FSUSB63 [FAIRCHILD]
3:1 High-Speed USB 2.0 Switch / Multiplexer; 3 ： 1高速USB 2.0开关/多路复用器
| 型号： | FSUSB63 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | 3:1 High-Speed USB 2.0 Switch / Multiplexer |
| 文件： | 总3页 (文件大小：1324K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
July 2012
FSUSB63 — 3:1 High-Speed USB 2.0 Switch / Multiplexer
Description
Features
The FSUSB63 is a bi-directional, low-power, High-Speed
(HS) USB 2.0 3:1 Multiplexer (MUX). It is optimized for
switching among three high-speed (480Mbps) sources or
any combination of high-speed and full-speed (12Mbps)
USB sources, such as an application processor, to one USB
2.0 connector.
Switch Type
USB
3:1 USB Switch
USB 2.0 High-Speed &
Full-Speed Compliant
126µs
Break-Before-Make Time
RON
CON
6Ω Typical
6pF Typical
Bandwidth
VCC
VCNTRL
Operating Temperature
ICCSLP
ICCACT
830MHz
2.7 to 4.4V
0 to VCC
-40°C to 85°C
<1µA
The FSUSB63 has a break-before-make time to force re-
enumeration by the host when switching between different
HS USB 2.0 controllers and thus requires minimal software
changes.
The FSUSB63 is compliant with the requirements of USB 2.0
and features extremely low on capacitance (CON). The wide
bandwidth exceeds the requirement to pass the third
harmonic, resulting in signals with minimum edge and phase
distortion. Superior channel-to-channel crosstalk also
minimizes interference.
7.5µA Typical
12- Lead UMLP 1.80 x 1.80 x
0.55mm, 0.40mm pitch
KG
Package
Top Mark
Ordering Information
FSUSB63UMX
Applications
Related Resources
. Cell Phone, Digital Camera, Notebook
. LCD Monitor, TV, and Set-Top Box
. Netbook, Mobile Internet Device (MID)
. For samples and questions, please contact:
Analog.Switch@fairchildsemi.com.
. FSUSB63 Demonstration Board
Typical Application
Figure 1. Analog Symbol
© 2010 Fairchild Semiconductor Corporation
FSUSB63 • Rev. 1.0.4
www.fairchildsemi.com
Physical Dimensions
(11X)
0.563
2.10
1.80
A
B
0.10 C
0.588
0.40
2X
1
1.80
2.10
PIN#1 IDENT
0.10 C
(12X)
0.20
TOP VIEW
2X
RECOMMENDED
LAND PATTERN
0.55 MAX.
0.152
0.10 C
0.08 C
0.45
0.35
0.10
0.05
0.00
SEATING
PLANE
C
0.10
0.10
SIDE VIEW
DETAIL A
SCALE : 2X
0.35
(11X)
NOTES:
0.45
3
6
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
0.40
B. DIMENSIONS ARE IN MILLIMETERS.
DETAIL A
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
1
PIN#1 IDENT
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
12
9
0.25
0.15
(12X)
BOTTOM VIEW
0.10 C
A B
E. DRAWING FILENAME: MKT-UMLP12Arev4.
0.05 C
PACKAGE
EDGE
LEAD
LEAD
OPTION 2
SCALE : 2X
OPTION 1
SCALE : 2X
Figure 18. 12-Lead, Ultrathin Molded Leadless Package (UMLP)
Ordering Information
Part Number Top Mark Operating Temperature Range
Package
12-Lead, Quad, Ultrathin Molded Leadless Package (UMLP),
1.8mm x 1.8mm x 0.55mm, 0.4mm pitch
FSUSB63UMX
KG
-40 to +85°C
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FSUSB63 • Rev. 1.0.4
www.fairchildsemi.com
10
© 2010 Fairchild Semiconductor Corporation
FSUSB63 • Rev. 1.0.4
www.fairchildsemi.com
11
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