FODM3051R4 [FAIRCHILD]
Triac Output Optocoupler, 1-Element, 3750V Isolation, MINIFLAT-4;![FODM3051R4](http://pdffile.icpdf.com/pdf2/p00222/img/icpdf/FODM3051R4_1295640_icpdf.jpg)
型号: | FODM3051R4 |
厂家: | ![]() |
描述: | Triac Output Optocoupler, 1-Element, 3750V Isolation, MINIFLAT-4 三端双向交流开关 输出元件 光电 |
文件: | 总8页 (文件大小:77K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
DESCRIPTION
The FODM305X series consists of a galium arsenide diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat
package. The lead pitch is 2.54 mm. The FODM305X series isolates low voltage logic from 115 and 240 Vac lines to provide
random phase control of high current triacs or thyristors. It also features greatly enhanced static dv/dt capability to ensure stable
switching performance of inductive loads.
FEATURES
PACKAGE DIMENSIONS
•
Compact 4-pin surface mount package
(2.4 mm maximum standoff height)
Peak blocking voltage – 600V
Guaranteed static dv/dt of 1000 V/µs
Available in tape and reel quantities of
500 and 2500.
PIN 1
0.026 (0.66)
•
•
•
0.100 (2.54) TYP
•
Applicable to Infrared Ray reflow
(230°C max, 30 seconds.)
0.020 (0.51)
0.012 (0.30)
0.287 (7.29)
0.248 (6.30)
•
•
BSI, CSA and VDE certifications pending
UL (File# E90700) certified
0.173 (4.40)
TYP
0.169 (4.29)
0.154 (3.91)
APPLICATIONS
•
•
Solenoid/valve controls
Interfacing microprocessors to
115 and 240 Vac peripherals
Temperature controls
Solid state relays
Lamp ballast
Static AC power switch
Motor control
0.094 (2.39)
0.079 (2.01)
0.008 (0.20)
0.000 (0.0)
•
•
•
•
•
•
0.035 (0.89)
0.012 (0.30)
MAIN
TERMINAL
0.033 (0.85)
0.026 (0.65)
1
2
4
3
ANODE
MAIN
TERMINAL
CATHODE
NOTE
All dimensions are in inches (millimeters)
Incandescent lamp dimmers
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise specified)
A
Parameter
Symbol
Value
Units
TOTAL PACKAGE
Storage Temperature
T
-40 to +125
125
°C
°C
°C
STG
T
Junction Temperature
J
T
Operating Temperature
-40 to +85
OPR
EMITTER
I
Continuous Forward Current
Peak Forward Current (1 µs pulse, 300 pps.)
60
1
mA
A
F (avg)
I
F (pk)
V
Reverse Input Voltage
3
V
R
Power Dissipation
P
100
mW
D
(No derating required over operating temp. range)
DETECTOR
I
70
mA (RMS)
T(RMS)
On-State RMS Current
V
Off-State Output Terminal Voltage
Power Dissipation
600
250
V
DRM
P
mW
D
(No derating required over operating temp. range)
© 2003 Fairchild Semiconductor Corporation
Page 1 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specified)
A
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol Device
Min
Typ*
Max
Unit
EMITTER
I = 10 mA
V
I
Input Forward Voltage
All
All
1.20
0.01
1.5
V
F
F
V = 3 V
Reverse Leakage Current
DETECTOR
100
µA
R
R
V
= 600V, I = 0 (note 1)
I
DRM
Peak Blocking Current Either Direction
Peak On-State Voltage Either Direction
Critical Rate of Rise of Off-State Voltage
All
All
All
3
100
2.5
nA
V
DRM
F
I
= 100mA peak
V
2.0
TM
TM
I = 0 (Figure 8, note 2)
dV/dt
1000
V/µs
F
TRANSFER CHARACTERISTICS (T = 25°C Unless otherwise specified)
A
DC Characteristics
Test Conditions
Symbol
Device
Min
Typ*
Max
Unit
FODM3051
FODM3052
FODM3053
15
10
5
Main Terminal
Voltage = 3V (note 3)
I
LED Trigger Current
mA
FT
Holding Current, Either Direc-
tion
I
All
300
µA
H
ISOLATION CHARACTERISTICS (T = 25°C Unless otherwise specified)
A
Characteristic
Test Conditions
Symbol
Device
Min
Typ*
Max
Unit
V
Steady State Isolation Voltage
t = 1 Minute
All
3750
V(RMS)
ISO
* All typicals at T = 25°C
A
Note
1. Test voltage must be applied within dv/dt rating.
2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only.
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating I lies
F
FT
F
between max I (15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max I (60 mA).
FT
F
© 2003 Fairchild Semiconductor Corporation
Page 2 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
TYPICAL PERFORMANCE CURVES
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Leakage Current vs. Ambient Temperature
1000
100
10
1.7
VDRM = 600V
1.6
1.5
1.4
1.3
T
= -40°C
A
1.2
1.1
1.0
0.9
T
= 25°C
= 85°C
A
1
T
A
0.1
-40
-20
0
20
40
60
80
100
1
10
100
T
- AMBIENT TEMPERATURE (°C)
I
- FORWARD CURRENT (mA)
A
F
Fig. 3 Holding Current vs. Ambient Temperature
Fig. 4 Trigger Current vs. Ambient Temperature
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
5
V
= 3V
TM
NORMALIZED TO T = 25°C
NORMALIZED TO T = 25°C
A
A
2
1.0
0.5
0.2
0.1
-40
-20
0
20
40
60
80
100
100
-40
-20
T
- AMBIENT TEMPERATURE (°C)
A
T
- AMBIENT TEMPERATURE (°C)
A
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width
Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature
12
10
8
1.4
T
=25°C
NORMALIZED TO T = 25°C
A
A
NORMALIZED TO PW >> 100µs
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
IN
6
4
2
0
20
40
60
80
100
-40
-20
0
1
10
100
T
- AMBIENT TEMPERATURE (°C)
A
PW - LED TRIGGER PULSE WIDTH (µs)
IN
© 2003 Fairchild Semiconductor Corporation
Page 3 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
Fig. 7 On-State Characteristics
800
600
400
200
0
T
= 25°C
A
-200
-400
-600
-800
-6
-4
-2
V
0
2
4
6
- ON-STATE VOLTAGE (V)
TM
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
400V
Vdc
RTEST
R = 10 kΩ
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
CTEST
removing the current. The variable R
allows the dv/dt to
TEST
PULSE
INPUT
be gradually increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
MERCURY
WETTED
RELAY
X100
SCOPE
PROBE
D.U.T.
the D.U.T. stops triggering. τ is measured at this point and
RC
recorded.
V
= 400 V
max
APPLIED VOLTAGE
WAVEFORM
252 V
0.63 V
252
max
dv/dt =
=
τ
τ
0 VOLTS
RC
RC
τ
RC
Figure 8. Static dv/dt Test Circuit
© 2003 Fairchild Semiconductor Corporation
Page 4 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
ORDERING INFORMATION
Option
Description
V
VDE Approved
R1
Tape and Reel (500 units)
Tape and Reel (2500 units)
R2
R3
Tape and Reel (500 units; unit 180° rotated)
Tape and Reel (2500 units; unit 180° rotated)
R4
R1V
R2V
R3V
R4V
Tape and Reel (500 units) and VDE Approved
Tape and Reel (2500 units) and VDE Approved
Tape and Reel (500 units; unit 180° rotated) and VDE Approved
Tape and Reel (2500 units; unit 180° rotated) and VDE Approved
MARKING INFORMATION
1
2
3051
6
V X YY M
3
4
5
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
© 2003 Fairchild Semiconductor Corporation
Page 5 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
P
2
D0
P
0
t
K0
E
A0
W
W
1
B0
F
d
D1
P
2.54 Pitch
Description
Symbol
Dimensions (mm)
12.00±0.4
0.30±0.20
4.00±0.20
1.55±0.20
1.75±0.20
5.50±0.20
2.00±0.20
8.00±0.20
4.40±0.20
7.30±0.20
2.30±0.20
1.55±0.20
9.20
Tape Width
W
t
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Dia.
P
0
D
0
Sprocket Hole Location
Pocket Location
E
F
P
2
Pocket Pitch
P
Pocket Dimension
A0
B0
K0
D1
Pocket Hole Dia.
Cover Tape Width
Cover Tape Thickness
W
1
d
0.065±0.02
Max. Component Rotation or Tilt
20˚ max
R1
R2
R1
R2
Devices Per Reel
500
2500
Reel Diameter
178 mm (7")
330 mm (13")
© 2003 Fairchild Semiconductor Corporation
Page 6 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.190 (4.83)
0.310 (7.87)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
(heating)
to 30 s
230°C (peak temperature)
210°C
180°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 7 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
© 2003 Fairchild Semiconductor Corporation
Page 8 of 8
11/10/03
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