  
9
30  
0.1  
1
10  
0
3
6
12  
Qg, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. Maximum Safe Operating Area  
- FDP5N50F  
1.2  
1.1  
1.0  
30  
30μs  
100μs  
10  
1ms  
10ms  
DC  
1
Operation in This Area  
is Limited by R DS(on)  
0.1  
0.01  
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
0.9  
*Notes:  
1. VGS = 0V  
2. ID = 250μA  
3. Single Pulse  
0.8  
-75  
-25  
25  
75  
125  
175  
1
10  
100  
1000  
TJ, Junction Temperature [oC]  
VDS, Drain-Source Voltage [V]  
Figure 9. Maximum Safe Operating Area  
- FDPF5N50FT  
Figure 10. Maximum Drain Current  
30  
5
30μs  
100μs  
10  
4
2
0
1ms  
10ms  
1
DC  
Operation in This Area  
is Limited by R DS(on)  
0.1  
0.01  
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
100  
1
10  
1000  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
Figure 11. Transient Thermal Response Curve - FDP5N50F  
3
1
0.5  
0.2  
0.1  
PDM  
0.1  
0.05  
t1  
0.02  
0.01  
t2  
*Notes:  
1. ZθJC(t) = 1.4oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
0.003  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
Rectangular Pulse Duration [sec]  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
4
Typical Performance Characteristics (Continued)  
Figure 12. Transient Thermal Response Curve - FDPF5N50FT  
10  
1
0.5  
0.2  
0.1  
PDM  
0.05  
t1  
0.02  
0.01  
0.1  
t2  
*Notes:  
1. ZθJC(t) = 4.5oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
0.005  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
103  
Rectangular Pulse Duration [sec]  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
5
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
6
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
7
Mechanical Dimensions  
TO-220  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
8
Package Dimensions  
TO-220F Potted  
* Front/Back Side Isolation Voltage : AC 2500V  
Dimensions in Millimeters  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
9
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
2Cool™  
F-PFS™  
PowerTrench®  
PowerXS™  
The Power Franchise®  
FRFET®  
®
AccuPower™  
AX-CAP™*  
Global Power ResourceSM  
Green Bridge™  
Green FPS™  
Green FPS™ e-Series™  
Gmax™  
Programmable Active Droop™  
BitSiC®  
QFET®  
TinyBoost™  
TinyBuck™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
QS™  
Quiet Series™  
RapidConfigure™  
TinyCalc™  
TinyLogic®  
GTO™  
IntelliMAX™  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
Current Transfer Logic™  
DEUXPEED®  
Dual Cool™  
EcoSPARK®  
EfficentMax™  
ESBC™  
ISOPLANAR™  
Marking Small Speakers Sound Louder SignalWise™  
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Saving our world, 1mW/W/kW at a time™  
SmartMax™  
SMART START™  
Solutions for Your Success™  
SPM®  
TranSiC®  
TriFault Detect™  
TRUECURRENT®*  
μSerDes™  
MicroPak™  
STEALTH™  
®
MicroPak2™  
MillerDrive™  
MotionMax™  
Motion-SPM™  
mWSaver™  
SuperFET®  
Fairchild®  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SupreMOS®  
SyncFET™  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
VoltagePlus™  
XS™  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
FAST®  
OptoHiT™  
OPTOLOGIC®  
OPTOPLANAR®  
Sync-Lock™  
®*  
FastvCore™  
FETBench™  
FlashWriter®  
FPS™  
*
®
tm  
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE  
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,  
WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used here in:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance with  
instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,  
www.Fairchildsemi.com, under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their  
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed  
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the  
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild  
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committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I61  
www.fairchildsemi.com  
FDP5N50F / FDPF5N50FT Rev. C1  
10  

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