FSUSB20BQX_12 [FAIRCHILD]

Low-Power, 1-Port, High-Speed USB (480Mbps) Switch;
FSUSB20BQX_12
型号: FSUSB20BQX_12
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Low-Power, 1-Port, High-Speed USB (480Mbps) Switch

文件: 总12页 (文件大小:703K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
April 2012  
FSUSB20 — Low-Power, 1-Port, High-Speed USB  
(480Mbps) Switch  
Features  
Description  
FSUSB20 is  
a
low-power, high-bandwidth switch  
.
.
.
.
.
.
.
.
-30dB Off Isolation: 250MHz  
specially designed for switching high-speed USB 2.0  
signals in handset and consumer applications; such as  
cell phone, digital camera, and notebook with hubs or  
controllers of limited USB I/O. The wide bandwidth  
(>720MHz) allows signals to pass with minimum edge  
and phase distortion. Superior channel-to-channel  
crosstalk results in minimal interference. It is compatible  
with the high-speed USB 2.0 standard.  
-30dB Non-adjacent Channel Crosstalk: 250MHz  
On Resistance: 4.5Ω Typical (RON)  
-3dB Bandwidth: >720MHz  
Low-Power Consumption: 1µA Maximum  
Control Input: LVTTL Compatible  
Bi-Directional Operation  
.
USB High-Speed and Full-Speed Signaling  
Capability  
Applications  
.
Cell Phones, PDAs, Digital Cameras, Notebook  
Computers  
Ordering Information  
Operating  
Part Number Temperature  
Range  
Packing  
Package  
Method  
Tape and  
Reel  
FSUSB20L10X  
FSUSB20BQX  
FSUSB20MUX  
-40 to +85°C 10-Lead MicroPak™, 1.6 x 2.1mm  
14-Terminal Depopulation Quad Very-Thin Flat Pack No Lead  
-40 to +85°C  
-40 to +85°C  
Tube  
(DQFN), JEDEC MO-241, 2.5 X 3.0mm  
10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187,  
3.0mm Wide  
Tape and  
Reel  
©2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
Connection Diagrams  
Figure 1. MicroPak™ (Top View)  
Figure 2. Analog Symbol  
Figure 3. DQFN (Top Through View)  
Figure 4. MSOP (Top Through View)  
Pin Descriptions  
Pin # MicroPak™ / MSOP  
Pin # DQFN  
Pin Names  
Description  
Select Input  
Bus B  
1
2
S
2, 3, 7, 8  
3, 5, 10, 12  
1B1, 1B2, 2B2, 2B1  
5
4, 6  
9
7
GND  
1A, 2A  
OE  
Ground  
6, 9  
12  
Bus A  
Bus Switch Enable  
Supply Voltage  
10  
14  
VCC  
Truth Table  
S
OE  
Function  
Disconnect  
A=B1  
Don’t Care  
LOW  
HIGH  
LOW  
LOW  
HIGH  
A=B2  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VCC  
Parameter  
Min.  
-0.5  
-0.5  
-0.5  
-50  
Max.  
4.6  
Unit  
V
Supply Voltage  
VS  
DC Switch Voltage  
DC Input Voltage(1)  
VCC + 0.05  
4.6  
V
VIN  
V
IIK  
DC Input Diode Current, VIN<0V  
DC Output Sink Current  
mA  
mA  
mA  
°C  
IOUT  
50  
ICC / IGND  
TSTG  
DC VCC / GND Current  
±100  
-65  
Storage Temperature Range  
+150  
All Pins  
7000  
7000  
ESD  
Human Body Model, JESD22-A114  
V
I/O to GND  
Note:  
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are  
observed.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
VCC  
Parameter  
Min.  
3.0  
0
Max.  
3.6  
Unit  
V
Power Supply Operating  
VIN  
Input Voltage  
VCC  
VCC  
5
V
VOUT  
Output Voltage  
0
V
Switch Control Input(2)  
Switch I/O  
0
tr, tf  
Input Rise and Fall Time  
ns/V  
°C  
0
DC  
+85  
TA  
Operating Temperature, Free Air  
-40  
Note:  
2. Unused control inputs must be held HIGH or LOW. They may not float.  
© 2005 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSUSB20 • Rev. 1.0.3  
3
DC Electrical Characteristics  
Typical values are at VCC = 3.0V and TA = 25°C.  
TA=-40 to +85°C  
Symbol  
Parameter  
Condition  
VCC (V)  
Unit  
Min.  
Typ.  
Max.  
VIK  
VIH  
VIL  
IIN  
Clamp Diode Voltage  
IIN = -18mA  
3.0  
3.0 to 3.6  
3.0 to 3.6  
3.6  
-1.2  
V
V
High-Level Input Voltage  
Low-Level Input Voltage  
Input Leakage Current  
Off-State Leakage Current  
2.0  
0.8  
±1.0  
±1.0  
7
V
µA  
µA  
0 VIN 3.6V  
0 A, B VCC  
IOFF  
3.6  
VIN = 0.8V, ION = 8mA  
3.0  
5
RON  
Switch On Resistance(3)  
Ω
VIN = 3.0V, ION = 8mA  
3.0  
4.5  
6.5  
VIN = 0.8V, VIN = 0V - 1.5V,  
Delta RON  
3.0  
3.0  
3.6  
0.3  
1
ΔRON  
Ω
Ω
I
ON = 8mA  
RFLAT(ON) On Resistance Flatness(4) IOUT = 8mA  
VIN = VCC or GND,  
OUT = 0  
ICC  
Quiescent Supply Current  
1
µA  
I
Notes:  
3. Measured by the voltage drop between the A and B pins at the indicated current through the switch. On  
resistance is determined by the lower of the voltages on the A or B pins.  
4. Flatness is defines as the difference between the maximum and the minimum value on resistance over the  
specified range of conditions.  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
4
AC Electrical Characteristics  
Typical values are at VCC = 3.3V and TA = 25°C.  
Symbol  
Parameter  
Condition  
VCC(V)  
Typ.  
Max.  
Unit  
Figure  
Turn-On Time  
S-to-Bus B  
Figure 9  
Figure 10  
tON  
VB = 0.8V  
3.0 to 3.6  
4.8  
7.0  
ns  
Turn-Off Time  
S-to-Bus B  
Figure 9  
Figure 10  
tOFF  
VB = 0.8V  
CL = 10pF  
3.0 to 3.6  
2.2  
4.0  
ns  
tPD  
Propagation Delay  
3.0 to 3.6  
3.0 to 3.6  
0.25  
-26  
ns  
Figure 14  
Figure 11  
f = 250MHz,  
RL = 50Ω  
Non-Adjacent Off  
Isolation  
OIRR  
dB  
f = 250MHz,  
RL = 50Ω  
Non-Adjacent  
Channel Crosstalk  
XTALK  
BW  
3.0 to 3.6  
3.0 to 3.6  
-45  
dB  
Figure 12  
Figure 13  
750  
435  
RL = 50Ω, CL = 0pF  
RL = 50Ω, CL = 5pF  
-3dB Bandwidth  
MHz  
USB Related AC Electrical Characteristics  
Typical values are at VCC = 3.3V and TA = 25°C.  
Symbol  
Parameter  
Condition  
VCC (V)  
Typ.  
Unit  
Figure  
Channel-to Channel  
Skew  
Figure 14  
Figure 16  
tSK(O)  
CL = 10pF  
3.0 to 3.6  
3.0 to 3.6  
3.0 to 3.6  
0.051  
ns  
Skew of Opposite  
Transition of the  
Same Output  
Figure 14  
Figure 16  
tSK(P)  
CL = 10pF  
0.020  
0.170  
ns  
ns  
RL = 50Ω, CL = 10pF  
tR = tF = 750ps at 480MPs  
TJ  
Total Jitter  
Capacitance  
Typical values are at VCC = 3.3V and TA = 25°C.  
Symbol  
CIN  
Parameter  
Control Pin Input Capacitance  
A/B On Capacitance  
Condition  
Typ.  
Unit  
pF  
VCC = 0V  
2.5  
12.0  
4.5  
CON  
VCC = 3.3V, /OE = 0V  
VCC and /OE = 3.3V  
pF  
COFF  
Port B Off Capacitance  
pF  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
5
Performance Characteristics  
Freqency Response  
0
Freqency Response  
0
-10  
-1  
-2  
-3  
-4  
-5  
-6  
-7  
-8  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
-110  
-120  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
Frequency (MHz)  
Frequency (MHz)  
CL = 0pF, VCC = 3.3V  
VBIAS = 0.5V, VCC = 3.3V  
Figure 5. Gain vs. Frequency  
Figure 6. Off Isolation  
10.0  
9.0  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
Freqency Response  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
85°C  
V
R
B2 = 800.000mV  
ON = 5.402  
-90  
-100  
-110  
-120  
25°C  
2.0  
1.0  
0.0  
V
B2 = 800.000mV  
ON = 4.437  
-40°C  
R
V
B2 = 800.000mV  
1
10  
100  
1000  
RON = 3.561  
Frequency (MHz)  
0.00  
0.50  
1.00  
1.50  
VB2 (V)  
2.00  
2.50  
3.00  
VBIAS = 0.5V, VCC = 3.3V  
Figure 7. Crosstalk  
Figure 8. RON  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
6
AC Loadings and Waveforms  
A
nB1  
nB2  
10pF  
50Ω  
GND  
+
VB  
Control  
S OE  
GND  
Notes: Input driven by 50Ω source terminated in 50Ω.  
CL includes load and stray capacitance.  
Input PRR-1.0MHz, tW = 500ns.  
Figure 9. AC Test Circuit  
tr = 2.5ns  
90% 90%  
1.5V 1.5V  
tf = 2.5ns  
3.0V  
SELECT  
INPUT  
10%  
tON  
10%  
tOFF  
GND  
VOH  
90%  
90%  
OUTPUT  
VOL  
Figure 10. AC Waveforms  
B1  
B1  
A
A
Network Analyzer  
100Ω  
100Ω  
50Ω  
50Ω  
B2  
Network Analyzer  
50Ω  
S
Control  
S
Control  
OE  
OE  
Figure 11. Off Isolation Test  
Figure 12. Crosstalk Test  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
7
AC Loadings and Waveforms  
A
B
Network Analyzer  
50Ω  
S
Control  
OE  
GND  
Figure 13. Bandwidth Test  
800mV  
Input  
400mV  
tPLH  
tPHL  
VOH  
VOL  
Output  
Figure 14. Propagation Delay  
800mV  
50%  
50%  
Input  
400mV  
0
tPHL  
tPLH  
VOH  
50%  
VOL  
50%  
Output  
tSK(P) = | tPHL - tPHL  
|
Figure 15. Pulse Skew tSP(P)  
800mV  
50%  
50%  
Input  
400mV  
tPHL1  
tPLH1  
0
50%  
50%  
Output 1  
tSK(O)  
tSK(O)  
50%  
50%  
Output 2  
tPHL2  
tPLH2  
tSK(O) = | tPLH1 - tPLH2 | or | tPHL1 - tPHL2  
|
Figure 16. Output Skew tSK(O)  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
8
Physical Dimensions  
0.10  
C
2.10  
A
2X  
1.62  
B
KEEPOUT ZONE, NO TRACES  
OR VIAS ALLOWED  
(0.11)  
0.56  
1.12  
1.60  
PIN1 IDENT IS  
2X LONGER THAN  
OTHER LINES  
0.10  
C
10X  
(0.35)  
(0.25)  
2X  
10X  
0.50  
TOP VIEW  
RECOMMENDED LAND PATTERN  
0.55 MAX  
0.05 C  
0.05 C  
0.05  
0.00  
(0.20)  
C
0.35  
0.25  
SIDE VIEW  
(0.15)  
D
DETAIL A  
(0.36)  
0.35  
0.25  
0.65  
0.55  
0.35  
0.25  
DETAIL A 2X SCALE  
1
4
0.56  
NOTES:  
10  
5
A. PACKAGE CONFORMS TO JEDEC  
REGISTRATION MO-255, VARIATION UABD .  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
D. PRESENCE OF CENTER PAD IS PACKAGE  
SUPPLIER DEPENDENT. IF PRESENT IT  
IS NOT INTENDED TO BE SOLDERED AND  
HAS A BLACK OXIDE FINISH.  
(0.29)  
0.35  
6
9
9X  
0.25  
0.50  
0.25  
0.15  
9X  
1.62  
0.10  
0.05  
C
C
A B  
ALL FEATURES  
E. DRAWING FILENAME: MKT-MAC10Arev5.  
BOTTOM VIEW  
Figure 17. 10-Lead MicroPak™, 1.6 x 2.1mm  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:  
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
9
Physical Dimensions  
Figure 18. 14-Terminal Depopulation Quad Very-Thin Flat Pack No Lead (DQFN), JEDEC MO-241, 2.5 X 3.0mm  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:  
http://www.fairchildsemi.com/ms/MS/MS-522.pdf.  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
10  
Physical Dimensions  
Figure 19. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/  
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:  
http://www.fairchildsemi.com/products/analog/pdf/msop10_tr.pdf  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
11  
© 2005 Fairchild Semiconductor Corporation  
FSUSB20 • Rev. 1.0.3  
www.fairchildsemi.com  
12  

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