H11N1M_技术文档

September 2009

H11N1M, H11N2M, H11N3M

6-Pin DIP High Speed Logic Optocouplers

Features

Description

■ High data rate, 5MHz typical (NRZ)

The H11NXM series has a high speed integrated circuit

detector optically coupled to an AlGaAs infrared emitting

diode. The output incorporates a Schmitt trigger, which

provides hysteresis for noise immunity and pulse shap-

ing. The detector circuit is optimized for simplicity of

operation and utilizes an open collector output for

maximum application flexibility.

■ Free from latch up and oscilliation throughout voltage

and temperature ranges.

■ Microprocessor compatible drive

■ Logic compatible output sinks 16mA at 0.5V

maximum

■ Guaranteed on/off threshold hysteresis

■ Wide supply voltage capability, compatible with all

popular logic systems

■ High common mode transient immunity, 2000V/µs

minimum

■ Fast switching t = 7.5ns typical, t = 12ns typical

r

f

■ Underwriter Laboratory (UL) recognized—

file #E90700

■ VDE recognized—File#102497 – Add option V

(e.g., H11N1VM)

Applications

■ Logic to logic isolator

■ Programmable current level sensor

■ Line receiver—eliminate noise and transient problems

■ A.C. to TTL conversion—square wave shaping

■ Interfaces computers with peripherals

■ Isolated power MOS driver for power supplies

Schematic

Package Outlines

1

2

6 V_CC

ANODE

CATHODE

5 GND

Truth Table

V_O

4

3

Input

Output

H

L

H

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

Absolute Maximum Ratings ^(T= 25°C unless otherwise specified.)

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameters

Value

Units

TOTAL DEVICE

T

Storage Temperature

Operating Temperature

-40 to +150

-40 to +85

260 for 10 sec

250

°C

STG

T

OPR

T

Lead Solder Temperature

°C

SOL

P

Total Device Power Dissipation @ 25°C

Derate Above 25°C

mW

mW/°C

D

2.94

EMITTER

I

Continuous Forward Current

Reverse Voltage

30

6

mA

V

F

V

R

I (pk)

Forward Current – Peak (1µs pulse, 300 pps)

LED Power Dissipation 25°C Ambient

Derate Linearly From 25°C

1.0

120

1.41

A

F

P

mW

mW/°C

D

DETECTOR

P

Detector Power Dissipation @ 25°C

Derate Linearly from 25°C

150

1.76

mW

mW/°C

V

D

V

Allowed Range

0 to 16

50

O

45

65

V

CC

I

I Output Current

mA

O

4

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

2

Electrical Characteristics ^{(T = 25°C unless otherwise speciﬁed.)}

A

Individual Component Characteristics

Symbol

EMITTER

Parameters

Test Conditions

Device

Min. Typ.* Max. Units

V

Input Forward Voltage

I = 10mA

All

1.4

2

V

F

I = 0.3mA

0.75

4

1.25

F

I

Reverse Current

Capacitance

V = 5V

All

10

µA

pF

R

C

V = 0, f = 1.0MHz

100

J

DETECTOR

V

Operating Voltage Range

Supply Current

All

15

10

V

CC

CC(off)

I

I = 0, V = 5V

6

mA

µA

F

CC

I

Output Current, High

I = 0.3mA, V = V = 15V

100

OH

F

CC

O

Transfer Characteristics

Symbol DC Characteristics

Test Conditions

Device

All

Min. Typ.* Max. Units

I

Supply Current

I = 10mA, V = 5V

6.5

10

mA

V

CC(on)

F

CC

V

Output Voltage, Low

R =270Ω,V =5V,

All

0.5

OL

L

CC

I = I

max.

F

F(on)

(1)

I

Turn-On Threshold Current R =270Ω, V = 5V

H11N1M

H11N2M

H11N3M

All

0.8

2.3

3.2

5

mA

F(on)

L

CC

4.1

10

I

Turn-Off Threshold Current R = 270Ω, V = 5V

0.3

mA

F(off)

L

CC

I

/ I

Hysteresis Ratio

R = 270Ω, V = 5V

All

0.65

0.95

F(off) F(on)

L

CC

Switching Speed

Symbol AC Characteristics

Test Conditions

Device

Min. Typ.* Max. Units

t

Propagation Delay Time

HIGH-to-LOW

C = 120pF, t = 1µs,

All

100

7.5

150

12

330

ns

PHL

P

(2)

R = , Figure 1

E

t

Rise Time

C = 120pF, t = 1µs,

All

ns

r

P

(2)

R = , Figure 1

E

t

Propagation Delay Time

LOW-to-HIGH

C = 120pF, t = 1µs,

330

ns

PLH

P

(2)

R = , Figure 1

E

t

Fall Time

C = 120pF, t = 1µs,

ns

f

P

(2)

R = , Figure 1

E

Data Rate

5

MHz

Isolation Characteristics

Symbol Parameters

Test Conditions

Min.

Typ.*

Max. Units

V

Input-Output Isolation Voltage f = 60 Hz, t =1 sec.

7500

V

PEAK

ISO

C

Isolation Capacitance

Isolation Resistance

V

= 0V, f = 1 MHz

= 500 VDC

0.4

0.6

pF

ISO

I-O

11

R

10

Ω

*Typical values at T = 25°C

A

Notes:

1. Maximum I

is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current

F(ON)

would require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band

is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA.

2. H11N1: R = 910Ω, H11N2: R = 560Ω, H11N3: R = 240Ω

E

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

3

Safety and Insulation Ratings

As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.

Compliance with the safety ratings shall be ensured by means of protective circuits.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Installation Classiﬁcations per DIN VDE 0110/1.89

Table 1

For Rated Main Voltage < 150Vrms

For Rated Main voltage < 300Vrms

Climatic Classiﬁcation

I-IV

55/100/21

2

Pollution Degree (DIN VDE 0110/1.89)

Comparative Tracking Index

CTI

175

V

Input to Output Test Voltage, Method b,

1594

V

PR

peak

V

x 1.875 = V , 100% Production Test

IORM

PR

with tm = 1 sec, Partial Discharge < 5pC

Input to Output Test Voltage, Method a,

1275

peak

V

x 1.5 = V , Type and Sample Test

PR

IORM

with tm = 60 sec, Partial Discharge < 5pC

Max. Working Insulation Voltage

Highest Allowable Over Voltage

External Creepage

V

850

6000

7

V

IORM

peak

V

IOTM

peak

mm

Ω

External Clearance

7

Insulation Thickness

0.5

9

RIO

Insulation Resistance at Ts, V = 500V

10

IO

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

4

Typical Performance Curves

C

I₆

5V

I_F

V

5V

50%

t_off

IN

H11N1-M

1

2

6

R_E

R_L

0

270Ω

V_O

4

V_IN

t_on

0.1µF

5

t_r= t_f≤ 0.01µS

Z = 50Ω

10%

90%

V_O

t_f

t_r

Figure 1. Switching Test Circuit and Waveforms

Figure 2.Transfer Characteristics

Figure 3.Threshold Current vs. Supply Voltage

1.4

6

5

4

3

2

TURN ON THRESHOLD

V

OH

1.2

1.0

0.8

0.6

0.4

0.2

0.0

V

= 5V

= 270Ω

= 25°C

CC

L

R

T

A

TURN OFF THRESHOLD

I

F(ON)

F(OFF)

NORMALIZED TO:

Hysteresis area

shaded for illustration

TURN ON THRESHOLD AT

V

= 5V, T = 25°C

A

CC

1

0

V

OL

0

2

4

6

8

10

12

14

16

0

1

2

3

4

V

– SUPPLY VOLTAGE (V)

CC

I

– INPUT CURRENT (mA)

F

Figure 4.Threshold Current vs.Temperature

Figure 5. Load Current vs. Output Voltage

1.2

1.0

0.8

0.6

0.4

0.2

0.0

I

F(On)

100

10

1

I

F(Off)

I

V

= I

F

F(ON)

= 5V

CC

NORMALIZED TO :

V

= 5V

CC

T

= 25°C

A

0

10

20

30

40

50

60

70

0.0

0.2

0.4

0.6

0.8

1.0

– TEMPERATURE (°C)

T

A

V_O– OUTPUT VOLTAGE, LOW (V)

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

5

Typical Performance Curves (Continued)

Figure 6. Supply Current vs. Supply Voltage

Figure 7. LED Forward Voltage vs. Forward Current

100

12

T

= -25°C

A

10

8

T

= 85°C

A

T

= -25°C

A

T

= 25°C

= 85°C

A

T

= 25°C

A

6

10

T

A

4

ON STATE

OFF STATE

I = 10mA

F

2

I = 0

1

0

1.0

1.2

1.4

1.6

1.8

2.0

2

4

6

8

10

12

14

16

V_F– FORWARD VOLTAGE (V)

V

CC

– SUPPLY VOLTAGE (V)

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

6

Package Dimensions

Through Hole

0.4" Lead Spacing

8.13–8.89

6

4

8.13–8.89

6

4

6.10–6.60

Pin 1

1

3

Pin 1

1

3

5.08 (Max.)

3.28–3.53

0.25–0.36

7.62 (Typ.)

5.08 (Max.)

3.28–3.53

0.25–0.36

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.38 (Min.)

2.54–3.81

2.54 (Bsc)

0.20–0.30

(0.86)

15° (Typ.)

(0.86)

0.41–0.51

0.76–1.14

0.20–0.30

10.16–10.80

1.02–1.78

0.41–0.51

0.76–1.14

1.02–1.78

Surface Mount

(1.78)

8.13–8.89

6

4

(1.52)

(2.54)

(7.49)

6.10–6.60

8.43–9.90

(10.54)

1

3

(0.76)

Pin 1

Rcommended Pad Layout

0.25–0.36

3.28–3.53

5.08

(Max.)

0.20–0.30

0.38 (Min.)

0.16–0.88

(8.13)

2.54 (Bsc)

(0.86)

0.41–0.51

0.76–1.14

1.02–1.78

Note:

All dimensions in mm.

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

7

Ordering Information

Order Entry Identiﬁer

(Example)

Option

Description

No option

H11N1M

H11N1SM

Standard Through Hole Device

Surface Mount Lead Bend

Surface Mount; Tape and Reel

0.4" Lead Spacing

S

SR2

T

H11N1SR2M

H11N1TM

V

H11N1VM

VDE 0884

TV

H11N1TVM

H11N1SVM

H11N1SR2VM

VDE 0884, 0.4" Lead Spacing

VDE 0884, Surface Mount

VDE 0884, Surface Mount, Tape and Reel

SV

SR2V

Marking Information

1

2

H11N1

X YY Q

6

V

5

3

4

Deﬁnitions

1

2

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

3

4

5

6

One digit year code, e.g., ‘3’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are

marked with date code ‘325’ or earlier are marked in portrait format.

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

8

Tape Dimensions

12.0 ± 0.1

2.0 ± 0.05

4.5 ± 0.20

Ø1.5 MIN

1.75 ± 0.10

4.0 ± 0.1

0.30 ± 0.05

11.5 ± 1.0

24.0 ± 0.3

9.1 ± 0.20

21.0 ± 0.1

Ø1.5 ± 0.1/-0

10.1 ± 0.20

0.1 MAX

User Direction of Feed

Note:

All dimensions are in millimeters.

Reflow Soldering Profile

300

280

260

240

220

200

180

260°C

>245°C = 42 Sec

Time above

160

°C

183°C = 90 Sec

140

120

100

80

1.822°C/Sec Ramp up rate

60

40

33 Sec

20

0

60

120

180

270

360

Time (s)

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

9

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

PowerTrench^®

PowerXS™

The Power Franchise^®

Auto-SPM™

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Current Transfer Logic™

EcoSPARK^®

EfficentMax™

EZSWITCH™*

™*

F-PFS™

FRFET^®

Global Power Resource^SM

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Programmable Active Droop™

QFET^®

TinyBoost™

TinyBuck™

QS™

Quiet Series™

RapidConfigure™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

™

Saving our world, 1mW/W/kW at a time™

SmartMax™

TinyWire™

TriFault Detect™

TRUECURRENT™*

µSerDes™

SMART START™

SPM^®

®

MicroPak™

MillerDrive™

MotionMax™

Motion-SPM™

OPTOLOGIC^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS™

SyncFET™

Fairchild^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

UHC^®

Ultra FRFET™

UniFET™

VCX™

VisualMax™

XS™

OPTOPLANAR^®

FAST^®

®

FastvCore™

FETBench™

PDP SPM™

Power-SPM™

Sync-Lock™

FlashWriter^®

®

*

FPS™

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR

CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain life,

and (c) whose failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be reasonably

expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.

Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,

and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of

counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are

listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have

full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.

Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide

any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our

customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status

Definition

Datasheet contains the design specifications for product development. Specifications may change in

any manner without notice.

Advance Information

Preliminary

Formative / In Design

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

First Production

Full Production

Not In Production

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes

at any time without notice to improve the design.

No Identification Needed

Obsolete

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I40

H11N1M, H11N2M, H11N3M Rev. 1.0.2

www.fairchildsemi.com

10


型号：	H11N1M
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	6-Pin DIP High Speed Logic Optocouplers 6引脚DIP高速逻辑光耦合器光电输出元件
文件：	总10页 (文件大小：248K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

H11N1M [FAIRCHILD]

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