ILC7010AIC530X [FAIRCHILD]
80mA SC70 Low Noise CMOS RF-LDO Regulator; 80毫安SC70低噪声CMOS RF- LDO稳压器
| 型号： | ILC7010AIC530X |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | 80mA SC70 Low Noise CMOS RF-LDO Regulator |
| 文件： | 总11页 (文件大小：371K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
www.fairchildsemi.com
ILC7010/7011
80mA SC70 Low Noise CMOS RF-LDO™ Regulator
Features
General Description
• 1% output voltage accuracy
• Low noise
The ILC7010/7011 is an 80mA, Ultra Low Noise, Low
Dropout (LDO) linear regulator, designed and processed in
CMOS technology. This process combines the best CMOS
features of low quiescent current, small size and low dropout
voltage with the best bipolar features of high ripple rejection,
ultra low noise and power handling capability. The ILC7010/
7011 offers a quiescent current of less than 100µA, a logic
level enable (regulator EN) pin, a footprint that is half the
size of the industry standard SOT-23, and a low dropout
voltage of 25mV at 10mA. With better than 70 dB (1kHz) of
ripple rejection, low noise of 40µV RMS and 1% output
voltage accuracy, the ILC7010/7011 sets a new standard in
linear regulators for communications and personal
• Only 75µA ground current at 80mA load
• Ripple rejection up to 75dB at 1kHz
• Excellent line and load transient response
• Guaranteed to 80mA output current
• Industry standard five lead SC70 packages
• Fixed 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V,
3.3V and custom output voltage options
Applications
• Cellular phones
• Wireless communicators
• PDAs / palmtops / organizers
• Battery powered portable electronics
electronics applications.
Block Diagram
VIN
Trans-
Error
conductance
Amplifier
Amplifier
Voltage
Reference
+
–
CN
(ILC7011
only)
VOUT
EN
Thermal
Shut
Down
GND
REV. 1.0.5 3/21/02
ILC7010/7011
PRODUCT SPECIFICATION
Test circuit
VIN
EN
VOUT
(CN)
VIN
CIN
COUT
RL
GND
CN
Figure 1.
Pin Configuration
VIN
VOUT
CN
EN
5
4
5
4
ILC7010
ILC7011
1
2
3
1
2
3
EN N/C GND
VOUT GND VIN
SC70
Pin Definition ILC7010
Pin Number
Pin Name
Pin Function Description
1
EN
Enable input. High level enables VOUT while Low level commands shutdown
mode and discharge COUT to GND
2
3
4
5
N/C
GND
VOUT
VIN
Not connected
Ground of the IC
Voltage output. Regulated output voltage
Supply voltage input
Pin Definition ILC7011
Pin Number
Pin Name
VOUT
GND
VIN
Pin Function Description
Voltage output. Regulated output voltage
Ground of the IC
1
2
3
4
Supply voltage input
EN
Enable input. High level enables VOUT while Low level commands shutdown
mode and discharge COUT to GND
5
CN
Optional noise bypass capacitor
2
REV. 1.0.5 3/21/02
PRODUCT SPECIFICATION
ILC7010/7011
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life
impaired. Functional operation under these conditions is not implied.
Parameter
Min.
Max.
Units
V
Supply Voltage
10
EN Input Voltage
-0.3
-0.3
VIN + 0.3
V
Output Voltage
VIN + 0.3
V
Junction Temperature (TJ)
Storage Temperature
Lead Soldering Temperature, 10 seconds
Power Dissipation (PD)
150, Internally limited
°C
°C
°C
mW
-40
150
300
150
Recommended Operating Conditions
Parameter
Conditions
Min.
Typ.
VOUT+VDO VOUT+1 VOUT+4
120
Max.
Units
Supply Voltage VDD
Peak Output Current
VIN to GND
V
IOUT to GND,
tpw=2mS
mA
Ambient Operating Temperature
TA
-40
85
°C
REV. 1.0.5 3/21/02
3
ILC7010/7011
PRODUCT SPECIFICATION
Electrical Specifications
VIN=VOUT+1V, IOUT=1mA, VEN=2V and TA = +25°C using circuit in Figure 1 with CIN=COUT=1µF, CN=0,
unless otherwise specified
Parameter
Symbol
VOUT
Conditions
Min.
Typ.
Max.
Units
Output Voltage
0.99
VOUTnom
1.01
V
VOUTnom
VOUTnom
Ground pin Current IGND
IOUT=10mA
70
90
90
µA
IOUT=80mA
110
Line Regulation
∆VOUT/VOUT
∆VIN
∆VOUT/VOUT IOUT=1 to 80mA
/
VIN: VOUT+1V to VOUT+2V
0.017
0.075
%/V
%
Load
Regulation
0.12
0.2
Dropout Voltage1,2
VDO
IOUT=10mA, VOUT>2.8V
25
50
30
60
mV
IOUT=20mA, VOUT>2.8V
IOUT=80mA, VOUT>2.8V
VEN=0
220
10
250
40
Shutdown
(OFF) current
IOFF
VEN
IEN
nA
V
EN Input Voltage
EN Input Current
High = ON state
Low = OFF state
2
0.6
VEN=0.6V
VEN=2V
0.3
1
µA
Output Noise
Voltage ILC7011
eN
BW=300Hz to 50kHz
CIN=COUT=2.2uF, CN=10nF
IOUT=10mA
40
µV
RMS
Ripple Rejection
PSRR
COUT=4.7uF, 120Hz
IOUT=80mA
65
10
15
1.5
dB
mV
mV
kΩ
Dynamic Line
Regulation
∆V
∆VIN=1V,IOUT=80mA,
tr/tf=2uS
OUT
(line)
Dynamic Load
Regulation
∆VOUT
(load)
∆IOUT=80mA, tr<5mS
Resistance
Discharge in OFF
state
RDISC
VEN=0
Notes:
1. For 2.5V < V
< 2.8V refer to diagram “Dropout Voltage vs. Output Voltage.”
OUT
2. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 2% below the nominal
value measured with 1V differential.
4
REV. 1.0.5 3/21/02
PRODUCT SPECIFICATION
ILC7010/7011
Typical Applications Diagrams
Thermal Protection
Load Transient Response
V
= V
+1V
V
= V
+1V, CN=0
IN
OUTnom
IN
OUT
Output to GND, I =0.5A/div
OUT
∆I =80mA
OUT
V
OUT(AC)
I
(0.1A/div)
OUT
Line Transient Response
∆V = V +1V to V +2V
ON/OFF Transient Response
Load=80mA,
IN
OUT
OUT
=2.2µF
Load=10mA, C
C
=1µF, CN=0
OUT
OUT
V
IN
V
EN
V
OUT(AC)
V
OUT
REV. 1.0.5 3/21/02
5
ILC7010/7011
PRODUCT SPECIFICATION
ON/OFF Transient Response
Load=10mA, C
=1µF
ON/OFF Transient Response
OUT
CN=10nF(ILC7011)
Load=10mA, C
=1µF, C =0
OUT N
V
V
EN
EN
V
V
OUT
OUT
Ground Current
120
110
100
90
80
70
60
50
40
30
20
10
0
80mA Load
No Load
0
1
2
3
4
5
6
7
8
Input Voltage (V)
Output Voltage
Dropout Voltage
2.830
2.825
300
250
1mA Load
25°C
200
2.820
2.815
2.810
85°C
80mA Load
150
100
-40°C
50
0
2.805
-40
-20
0
20
40
60
80
0
20
40
60
80
100
Temperature (C)
Load Current (mA)
6
REV. 1.0.5 3/21/02
PRODUCT SPECIFICATION
ILC7010/7011
Ripple Rejection
Load=10mA, C =4.7µF
Ripple Rejection
Load=80mA, C =4.7µF
OUT
OUT
Dropout Voltage vs. Output Voltage
400
350
300
250
200
150
100
50
80mA load
10mA load
0
2.5 2.75
3
3.25 3.5 3.75
VOUT (V)
4
4.25 4.5 4.75
5
REV. 1.0.5 3/21/02
7
ILC7010/7011
PRODUCT SPECIFICATION
Thermal Characteristics
Application Information
ILC7010/7011 is designed to supply up to 80mA at the
specified output voltage with an operating die (junction)
temperature of up to 125 °C. While the power dissipation is
calculated from known electrical parameters, the thermal
resistance is a result of the thermal characteristics of the
compact SC70 surface-mount package and the surrounding
PC Board copper to which it is mounted.
Capacitor Selection
In general ceramic capacitors are preferred due to their
superior ESR performance.Those with X5R dielectric
offer the best temperature coefficient.
An input capacitor of 1µF or greater, connected between
Input and Ground, located in close proximity to the device
will improve the transient response and the noise rejection.
The relationship describing the thermal behavior of the pack-
age is:
An output capacitor of at least 1µF is required to maintain
regulator loop stability. Stable operation will be achieved
with a wide variety of capacitors with ESR ranging from
10mΩ to 10Ω.
T
J(max) – TA
PD(max) = --------------------------------
ΘJA
where TJ(max) is the maximum junction temperature of the
die, which is 125 °C, and TA is the ambient operating
temperature. ΘJA is dependent on the surrounding PC
board layout and can be empirically obtained. While the
JC (junction-to-case) of the SC70 package is specified at
224 °C /W, the ΘJA of the minimum PWB footprint will be at
least 235 °C /W.
An optional capacitor connected between the CN pin and
ground can significantly reduce noise on the output.Values
ranging from 470pF to 10nF can be used, depending upon
the sensitivity to output noise in the application. Care should
be taken to prevent noise from external sources to enter into
the CN pin, which is a very sensitive, high impedance pin.
Leakage currents into this pin will directly affect the regula-
tor accuracy and should be kept as low as possible.
Θ
This can be improved upon by providing a heat sink of
surrounding copper ground on the PCB.
Control Functions
Enable Pin
Applying a voltage of 0.6V or less at the Enable pin will
disable the output, reducing the quiescent output current to
less than 1µA, while a voltage of 2V or greater will enable
the device. If this shutdown function is not needed,the pin
can simply be connected to the VIN pin. Allowing this pin to
float will cause erratic operation.
Depending on the size of the copper area, the resulting ΘJA
can range from approximately 180 °C /W for one square
inch, to nearly 130 °C /W for 4 square inches.
The addition of backside copper with through-holes, stiffen-
ers, and other enhancements can also aid in reducing this
value. The heat contributed by the dissipation of other
devices located nearby must be included in design consider-
ations.
Thermal Protection
Once the limiting parameters in the thermal relationship
have been determined, the electrical design should be
verified to ensure that the device remains within specified
operating conditions.
The ILC7010/7011 is designed to supply high peak output
currents for brief periods, however this output load will
cause the device temperature to increase and exceed maxi-
mum ratings due to power dissipation.During output over-
load conditions, when the die temperature exceeds the
shutdown limit temperature of 125 °C, onboard thermal
protection will disable the output until the temperature drops
below this limit, at which point the output is then re-enabled.
If overload conditions are not considered, it is possible for
the device to enter a thermal cycling loop, in which the
circuit enters a shutdown condition, cools, reenables, and
then again overheats and shuts down repeatedly due to an
unmanaged fault condition.
During a thermal shutdown situation the user may assert the
power-down function at the Enable pin, reducing power
consumption to the minimum level.
8
REV. 1.0.5 3/21/02
PRODUCT SPECIFICATION
ILC7010/7011
The proximity of the output capacitor is especially important
to achieve optimal noise compensation from the onboard
error amplifier, especially during high load conditions.
General PCB Layout Considerations
To achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish-
ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane.
A large copper area in the local ground will provide the heat
sinking discussed above when high power dissipation signif-
icantly increases the temperature of the device.
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.
The quiet local ground is then routed back to the main
ground plane using feedthrough vias.
In general, the high frequency compensation components
(input, bypass, and output capacitors)should be located as
close to the device as possible.
REV. 1.0.5 3/21/02
9
ILC7010/7011
PRODUCT SPECIFICATION
Mechanical Dimensions
5 Lead SC70
0.65
-A-
2.00 0.20
.5 min
0.65
5
1
4
1.9
1.25 0.10 2.10 0.10
-B-
2
3
0.4 min
+0.10
0.20
0.25
-0.05
LAND PATTERN RECOMMENDATION
SEE DETAIL A
M
max 0.1
0.25
0.10
0.9 .10
0.95 .15
0.10
0.00
6.00°
max 0.1
R0.14
GAGE PLANE
R0.10
0°-30°
0.20
6.00°
0.45
0.10
0.425 NOMINAL
DETAIL A
NOTES:
A. CONFORMS TO EIAJ REGISTERED OUTLINE DRAWING SC88A.
B. DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH.
C. DIMENSIONS ARE IN MILLIMETERS.
10
REV. 1.0.5 3/21/02
ILC7010/7011
PRODUCT SPECIFICATION
Ordering Information
Output Voltage
Part Number
ILC7010AIC525X
ILC7010AIC526X
ILC7010AIC527X
ILC7010AIC528X
ILC7010AIC5285X
ILC7010AIC529X
ILC7010AIC530X
ILC7010AIC531X
ILC7010AIC533X
Temperature Range
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
Package
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
2.5
2.6
2.7
2.8
2.85
2.9
3.0
3.1
3.3
Output Voltage
Part Number
ILC7011AIC525X
ILC7011AIC526X
ILC7011AIC527X
ILC7011AIC528X
ILC7011AIC5285X
ILC7011AIC529X
ILC7011AIC530X
ILC7011AIC531X
ILC7011AIC533X
Temperature Range
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
-40 to 85 °C
Package
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
2.5
2.6
2.7
2.8
2.85
2.9
3.0
3.1
3.3
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
3/21/02 0.0m 002
Stock#DS30007010
2002 Fairchild Semiconductor Corporation
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