FDP6670AL-OLDDIE [FAIRCHILD]
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET;型号: | FDP6670AL-OLDDIE |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET |
文件: | 总5页 (文件大小:156K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
May 2003
FDP6670AL/FDB6670AL
N-Channel Logic Level PowerTrenchÒ MOSFET
General Description
Features
This N-Channel Logic Level MOSFET has been
designed specifically to improve the overall efficiency of
DC/DC converters using either synchronous or
conventional switching PWM controllers.
·
·
·
·
80 A, 30 V
RDS(ON) = 6.5 mW @ VGS = 10 V
RDS(ON) = 8.5 mW @ VGS = 4.5 V
Critical DC electrical parameters specified at
elevated temperature
These MOSFETs feature faster switching and lower
gate charge than other MOSFETs with comparable
RDS(ON) specifications.
High performance trench technology for extremely
low RDS(ON)
The result is a MOSFET that is easy and safer to drive
(even at very high frequencies), and DC/DC power
supply designs with higher overall efficiency.
175°C maximum junction temperature rating
It has been optimized for low gate charge, low RDS(ON)
and fast switching speed.
D
D
G
G
G
S
TO-263AB
FDB Series
TO-220
FDP Series
D
S
S
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
VDSS
Parameter
Drain-Source Voltage
Ratings
Units
30
V
V
A
VGSS
Gate-Source Voltage
± 20
ID
Drain Current – Continuous
– Pulsed
(Note 1)
(Note 1)
80
240
PD
68
W
W/°C
°C
Total Power Dissipation @ TC = 25°C
0.45
Derate above 25°C
Operating and Storage Junction Temperature Range
TJ, TSTG
–65 to +175
Thermal Characteristics
RqJC
Thermal Resistance, Junction-to-Case
2.2
°C/W
°C/W
RqJA
Thermal Resistance, Junction-to-Ambient
62.5
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
24mm
Quantity
FDB6670AL
FDB6670AL
FDP6670AL
13’’
800 units
45
FDP6670AL
Tube
n/a
FDP6670AL/FDB6670AL Rev D(W)
Ó2003 Fairchild Semiconductor Corporation
Electrical Characteristics
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Drain-Source Avalanche Ratings (Note 1)
WDSS
IAR
Single Pulse Drain-Source
Avalanche Energy
VDD = 15 V,
ID = 80 A
114
80
mJ
A
Maximum Drain-Source Avalanche
Current
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
30
V
VGS = 0 V,
ID = 250 mA
DBVDSS
DTJ
Breakdown Voltage Temperature
Coefficient
ID = 250 mA, Referenced to 25°C
mV/°C
24
IDSS
IGSS
Zero Gate Voltage Drain Current
Gate–Body Leakage
VDS = 24 V,
VGS = 0 V
1
mA
nA
VGS = ± 20 V, VDS = 0 V
± 100
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
1
1.9
–5
3
V
VDS = VGS
,
ID = 250 mA
DVGS(th)
DTJ
Gate Threshold Voltage
Temperature Coefficient
ID = 250 mA, Referenced to 25°C
mV/°C
RDS(on)
Static Drain–Source On–
Resistance
VGS = 10 V,
VGS = 4.5 V,
VGS= 10 V, ID = 40 A, TJ=125°C
ID = 40 A
ID = 37 A
5.2
6.5
7.2
6.5
8.5
9.7
mW
ID(on)
gFS
On–State Drain Current
VGS = 10 V,
VDS = 10V,
VDS = 10 V
ID = 40 A
80
A
S
Forward Transconductance
115
Dynamic Characteristics
Ciss
Input Capacitance
2440
580
pF
pF
VDS = 15 V,
f = 1.0 MHz
V GS = 0 V,
Coss
Output Capacitance
Crss
RG
Reverse Transfer Capacitance
Gate Resistance
250
1.4
pF
VGS = 15 mV, f = 1.0 MHz
W
Switching Characteristics (Note 2)
td(on)
tr
td(off)
tf
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
VDD = 10V,
VGS = 10 V,
ID = 1 A,
RGEN = 6 W
13
13
42
15
24
7
23
23
68
27
33
ns
ns
ns
ns
VDS = 15 V,
VGS = 5 V
ID = 40 A,
Qg
Qgs
Qgd
nC
nC
nC
9
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
80
A
V
Drain–Source Diode Forward
VGS = 0 V, IS = 40 A
Voltage
VSD
(Note 1)
0.9
1.3
trr
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
IF = 40 A,
diF/dt = 100 A/µs
34
24
nS
nC
Qrr
Notes:
1. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%
FDP6670AL/FDB6670AL Rev D(W)
Typical Characteristics
1.8
1.6
1.4
1.2
1
100
4.0V
4.5V
VGS = 10V
6.0V
VGS = 3.5V
75
50
25
0
3.5V
4.0V
4.5V
5.0V
6.0V
3.0V
1.5
10V
80
0.8
0
0.5
1
2
0
20
40
60
100
VDS, DRAIN-SOURCE VOLTAGE (V)
ID, DRAIN CURRENT (A)
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
0.021
1.6
ID = 80A
VGS =10V
ID = 40A
1.4
0.017
0.013
0.009
0.005
1.2
1
TA = 125oC
0.8
0.6
TA = 25oC
-50
-25
0
25
50
75
100
125
150
2
4
6
8
10
TJ, JUNCTION TEMPERATURE (oC)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation with
Temperature.
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
100
1000
VGS = 0V
VDS = 10V
100
10
80
60
40
20
0
TA = 125oC
25oC
1
-55oC
TA = 125oC
25oC
0.1
0.01
0.001
-55oC
2
2.5
3
3.5
4
0
0.2
0.4
0.6
0.8
1
1.2
1.4
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
FDP6670AL/FDB6670AL Rev D(W)
Typical Characteristics
10
4000
3000
2000
1000
0
ID = 80A
f = 1MHz
VGS = 0 V
8
VDS = 10V
6
Ciss
15V
20V
4
Coss
2
0
Crss
0
10
20
30
40
50
0
5
10
15
20
25
30
Qg, GATE CHARGE (nC)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics.
Figure 8. Capacitance Characteristics.
5000
1000
SINGLE PULSE
RqJC = 2.2°C/W
TA = 25°C
4000
10µs
100µs
1mS
10mS
100mS
DC
RDS(ON) LIMIT
100
10
1
3000
2000
1000
0
VGS = 10V
SINGLE PULSE
RqJA = 2.2oC/W
TA = 25oC
0.1
1
10
100
0.00001
0.0001
0.001
0.01
0.1
1
VDS, DRAIN-SOURCE VOLTAGE (V)
t1, TIME (sec)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
RqJC(t) = r(t) * RqJA
RqJA = 2.2 °C/W
0.2
P(pk
0.1
0.1
t1
t2
0.05
0.02
0.01
TJ - TA = P * RqJA(t)
Duty Cycle, D = t1 / t2
SINGLE PULSE
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t1, TIME (sec)
Figure 11. Transient Thermal Response Curve.
FDP6670AL/FDB6670AL Rev D(W)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
PACMAN™
POP™
SPM™
ImpliedDisconnect™
ISOPLANAR™
LittleFET™
FACT™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
Stealth™
FACT Quiet Series™
FAST
Power247™
PowerTrench
QFET
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
FASTr™
FRFET™
QS™
GlobalOptoisolator™
GTO™
EcoSPARK™
E2CMOSTM
EnSignaTM
QT Optoelectronics™ TinyLogic
Quiet Series™
RapidConfigure™
RapidConnect™
TruTranslation™
MSXPro™
HiSeC™
I2C™
UHC™
OCX™
UltraFET
OCXPro™
Across the board. Around the world.™
The Power Franchise™
SILENT SWITCHER VCX™
SMARTSTART™
OPTOLOGIC
OPTOPLANAR™
ProgrammableActive Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOTASSUMEANY LIABILITYARISING OUT OF THEAPPLICATION OR USE OFANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I3
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