FSL126MRT [FAIRCHILD]
Green-Mode Fairchild Power Switch (FPSâ¢); 绿色模式飞兆功率开关( FPSA ?? ¢ )型号: | FSL126MRT |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Green-Mode Fairchild Power Switch (FPSâ¢) |
文件: | 总13页 (文件大小:873K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
May 2012
FSL126MRT
Green-Mode Fairchild Power Switch (FPS™)
Features
Description
The FSL126MRT is an integrated Pulse Width
Modulation (PWM) controller and SenseFET specifically
designed for offline Switch-Mode Power Supplies
(SMPS) with minimal external components. The PWM
controller includes an integrated fixed-frequency
oscillator, Under-Voltage Lockout (UVLO), Leading-
Edge Blanking (LEB), optimized gate driver, internal
soft-start, temperature-compensated precise current
sources for loop compensation, and self-protection
circuitry. Compared with a discrete MOSFET and PWM
controller solution, the FSL126MRT can reduce total
cost, component count, size, and weight; while
simultaneously increasing efficiency, productivity, and
system reliability. This device provides a basic platform
suited for cost-effective design of a flyback converter.
. Internal Avalanched Rugged 650V SenseFET
. Advanced Soft Burst-Mode Operation for Low
Standby Power and Low Audible Noise
. Random Frequency Fluctuation for Low EMI
. Pulse-by-Pulse Current Limit
. Various Protection Functions: Overload Protection
(OLP), Over-Voltage Protection (OVP), Abnormal
Over-Current Protection (AOCP), Internal Thermal
Shutdown (TSD) with Hysteresis and Under-Voltage
Lockout (UVLO) with Hysteresis
. Low Operating Current(0.4mA) in Burst Mode
. Internal Startup Circuit
. Built-in Soft-Start: 15ms
. Auto-Restart Mode
Applications
. Power Supply for STB Home Appliances, and DVD
Combination
Ordering Information
Output Power Table(2)
Operating
Junction
Temperature
Part
Number
CurrentRDS(ON) 230VAC ± 15%(3)
85~265VAC
Package
Replaces Device
Limit (Max.)
Open
Open
Adapter(4)
Adapter(4)
Frame(5)
Frame(5)
TO-220F
6-Lead(1)
W-Forming
-40°C ~
+125°C
FSL126MRT
1.2A
30W
40W
17W
25W KA5M0265RYDTU
6.2Ω
Notes:
1. Pb-free package per JEDEC J-STD-020B.
2. The junction temperature can limit the maximum output power.
3. 230VAC or 100/115VAC with voltage doubler.
4. Typical continuous power in a non-ventilated enclosed adapter measured at 50°C ambient temperature.
5. Maximum practical continuous power in an open-frame design at 50°C ambient temperature.
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
Application Circuit
VO
AC
IN
VSTR
Drain
GND
VCC
FB
Figure 1.
Typical Application Circuit
Internal Block Diagram
VSTR
VCC
Drain
6
3
1
Vburst
0.40V / 0.55V
ICH
Soft Burst
VREF
VCC Good
7.5V / 12V
Random
OSC
VCC
VREF
Soft-Start
2.0µA
IDELAY
90µA
IFB
S
R
Q
Q
PWM
Gate
Driver
FB
4
5
3R
R
LEB (350ns)
NC
2
GND
VAOCP
VSD
7.0V
TSD
S
R
Q
VCC
VCC Good
Q
VOVP
24.5V
Figure 2.
Internal Block Diagram
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
2
Pin Configuration
Figure 3.
Pin Configuration (Top View)
Pin Definitions
Pin #
Name
Drain
GND
Description
1
2
SenseFET Drain. High-voltage power SenseFET drain connection.
Ground. This pin is the control ground and the SenseFET source.
Power Supply. This pin is the positive supply input, which provides the internal operating
current for both startup and steady-state operation.
3
VCC
Feedback. This pin is internally connected to the inverting input of the PWM comparator.
The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor
should be placed between this pin and GND. If the voltage of this pin reaches 7V, the overload
protection triggers, which shuts down the FPS.
4
5
6
FB
NC
No Connection
Startup. This pin is connected directly, or through a resistor, to the high-voltage DC link.
At startup, the internal high-voltage current source supplies internal bias and charges the
external capacitor connected to the VCC pin. Once VCC reaches 12V, the internal current
source (ICH) is disabled.
VSTR
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VSTR
VDS
Parameter
Min.
Max.
650
650
26
Unit
V
VSTR Pin Voltage
Drain Pin Voltage
VCC Pin Voltage
V
VCC
VFB
V
Feedback Pin Voltage
Drain Current Pulsed(6)
-0.3
10.0
8
V
IDM
A
IDS
Continuous Switching Drain Current
Single Pulsed Avalanche Energy(7)
Total Power Dissipation (TC=25°C)(8)
Maximum Junction Temperature
Operating Junction Temperature(9)
Storage Temperature
2
A
EAS
73
mJ
W
°C
°C
°C
PD
50
150
+125
+150
TJ
-40
-55
TSTG
Notes:
6. Repetitive peak switching current when the inductive load is assumed: Limited by maximum duty (DMAX=0.74)
and junction temperature (see Figure 4).
7. L=45mH, starting TJ=25°C.
8. Infinite cooling condition (refer to the SEMI G30-88).
9. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.
Figure 4.
Repetitive Peak Switching Current
ESD Capability
Symbol
Parameter
Value
Unit
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
5
2
ESD
KV
Thermal Impedance
TA=25°C unless otherwise specified.
Symbol
Parameter
Value
63.5
2.9
Unit
°C/W
°C/W
θJA
θJC
Junction-to-Ambient Thermal Impedance(10)
Junction-to-Case Thermal Impedance(11)
Notes:
10. Free standing without heat sink under natural convection condition, per JEDEC 51-2 and 1-10.
11. Infinite cooling condition per Mil Std. 883C method 1012.1.
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSL126MRT • Rev. 1.0.0
4
Electrical Characteristics
TJ = 25°C unless otherwise specified.
Symbol
Parameter
Condition
Min. Typ. Max.
Unit
SenseFET Section
BVDSS
IDSS
Drain-Source Breakdown Voltage
Zero-Gate-Voltage Drain Current
Drain-Source On-State Resistance
Input Capacitance(12)
Output Capacitance(12)
Reverse Transfer Capacitance(12)
Rise Time
650
V
V
CC=0V, ID=250μA
250
VDS=520V, TA=125°C
μA
Ω
RDS(ON)
CISS
COSS
CRSS
tr
VGS=10V, ID=1A
4.9
210
33.3
4.1
6.2
VDS=25V, VGS=0V, f=1MHz
VDS=25V, VGS=0V, f=1MHz
VDS=25V, VGS=0V, f=1MHz
VDS=325V, ID=2A, RG=25Ω
VDS=325V, ID=2A, RG=25Ω
VDS=325V, ID=2A, RG=25Ω
VDS=325V, ID=2A, RG=25Ω
pF
pF
pF
ns
ns
ns
ns
16.4
23
tf
Fall Time
td(on)
td(off)
Turn-On Delay
23
Turn-Off Delay
17.2
Control Section
fS
ΔfS
Switching Frequency(12)
Switching Frequency Variation(12)
VCC=14V, VFB=4V
-25°C < TJ < 125°C
VCC=14V, VFB=4V
VCC=14V, VFB=0V
VFB=0
61
61
67
±5
67
73
±10
73
kHz
%
DMAX
DMIN
IFB
Maximum Duty Ratio
%
Minimum Duty Ratio
0
%
Feedback Source Current
65
11
90
12
7.5
15
115
13
μA
V
VSTART
VSTOP
tS/S
VFB=0V, VCC Sweep
After Turn-on, VFB=0V
VCC Sweep
UVLO Threshold Voltage
Internal Soft-Start Time
7.0
8.0
V
ms
Burst-Mode Section
VBURH
0.46
0.33
0.55
0.40
150
0.66
0.48
V
V
VBURL
Burst-Mode Voltage
VCC=14V, VFB Sweep
Hys
mV
Protection Section
ILIM
VSD
Peak Drain Current Limit
1.05
6.45
1.2
1.20
7.00
2.0
1.34
7.55
2.8
A
V
di/dt=300mA/μs
Shutdown Feedback Voltage
Shutdown Delay Current
Leading-Edge Blanking Time(12,14)
VCC=14V, VFB Sweep
VCC=14V, VFB=4V
IDELAY
tLEB
μA
ns
V
350
24.5
140
60
VOVP
TSD
Over-Voltage Protection
VCC Sweep
23.0
130
26.0
150
Shutdown Temperature
Hysteresis
°C
°C
Thermal Shutdown Temperature(12)
Hys
Continued on the following page…
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
5
Electrical Characteristics (Continued)
TJ = 25°C unless otherwise specified.
Symbol
Parameter
Condition
Min.
Typ. Max.
Unit
Total Device Section
Operating Supply Current,
(Control Part in Burst Mode)
IOP
IOPS
V
CC=14V, VFB=0V
0.3
0.4
1.00
120
0.5
mA
mA
μA
Operating Switching Current,
(Control Part and SenseFET Part)
VCC=14V, VFB=2V
1.35
VCC=11V (Before VCC
Reaches VSTART
ISTART
Start Current
85
155
1.3
)
ICH
Startup Charging Current
VCC=VFB=0V, VSTR=40V
VCC=VFB=0V, VSTR Sweep
0.7
1.0
26
mA
V
VSTR
Minimum VSTR Supply Voltage
Notes:
12. Although these parameters are guaranteed, they are not 100% tested in production.
13. Average value.
14. tLEB includes gate turn-on time.
Comparison of KA5M0265R and FSL126MRT
Function
KA5M0265RYDTU
FSL126MRT
Built-in
Advantages of FSL126MRT
Random Frequency
Fluctuation
N/A
7mA
N/A
Low EMI
Operating Current
0.4mA
Very low stand-by power
High-Voltage
Startup Circuit
Built-in
OLP
OVP
OLP
OVP
TSD
Protections
Enhanced protections and high reliability
AOCP
TSD with Hysteresis
The difference of input power between the
low and high input voltage is quite small.
Power Balance
Long tCLD
Very Short tCLD
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
6
Typical Performance Characteristics
Characteristic graphs are normalized at TA=25°C.
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C
0.60
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 12
Temperature [ °C]
Figure 5.
Operating Supply Current (IOP) vs. TA
Figure 6.
Operating Switching Current (IOPS) vs. TA
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 12
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 12
Figure 7.
Startup Charging Current (ICH) vs. TA
Figure 8.
Peak Drain Current Limit (ILIM) vs. TA
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 12
Temperature [ °C]
Figure 9.
Feedback Source Current (IFB) vs. TA
Figure 10. Shutdown Delay Current (IDELAY) vs. TA
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
7
Typical Performance Characteristics
Characteristic graphs are normalized at TA=25°C.
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
0.60
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125
Figure 11. UVLO Threshold Voltage (VSTART) vs. TA
Figure 12. UVLO Threshold Voltage (VSTOP) vs. TA
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
0.60
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 12
Figure 13. Shutdown Feedback Voltage (VSD) vs. TA
Figure 14. Over-Voltage Protection (VOVP) vs. TA
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
0.60
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125
-40'C -20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125
Figure 15. Switching Frequency (fS) vs. TA
Figure 16. Maximum Duty Ratio (DMAX) vs. TA
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSL126MRT • Rev. 1.0.0
8
Functional Description
1. Startup: At startup, an internal high-voltage current
source supplies the internal bias and charges the
external capacitor (CVCC) connected to the VCC pin, as
illustrated in Figure 17. When VCC reaches 12V, the
FSL126MRT begins switching and the internal high-
voltage current source is disabled. Normal switching
operation continues and the power is supplied from the
auxiliary transformer winding unless VCC goes below the
stop voltage of 7.5V.
3. Feedback Control: This device employs Current-
Mode control, as shown in Figure 18. An opto-coupler
(such as the FOD817) and shunt regulator (such as the
KA431) are typically used to implement the feedback
network. Comparing the feedback voltage with the
voltage across the RSENSE resistor makes it possible to
control the switching duty cycle. When the reference pin
voltage of the shunt regulator exceeds the internal
reference voltage of 2.5V, the opto-coupler LED current
increases, pulling down the feedback voltage and
reducing drain current. This typically occurs when the
input voltage is increased or the output load is decreased.
3.1 Pulse-by-Pulse Current Limit: Because Current-
Mode control is employed, the peak current through
the SenseFET is limited by the inverting input of PWM
comparator (VFB*), as shown in Figure 18. Assuming
that the 90μA current source flows only through the
internal resistor (3R + R =27kꢀ), the cathode voltage
of diode D2 is about 2.4V. Since D1 is blocked when
the feedback voltage (VFB) exceeds 2.4V, the
maximum voltage of the cathode of D2 is clamped at
this voltage. Therefore, the peak value of the current
through the SenseFET is limited.
3.2 Leading-Edge Blanking (LEB): At the instant the
internal SenseFET is turned on, a high-current spike
usually occurs through the SenseFET, caused by
primary-side capacitance and secondary-side rectifier
reverse recovery. Excessive voltage across the
Figure 17. Startup Block
2. Soft-Start: The internal soft-start circuit increases
PWM comparator inverting input voltage, together with
the SenseFET current, slowly after startup. The typical
soft-start time is 15ms. The pulse width to the power
switching device is progressively increased to establish
the correct working conditions for the transformers,
inductors, and capacitors. The voltage on the output
capacitors is progressively increased to smoothly
establish the required output voltage. This helps prevent
transformer saturation and reduces stress on the
secondary diode during startup.
RSENSE resistor leads to incorrect feedback operation
in the Current-Mode PWM control. To counter this
effect, the leading-edge blanking (LEB) circuit inhibits
the PWM comparator for tLEB (350ns) after the
SenseFET is turned on.
Figure 18. Pulse Width Modulation Circuit
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
9
increasing until it reaches 7.0V, when the switching
operation is terminated, as shown in Figure 20. The
delay for shutdown is the time required to charge CFB
from 2.4V to 7.0V with 2.0µA. This protection is
implemented in Auto-Restart Mode.
4. Protection Circuits: The FSL126MRT has several
self-protective functions, such as Overload Protection
(OLP), Abnormal Over-Current Protection (AOCP),
Over-Voltage Protection (OVP), and Thermal Shutdown
(TSD). All the protections are implemented as auto-
restart. Once the fault condition is detected, switching is
terminated and the SenseFET remains off. This causes
VCC to fall. When VCC falls to the Under-Voltage Lockout
(UVLO) stop voltage of 7.5V, the protection is reset and
the startup circuit charges the VCC capacitor. When VCC
reaches the start voltage of 12.0V, the FSL126MRT
resumes normal operation. If the fault condition is not
removed, the SenseFET remains off and VCC drops to
stop voltage again. In this manner, the auto-restart can
alternately enable and disable the switching of the
power SenseFET until the fault condition is eliminated.
Because these protection circuits are fully integrated
into the IC without external components, reliability is
improved without increasing cost.
Fault
occurs
Fault
removed
Power
on
VDS
Figure 20. Overload Protection
4.2 Abnormal Over-Current Protection (AOCP):
When the secondary rectifier diodes or the
transformer pins are shorted, a steep current with
extremely high di/dt can flow through the SenseFET
during the minimum turn-on time. Even though the
FSL126MRT has overload protection, it is not enough
to protect in that abnormal case; due to the severe
current stress imposed on the SenseFET until OLP is
triggered. The internal AOCP circuit is shown in
Figure 21. When the gate turn-on signal is applied to
the power SenseFET, the AOCP block is enabled and
monitors the current through the sensing resistor. The
voltage across the resistor is compared with a preset
AOCP level. If the sensing resistor voltage is greater
than the AOCP level, the set signal is applied to the
S-R latch, resulting in the shutdown of the SMPS.
VCC
12.0V
7.5V
t
Normal
operation
Fault
situation
Normal
operation
Figure 19. Auto-Restart Protection Waveforms
4.1 Overload Protection (OLP): Overload is defined
as the load current exceeding its normal level due to
an unexpected abnormal event. In this situation, the
protection circuit should trigger to protect the SMPS.
However, even when the SMPS is in normal
operation, the overload protection circuit can be
triggered during the load transition. To avoid this
undesired operation, the overload protection circuit is
designed to trigger only after a specified time to
determine whether it is a transient situation or a true
overload situation. Because of the pulse-by-pulse
current-limit capability, the maximum peak current
through the SenseFET is limited and, therefore, the
maximum input power is restricted with a given input
voltage. If the output consumes more than this
maximum power, the output voltage (VOUT) decreases
below the set voltage. This reduces the current
through the opto-coupler LED, which also reduces the
opto-coupler transistor current, increasing the
feedback voltage (VFB). If VFB exceeds 2.4V, D1 is
blocked and the 2.0µA current source starts to charge
CFB slowly up. In this condition, VFB continues
Figure 21. Abnormal Over-Current Protection
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
10
4.4 Over-Voltage Protection (OVP): If the
secondary-side feedback circuit malfunctions or a
solder defect causes an opening in the feedback path,
the current through the opto-coupler transistor
becomes almost zero. Then VFB climbs up in a similar
manner to the overload situation, forcing the preset
maximum current to be supplied to the SMPS until the
overload protection is triggered. Because more energy
than required is provided to the output, the output
voltage may exceed the rated voltage before the
overload protection is triggered, resulting in the
breakdown of the devices in the secondary side. To
prevent this situation, an OVP circuit is employed. In
general, the VCC is proportional to the output voltage
and the FS136MRT uses VCC instead of directly
monitoring the output voltage. If VCC exceeds 24.5V,
an OVP circuit is triggered, resulting in the termination
of the switching operation. To avoid undesired
activation of OVP during normal operation, VCC should
be designed to be below 24.5V.
6. Random Frequency Fluctuation (RFF): Fluctuating
switching frequency of an SMPS can reduce EMI by
spreading the energy over a wide frequency range. The
amount of EMI reduction is directly related to the
switching frequency variation, which is limited internally.
The switching frequency is determined randomly by
external feedback voltage and an internal free-running
oscillator at every switching instant. This random
frequency fluctuation scatters the EMI noise around
typical switching frequency (67kHz) effectively and can
reduce the cost of the input filter included to meet the
EMI requirements (e.g. EN55022).
4.5 Thermal Shutdown (TSD): The SenseFET and
the control IC on a die in one package makes it easier
for the control IC to detect the over temperature of the
SenseFET. If the temperature exceeds 140°C, the
thermal shutdown is triggered and stops operation.
The FSL126MRT operates in Auto-Restart Mode until
the temperature decreases to around 80°C, when
normal operation resumes.
Figure 23. Random Frequency Fluctuation
5. Soft Burst-Mode Operation: To minimize power
dissipation in Standby Mode, the FSL126MRT enters
Burst-Mode operation. As the load decreases, the
feedback voltage decreases. The device automatically
enters Burst Mode when the feedback voltage drops
below VBURL (400mV), as shown in Figure 22. At this
point, switching stops and the output voltages start to
drop at a rate dependent on standby current load. This
causes the feedback voltage to rise. Once it passes
VBURH (550mV), switching resumes. The feedback
voltage then falls and the process repeats. Burst Mode
alternately enables and disables switching of the
SenseFET, reducing switching loss in Standby Mode.
Figure 22. Burst-Mode Operation
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
11
Physical Dimensions
10.16
9.96
2.74
2.34
(0.70)
(7.00)
3.28
Ø
3.40
3.20
3.08
(5.40)
6.90
6.50
16.07
15.67
20.00
19.00
(13.05)
24.00
23.00
(0.48)
R0.55
R0.55
3.06
2.46
8.13
7.13
1.40
1.20
0.80
0.70
(7.15)
(1.13)
0.70
0.50
2,4,6
1,3,5
1
6
0.60
0.45
2.19
1.75
1.27
3.81
3.48
2.88
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE DOES NOT COMPLY
5°
5°
TO ANY CURRENT PACKAGING STANDARD.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) LEADFORM OPTION A
E) DFAWING FILENAME: TO220A06REV4
Figure 24. TO-220F-6L (W-Forming)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
www.fairchildsemi.com
12
© 2012 Fairchild Semiconductor Corporation
FSL126MRT • Rev. 1.0.0
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