FSSD06BQX_12 [FAIRCHILD]
SD/SDIO and MMC Two-Port Multiplexer; SD / SDIO和MMC双端口多路复用器型号: | FSSD06BQX_12 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | SD/SDIO and MMC Two-Port Multiplexer |
文件: | 总14页 (文件大小:575K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
March 2012
FSSD06 — SD/SDIO and MMC Two-Port Multiplexer
Features
Description
The FSSD06 is a two-port multiplexer that allows Secure
Digital (SD), Secure Digital I/O (SDIO), and Multimedia
Card (MMC) host controllers to be expanded out to
multiple cards or peripherals. This configuration enables
the CMD, CLK, and D[3:0] signals to be multiplexed to
dual-card peripherals. It is optimized for 1-bit / 4-bit SD /
MMC applications.
. On Resistance Typically 4Ω, VDDH=2.7V
. ftoggle: > 120MHz
. Low On Capacitance: 9pF Typical
. Low Power Consumption: 1µA Maximum
. Conforms to Secure Digital (SD), Secure Digital I/O
(SDIO), and Multimedia Card (MMC) Specifications
The architecture includes the necessary bi-directional
data and command transfer capability for single high-
voltage cards or dual-voltage supply cards. The clock
path for the FSSD06 is a uni-directional buffer with an
integrated pull-up for high-impedance mode.
. Supports 1-Bit / 4-Bit Host Controllers (VDDH=1.65V to
3.6V) Communicating with High-Voltage (2.7-3.6V)
and Dual-Voltage Cards (1.65-1.95V, 2.7-3.6V)
-
VDDH=1.65 to 3.6V, VDDC1/C2=VDDH to 3.6V
Typical applications involve switching in portables and
consumer applications: cell phones, digital cameras,
home theater monitors, portable GPS units, and printers.
. 24-Lead MLP (3.5 x 4.5mm) and UMLP Packages
Applications
. Cell Phone, PDA, Digital Camera, Portable GPS
. LCD Monitor, Home Theater PC/TV, All-in-One Printer
Analog Symbol Diagram
VDDC1
VDDC2
VDDH
/OE
S
Control
5
5
1DAT[0:3], 1CMD
5
DAT[0:3], CMD
2DAT[0:3], 2CMD
VDDC1
VDDC2
RPU
RPU
1CLK
2CLK
CLK
GND
Figure 1.
Analog Symbol Diagram
Ordering Information
Operating
Temperature Range
Packing
Method
Part Number
Package Description
24-Lead Molded Leadless Package (MLP), JEDEC MO-
220, 3.5 x 4.5mm
FSSD06BQX
FSSD06UMX
-40°C to +85°C
Tape & Reel
Tape & Reel
-40°C to +85°C
24-Lead Ultrathin Molded Leadless Package (UMLP)
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
Pin Configuration
2
1
24 23
24
23
22
21
20
19
DAT[2]
DAT[3]
22
21
20
19
18
17
3
4
5
6
7
8
9
VDDC1
1CLK
DAT[3]
CMD
18
1CLK
1
2
17
16
15
14
13
1DAT[0]
1DAT[1]
1DAT[0]
1DAT[1]
2DAT[2]
2DAT[3]
2CMD
CMD
VDDH
GND
VDDH
GND
CLK
3
4
2DAT[2]
CLK
5
6
2DAT[3]
2CMD
DAT[0]
16
15
DAT[0]
DAT[1] 10
VDDC2
11
7
9
12
10
8
11 12 13 14
Figure 2.
MLP Pin Assignments
Figure 3.
UMLP Pin Assignments
Pin Definitions
Name
Description
VDDH
Power Supply (Host ASIC)
VDDC1, VDDC2
Power Supply (SDIO Peripheral Card Ports)
Output Enable (Active Low)
Select Pin
/OE
S
1DAT[3:0], 2DAT[3:0], 1CMD, 2CMD
DAT[3:0], CMD
SDIO Card Ports
SDIO Common Ports
Clock Path Ports
CLK, 1CLK, 2CLK
Truth Table
/OE
S
Function
LOW
LOW
HIGH
LOW
HIGH
X
CMD, CLK, DAT[3:0] connected to 1CMD, 1CLK, 1DAT[3:0]; 2CLK pulled HIGH via RPU
CMD, CLK, DAT[3:0] connected to 2CMD, 2CLK, 2DAT[3:0]; 1CLK pulled HIGH via RPU
All Ports High Impedance; 1CLK, 2CLK pulled HIGH via RPU
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
2
Typical Application Diagram
VDDH
VDDC1
1.65 – 3.60V
FSSD06
VDD H to 3.6V
RT
GND
1CMD, 1DAT[3:0]
WiFi,
CMD, DAT[3:0]
Bluetooth,
MMC or SD
Module
5
5
Processor
1CLK
Secure Data /
Multimedia Card
2:1 Peripheral
Expander
VDDC2
CLK
VDD H to 3.6V
RT
Note: External resistors (R T) are
recommended if card supplies are
allowed to float in the application.
The resistors should be >500K to
minimize power consumption.
GND
2CMD, 2DAT[3:0]
WiFi,
5
Bluetooth,
MMC or SD
Module
2CLK
/OE
S
GND
Figure 4.
Typical Application Diagram
Functional Description
The FSSD06 enables sharing the ASIC/baseband
processor SDIO port(s) to two peripheral cards,
providing bi-directional support for dual-voltage
SD/SDIO or MMC cards available in the marketplace.
Each SDIO port of the FSSD06 has its own supply rail,
allowing peripheral cards with different supplies to be
interfaced to the host. The peripheral card supplies must
be equal or greater than the host to minimize power
consumption. The independent VDDH, VDDC1, and VDDC2
are defined by the supplies connected from the
application Power Management ICs (PMICs) to the
FSSD06. The clock path is a uni-directional buffered
path rather than a bi-directional switch port.
CLK Bus
The 1CLK and 2CLK outputs are bi-state buffer
architectures, rather than a switch I/O, to ensure 52MHz
incident wave switching. When there is no
communication on the bus (IDLE), the FSSD06 can be
disabled with the /OE pin. When this pin is pulled HIGH,
the nCLK outputs are also pulled HIGH. Along with
nCMD, nDAT[3:0] goes high-impedance to ensure that
the CLK path between the FSSD06 and the peripheral
does not float.
IDLE State CMD/DAT Bus “Parking”
The SD and MMC card specifications were written for a
direct point-to-point communication between host
controller and card. The introduction of the FSSD06 in
that path, as an expander, requires that the functional
operation and system latency not be impacted by the
FSSD06 switch characteristics. Since there are various
card formats, protocols, and configurable controllers, a
/OE pin is available to facilitate a fast IDLE transition for
the nCMD/nDAT[3:0] outputs. Some controllers, rather
than simply placing CMD/DAT into high-impedance
mode, may pull their outputs HIGH for a clock cycle prior
to going into high-impedance mode (referred to as
“parking” the output). Some legacy controllers pull their
outputs HIGH versus high impedance.
CMD, DAT Bus Pull-ups
The 1CMD, 2CMD, 1DAT[3:0], and 2DAT[3:0] ports do
not have, internally, the system pull-up resistors as
defined in the MMC or SD card system bus
specifications. The system bus pull-up must be added
external to the FSSD06. The value, within the specific
specification limits, is a function of the individual
application and type of card or peripheral connected. For
SD card applications, the RCMD and RDAT pull-ups should
be between 10kΩ and 100kΩ. For MMC applications,
the RCMD pull-ups should be between 4.7kΩ and 100kΩ
and the RDAT pull-ups between 50kΩ and 100kΩ. The
card-side 1CMD, 2CMD, 1DAT[3:0], and 2DAT[3:0]
outputs have a circuit that facilitates incident wave
switching, so the external pull-up resistors ensure
retention of the output high level.
If the /OE pin is left LOW and the controller places the
CMD/DAT[3:0] outputs into high impedance, the
nCMD/nDAT[3:0] output rise time is a function of the RC
time constant through the switch path. It is
recommended that the host controller pull CMD and
DAT[3:0] HIGH for one cycle before pulling /OE HIGH.
This facilitates parking all nCMD/nDAT[3:0] outputs
HIGH before putting the switch I/Os in high impedance.
The /OE pin can be used to place the 1CMD, 2CMD,
1DAT[3:0] and 2DAT[3:0] into high-impedance mode
when the system enters IDLE state (see IDLE State
CMD/DAT Bus “Parking”).
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Conditions
Min.
-0.5
Max.
4.6
Unit
V
VDDH
Supply Voltage
VDDC1,VDDC2 Supply Voltage
-0.5
4.6
V
1DAT[3:0], 2DAT[3:0], 1CMD,
2CMD Pins
VDDx(2)+ 0.3V
(4.6V maximum)
VDDx(2)+ 0.3V
(4.6V maximum)
-0.5
-0.5
V
V
(1)
VSW
Switch I/O Voltage
DAT[3:0], CMD Pins
(1)
VCNTRL
Control Input Voltage
CLK Input Voltage
S, /OE
CLK
-0.5
-0.5
4.6
4.6
V
V
(1)
VCLKI
VDDx(2)+ 0.3V
(4.6V maximum)
(1)
VCLKO
CLK Output Voltage
1CLK, 2CLK
-0.5
V
IINDC
ISW
Input Clamp Diode Current
Switch I/O Current
-50
50
mA
mA
SDIO Continuous
SDIO Pulsed at 1ms Duration,
<10% Duty Cycle
ISWPEAK
Peak Switch Current
100
mA
TSTG
TJ
Storage Temperature Range
Max Junction Temperature
Lead Temperature
-65
+150
C
C
C
+150
TL
Soldering, 10 Seconds
I/O to GND
+260C
8
9
5
Human Body Model
(JEDEC: JESD22-A114)
Supply to GND
All Other Pins
kV
ESD
Charged Device Model (JEDEC: JESD22-C101)
2
kV
Notes:
1. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.
2. DDx references the specific SDIO port VDD rail (i.e. VDDC1, VDDC2, VDDH).
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VDDH
Parameter
Supply Voltage - Host Side
Minimum
Maximum
3.6V
Unit
V
1.65
VDDH
0
VDDC1, VDDC2
VCNTRL
Supply Voltage - SDIO Cards
Control Input Voltage - VS,V/OE
Clock Input Voltage - VCLKI
3.6V
V
VDDH
V
VCLKI
0
VDDH
V
Switch I/O Voltage - CMD, DAT[3:0]
Switch I/O Voltage - 1CMD, 1DAT[3:0]
Switch I/O Voltage - 2CMD, 2DAT[3:0]
Operating Temperature
0
VDDH
V
VSW
0
VDDC1
VDDC2
+85
V
0
V
°C
-40
°C
°C/W
Thermal Resistance (free air), MLP24
50
JA
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
4
DC Electrical Characteristics at 1.8V VDDH
All typical values are for VDDH=1.8V at 25°C unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
VDDC1
VDDC2 (V)
/
Symbol
Parameter
Conditions
Unit
Common Pins
VIK
VIH
VIL
IIN
Clamp Diode Voltage
2.7
2.7
2.7
3.6
IIK=-18mA
-1.2
Control Input Voltage
High
1.3
V
VDDH=1.65V
Control Input Voltage Low
0.5
VDDH=1.95V, VCNTRL=0V to
VDDH
S, /OE Input High Current
-1
1
µA
µA
µA
Off Leakage, Current of
all ports
IOZ
IPU
3.6
3.6
VDDH=1.95V, VSW=0V to VDDX -1.0
0.5
1.0
35
VCLKI=VDDH VCLKO=0V,
/OE=VDDH
CLK Pull-up Current
2.4
50
VOHC
VOLC
RPU
CLK Output Voltage High
CLK Output Voltage Low
CLK Pull-up Resistance(3)
2.7
3.6
IOH=-2mA
IOL=-2mA
V
90
6
mV
kꢀ
100
4
VCMD, DAT[3:0]=0V, ION=-2mA,
See Figure 5
RON
Switch On Resistance(4)
Delta On Resistance(4, 5)
2.7
2.7
ꢀ
ꢀ
∆RON
VCMD, DAT[3:0]=0V, ION=- 2mA
0.8
Power Supply
Quiescent Supply Current
VDDH=1.95V, VSW=0 or VDDH
,
ICC(VDDH)
0
1
1
µA
µA
(Host)
I
OUT=0
VSW=0 or VDDx, IOUT=0,
CLKI=VDDH, VCLKO=Open,
/OE=0V
ICC(VDDC1, Quiescent Supply Current
3.6
V
(SDIO Cards)
VDDC2)
V
SW=0 or VDDx, IOUT=0,
Delta ICC(VDDC1, VDDC2) for
One Card Powered Off
3.6V
/ 0V
∆ICARD
VCLKI=VDDH, VCLKO=Open,
1
µA
/OE=0V
Notes:
3. Guaranteed by characterization, not production tested.
4. On resistance is determined by the voltage drop between the switch I/O pins at the indicated current through the switch.
5. ∆ RON=RON max – RON min measured at identical VCC, temperature, and voltage.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
5
DC Electrical Characteristics at 2.7V VDDH
All typical values are for VDDH=2.7V at 25°C unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
VDDC1
VDDC2 (V)
/
Symbol
Parameter
Conditions
Unit
Common Pins
VIK
VIH
VIL
IIN
Clamp Diode Voltage
2.7
2.7
2.7
3.6
IIK=-18mA
-1.2
Control Input Voltage
High
1.8
V
VDDH=2.7V
Control Input Voltage Low
0.8
VDDH=3.6V, VCNTRL=0V to
VDDH
S, /OE Input High Current
-1
1
µA
µA
µA
IOZ
Off Leakage Current of all
ports
VDDH=3.6V, VSW=0V to VDDX
3.6
3.6
-1.0
0.5
1.0
50
IPU
CLK Pull-up Current
VCLKI=VDDH, VCLKO=0V,
/OE=VDDH
2.4
50
VOHC
VOLC
RPU
CLK Output Voltage High
CLK Output Voltage Low
CLK Pull-up Resistance(6)
2.7
3.6
IOH=-2mA
IOL=-2mA
V
90
mV
kꢀ
100
2.5
0.8
VCMD, DAT[3:0]=0V, ION=-2mA
See Figure 5
RON
Switch On Resistance(7)
Delta On Resistance(7,8)
2.7
2.7
6.0
ꢀ
ꢀ
∆RON
VCMD, DAT[3:0]=0V, ION=- 2mA
Power Supply
Quiescent Supply Current
VDDH=3.6V, VSW=0 or VDDH
IOUT=0
,
ICC(VDDH)
0
1
1
µA
µA
(Host)
VSW=0 or VDDx, IOUT=0,
CLKI=VDDH , VCLKO=Open,
/OE=0V
ICC(VDDC1, Quiescent Supply Current
3.6
V
(SDIO Cards)
VDDC2)
V
SW=0 or VDDx, IOUT=0,
Delta ICC(VDDC1, VDDC2) for
∆ICARD
3.6V/0V
0V/3.6V
VCLKI=VDDH, VCLKO=Open,
1
µA
One Card Powered Off
/OE=0V
Notes:
6. Guaranteed by characterization, not production tested.
7. On resistance is determined by the voltage drop between the switch I/O pins at the indicated current through the switch.
8. ∆RON=RON max – RON min measured at identical VCC, temperature, and voltage.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
6
AC Electrical Characteristics at 1.8V VDDH
All typical values are for VDDH=1.8V at 25°C unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
VDDC1
/
Symbol
Parameter
Conditions
Unit
VDDC2 (V)
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
Turn-On Time,
S, /OE to CMD, DAT[3:0]
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
tON1
tOFF1
tPD
10
7
24
22
ns
ns
ns
ns
ns
ns
ns
dB
Turn-Off Time,
S, /OE to CMD, DAT[3:0]
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
Switch Propagation
Delay(9)
Switch Skew(9, 10)
CMD, DAT[3:0]
See Figure 9
1
tSKEW
tON2
RL=1kꢀ, CL=30pF
2
Turn-On Time,
S, /OE to 1CLK, 2CLK
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
17
10
3.0
-60
35
28
Turn-Off Time
S, /OE to 1CLK, 2CLK
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
tOFF2
tPDCLK
OIRR
Xtalk
RL=1kꢀ, CL=30pF
See Figure 11
Clock Propagation Delay
Off Isolation(9)
5.5
f=10MHz, RT=50ꢀ, CL=30pF,
See Figure 12
Non-Adjacent Channel
Crosstalk(9)
Clock Frequency(9)
f=10MHz, RT=50ꢀ, CL=30pF,
See Figure 13
2.7 to 3.6
2.7 to 3.6
-60
dB
ftoggle
CL=30pF
120
MHz
Notes:
9. Guaranteed by characterization, not production tested.
10. Skew is determined by |TPLH - TPHL | for worst-case temperature and VDDX
.
© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSSD06 • Rev. 1.0.5
7
AC Electrical Characteristics at 2.7V VDDH
All typical values are for VDDH=2.7V at 25°C unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
VDDC1
/
Symbol
Parameter
Conditions
Unit
VDDC2 (V)
2.7 to 3.6
2.7 to 3.6
Turn-On Time
S, /OE to CMD, DAT[3:0]
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
tON1
tOFF1
tPD
8
6
17
13
ns
ns
ns
ns
ns
ns
ns
dB
Turn-Off Time
S, /OE to CMD, DAT[3:0]
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
Switch Propagation
Delay(11)
Switch Skew(12)
CMD, DAT[3:0]
2.7 to 3.6 See Figure 9
1
tSKEW
tON2
2.7 to 3.6 RL=1kꢀ, CL=30pF
1.5
15
10
1.5
-60
Turn-On Time
S, /OE to 1CLK, 2CLK
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
25
25
Turn-Off Time
S, /OE to 1CLK, 2CLK
VSW=0V, RL=1kꢀ, CL=30pF
See Figure 7, Figure 8
tOFF2
tPDCLK
OIRR
Xtalk
RL=1kꢀ, CL=30pF
See Figure 11
Clock Propagation Delay
Off Isolation(11)
3.0
f=10MHz, RT=50ꢀ, CL=30pF
See Figure 12
Non-Adjacent Channel
Crosstalk(11)
f=10MHz, RT=50ꢀ, CL=30pF
See Figure 13
-60
dB
ftoggle
Clock Frequency(11)
2.7 to 3.6 CL=30pF
120
MHz
Notes:
11. Guaranteed by characterization, not production tested.
12. Skew is determined by |TPLH - TPHL | for worst-case temperature and VDDX
.
Capacitance
TA=- 40°C to +85°C
Min. Typ. Max.
Symbol
CIN (S, /OE, CLK)
CON
Parameter
Conditions
Unit
Control and CLK Pin Input
Capacitance
V
DDH=0V
2.5
V
V
DDH=1.8V,VDDC1=VDDC2=2.7V,
/OE=0V, Vbias=0V, f=1MHz
See Figure 15
Common Port On Capacitance
9.0
(CDAT[3:0], CMD
)
pF
VDDH=1.8V,VDDC1=VDDLH2=2.7V,
COFF
Input Source Off Capacitance
V/OE=3.3V, Vbias=0V, f=1MHz
4.0
See Figure 14
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
8
Test Diagrams
VON
IOZ
NC
nDAT[3:0],nCMD
DAT[3:0],CMD
A
V
V
IN
IN
ION
Select
GND
GND
Select
GND
ddl
VS= 0 orVddl
V
V
S= 0 or
R
ON = VON / ION
Figure 5.
On Resistance
Figure 6.
Off Leakage (Each Switch Port is
Tested Separately)
V
DDx
tRISE= 2.5ns
tFALL = 2.5ns
DAT[3:0],
CMD
nDAT[3:0],nCMD
R
L
Vddx
V
90%
Vddx /2
90%
SW
VOUT
Input- V
CNTRL
Vddx /2
C
R
GND
L
S
10%
10%
50%
GND
GND
VOH
V
S
Output-VOUT
VOL
GND
Vol + 0.15V
tON
tOFF
RL , RS, and CL are function of application
environment (see AC Tables for specific values)
CL includes test fixture and stray capacitance
Figure 7.
AC Test Circuit Load
Figure 8.
Turn On/Off Time Waveforms
V
DDx
tRISE= 2.5ns
tFALL = 2.5ns
CLK
1CLK,
V
R
2CLK
ddx
L
90%
Vddx /2
90%
V
CLKI
Input- VSW
10%
VOUT
Vddx/2
C
L
R
GND
10%
S
GND
GND
VOH
V
Output- VOUT
VOL
S
50%
50%
tpLH
GND
tpHL
RL , RS, and CL are function of application
environment (see AC Tables for specific values)
CL includes test fixture and stray capacitance
Figure 9.
Switch Propagation Delay Waveform
Figure 10. AC Test Circuit Load (CLK)
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
9
Test Diagrams (Continued)
t
t
FALL= 2.5ns
RISE = 2.5ns
Network Analyzer
R
S
V
ddx
V
90%
Vddx/2
90%
IN
V
S
GND
R
Input- V
T
CLKI
Vddx/2
GND
10%
10%
50%
V
GND
S
GND
V
OUT
VOHC
GND
GND
R
T
Output -V
RS and RT are function of application
environment (see AC Tables for specific values)
CLKO
50%
tpLH
GND
VOLC
tpHL
Off-Isolation = 20 Log (VOUT / VIN
)
Figure 11. CLK Propagation Delay Waveforms
Figure 12. Channel Off Isolation
Network Analyzer
NC
R
S
V
IN
V
S
GND
GND
V
S
GND
R
T
GND
V
OUT
GND
R
T
RS and RT are function of application environment
(see AC Tables for specific values)
GND
CROSSTALK = 20 Log (VOUT/ VIN
)
Figure 13. Channel-to-Channel Crosstalk
nDAT[3:0], nCMD, nCLK
Capacitance
Meter
S
S
Capacitance
Meter
V
= 0 orV
ddh
S
V
S= 0 orVddh
f = 1MHz, Vbias = 0V
f = 1MHz,Vbias = 0V
nDAT[3:0], nCMD, nCLK
nDAT[3:0], nCMD, nCLK
Figure 14. Channel Off Capacitance
Figure 15. Channel On Capacitance
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
10
Tape and Reel Specifications
Package
Cover Tape
Status
Tape Selection
Designator
Number Cavities
Cavity Status
Leader (Start End)
125 (Typical)
3000
Empty
Filled
Sealed
Sealed
Sealed
MPX
Carrier
Trailer (Hub End)
75 (Typical)
Empty
Tape Dimensions
Dimensions are in millimeters unless otherwise noted.
Reel Dimensions
Dimensions are in inches (millimeters) unless otherwise noted.
Tape Size
A
B
C
D
N
W1
W2
13.000
(330.00)
0.059
(1.50)
0.512
(13.00)
0.795
(20.00)
2.165
(55.00)
0.488
(12.40)
0.724
(18.40)
(12.00mm)
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
11
Physical Dimensions
Figure 16. 24-Lead Molded Leadless Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
12
Physical Dimensions
2.80
2.23
0.66
0.56
0.10 C
24
19
B
2.50
A
2X
1
0.40
3.70
2.23
PIN #1 IDENT
3.40
13
7
0.10 C
0.23
2X
TOP VIEW
RECOMMENDED LAND PATTERN
0.55 MAX.
0.10 C
0.08 C
0.15
SEATING
PLANE
C
0.05
0.00
SIDE VIEW
7
0.35
0.45
13
23X
0.40
1
24
19
0.45
0.55
0.15
0.25
24X
0.10 C A B
0.05 C
BOTTOM VIEW
Figure 17. 24-Lead Ultrathin Molded Leadless Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
13
© 2007 Fairchild Semiconductor Corporation
FSSD06 • Rev. 1.0.5
www.fairchildsemi.com
14
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