FOD817C [FAIRCHILD]

4-PIN PHOTOTRANSISTOR OPTOCOUPLERS; 4引脚光电晶体管光耦合器


型号：	FOD817C
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	4-PIN PHOTOTRANSISTOR OPTOCOUPLERS 4引脚光电晶体管光耦合器晶体光电晶体管光电晶体管输出元件
文件：	总9页 (文件大小：164K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

DESCRIPTION

The FOD817 Series consists of a gallium arsenide infrared

emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.

FEATURES

•

Applicable to Pb-free IR reﬂow soldering

Compact 4-pin package

Current transfer ratio in selected groups:

FOD817:

50-600%

80-160%

130-260%

200-400%

300-600%

FOD817A:

FOD817B:

FOD817C:

FOD817D:

FUNCTIONAL BLOCK DIAGRAM

•

C-UL, UL and VDE approved

High input-output isolation voltage of 5000 Vrms

COLLECTOR

ANODE

APPLICATIONS

CATHODE

3 EMITTER

FOD817 Series

•

Power supply regulators

Digital logic inputs

Microprocessor inputs

ABSOLUTE MAXIMUM RATINGS (T = 25°C Unless otherwise speciﬁed.)

Parameter

Symbol

Value

Units

TOTAL DEVICE

Storage Temperature

Operating Temperature

Lead Solder Temperature

-55 to +125

-30 to +100

260 for 10 sec

200

°C

STG

OPR

°C

SOL

Total Device Power Dissipation

EMITTER

Continuous Forward Current

Reverse Voltage

LED Power Dissipation

Derate above 25°C

0.93

mW/°C

DETECTOR

Collector-Emitter Voltage

Emitter-Collector Voltage

Continuous Collector Current

CEO

ECO

150

2.0

mW/°C

Detector Power Dissipation

Derate above 25°C

Page 1 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise speciﬁed.)

INDIVIDUAL COMPONENT CHARACTERISTICS

Parameter

Test Conditions

Symbol

Min

Typ*

Max

Unit

EMITTER

(I = 20 mA)

—

1.2

1.4

Input Forward Voltage

Reverse Leakage Current

Terminal Capacitance

(V = 4.0 V)

—

–

—

µA

(V = 0, f = 1 kHz)

250

DETECTOR

Collector-Emitter Breakdown Voltage

Emitter-Collector Breakdown Voltage

Collector-Emitter Dark Current

(I = 0.1 mA, I = 0)

—

–

—

–

CEO

(I = 10 µA, I = 0)

ECO

(V = 20 V, I = 0)

CEO

—

–

100

*Typical values at T = 25°C.

TRANSFER CHARACTERISTICS (T = 25°C Unless otherwise speciﬁed.)

DC Characteristic

Test Conditions

Symbol

Device

Min

Typ*

Max Unit

FOD817

—

600

160

260

400

600

FOD817A

FOD817B

FOD817C

FOD817D

Current Transfer Ratio

(I = 5 mA, V = 5 V) (note 1)

CTR

130

200

300

Collector-Emitter

Saturation Voltage

(I = 20 mA, I = 1 mA)

—

0.1

0.2

CE (SAT)

AC Characteristic

Rise Time

(I = 2 mA, V = 2 V, R = 100Ω) (note 2)

—

µs

Fall Time

(I = 2 mA, V = 2 V, R = 100Ω) (note 2)

ISOLATION CHARACTERISTICS

Characteristic

Test Conditions

Symbol

Min

Typ*

Max

Units

Input-Output Isolation Voltage (note 3)

Isolation Resistance

f = 60Hz, t = 1 min

5000

Vac(rms)

ISO

(V = 500 VDC)

5 x 10

0.6

Ω

I-O

Isolation Capacitance

(V = 0, f = 1 MHz)

1.0

I-O

*Typical values at T = 25°C.

NOTES

1. Current Transfer Ratio (CTR) = I /I x 100%.

C F

2. For test circuit setup and waveforms, refer to page 4.

3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.

Page 2 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

Typical Electrical/Optical Characteristic Curves ^{(T = 25°C Unless otherwise speciﬁed.)}

Fig. 1 Forward Current

vs. Ambient Temperature

Fig. 2 Collector Power Dissipation

vs. Ambient Temperature

200

150

100

-30

100 125

AMBIENT TEMPERATURE T (°C)

Fig. 3 Collector-Emitted Saturation Voltage

Fig. 4 Forward Current vs. Forward Voltage

500

vs. Forward Current

Ta = 25°C

Ta=75°C

200

100

50°C

25°C

0°C

-25°C

0.5

1.0

1.5

2.0

2.5

3.0

FORWARD VOLTAGE V (V)

FORWARD CURRENT I (mA)

Fig. 5 Current Transfer Ratio

vs. Forward Current

Fig. 6 Collector Current

vs. Collector-Emitter Voltage

200

180

160

140

120

100

= 5V

II = 30mA

Ta = 25°C

20mA

Pc(MAX.)

10mA

5mA

FORWARD CURRENT I (mA)

COLLECTOR-EMITTER VOLTAGE V

(V)

Page 3 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

Typical Electrical/Optical Characteristic Curves ^{(T = 25°C Unless otherwise speciﬁed.)}

Fig. 8 Collector-Emitter Saturation Voltage

Fig. 7. Relative Current Transfer Ratio

vs. Ambient Temperature

0.16

150

100

= 5mA

= 20mA

= 1mA

0.14

0.12

0.10

0.08

0.06

0.04

0.02

= 5V

-25

100

-30

100

AMBIENT TEMPERATURE T (°C)

Fig. 9 Collector Dark Current

vs. Ambient Temperature

Fig. 10. Response Time

vs. Load Resistance

10^-5

10^-6

10^-7

10^-8

10^-9

10^-10

10^-11

500

200

100

= 2V

= 2mA

= 20V

Ta = 25°C

0.5

0.2

0.05

-25

100

0.1 0.2 0.5

AMBIENT TEMPERATURE T (°C)

LOAD RESISTANCE R (kΩ)

Test Circuit for Response Time

Fig. 11. Frequency Response

= 2V

= 2mA

Ta = 25°C

R =10kΩ

1kΩ 100Ω

Test Circuit for Frequency Response

0.5

10 20 50100

500

FREQUENCY f (kHz)

Page 4 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

Package Dimensions (Through Hole)

Package Dimensions (Surface Mount)

0.312 (7.92)

0.288 (7.32)

0.276 (7.00)

0.236 (6.00)

0.312 (7.92)

0.288 (7.32)

0.200 (5.10)

0.161 (4.10)

0.200 (5.10)

0.276 (7.00)

0.161 (4.10)

0.236 (6.00)

0.157 (4.00)

0.118 (3.00)

0.157 (4.00)

0.118 (3.00)

0.010 (0.26)

0.051 (1.30)

0.043 (1.10)

0.049 (1.25)

0.030 (0.76)

0.130 (3.30)

0.020 (0.51)

0.091 (2.30)

TYP

0.024 (0.60)

0.004 (0.10)

0.412 (10.46)

0.388 (9.86)

0.010 (0.26)

0.150 (3.80)

0.110 (2.80)

0.110 (2.79)

0.090 (2.29)

0.300 (7.62)

typ

Lead Coplanarity 0.004 (0.10) MAX

0.024 (0.60)

0.016 (0.40)

0.110 (2.79)

0.090 (2.29)

Package Dimensions (0.4” Lead Spacing)

Footprint Dimensions (Surface Mount)

0.312 (7.92)

0.288 (7.32)

1.5

0.200 (5.10)

0.161 (4.10)

0.157 (4.00)

0.118 (3.00)

0.276 (7.00)

0.236 (6.00)

1.3

0.291 (7.40)

0.252 (6.40)

0.130 (3.30)

0.091 (2.30)

0.110 (2.80)

0.011 (1.80)

0.150 (3.80)

0.110 (2.80)

0.010 (0.26)

0.110 (2.79)

0.090 (2.29)

0.024 (0.60)

0.016 (0.40)

2.54

NOTE

All dimensions are in inches (millimeters)

Page 5 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

ORDERING INFORMATION

Option

Order Entry Identiﬁer

Description

.SD

Surface Mount Lead Bend

Surface Mount; Tape and reel

0.4" Lead Spacing

300

300W

.300

.300W

.3S

VDE 0884

VDE 0884, 0.4" Lead Spacing

VDE 0884, Surface Mount

VDE 0884, Surface Mount, Tape & Reel

3SD

.3SD

MARKING INFORMATION

V X ZZ Y

817

Deﬁnitions

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

One digit year code

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

Page 6 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

Carrier Tape Specifications

Ø1.55 0.05

1.75 0.1

0.3 0.05

NOTE

All dimensions are in millimeters

Description

Symbol

Dimensions in mm (inches)

Tape wide

16 0.3 (.63)

Pitch of sprocket holes

0.1 (.15)

7.5 0.1 (.295)

0.1 (.079)

12 0.1 (.472)

Distance of compartment

Distance of compartment to compartment

Page 7 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

Lead Free recommended IR Reﬂow condition

Tsmax

Tsmin

Ramp-down

25°C

Soldering zon

ts (Preheat)

Time (sec)

Proﬁle Feature

Pb-Sn solder assembly

Lead Free assembly

Preheat condition

(Tsmin-Tsmax / ts)

100°C ~ 150°C

60 ~ 120 sec

150°C ~ 200°C

60 ~120 sec

183°C

60 ~ 120 sec

217°C

30 ~ 90 sec

Melt soldering zone

Peak temperature (Tp)

Ramp-down rate

240 +0/-5°C

250 +0/-5°C

6°C/sec max.

Recommended Wave Soldering condition

Proﬁle Feature

For all solder assembly

Max 260°C for 10 sec

Peak temperature (Tp)

Page 8 of 9

8/19/04

4-PINPHOTOTRANSISTOR

OPTOCOUPLERS

FOD817 Series

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO

ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME

ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;

NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES

OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body, or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

2. A critical component in any component of a life support

device or system whose failure to perform can be

reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

Page 9 of 9

8/19/04

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