FODM3083V [FAIRCHILD]

Triac Output Optocoupler, 1-Element, 3750V Isolation, MINIFLAT-4;
FODM3083V
型号: FODM3083V
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Triac Output Optocoupler, 1-Element, 3750V Isolation, MINIFLAT-4

驱动器 可控硅 光电 三端双向交流开关 输出元件 PC
文件: 总10页 (文件大小:99K)
中文:  中文翻译
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March 2007  
FODM3062/FODM3063/FODM3082/FODM3083  
4-Pin Full Pitch Mini-Flat Package Zero-Cross Triac  
Driver Output Optocouplers  
Features  
Description  
dv/dt of 600V/µs guaranteed  
The FODM306X and FODM308X series consist of an  
infrared emitting diode optically coupled to a monolithic  
silicon detector performing the function of a zero voltage  
crossing bilateral triac driver, and is housed in a compact  
4-pin mini-flat package. The lead pitch is 2.54mm. They  
are designed for use with a triac in the interface of logic  
systems to equipment powered from 115/240 VAC lines,  
such as solid state relays, industrial controls, motors,  
solenoids and consumer appliances.  
Compact 4-pin surface mount package  
(2.4mm maximum standoff height)  
Zero voltage crossing  
Peak blocking voltage: 600V (FODM306X)  
800V (FODM308X)  
Available in tape and reel quantities of 500 and 2500.  
C-UL, UL and VDE certifications pending  
Applications  
Solenoid/valve controls  
Lighting controls  
Static power switches  
AC motor drives  
Temperature controls  
E.M. contactors  
AC motor starters  
Solid state relays  
Package Dimensions  
4.40 0.20  
ANODE 1  
4
3
MAIN TERM.  
MAIN TERM.  
2.54 0.25  
ZERO  
CROSSING  
CIRCUIT  
CATHODE  
2
3.60 0.30  
5.30 0.30  
2.00 0.20  
0.20 0.05  
0.10 0.10  
+0.2  
–0.7  
0.40 0.10  
7.00  
Note:  
All dimensions are in millimeters.  
©2006 Fairchild Semiconductor Corporation  
FODM306X/FODM308X Rev. 1.0.4  
1
www.fairchildsemi.com  
Absolute Maximum Ratings (T = 25°C unless otherwise specified)  
A
Symbol  
Parameter  
Rating  
Units  
TOTAL PACKAGE  
T
Storage Temperature  
Operating Temperature  
-55 to +150  
-40 to +100  
°C  
°C  
STG  
T
OPR  
EMITTER  
I
Continuous Forward Current  
60  
1
mA  
A
F (avg)  
I
Peak Forward Current (1µs pulse, 300pps.)  
Reverse Input Voltage  
F (pk)  
V
P
6
V
R
Power Dissipation (No derating required over operating temp. range)  
100  
mW  
D
DETECTOR  
I
On-State RMS Current  
70  
mA (RMS)  
V
T(RMS)  
V
Off-State Output Terminal Voltage  
FODM3062/FODM3063  
FODM3082/FODM3083  
600  
800  
300  
DRM  
P
Power Dissipation (No derating required over operating temp. range)  
mW  
D
2
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Electrical Characteristics (T = 25°C)  
A
Individual Component Characteristics  
Symbol  
EMITTER  
Parameter  
Test Conditions  
Min.  
Typ.*  
Max.  
Units  
V
Input Forward Voltage  
I = 30mA  
1.5  
V
F
F
I
Reverse Leakage Current  
V = 6V  
100  
µA  
R
R
DETECTOR  
(1)  
I
Peak Blocking Current,  
Either Direction  
500  
nA  
DRM1  
Rated V  
, I = 0  
DRM  
F
(2)  
dV/dt  
Critical Rate of Rise of  
Off-State Voltage  
600  
V/µs  
I = 0 (Figure 1)  
F
Transfer Characteristics  
Symbol DC Characteristics  
Test Conditions  
Device  
Min.  
Typ.*  
Max.  
Units  
I
LED Trigger Current  
Main Terminal  
FODM3062  
FODM3082  
FODM3063  
FODM3083  
All  
10  
mA  
FT  
(3)  
Voltage = 3V  
5
3
I
Holding Current,  
Either Direction  
300  
µA  
V
H
V
Peak On-StateVoltage, I = Rated I ,  
All  
TM  
F
FT  
Either Direction  
I
= 100mA peak  
TM  
Zero Crossing Characteristics  
Symbol  
Characteristics  
Test Conditions  
Device  
Min.  
Typ.*  
Max.  
Units  
V
Inhibit Voltage,  
I = Rated I  
FT  
All  
20  
V
IH  
F
MT1-MT2 Voltage  
above which device  
will not trigger  
IDRM2 Leakage in Inhibit  
State  
I = Rated I ,  
All  
500  
µA  
F
FT  
Rated VDRM,  
Off-State  
Isolation Characteristics  
Characteristics  
Test Conditions Symbol  
Device  
Min.  
Typ.*  
Max.  
Units  
Steady State Isolation (1 Minute)  
V
All  
3750  
VRMS  
ISO  
(4)  
R.H. = 40% to 60%  
Voltage  
Notes:  
* All typicals at 25°C.  
1. Test voltage must be applied within dv/dt rating.  
2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only.  
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating  
F
FT  
I lies between max I (10mA for FODM3062/82, 5mA for FODM3063/83) and absolute max I (60 mA).  
F
FT  
F
4. Steady state isolation voltage, V , is an internal device dielectric breakdown rating. For this test, pins 1 & 2 are  
ISO  
common, and pins 3 & 4 are common.  
3
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Typical Performance Curves  
Fig. 1 LED Forward Voltage vs. Forward Current  
Fig. 2 Leakage Current vs. Ambient Temperature  
1000  
100  
10  
1.8  
VDRM = 600V  
1.7  
1.6  
1.5  
1.4  
T
= -40°C  
A
1.3  
1.2  
1.1  
1.0  
0.9  
T
= 25°C  
A
1
T
= 100°C  
A
0.1  
-40  
-20  
0
20  
40  
60  
80  
100  
1
10  
- FORWARD CURRENT (mA)  
100  
T
- AMBIENT TEMPERATURE (°C)  
I
A
F
Fig. 3 Holding Current vs. Ambient Temperature  
Fig. 4 Trigger Current vs. Ambient Temperature  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.8  
10  
1.0  
0.1  
V
= 3V  
TM  
NORMALIZED TO T = 25°C  
NORMALIZED TO T = 25°C  
A
A
-40  
-20  
0
20  
40  
60  
80  
100  
100  
-40  
-20  
0
20  
40  
60  
80  
T
- AMBIENT TEMPERATURE (°C)  
A
T
- AMBIENT TEMPERATURE (°C)  
A
4
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Typical Performance Curves  
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width  
Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature  
12  
1.4  
T
=T25°C  
A
NORMALIZED TO T = 25°C  
A
NORMALIZED TO PW >> 100µs  
IN  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
10  
8
6
4
2
0
20  
40  
60  
80  
100  
-40  
-20  
0
1
10  
100  
T
- AMBIENT TEMPERATURE (°C)  
A
PW - LED TRIGGER PULSE WIDTH (°C)  
IN  
Fig. 7 On-State Characteristics  
800  
600  
400  
200  
0
T
A
= 25°C  
-200  
-400  
-600  
-800  
-4  
-3  
-2  
-1  
0
1
2
3
4
V
- ON-STATE VOLTAGE (V)  
TM  
5
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Typical Performance Curves  
1. The mercury wetted relay provides a high speed repeated  
pulse to the D.U.T.  
2. 100x scope probes are used, to allow high speeds and  
voltages.  
3. The worst-case condition for static dv/dt is established by  
triggering the D.U.T. with a normal LED input current, then  
removing the current. The variable RTEST allows the dv/dt  
to be gradually increased until the D.U.T. continues to trigger  
in response to the applied voltage pulse, even after the LED  
current has been removed. The dv/dt is then decreased until  
the D.U.T. stops triggering. tRC is measured at this point  
and recorded.  
RTEST  
Vdc  
800V (FODM3082)  
(FODM3083)  
600V (FODM3062)  
(FODM3063)  
R = 10 k  
CTEST  
PULSE  
INPUT  
MERCURY  
WETTED  
RELAY  
X100  
SCOPE  
PROBE  
D.U.T.  
V
= 800V (FODM3082, FODM3083)  
= 600V (FODM3062, FODM3063)  
max  
APPLIED VOLTAGE  
WAVEFORM  
378V (FODM3062, FODM3063)  
504V (FODM3082, FODM3083)  
0.63 V  
378  
max  
dv/dt =  
=
=
(FODM3062, FODM3063)  
(FODM3082, FODM3083)  
τ
τ
0 VOLTS  
RC  
RC  
τ
RC  
504  
Note:  
τ
RC  
This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.  
Figure 8. Static dv/dt Test Circuit  
Typical circuit for use when hot line switching of 240VAC  
is required. In this circuit the “hot” side of the line is  
switched and the load connected to the cold or neutral  
side. The load may be connected to either the neutral or  
hot line.  
Rin  
360 Ω  
1
2
4
3
HOT  
VCC  
FODM3062  
FODM3063  
FODM3082  
FODM3083  
39*  
Rin is calculated so that IF is equal to the rated IFT of the  
part, 5mA for the FODM3063/83 and 10mA for the  
FODM3062/82. The 39resistor and 0.01µF capacitor are  
for snubbing of the triac and may or may not be necessary  
depending upon the particular triac and load used.  
240 VAC  
0.01  
330  
LOAD  
For highly inductive loads (power factor < 0.5), change this value to 360 ohms.  
NEUTRAL  
*
Figure 9. Hot-Line Switching Application Circuit  
240 VAC  
R1  
D1  
Suggested method of firing two, back-to-back  
SCR’s, with a Fairchild triac driver. Diodes can  
be 1N4001; resistors, R1 and R2, are optional  
330 ohms.  
1
2
4
3
VCC  
FODM3062  
FODM3063  
FODM3082  
FODM3083  
SCR  
SCR  
Rin  
360 Ω  
R2  
D2  
LOAD  
Note:  
This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.  
Figure 10. Inverse-Parallel SCR Driver Circuit (240VAC)  
6
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Ordering Information  
Option  
Description  
No option  
V
Bulk (100 units/tube)  
VDE Approved  
R1  
Tape and Reel (500 units)  
R2  
Tape and Reel (2500 units)  
R1V  
R2V  
Tape and Reel (500 units) and VDE Approved  
Tape and Reel (2500 units) and VDE Approved  
Marking Information  
1
2
3063  
V X YY R  
6
3
4
5
Definitions  
1
2
3
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option – See order entry table)  
4
5
6
One digit year code  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
7
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Tape and Reel Information  
P
2
D0  
P0  
t
K0  
E
A0  
W
W1  
B0  
F
d
D1  
P
2.54 Pitch  
Description  
Tape Width  
Symbol  
Dimensions  
12.00 0.3  
0.30 0.05  
4.00 0.1  
1.50 0.1  
1.75 0.1  
5.50 0.1  
2.00 0.1  
8.00 0.1  
3.90 0.1  
7.45 0.1  
2.45 0.1  
1.50 0.1  
9.30 0.1  
0.062 0.02  
W
t
Tape Thickness  
Sprocket Hole Pitch  
Sprocket Hole Dia.  
Sprocket Hole Location  
P0  
D0  
E
Pocket Location  
F
P2  
P
Pocket Pitch  
Pocket Dimension  
A0  
B0  
K0  
D1  
W1  
d
Pocket Hole Dia.  
Cover Tape Width  
Cover Tape Thickness  
Max. Component Rotation or Tilt  
20˚ max  
R1  
R2  
R1  
R2  
Devices Per Reel  
Reel Diameter  
500  
2500  
178 mm (7")  
330 mm (13")  
8
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
Footprint Drawing for PCB Layout  
0.80  
1.00  
6.50  
2.54  
Note:  
All dimensions are in mm.  
Recommended Infrared Relow Soldering Profile  
• Peak reflow temperature: 260°C (package surface temperature)  
• Time of temperature higher than 245°C: 40 seconds or less  
• Number of reflows: 3  
10s  
300  
250  
200  
150  
100  
50  
260°C  
245°C  
40s  
0
0
50  
100  
150  
200  
250  
300  
Time (s)  
9
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an  
exhaustive list of all such trademarks.  
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QFET®  
QS¥  
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ScalarPump¥  
SMART START¥  
SPM®  
STEALTH™  
SuperFET¥  
SuperSOT¥-3  
SuperSOT¥-6  
SuperSOT¥-8  
SyncFET™  
Across the board. Around the world.¥  
ActiveArray¥  
Bottomless¥  
Build it Now¥  
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IntelliMAX¥  
ISOPLANAR¥  
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DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE  
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER  
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S  
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,  
which, (a) are intended for surgical implant into the body or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury of the user.  
device, or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In Design  
This datasheet contains the design specifications for product  
development. Specifications may change in any manner without notice.  
Preliminary  
First Production  
Full Production  
Not In Production  
This datasheet contains preliminary data; supplementary data will be  
published at a later date. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve design.  
No Identification Needed  
Obsolete  
This datasheet contains final specifications. Fairchild Semiconductor  
reserves the right to make changes at any time without notice to improve  
design.  
This datasheet contains specifications on a product that has been  
discontinued by Fairchild Semiconductor. The datasheet is printed for  
reference information only.  
Rev. I24  
10  
www.fairchildsemi.com  
FODM306X/FODM308X Rev. 1.0.4  

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