FPF1038 [FAIRCHILD]
Low On-Resistance, Slew-Rate-Controlled Load Switch; 低导通电阻，摆率控制的负荷开关
| 型号： | FPF1038 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Low On-Resistance, Slew-Rate-Controlled Load Switch |
| 文件： | 总3页 (文件大小：622K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
September 2012
FPF1038
Low On-Resistance, Slew-Rate-Controlled Load Switch
Features
Description
.
.
1.2 V to 5.5 V Input Voltage Operating Range
Typical RON
The FPF1038 advanced load-management switch target
applications requiring a highly integrated solution for
disconnecting loads powered from DC power rail (<6 V)
with stringent shutdown current targets and high load
capacitances (up to 200 µF). The FPF1038 consists of
slew-rate controlled low-impedance MOSFET switch
(21 mΩ typical) and other integrated analog features.
The slew-rate controlled turn-on characteristic prevents
inrush current and the resulting excessive voltage droop
on power rails.
:
−
−
−
−
20 mΩ at VIN=5.5 V
21 mΩ at VIN=4.5 V
37 mΩ at VIN=1.8 V
75 mΩ at VIN=1.2 V
.
.
.
.
.
Slew Rate / Inrush Control with tR: 2.7 ms (Typical)
3 A Maximum Continuous Current Capability
Low <1 µA Shutdown Current
These devices have exceptionally low shutdown current
drain (<1 µA maximum) that facilitates compliance in
low standby power applications. The input voltage range
operates from 1.2 V to 5.5 V DC to support a wide range
of applications in consumer, optical, medical, storage,
portable, and industrial device power management.
ESD Protected: Above 8 kV HBM, 1.5 kV CDM
GPIO / CMOS-Compatible Enable Circuitry
Switch control is managed by a logic input (active HIGH)
capable of interfacing directly with low-voltage control
signal / GPIO with no external pull-up required. The
device is packaged in advanced fully “green” 1mm
x1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP);
providing excellent thermal conductivity, small footprint,
and low electrical resistance for wider application usage.
Applications
.
.
.
.
.
.
.
HDD, Storage, and Solid-State Memory Devices
Portable Media Devices, UMPC, Tablets, MIDs
Wireless LAN Cards and Modules
SLR Digital Cameras
Portable Medical Devices
GPS and Navigation Equipment
Industrial Handheld and Enterprise Equipment
Ordering Information
Switch RON
(Typical)
at 4.5 VIN
Top
Mark
Input
Output
ON Pin
Part Number
tR
Package
Buffer Discharge Activity
Active
HIGH
6-Bump, WLCSP, 1.0 mm
x 1.5 mm, 0.5 mm Pitch
FPF1038UCX
QE
21 mΩ
CMOS
NA
2.7 ms
© 2010 Fairchild Semiconductor Corporation
FPF1038 • Rev. 1.0.5
www.fairchildsemi.com
Physical Dimensions
0.03
C
F
(Ø0.250)
Cu Pad
E
A
2X
(Ø0.350)
SOLDER MASK
OPENING
B
D
A1
(1.00)
(0.50)
BALL A1
INDEX AREA
0.03
C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06
C
E
0.332±0.018
0.250±0.025
0.625
0.539
0.05
C
C
D
SEATING PLANE
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
0.005
C A B
Ø0.315 +/- .025
6X
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
0.50
0.50
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
C
1.00
B
A
(Y) ±0.018
F
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
1
2
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
(X) ±0.018
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 30. 6 Ball, 1.0 x 1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP)
Nominal Values
Bump
Pitch
Overall Package
Height
Silicon
Thickness
Solder Bump
Height
Solder Bump
Diameter
0.5 mm
0.582 mm
0.332 mm
0.250 mm
0.315 mm
Product-Specific Dimensions
Product
D
E
X
Y
FPF1038UCX
1.5 mm ±0.03
1.0 mm ±0.03
0.240 mm
0.240 mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FPF1038 • Rev. 1.0.5
www.fairchildsemi.com
11
© 2010 Fairchild Semiconductor Corporation
FPF1038 • Rev. 1.0.5
www.fairchildsemi.com
12
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