FOD817BS_技术文档

July 2009

FOD814 Series, FOD817 Series

4-Pin High Operating Temperature

Phototransistor Optocouplers

Features

Description

■ AC input response (FOD814 only)

■ Applicable to Pb-free IR reflow soldering

■ Compact 4-pin package

The FOD814 consists of two gallium arsenide infrared

emitting diodes, connected in inverse parallel, driving a

silicon phototransistor output in a 4-pin dual in-line

package. The FOD817 Series consists of a gallium

■ Current transfer ratio in selected groups:

arsenide infrared emitting diode driving

phototransistor in a 4-pin dual in-line package.

a silicon

FOD814: 20–300%

FOD814A: 50–150%

FOD817: 50–600%

FOD817A: 80–160%

FOD817B: 130–260%

FOD817C: 200–400%

FOD817D: 300–600%

■ C-UL, UL and VDE approved

■ High input-output isolation voltage of 5000Vrms

■ Minimum BV

of 70V guaranteed

CEO

■ Higher operating temperatures (versus H11AXXX

counterparts)

Applications

FOD814 Series

■ AC line monitor

■ Unknown polarity DC sensor

■ Telephone line interface

FOD817 Series

■ Power supply regulators

■ Digital logic inputs

■ Microprocessor inputs

Functional Block Diagram

ANODE, CATHODE 1

4 COLLECTOR

3 EMITTER

1

2

4

COLLECTOR

ANODE

CATHODE, ANODE 2

4

CATHODE

3 EMITTER

FOD814

FOD817

1

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

Absolute Maximum Ratings ^{(T = 25°C Unless otherwise speciﬁed.)}

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Value

Units

Symbol

Parameter

FOD814

FOD817

TOTAL DEVICE

T

Storage Temperature

-55 to +150

-55 to +105 -55 to +110

°C

STG

T

Operating Temperature

Lead Solder Temperature

Junction Temperature

OPR

T

260 for 10 sec

125 Max.

210

°C

SOL

T

°C

J

θ

Junction-to-Case Thermal Resistance

Total Power Dissipation

°C/W

mW

JC

P

200

TOT

EMITTER

I

Continuous Forward Current

Reverse Voltage

50

6

mA

F

V

P

R

Power Dissipation

70

mW

D

Derate above 100°C

1.7

mW/°C

DETECTOR

V

Collector-Emitter Voltage

Emitter-Collector Voltage

Continuous Collector Current

70

6

V

CEO

ECO

I

50

mA

C

P

Collector Power Dissipation

Derate above 90°C

150

2.9

mW

C

mW/°C

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

2

Electrical Characteristics ^{(T = 25°C Unless otherwise speciﬁed.)}

A

Individual Component Characteristics

Symbol

EMITTER

Parameter

Forward Voltage

Device

Test Conditions Min. Typ.* Max. Unit

V

FOD814

FOD817

FOD814

FOD817

I = 20mA

1.2

1.4

10

V

F

I = 20mA

F

I

Reverse Leakage Current

Terminal Capacitance

V

= 4.0V

µA

pF

R

C

V = 0, f = 1kHz

50

30

250

t

DETECTOR

I

Collector Dark Current

FOD814

FOD817

FOD814

FOD817

FOD814

FOD817

V

= 20V, I = 0

100

nA

V

CEO

CE

F

= 20V, I = 0

CE

F

BV

Collector-Emitter Breakdown

Voltage

I

= 0.1mA, I = 0

70

6

CEO

ECO

C

F

= 0.1mA, I = 0

F

Emitter-Collector Breakdown

Voltage

I = 10µA, I = 0

V

E

F

I = 10µA, I = 0

6

E

F

DC Transfer Characteristics

DC

Symbol

Characteristic

Device

Test Conditions

Min.

20

Typ.* Max. Unit

(1)

CTR

Current Transfer

Ratio

FOD814 I = 1mA, V = 5V

300

150

600

160

260

400

600

0.2

%

F

CE

FOD814A

FOD817 I = 5mA, V = 5V

50

(1)

50

F

CE

FOD817A

FOD817B

FOD817C

FOD817D

80

130

200

300

V

Collector-Emitter

Saturation Voltage

FOD814 I = 20mA, I = 1mA

0.1

V

CE (sat)

F

C

FOD817 I = 20mA, I = 1mA

0.2

F

C

AC Transfer Characteristics

Symbol AC Characteristic

Device

Test Conditions

Min. Typ.* Max. Unit

f

Cut-Off Frequency

FOD814

V

= 5V, I = 2mA, R = 100Ω,

15

80

kHz

C

CE

C

L

-3dB

(2)

t

Response Time (Rise) FOD814,

FOD817

V

= 2 V, I = 2mA, R = 100Ω

4

18

µs

r

CE

C

L

t

Response Time (Fall)

FOD814,

FOD817

3

µs

f

*Typical values at T = 25°C

A

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

3

Electrical Characteristics ^{(T = 25°C Unless otherwise speciﬁed.) (Continued)}

A

Isolation Characteristics

Symbol

Characteristic

Device Test Conditions

Min.

Typ.*

Max.

Units

V

R

C

Input-Output Isolation

Voltage

FOD814, f = 60Hz, t = 1 min,

5000

Vac(rms)

ISO

(3)

FOD817

I

≤ 2µA

I-O

10

11

Isolation Resistance

Isolation Capacitance

FOD814,

FOD817

V

= 500VDC

5x10

1x10

Ω

I-O

FOD814,

FOD817

V

= 0, f = 1 MHz

0.6

1.0

pf

*Typical values at T = 25°C

A

Notes:

1. Current Transfer Ratio (CTR) = I /I x 100%.

C

F

2. For test circuit setup and waveforms, refer to page 7.

3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

4

Typical Electrical/Optical Characteristics ^{(T = 25°C Unless otherwise speciﬁed.)}

A

Fig. 1 Collector Power Dissipation

vs. Ambient Temperature (FOD814)

Fig. 2 Collector Power Dissipation

vs. Ambient Temperature (FOD817)

200

150

100

50

200

150

100

50

0

-55

0

-55

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

AMBIENT TEMPERATURE T (°C)

A

Fig. 3 Collector-Emitter Saturation Voltage

vs. Forward Current

Fig. 4 Forward Current vs. Forward Voltage

(FOD814)

6

100

10

1

Ic = 0.5mA

Ta = 25°C

1mA

3mA

5mA

T

A

= 105^oC

75^oC

50^oC

5

4

7mA

25^oC

0^oC

3

2

1

0

-30^oC

-55^oC

0.1

0.5

1.0

1.5

2.0

0

2.5

5.0

7.5 10.0 12.5 15.0

FORWARD CURRENT I (mA)

FORWARD VOLTAGE V (V)

F

Fig. 6 Current Transfer Ratio

vs. Forward Current

Fig. 5 Forward Current vs. Forward Voltage

(FOD817)

100

10

1

140

120

100

V_CE= 5V

Ta= 25°C

T

A

= 110^oC

75^oC

50^oC

FOD817

80

60

40

20

0

25^oC

0^oC

-30^oC

FOD814

-55^oC

0.1

0.5

1.0

1.5

2.0

0.1 0.2 0.5

1

2

5

10 20 50 100

FORWARD VOLTAGE V (V)

FORWARD CURRENT I (mA)

F

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

5

Typical Electrical/Optical Characteristics ^{(Continued) (T = 25°C Unless otherwise speciﬁed.)}

A

Fig. 8 Collector Current vs.

Collector-Emitter Voltage (FOD817)

Fig. 7 Collector Current

vs. Collector-Emitter Voltage (FOD814)

30

25

20

15

10

5

50

Ta= 25°C

II = 30mA

Ta = 25°C

Pc(MAX.)

F

I_F= 30mA

20mA

40

30

20

10

0

20mA

Pc(MAX.)

10mA

5mA

1mA

10 20 30 40 50 60 70 80 90 100

0

10 20 30 40 50 60 70 80 90

0

COLLECTOR-EMITTER VOLTAGE V (V)

CE

COLLECTOR-EMITTER VOLTAGE V (V)

CE

Fig. 10 Collector-Emitter Saturation Voltage

Fig. 9 Relative Current Transfer Ratio

vs. Ambient Temperature

160

140

120

100

80

0.12

I

= 20mA

= 1mA

FOD814

F

I

V

= 1 mA

= 5V

F

C

0.10

0.08

0.06

0.04

0.02

0.00

CE

FOD817

= 5mA

I

F

60

V

CE

= 5V

40

20

0

-60 -40 -20

0

20 40 60 80 100 120

-60 -40 -20

0

20 40 60 80 100 120

AMBIENT TEMPERATURE T (°C)

A

AMBIENT TEMPERATURE T (°C)

A

Fig. 11 LED Power Dissipation

Fig. 12 LED Power Dissipation

vs. Ambient Temperature (FOD814)

vs. Ambient Temperature (FOD817)

100

80

60

40

20

0

80

60

40

20

0

-55 -40 -20

0

20 40 60 80 100 120

-55 -40 -20

0

20 40 60 80 100 120

AMBIENT TEMPERATURE T (°C)

A

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

6

Typical Electrical/Optical Characteristics ^{(Continued) (T = 25°C Unless otherwise speciﬁed.)}

A

Fig. 13 Response Time

Fig. 14 Frequency Response

vs. Load Resistance

100

50

V_CE= 2V

Ic = 2mA

Ta = 25°C

V_CE= 2V

Ic= 2mA

Ta = 25°C

tr

0

-10

-20

20

10

5

tf

td

R_L=10k

100

1k

2

1

ts

0.5

0.2

0.1

0.1 0.2 0.5

1

2

5

10

0.2 0.5 15 2

10

100

1000

FREQUENCY f (kHz)

LOAD RESISTANCE R (kΩ)

L

Fig. 15 Collector Dark Current

vs. Ambient Temperature

10000

1000

100

10

V

CE

= 20V

1

0.1

0.01

-60 -40 -20

0

20 40 60 80 100 120

AMBIENT TEMPERATURE T (°C)

A

Test Circuit for Frequency Response

Test Circuit for Response Time

Vcc

Input

Output

Vcc

R_L

R_D

Output

10%

90%

R_D

Input

td

ts

tr

tf

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

7

Package Dimensions

Through Hole

Surface Mount

0.312 (7.92)

0.288 (7.32)

0.276 (7.00)

0.236 (6.00)

0.312 (7.92)

0.288 (7.32)

0.200 (5.10)

0.161 (4.10)

0.200 (5.10)

0.161 (4.10)

0.276 (7.00)

0.236 (6.00)

0.157 (4.00)

0.118 (3.00)

0.157 (4.00)

0.118 (3.00)

0.010 (0.26)

0.051 (1.30)

0.043 (1.10)

0.049 (1.25)

0.030 (0.76)

0.130 (3.30)

0.020 (0.51)

0.091 (2.30)

TYP

0.024 (0.60)

0.004 (0.10)

0.412 (10.46)

0.388 (9.86)

0.010 (0.26)

0.150 (3.80)

0.110 (2.80)

0.110 (2.79)

0.090 (2.29)

0.393 (9.98)

0.300 (7.62)

Lead Coplanarity 0.004 (0.10) MAX

0.024 (0.60)

0.016 (0.40)

0.110 (2.79)

0.090 (2.29)

Surface Mount (Footprint Dimensions)

1.5

0.4" Lead Spacing

1.3

0.312 (7.92)

0.288 (7.32)

0.200 (5.10)

0.161 (4.10)

0.157 (4.00)

0.118 (3.00)

0.276 (7.00)

0.236 (6.00)

9

0.291 (7.40)

0.252 (6.40)

0.130 (3.30)

0.091 (2.30)

0.110 (2.80)

0.011 (1.80)

0.150 (3.80)

0.110 (2.80)

2.54

0.010 (0.26)

0.110 (2.79)

0.090 (2.29)

0.024 (0.60)

0.016 (0.40)

0.42 (10.66)

0.38 (9.66)

Note:

All dimensions are in inches (millimeters)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

8

Ordering Information

Option

S

Part Number Example

Description

Surface Mount Lead Bend

FOD814S

FOD814SD

FOD814300

FOD814300W

FOD8143S

SD

Surface Mount; Tape and reel

VDE Approved

300

300W

3S

VDE Approved, 0.4" Lead Spacing

VDE Approved, Surface Mount

VDE Approved, Surface Mount, Tape & Reel

3SD

FOD8143SD

Marking Information

4

5

6

V X ZZ Y

814

3

2

1

Deﬁnitions

1

2

3

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4

5

6

One digit year code

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

9

Carrier Tape Specifications

P

0

2

Ø1.55±0.05

1.75±0.1

F

W

B0

A0

P

1

0.3±0.05

K0

Note:

All dimensions are in millimeters.

Symbol

Description

Dimensions in mm (inches)

W

Tape wide

16 0.3 (.63)

P

Pitch of sprocket holes

4

0.1 (.15)

7.5 0.1 (.295)

0.1 (.079)

0

F

Distance of compartment

P

2

P

Distance of compartment to compartment

Compartment

12 0.1 (.472)

10.45 0.1 (.411)

5.30 0.1 (.209)

4.25 0.1 (.167)

1

A0

B0

K0

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

10

Lead Free Recommended IR Reflow Condition

Tp

Tsmax

Tsmin

Ramp-down

25°C

Soldering zon

ts (Preheat)

Time (sec)

Proﬁle Feature

Pb-Sn solder assembly

Lead Free assembly

Preheat condition

(Tsmin-Tsmax / ts)

100°C ~ 150°C

60 ~ 120 sec

150°C ~ 200°C

60 ~120 sec

Melt soldering zone

183°C

217°C

60 ~ 120 sec

30 ~ 90 sec

Peak temperature (Tp)

Ramp-down rate

240 +0/-5°C

260 +0/-5°C

6°C/sec max.

Recommended Wave Soldering condition

Proﬁle Feature

For all solder assembly

Max 260°C for 10 sec

Peak temperature (Tp)

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

11

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

PowerTrench^®

PowerXS™

The Power Franchise^®

Auto-SPM™

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Current Transfer Logic™

EcoSPARK^®

EfficentMax™

EZSWITCH™*

™*

F-PFS™

FRFET^®

Global Power Resource^SM

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Programmable Active Droop™

QFET^®

TinyBoost™

TinyBuck™

QS™

Quiet Series™

RapidConfigure™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

™

Saving our world, 1mW/W/kW at a time™

SmartMax™

TinyWire™

TriFault Detect™

TRUECURRENT™*

µSerDes™

SMART START™

SPM^®

®

MicroPak™

MillerDrive™

MotionMax™

Motion-SPM™

OPTOLOGIC^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS™

SyncFET™

Fairchild^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

UHC^®

Ultra FRFET™

UniFET™

VCX™

VisualMax™

XS™

OPTOPLANAR^®

FAST^®

®

FastvCore™

FETBench™

PDP SPM™

Power-SPM™

Sync-Lock™

FlashWriter^®

®

*

FPS™

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR

CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain life,

and (c) whose failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be reasonably

expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.

Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,

and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of

counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are

listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have

full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.

Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide

any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our

customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status

Definition

Datasheet contains the design specifications for product development. Specifications may change in

any manner without notice.

Advance Information

Preliminary

Formative / In Design

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

First Production

Full Production

Not In Production

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes

at any time without notice to improve the design.

No Identification Needed

Obsolete

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I40

FOD814 Series, FOD817 Series Rev. 1.1.4

www.fairchildsemi.com

12


型号：	FOD817BS
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	Transistor Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, DIP-4 输出元件光电
文件：	总12页 (文件大小：343K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FOD817BS [FAIRCHILD]

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