FODM3012R1 [FAIRCHILD]
Triac Output Optocoupler, 1-Element, 3750V Isolation, MINIFLAT-4;
| 型号： | FODM3012R1 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Triac Output Optocoupler, 1-Element, 3750V Isolation, MINIFLAT-4 |
| 文件： | 总11页 (文件大小：168K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 2007
FODM3011, FODM3012, FODM3022, FODM3023,
FODM3052, FODM3053
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac
Driver Output Optocouplers
Features
Applications (Continued)
■ Compact 4-pin surface mount package (2.4 mm
■ Solid state relay
maximum standoff height)
■ Lamp ballasts
■ Peak blocking voltage
250V (FODM301X)
400V (FODM302X)
600V (FODM305X)
■ Solenoid/valve controls
■ Static AC power switch
■ Incandescent lamp dimmers
■ Motor control
■ Available in tape and reel quantities of 500 and 2500.
■ Add “NF098” for new construction version with 260°C
Description
max. reflow temperature rating
The FODM301X, FODM302X, and FODM305X series
consists of a GaAs infrared emitting diode driving a
silicon bilateral switch housed in a compact 4-pin
mini-flat package. The lead pitch is 2.54mm. They are
designed for interfacing between electronic controls and
power triacs to control resistive and inductive loads for
115V/240V operations.
■ UL, C-UL and VDE certifications pending
Applications
■ Industrial controls
■ Traffic lights
■ Vending machines
Package Dimensions
4.40 0.20
MAIN
TERMINAL
1
4
3
ANODE
2.54 0.25
MAIN
TERMINAL
CATHODE 2
3.60 0.30
5.30 0.30
2.00 0.20
0.20 0.05
0.10 0.10
+0.2
–0.7
0.40 0.10
7.00
Note:
All dimensions are in millimeters.
©2006 Fairchild Semiconductor Corporation
FODM30XX Rev. 1.0.5
1
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Absolute Maximum Ratings (T = 25°C unless otherwise specified)
A
Symbol
Parameter
Value
Units
TOTAL PACKAGE
T
Storage Temperature
Operating Temperature
-55 to +150
-40 to +100
°C
°C
STG
T
OPR
EMITTER
I
Continuous Forward Current
60
1
mA
A
F (avg)
I
Peak Forward Current (1µs pulse, 300pps.)
Reverse Input Voltage
F (pk)
V
P
3
V
R
Power Dissipation (No derating required over operating temp. range)
100
mW
D
DETECTOR
I
On-State RMS Current
70
mA (RMS)
V
T(RMS)
V
Off-State Output Terminal Voltage
FODM3011/FODM3012
FODM3022/FODM3023
FODM3052/FODM3053
250
400
600
300
DRM
P
Power Dissipation (No derating required over operating temp. range)
mW
D
2
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FODM30XX Rev. 1.0.5
Electrical Characteristics (T = 25°C)
A
Individual Component Characteristics
Symbol
EMITTER
Parameter
Test Conditions
Device
Min. Typ.* Max. Unit
V
Input Forward Voltage
I = 10mA
All
All
1.20
0.01
1.5
V
F
F
I
Reverse Leakage Current
V = 3V, T = 25°C
100
µA
R
R
A
DETECTOR
(1)
I
Peak Blocking Current Either Rated V
Direction
, I = 0
All
2
100
nA
DRM
DRM
F
(2)
dV/dt
Critical Rate of Rise of
Off-State Voltage
I = 0 (Figure 8)
FODM3011,
FODM3012,
FODM3022,
FODM3023
10
V/µs
F
FODM3052, 1,000
FODM3053
Transfer Characteristics (T = 25°C)
A
Symbol
DC Characteristics
Test Conditions
Device
Min.
Typ.* Max.
Unit
I
LED Trigger Current
Main Terminal
Voltage = 3V
FODM3011,
FODM3022,
FODM3052
10
mA
FT
(3)
FODM3012,
FODM3023,
FODM3053
5
I
Holding Current, Either
Direction
All
300
µA
V
H
V
Peak On-StateVoltage Either
Direction
I
= 100mA peak
All
1.7
3
TM
TM
Isolation Characteristics
Symbol Characteristic
Test Conditions
Device
Min.
Typ.*
Max.
Unit
V
Steady State Isolation
Voltage
1 Minute,
R.H. = 40% to 60%
All
3750
VRMS
ISO
*All typicals at T = 25°C
A
Notes:
1. Test voltage must be applied within dv/dt rating.
2. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating
F
FT
I lies between max I (10mA for FODM3011, FODM3022, and FODM3052, 5mA for FODM3012, FODM3023,
F
FT
and FODM3053) and absolute max I (60mA).
F
3
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FODM30XX Rev. 1.0.5
Typical Performance Curves
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Leakage Current vs. Ambient Temperature
1000
100
10
1.8
VDRM = 600V
1.7
1.6
1.5
1.4
T
= -40°C
A
1.3
1.2
1.1
1.0
0.9
T
= 25°C
A
1
T
= 100°C
A
0.1
-40
-20
0
20
40
60
80
100
1
10
- FORWARD CURRENT (mA)
100
T
- AMBIENT TEMPERATURE (°C)
I
A
F
Fig. 3 Holding Current vs. Ambient Temperature
Fig. 4 Trigger Current vs. Ambient Temperature
1.6
1.4
1.2
1.0
0.8
0.6
0.8
10
1.0
0.1
V
= 3V
TM
NORMALIZED TO T = 25°C
NORMALIZED TO T = 25°C
A
A
-40
-20
0
20
40
60
80
100
100
-40
-20
0
20
40
60
80
T
- AMBIENT TEMPERATURE (°C)
A
T
- AMBIENT TEMPERATURE (°C)
A
4
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FODM30XX Rev. 1.0.5
Typical Performance Curves
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width
Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature
12
1.4
T
=T25°C
A
NORMALIZED TO T = 25°C
A
NORMALIZED TO PW >> 100µs
IN
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
10
8
6
4
2
0
20
40
60
80
100
-40
-20
0
1
10
100
T
- AMBIENT TEMPERATURE (°C)
A
PW - LED TRIGGER PULSE WIDTH (°C)
IN
Fig. 7 On-State Characteristics
800
600
400
200
0
T
A
= 25°C
-200
-400
-600
-800
-4
-3
-2
-1
0
1
2
3
4
V
- ON-STATE VOLTAGE (V)
TM
5
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FODM30XX Rev. 1.0.5
Typical Performance Curves
600V (FODM3052)
(FODM3053)
400V (FODM3022)
(FODM3023)
250V (FODM3011)
(FODM3012)
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current,
RTEST
Vdc
R = 10 kΩ
CTEST
PULSE
INPUT
MERCURY
WETTED
RELAY
then removing the current.The variable R
allows the
TEST
X100
SCOPE
PROBE
dv/dt to be gradually increased until the D.U.T. continues
to trigger in response to the applied voltage pulse, even
after the LED current has been removed. The dv/dt is
D.U.T.
then decreased until the D.U.T. stops triggering. τ is
RC
measured at this point and recorded.
V
= 600 V (FODM3052, FODM3053)
= 400 V (FODM3022, FODM3023)
= 250 V (FODM3011, FODM3012)
max
APPLIED VOLTAGE
WAVEFORM
378 V (FODM3052, FODM3053)
252 V (FOMD3022, FODM3023)
158 V (FODM3011, FODM3012)
0.63 V
378
max
dv/dt =
=
(FODM3053)
(FODM3052)
τ
τ
0 VOLTS
RC
RC
τ
RC
252
=
=
(FODM3023)
(FODM3022)
τ
RC
158
(FODM3011)
(FODM3012)
τ
RC
NOTE: This optoisolator should not be used to drive a load directly. It is
intended to be a trigger device only.
Figure 8. Static dv/dt Test Circuit
RL
Rin
180
1
2
4
3
VCC
120 V
60 Hz
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
Figure 9. Resistive Load
ZL
Rin
180
2.4k
1
2
4
3
VCC
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
120 V
60 Hz
C1
0.1 µF
Figure 10. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
6
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FODM30XX Rev. 1.0.5
Rin
360
470
1
2
4
3
HOT
VCC
FODM3022
FODM3023
FODM3052
FODM3053
39
0.05 µF
240
VAC
0.01 µF
LOAD
GROUND
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.
The 39Ω resistor and 0.01µF capacitor are for snubbing of the triac, and the 470Ω resistor and 0.05µF capacitor are for
snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.
Figure 11.Typical Application Circuit
7
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FODM30XX Rev. 1.0.5
Ordering Information
Option
V_NF098
Description
VDE Approved
R1_NF098
R2_NF098
R1V_NF098
R2V_NF098
Tape and Reel (500 units)
Tape and Reel (2500 units)
Tape and Reel (500 units) and VDE Approved
Tape and Reel (2500 units) and VDE Approved
Note:
To specify the new construction version with 260°C max reflow peak temperature rating: Add "NF098" to the end of the
part number. The non NF098 version is rated for 230°C peak reflow temperature.
Marking Information
1
2
3011
6
V X YY R
3
4
5
Definitions
1
2
3
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
5
6
One digit year code
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
8
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FODM30XX Rev. 1.0.5
Tape and Reel Information
P
2
D0
P0
t
K0
E
A0
W
W1
B0
F
d
D1
P
2.54 Pitch
Description
Tape Width
Symbol
Dimensions
12.00 0.3
0.30 0.05
4.00 0.1
1.50 0.1
1.75 0.1
5.50 0.1
2.00 0.1
8.00 0.1
3.90 0.1
7.45 0.1
2.45 0.1
1.50 0.1
9.30 0.1
0.062 0.02
W
t
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Dia.
Sprocket Hole Location
P0
D0
E
Pocket Location
F
P2
P
Pocket Pitch
Pocket Dimension
A0
B0
K0
D1
W1
d
Pocket Hole Dia.
Cover Tape Width
Cover Tape Thickness
Max. Component Rotation or Tilt
20˚ max
R1
R2
R1
R2
Devices Per Reel
Reel Diameter
500
2500
178 mm (7")
330 mm (13")
9
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FODM30XX Rev. 1.0.5
Footprint Drawing for PCB Layout
0.80
1.00
6.50
2.54
Note:
All dimensions are in mm.
Recommended Infrared Reflow Soldering Profile
• Peak reflow temperature: 260°C (package surface temperature)
• Time of temperature higher than 245°C: 40 seconds or less
• Number of reflows: 3
10s
300
250
200
150
100
50
260°C
245°C
40s
0
0
50
100
150
200
250
300
Time (s)
10
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FODM30XX Rev. 1.0.5
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
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POWEREDGE®
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TinyWire™
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ISOPLANAR™
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MICROCOUPLER™
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EcoSPARK®
FACT Quiet Series™
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QT Optoelectronics™
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RapidConfigure™
SMART START™
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
First Production
Full Production
Not In Production
Preliminary
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Obsolete
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I29
11
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FODM30XX Rev. 1.0.5
相关型号：
FODM3012R2
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
FAIRCHILD
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