FMS6203_0611 [FAIRCHILD]

Low-Cost 3-Channel Video Filter Driver for SD/PS/HD; 支持SD / PS / HD低成本三通道视频滤波驱动器
FMS6203_0611
型号: FMS6203_0611
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low-Cost 3-Channel Video Filter Driver for SD/PS/HD
支持SD / PS / HD低成本三通道视频滤波驱动器

驱动器
文件: 总9页 (文件大小:303K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
November 2006  
FMS6203  
Low-Cost 3-Channel Video Filter Driver for SD/PS/HD  
Features  
Description  
The FMS6203 offers comprehensive filtering for set-top  
box or DVD applications. It is intended to replace passive  
LC filters and drivers with a low-cost integrated device.  
„ Three 6th-Order Video Anti-Aliasing or Reconstruction  
Filters  
„ Supports Component YPrPb or RGB Video  
„ Three Channels, Selectable to 8MHz,16MHz, 32MHz  
Filter channels are specialized for either component  
(YPbPr) or RGB video signals. These channels offer a  
selectable frequency response of 8, 16, or 32MHz. The  
filters can also be bypassed for high-frequency opera-  
tion. Additional functionality of these channels includes  
input biasing mode and output disable.  
for SD/PS/HD Applications  
„ Includes Wide Bandwidth Bypass Mode  
„ 6dB Gain Option Available for 150Ω Double Termi-  
nated Video Load  
„
0dB Gain Option Available for High Impedance Loading  
The FMS6203 may be driven directly by a DC-coupled  
DAC output or an AC-coupled signal. All inputs accept  
standard 1Vpp video signals.  
„ Selectable Clamp or Bias Mode on Pb,Pr / B,R Inputs  
„ Inputs and Outputs can be either AC or DC Coupled  
„ DC-Coupled Outputs Eliminate Expensive Coupling  
Each channel includes an output amplifier capable of  
driving a single (150Ω) AC- or DC-coupled video load. All  
outputs can be disabled to save power in DC-coupled  
applications.  
Capacitors  
„ Output Disable  
„ Single 5V supply  
„ 2kV CDM / 8kV HBM ESD Protection  
„ Lead-Free TSSOP-14 Package  
The device is available in two factory-set options, a 0dB  
gain option and a 6dB gain option.  
Applications  
„ Cable and Satellite Set-Top Boxes  
„ DVD Players  
„ HDTV  
„ Personal Video Recorders (PVR)  
„ Video On Demand (VOD)  
Functional Block Diagram  
Y/G In  
Clamp  
Y/G Out  
SD  
SD  
SD  
PS  
PS  
PS  
HD  
HD  
HD  
BP  
BP  
BP  
Pb/B In  
Clamp / Bias  
Clamp / Bias  
Pb/B Out  
Pr/R Out  
Bias  
Pr/R In  
FSEL0  
FSEL1  
OE  
Factory Option:  
0dB or 6dB Gain  
Figure 1. Block Diagram  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
Ordering Information  
Gain  
Setting  
Operating Temperature  
Range  
Packing  
Method  
Part Number  
Package  
TSSOP-14  
TSSOP-14  
TSSOP-14  
TSSOP-14  
Pb-Free  
Yes  
FMS6203MTC1400  
FMS6203MTC1400X  
FMS6203MTC1406  
FMS6203MTC1406X  
0dB  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
Tube  
0dB  
Yes  
Tape and Reel  
Tube  
6dB  
Yes  
6dB  
Yes  
Tape and Reel  
Note:  
1. Moisture sensitivity level for all parts is MSL-1.  
Pin Configuration  
VCC  
VCC  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
FSEL0  
Y/G In  
FSEL1  
FAIRCHILD  
Y/G Out  
Pb/B Out  
Pr/R Out  
OE  
FMS6203  
Pb/B In  
Pr/R In  
BIAS  
14P TSSOP  
GND  
GND  
8
Figure 2. Pin Configuration  
Pin Assignments  
Pin #  
1
Name  
VCC  
Type  
Description  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Output  
Output  
Input  
Input  
+5V supply.  
2
FSEL0  
Y/G In  
Pb/B In  
Pr/R In  
BIAS  
Selects filter corner frequency.  
Selectable video input.  
3
4
Selectable video input.  
5
Selectable video input.  
6
Input Bias on Pb/B Pr/R 0 = Bias 1 = Clamp.  
Must be tied to ground. Do not float.  
Must be tied to ground. Do not float.  
Output disable control 0 = OFF 1 = ON.  
Filtered SD,PS,HD,BP video output.  
Filtered SD,PS,HD,BP video output.  
Filtered SD,PS,HD,BP video output.  
Selects filter corner frequency.  
+5V supply.  
7
GND  
8
GND  
9
OE  
10  
11  
12  
13  
14  
Pr/R Out  
Pb/B Out  
Y/G Out  
FSEL1  
VCC  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The  
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables  
are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the  
conditions for actual device operation.  
Parameter  
Min.  
-0.3  
-0.3  
Max.  
6
Unit  
V
DC Supply Voltage  
Analog and Digital I/O  
Vcc + 0.3  
50  
V
Output Current, Any One Channel, Do Not Exceed  
mA  
Reliability Information  
Symbol  
TJ  
Parameter  
Min.  
Typ.  
Max.  
Unit  
Junction Temperature  
150  
150  
300  
°C  
°C  
TSTG  
TL  
Storage Temperature Range  
-65  
Lead Temperature, Soldering 10 seconds  
°C  
ΘJA  
Thermal Resistance JEDEC Standard Multi-Layer Test  
Boards, Still Air  
97  
°C/W  
Recommended Operating Conditions  
Symbol  
TA  
Parameter  
Operating Temperature Range  
Supply Voltage Range  
Min.  
-40  
Typ.  
Max.  
85  
Unit  
°C  
VCC  
4.75  
5.0  
5.25  
V
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
3
DC Electrical Characteristics  
TA = 25°C, Vcc = 5V, Rsource = 37.5Ω, inputs AC coupled with 0.1μF, all outputs AC coupled with 220μF into 150Ω  
loads, referenced to 400kHz; all gain options; unless otherwise noted.  
Symbol  
ICC  
Parameter  
Supply Current(1)  
Supply Current (1)  
Conditions  
Min.  
Typ.  
36  
Max  
75  
Units  
mA  
mA  
Vpp  
V
No Load  
No Load, Output Disabled  
ICC1  
VIN  
15  
35  
Video Input Voltage Range Referenced to GND if DC Coupled  
1.0  
VIL  
Digital Input Low(1)  
Digital Input High(1)  
FSEL0,FSEL1  
FSEL0,FSEL1  
150Ω DC load  
0
0.8  
Vcc  
VIH  
2.4  
V
tENABLE Output Enable Time  
300  
ns  
Note:  
1. 100% tested at 25°C.  
Standard Definition Electrical Characteristics  
TA = 25°C, VIN = 1Vpp, Vcc = 5V, Rsource = 37.5Ω, all inputs AC coupled with 0.1μF, all outputs AC coupled with 220μF  
into 150Ω loads, referenced to 400kHz, all gain options; unless otherwise noted.  
Symbol  
AVSD  
Parameter  
Channel Gain Error (1)  
-1dB Bandwidth(1)  
-3dB Bandwidth  
Conditions  
Min.  
-0.4  
Typ.  
0
Max  
Units  
dB  
0.4  
f1dBSD  
fcSD  
5.20  
7.15  
8
MHz  
MHz  
Attenuation (Stopband  
Reject)(1)  
fSBSD  
f = 27MHz  
40  
50  
dB  
DG  
DP  
Differential Gain  
0.3  
1.0  
%
°
Differential Phase  
Total Harmonic Distortion,  
Output  
THD  
VOUT = 1.4Vpp, 3.58MHz  
0.6  
%
XTALKSD Crosstalk (ch-to-ch)  
1MHz  
-70  
75  
85  
dB  
dB  
ns  
SNR  
tpdSD  
Signal-to-Noise Ratio(2)  
NTC-7 weighting, 100kHz to 4.2MHz  
Delay from input to output, 4.5MHz  
Propagation Delay  
Notes:  
1. 100% tested at 25°C.  
2. SNR = 20 * log (714mV / rms noise).  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
4
Progressive Scan Electrical Characteristics  
TA = 25°C, VIN = 1Vpp, Vcc = 5V, Rsource = 37.5Ω, all inputs AC coupled with 0.1μF, all outputs AC coupledwith 220μF  
into 150Ω loads, referenced to 400kHz, all gain options; unless otherwise noted.  
Symbol  
Parameter  
Channel Gain Error(1)  
Conditions  
Min.  
-0.4  
Typ.  
0
Max  
Units  
dB  
AVPS  
0.4  
f1dBSPS -1dB Bandwidth(1)  
10.0  
13.5  
16  
MHz  
MHz  
fcPS  
-3dB Bandwidth  
Attenuation (Stopband  
Reject)(1)  
fSBPS  
f = 54MHz  
37  
44  
dB  
%
Total Harmonic Distortion,  
Output  
THD  
VOUT = 1.4Vpp, 7MHz  
0.55  
XTALKPS Crosstalk (ch-to-ch)  
1MHz  
-75  
66  
dB  
dB  
ns  
SNR  
tpdPS  
Signal-to-Noise Ratio(2)  
Unweighted; 100kHz to 15MHz  
Delay from input to output, 10MHz  
Propagation Delay  
47  
Notes:  
1. 100% tested at 25°C.  
2. SNR = 20 * log (714mV / rms noise).  
High-Definition Electrical Characteristic  
TA = 25°C, VIN = 1Vpp, Vcc = 5V, Rsource = 37.5Ω, all inputs AC coupled with 0.1μF, all outputs AC coupled with 220μF  
into 150Ω loads, referenced to 400kHz, all gain options; unless otherwise noted.  
Symbol  
AVHD  
Parameter  
Channel Gain Error(1)  
-1dB Bandwidth(1)  
-3dB Bandwidth  
Conditions  
Min.  
-0.4  
28  
Typ.  
0
Max. Units  
0.4  
dB  
f1dBHD  
fcHD  
31  
MHz  
MHz  
32  
Attenuation (Stopband  
Reject)(1)  
fSBHD  
f = 74.25MHz  
30  
40  
0.5  
0.5  
dB  
%
V
load  
OUT = 0.7Vpp, 22MHz, 0dB, 10kΩ  
Total Harmonic Distortion,  
Output  
THD  
VOUT = 1.4Vpp, 22MHz, 6dB, 150Ω  
load  
%
1MHz  
-75  
-57  
66  
dB  
dB  
dB  
ns  
XTALKHD Crosstalk (ch-to-ch)  
30MHz  
SNR  
Signal-to-Noise Ratio(2)  
Propagation Delay  
Unweighted, 100kHz to 30MHz  
Delay from input to output, 20MHz  
tpdHD  
25  
Notes:  
1. 100% tested at 25°C.  
2. SNR = 20 * log (714mV / rms noise).  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
5
Bypass Mode Electrical Characteristics  
TA = 25°C, VIN = 1Vpp, Vcc = 5V, Rsource = 37.5Ω, all inputs AC coupled with 0.1μF, all outputs AC coupled with 220μF  
into 150Ω loads, referenced to 400kHz, all gain options; unless otherwise noted.  
Symbol  
AVBP  
Parameter  
Channel Gain Error(1)  
-1dB Bandwidth  
Conditions  
Min.  
Typ.  
0
Max. Units  
DC  
-0.4  
0.4  
dB  
MHz  
MHz  
%
f1dBBP  
fcBP  
90  
-3dB Bandwidth  
115  
0.3  
0.25  
-74  
-64  
70  
VOUT = 0.7Vpp, 22MHz, 0dB, 10kΩ load  
Total Harmonic Distor-  
tion, Output  
THD  
VOUT = 1.4Vpp, 22MHz, 6dB, 150Ω load  
%
1MHz  
dB  
XTALKBP Crosstalk (ch-to-ch)  
SNR  
Notes:  
30MHz  
dB  
Signal-to-Noise Ratio(2) Unweighted, 100kHz to 30MHz  
dB  
1. 100% tested at 25°C.  
2. SNR = 20 * log (714mV / rms noise).  
Frequency Select Truth Table  
F
F
Filter Frequency  
8MHz  
Video Format  
Sync Format  
SEL1  
SEL0  
0
0
SD,480i  
PS,480p  
Bi-level, 4.7μs pulse width  
Bi-level, 2.35μs pulse width  
Tri-level, 589ns pulse width  
0
1
1
1
0
1
16MHz  
32MHz  
HD,1080i,720p  
Bypass  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
6
Layout Considerations  
General layout and supply bypassing play a major role in  
high-frequency performance and thermal characteristics.  
Fairchild offers a demonstration board to guide layout  
and aid device evaluation. The demo board is a four-  
layer board with full power and ground planes. Following  
this layout configuration provides optimum performance  
and thermal characteristics for the device. For the best  
results, follow the steps and recommended routing rules  
listed below.  
„ For two-layer boards, use a ground plane that extends  
beyond the device body by at least 0.5 inches on all  
sides. Include a metal paddle under the device on the  
top layer.  
„ Minimize all trace lengths to reduce series inductance.  
Thermal Considerations  
Since the interior of most systems, such as set-top-  
boxes, TVs, and DVD players are at +70ºC; consider-  
ation must be given to providing an adequate heat sink  
for the device package for maximum heat dissipation.  
When designing a system board, determine how much  
power each device dissipates. Ensure that devices of  
high power are not placed in the same location, such as  
directly above (top plane) and below bottom plane) each  
other on the PCB.  
Recommended Routing/Layout Rules  
„ Do not run analog and digital signals in parallel.  
„ Use separate analog and digital power planes to  
supply power.  
„ Traces should run on top of the ground plane at all-  
times.  
„ No trace should run over ground/power splits.  
„ Avoid routing at 90-degree angles.  
PCB Thermal Layout Considerations  
„ Understand the system power requirements and envi-  
„ Minimize clock and video data trace length differ-  
ronmental conditions.  
ences.  
„ Maximize thermal performance of the PCB.  
„ Include 10µF and 0.1µF ceramic power supply bypass  
„ Consider using 70µm of copper for high-power  
capacitors.  
designs.  
„ Place the 0.1µF capacitor within 0.1 inches of the  
„ Make the PCB as thin as possible by reducing FR4  
device power pin.  
thickness.  
„ Place the 10µF capacitor within 0.75 inches of the  
„ Use vias in power pad to tie adjacent layers together.  
device power pin.  
„ Remember that baseline temperature is a function of  
„ For multilayer boards, use a large ground plane to  
board area, not copper thickness.  
help dissipate heat.  
„ Modeling techniques can provide a first-order approxi-  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
7
Mechanical Dimensions  
Dimensions are in millimeters unless otherwise noted.  
14-Lead TSSOP  
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP)  
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
8
© 2006 Fairchild Semiconductor Corporation  
FMS6203 Rev. 1.0.2  
www.fairchildsemi.com  
9

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