H11G23SD [FAIRCHILD]

HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS; 高压光电复合光耦合器
H11G23SD
型号: H11G23SD
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS
高压光电复合光耦合器

光电 输出元件 高压
文件: 总7页 (文件大小:402K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HIGH VOLTAGE  
PHOTODARLINGTON OPTOCOUPLERS  
H11G1  
H11G2  
H11G3  
DESCRIPTION  
The H11GX series are photodarlington-type optically coupled optocouplers. These devices have a  
gallium arsenide infrared emitting diode coupled with a silicon darlington connected phototransistor  
which has an integral base-emitter resistor to optimize elevated temperature characteristics.  
FEATURES  
• High BVCEO  
- Minimum 100 V for H11G1  
- Minimum 80 V for H11G2  
- Minimum 55 V for H11G3  
• High sensitivity to low input current  
Minimum 500 percent CTR at IF = 1 mA  
• Low leakage current at elevated temperature  
(maximum 100 µA at 80°C)  
• Underwriters Laboratory (UL) recognized File# E90700  
APPLICATIONS  
CMOS logic interface  
Telephone ring detector  
Low input TTL interface  
Power supply isolation  
Replace pulse transformer  
ANODE  
CATHODE  
N/C  
1
6
BASE  
2
3
5
4
COLLECTOR  
EMITTER  
NOTE  
All dimensions are in inches (millimeters)  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Units  
TOTAL DEVICE  
TSTG  
-55 to +150  
°C  
Storage Temperature  
Operating Temperature  
Lead Solder Temperature  
Total Device Power Dissipation @ TA = 25°C  
Derate above 25°C  
TOPR  
TSOL  
-55 to +100  
260 for 10 sec  
260  
°C  
°C  
mW  
PD  
3.5  
mW/°C  
Vac(rms)  
Input-Output Isolation Voltage  
EMITTER  
VISO  
5300  
IF  
60  
mA  
Forward Input Current  
Reverse Input Voltage  
Forward Current - Peak (1µs pulse, 300pps)  
LED Power Dissipation @ TA = 25°C  
Derate above 25°C  
VR  
6.0  
3.0  
100  
1.8  
V
A
IF(pk)  
mW  
mW/°C  
PD  
DETECTOR  
Collector-Emitter Voltage  
H11G1  
VCEO  
100  
80  
V
H11G2  
H11G3  
55  
Detector Power Dissipation @ TA = 25°C  
Derate above 25°C  
200  
2.67  
mW  
PD  
mW/°C  
7/21/00  
200045A  
HIGH VOLTAGE  
PHOTODARLINGTON OPTOCOUPLERS  
H11G1, H11G2, H11G3  
ELECTRICAL CHARACTERISTICS (T = 25 Unless otherwise specified.)  
°C  
A
INDIVIDUAL COMPONENT CHARACTERISTICS  
Characteristic  
Test Conditions Symbol Device  
Min  
Typ**  
Max  
Unit  
EMITTER  
(IF = 10 mA)  
VF  
ALL  
ALL  
1.3  
1.50  
V
Forward Voltage  
Forward Voltage Temp.  
Coefficient  
VF  
TA  
BVR  
-1.8  
mV/°C  
Reverse Breakdown Voltage  
(IR = 10 µA)  
(VF = 0 V, f = 1 MHz)  
(VF = 1 V, f = 1 MHz)  
(VR = 3.0 V)  
ALL  
3.0  
25  
50  
V
ALL  
pF  
pF  
µA  
Junction Capacitance  
CJ  
IR  
ALL  
65  
Reverse Leakage Current  
DETECTOR  
ALL  
0.001  
10  
H11G1  
H11G2  
H11G3  
H11G1  
H11G2  
H11G3  
ALL  
100  
80  
55  
100  
80  
55  
7
Breakdown Voltage  
Collector to Emitter  
(IC = 1.0 mA, IF = 0)  
(IC = 100 µA)  
BVCEO  
V
Collector to Base  
Emitter to Base  
BVCBO  
BVEBO  
10  
(VCE = 80 V, IF = 0)  
(VCE = 60 V, IF = 0)  
H11G1  
H11G2  
H11G3  
H11G1  
H11G2  
100  
100  
nA  
µA  
Leakage Current  
(VCE = 30 V, IF = 0)  
ICEO  
Collector to Emitter  
(VCE = 80 V, IF = 0, TA = 80°C)  
(VCE = 60 V, IF = 0, TA = 80°C)  
TRANSFER CHARACTERISTICS  
DC Characteristic  
Test Conditions Symbol Device  
Min  
Typ**  
Max  
Unit  
EMITTER  
(IF = 10 mA, VCE = 1 V)  
H11G1/2 100 (1000)  
H11G1/2 5 (500)  
Current Transfer Ratio  
Collector to Emitter  
CTR  
mA (%)  
(IF = 1 mA, VCE = 5 V)  
H11G3  
2 (200)  
(IF = 16 mA, IC = 50 mA)  
H11G1/2  
0.85  
0.75  
0.85  
1.0  
1.0  
1.2  
Saturation Voltage  
(IF = 1 mA, IC = 1 mA) VCE (SAT) H11G1/2  
V
(IF = 20 mA, IC = 50 mA)  
H11G3  
TRANSFER CHARACTERISTICS  
Characteristic  
Test Conditions Symbol Device  
Min  
Typ**  
Max  
Unit  
SWITCHING TIMES  
(RL = 100 1, IF = 10 mA)  
ton  
toff  
ALL  
ALL  
5
Turn-on Time  
Turn-off Time  
µs  
(VCE = 5 V) Pulse Width 6ꢁ300 µs, f 6ꢁ30 Hz)  
100  
** All typical values at TA = 25°C  
7/21/00  
200045A  
HIGH VOLTAGE  
PHOTODARLINGTON OPTOCOUPLERS  
H11G1, H11G2, H11G3  
Fig. 2 Normalized Output Current vs.Temperature  
Fig. 1 Output Current vs. Input Current  
100  
10  
10  
1
Normalized to:  
V
= 5 V  
CE  
= 1 mA  
I
F
T
A
= 25˚C  
I
I
= 50 mA  
= 5 mA  
F
F
Normalized to:  
= 5 V  
V
CE  
= 1 mA  
I
F
I
= 1 mA  
F
F
1
0.1  
I
= 0.5 mA  
0.1  
0.01  
0.01  
0.001  
-60  
-40  
-20  
T
0
20  
40  
60  
80  
100  
120  
0.1  
1
10  
- AMBIENT TEMPERATURE (˚C)  
I
- LED INPUT CURRENT(mA)  
A
F
Fig. 3 Output Current vs. Collector - Emitter Voltage  
Fig. 4 Collector-Emitter Dark Current  
vs. Ambient Temperature  
1000  
100  
10  
100  
10  
Normalized to:  
V
I
= 5 V  
CE  
= 1 mA  
I
I
= 50 mA  
= 10 mA  
V
CE  
= 80V  
F
F
T
A
= 25˚C  
F
I
F
I
F
= 2 mA  
= 1 mA  
V
CE  
= 30V  
1
V
CE  
= 10V  
I
F
= 0.5 mA  
1
0.1  
0.01  
0.1  
0.01  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
1
10  
T
- AMBIENT TEMPERATURE (˚C)  
V
- COLLECTOR - EMITTER VOLTAGE (V)  
A
CE  
Fig. 5 Input Current  
vs.Total Switching Speed (Typical Values)  
10  
R
L
= 10  
R
L
= 100 Ω  
R = 1k Ω  
L
1
Normalized to:  
= 5 V  
V
CC  
= 10 mA  
I
F
R
L
= 100 Ω  
0.1  
0.1  
1
10  
t
+ t - TOTAL SWITCHING SPEED (NORMALIZED)  
off  
on  
7/21/00  
200045A  
HIGH VOLTAGE  
PHOTODARLINGTON OPTOCOUPLERS  
H11G1, H11G2, H11G3  
Package Dimensions (Through Hole)  
Package Dimensions (Surface Mount)  
0.350 (8.89)  
0.330 (8.38)  
3
2
1
PIN 1  
ID.  
PIN 1  
ID.  
3
2
1
0.270 (6.86)  
0.240 (6.10)  
0.270 (6.86)  
0.240 (6.10)  
4
5
6
0.350 (8.89)  
0.330 (8.38)  
4
5
6
0.070 (1.78)  
0.045 (1.14)  
0.300 (7.62)  
TYP  
0.070 (1.78)  
0.045 (1.14)  
0.200 (5.08)  
0.135 (3.43)  
0.200 (5.08)  
0.165 (4.18)  
0.016 (0.41)  
0.008 (0.20)  
0.020 (0.51)  
MIN  
0.020 (0.51)  
MIN  
0.154 (3.90)  
0.100 (2.54)  
0.016 (0.40) MIN  
0.022 (0.56)  
0.016 (0.41)  
0.100 (2.54)  
TYP  
0.016 (0.40)  
0.008 (0.20)  
0.315 (8.00)  
MIN  
0.300 (7.62)  
TYP  
0.022 (0.56)  
0.016 (0.41)  
0° to 15°  
0.405 (10.30)  
MAX  
0.100 (2.54)  
TYP  
Lead Coplanarity : 0.004 (0.10) MAX  
Package Dimensions (0.4”Lead Spacing)  
Recommended Pad Layout for  
Surface Mount Leadform  
3
2
1
PIN 1  
ID.  
0.270 (6.86)  
0.240 (6.10)  
0.070 (1.78)  
0.060 (1.52)  
4
5
6
0.350 (8.89)  
0.330 (8.38)  
0.415 (10.54)  
0.100 (2.54)  
0.070 (1.78)  
0.045 (1.14)  
0.295 (7.49)  
0.030 (0.76)  
0.004 (0.10)  
MIN  
0.200 (5.08)  
0.135 (3.43)  
0.154 (3.90)  
0.100 (2.54)  
0.016 (0.40)  
0.008 (0.20)  
0° to 15°  
0.022 (0.56)  
0.016 (0.41)  
0.400 (10.16)  
TYP  
0.100 (2.54) TYP  
NOTE  
All dimensions are in inches (millimeters)  
7/21/00  
200045A  
HIGH VOLTAGE  
PHOTODARLINGTON OPTOCOUPLERS  
H11G1, H11G2, H11G3  
ORDERING INFORMATION  
Order Entry Identifier  
Option  
Description  
S
.S  
Surface Mount Lead Bend  
Surface Mount; Tape and reel  
0.4” Lead Spacing  
SD  
W
.SD  
.W  
300  
300W  
3S  
.300  
.300W  
.3S  
VDE 0884  
VDE 0884, 0.4” Lead Spacing  
VDE 0884, Surface Mount  
VDE 0884, Surface Mount, Tape & Reel  
3SD  
.3SD  
QT Carrier Tape Specifications (“D” Taping Orientation)  
12.0 0.1  
4.0 0.1  
4.85 0.20  
Ø1.55 0.05  
1.75 0.10  
0.30 0.05  
4.0 0.1  
7.5 0.1  
16.0 0.3  
13.2 0.2  
9.55 0.20  
Ø1.6 0.1  
10.30 0.20  
User Direction of Feed  
0.1 MAX  
NOTE  
All dimensions are in millimeters  
7/21/00  
200045A  
MARKING INFORMATION  
1
2
6
H11G1  
V XX YY K  
5
3
4
Definitions  
1
2
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option – See order entry table)  
3
4
5
6
Two digit year code, e.g., ‘03’  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
Reflow Profile (Black Package, No Suffix)  
300  
250  
215°C, 1030 s  
225 C peak  
200  
150  
Time above 183°C, 60150 sec  
Ramp up = 3C/sec  
100  
50  
0
Peak reflow temperature: 225°C (package surface temperature)  
Time of temperature higher than 183°C for 60150 seconds  
One time soldering reflow is recommended  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
Time (Minute)  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
ACEx™  
Power247™  
PowerEdge™  
PowerSaver™  
Stealth™  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
FAST  
ActiveArray™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DOME™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
FASTr™  
FPS™  
FRFET™  
GlobalOptoisolator™  
GTO™  
PowerTrench  
QFET  
QS™  
SyncFET™  
QT Optoelectronics™ TinyLogic  
HiSeC™  
I2C™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
TINYOPTO™  
MSXPro™  
OCX™  
TruTranslation™  
UHC™  
i-Lo™  
ImpliedDisconnect™  
OCXPro™  
OPTOLOGIC  
FACT Quiet Series™  
UltraFET  
SILENT SWITCHER VCX™  
SMART START™  
SPM™  
OPTOPLANAR™  
PACMAN™  
POP™  
Across the board. Around the world.™  
The Power Franchise  
ProgrammableActive Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY  
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY  
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT  
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. I13  

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