ISL9R30120G2_NL [FAIRCHILD]

Rectifier Diode, 1 Phase, 1 Element, 30A, 1200V V(RRM), Silicon, TO-247, ROHS COMPLIANT, TO-247, 2 PIN;
ISL9R30120G2_NL
型号: ISL9R30120G2_NL
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Rectifier Diode, 1 Phase, 1 Element, 30A, 1200V V(RRM), Silicon, TO-247, ROHS COMPLIANT, TO-247, 2 PIN

软恢复二极管 快速软恢复二极管 局域网
文件: 总6页 (文件大小:112K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 2002  
ISL9R30120G2  
30A, 1200V Stealth™ Diode  
General Description  
Features  
Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . .t / t > 4.5  
b a  
The ISL9R30120G2 is a Stealth™ diode optimized for low loss  
performance in high frequency hard switched applications. The  
Stealth™ family exhibits low reverse recovery current  
Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . t < 56ns  
rr  
o
Operating Temperature . . . . . . . . . . . . . . . . . . . . 150 C  
(I  
) and exceptionally soft recovery under typical  
RM(REC)  
Reverse Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . 1200V  
Avalanche Energy Rated  
operating conditions.  
This device is intended for use as a free wheeling or boost  
diode in power supplies and other power switching  
Applications  
applications. The low I  
and short t phase reduce loss  
RM(REC)  
a
Switch Mode Power Supplies  
Hard Switched PFC Boost Diode  
UPS Free Wheeling Diode  
Motor Drive FWD  
in switching transistors. The soft recovery minimizes ringing,  
expanding the range of conditions under which the diode may  
be operated without the use of additional snubber circuitry.  
Consider using the Stealth™ diode with a 1200V NPT IGBT to  
provide the most efficient and highest power density design at  
lower cost.  
SMPS FWD  
Formerly developmental type TA49415.  
Snubber Diode  
Package  
Symbol  
JEDEC STYLE 2 LEAD TO-247  
ANODE  
CATHODE  
K
CATHODE  
(BOTTOM SIDE  
METAL)  
A
Device Maximum Ratings T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Ratings  
Units  
V
V
Repetitive Peak Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
1200  
1200  
1200  
30  
RRM  
RWM  
V
V
V
V
R
o
I
Average Rectified Forward Current (T = 80 C)  
A
F(AV)  
C
I
Repetitive Peak Surge Current (20kHz Square Wave)  
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz)  
Power Dissipation  
70  
A
FRM  
I
325  
A
FSM  
P
166  
W
mJ  
°C  
D
E
Avalanche Energy (1A, 40mH)  
20  
AVL  
T , T  
Operating and Storage Temperature Range  
-55 to 150  
J
STG  
T
Maximum Temperature for Soldering  
L
T
Leads at 0.063in (1.6mm) from Case for 10s  
Package Body for 10s, See Application Note AN-7528  
300  
260  
°C  
°C  
PKG  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and  
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
©2002 Fairchild Semiconductor Corporation  
ISL9R30120G2 Rev. A  
Package Marking and Ordering Information  
Device Marking  
R30120G2  
Device  
Package  
TO-247  
Tape Width  
N/A  
Quantity  
30  
ISL9R30120G2  
Electrical Characteristics T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max Units  
Off State Characteristics  
I
Instantaneous Reverse Current  
V
= 1200V  
T
T
= 25°C  
-
-
-
-
100  
1.0  
µA  
R
R
C
C
= 125°C  
mA  
On State Characteristics  
V
Instantaneous Forward Voltage  
I = 30A  
T
T
= 25°C  
-
-
2.8  
2.6  
3.3  
3.1  
V
V
F
F
C
C
= 125°C  
Dynamic Characteristics  
C
Junction Capacitance  
V
= 10V, I = 0A  
-
115  
-
pF  
J
R
F
Switching Characteristics  
t
Reverse Recovery Time  
I
I
I
= 1A, dI /dt = 100A/µs, V = 15V  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
45  
80  
56  
ns  
ns  
ns  
A
rr  
F
F
F
F
R
= 30A, dI /dt = 100A/µs, V = 15V  
100  
F
R
t
Reverse Recovery Time  
= 30A,  
269  
7.5  
930  
529  
6.2  
11  
-
-
-
-
-
-
-
-
-
-
-
-
rr  
dI /dt = 200A/µs,  
V
I
I
I
Maximum Reverse Recovery Current  
Reverse Recovered Charge  
Reverse Recovery Time  
F
RM(REC)  
= 780V, T = 25°C  
C
R
Q
nC  
ns  
-
RR  
t
I = 30A,  
F
dI /dt = 200A/µs,  
V
T
rr  
S
Softness Factor (t /t )  
F
b
a
= 780V,  
= 125°C  
R
C
Maximum Reverse Recovery Current  
Reverse Recovered Charge  
Reverse Recovery Time  
A
RM(REC)  
Q
3.0  
260  
4.8  
30  
µC  
ns  
-
RR  
t
I = 30A,  
F
dI /dt = 1000A/µs,  
V
T
rr  
S
Softness Factor (t /t )  
F
b
a
= 780V,  
= 125°C  
R
C
Maximum Reverse Recovery Current  
Reverse Recovered Charge  
A
RM(REC)  
Q
3.4  
520  
µC  
A/µs  
RR  
dI /dt  
Maximum di/dt during t  
b
M
Thermal Characteristics  
R
R
Thermal Resistance Junction to Case  
TO-247  
-
-
-
-
0.75 °C/W  
30 °C/W  
θJC  
θJA  
Thermal Resistance Junction to Ambient TO-247  
©2002 Fairchild Semiconductor Corporation  
ISL9R30120G2 Rev. A  
Typical Performance Curves  
60  
1000  
100  
10  
o
150 C  
o
50  
125 C  
o
150 C  
o
100 C  
40  
o
125 C  
o
75 C  
30  
1
o
100 C  
20  
10  
0
o
o
25 C  
0.1  
25 C  
0.01  
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2  
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V , FORWARD VOLTAGE (V)  
V
, REVERSE VOLTAGE (KV)  
F
R
Figure 1. Forward Current vs Forward Voltage  
Figure 2. Reverse Current vs Reverse Voltage  
750  
750  
o
o
V
= 780V, T = 125 C  
C
V
= 780V, T = 125 C  
C
R
R
625  
500  
375  
250  
125  
0
625  
500  
375  
250  
125  
0
t
at dI /dt = 200A/µs, 500A/µs, 800A/µs  
F
b
t
at I = 60A, 30A, 15A  
F
b
t
at dI /dt = 200A/µs, 500A/µs, 800A/µs  
F
a
t
at I = 60A, 30A, 15A  
F
a
0
10  
20  
30  
40  
50  
60  
200  
400  
600  
800  
1000  
1200  
I
, FORWARD CURRENT (A)  
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
F
F
Figure 3. t and t Curves vs Forward Current  
Figure 4. t and t Curves vs dI /dt  
a
b
a
b
F
40  
30  
20  
10  
0
40  
35  
30  
25  
20  
15  
10  
o
o
V
= 780V, T = 125 C  
V = 780V, T = 125 C  
R C  
R
C
dI /dt = 800A/µs  
F
dI /dt = 500A/µs  
F
I
= 60A  
F
dI /dt = 200A/µs  
F
I
= 30A  
F
I
= 15A  
F
0
10  
20  
30  
40  
50  
60  
200  
400  
600  
800  
1000  
1200  
I
, FORWARD CURRENT (A)  
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
F
F
Figure 5. Maximum Reverse Recovery Current vs  
Forward Current  
Figure 6. Maximum Reverse Recovery Current vs  
dI /dt  
F
©2002 Fairchild Semiconductor Corporation  
ISL9R30120G2 Rev. A  
Typical Performance Curves (Continued)  
6.0  
5.6  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
9
o
o
V
= 780V, T = 125 C  
C
V
= 780V, T = 125 C  
R
R
C
I
= 60A  
8
7
6
5
4
3
F
I
= 60A  
F
I
= 30A  
= 15A  
F
I
I
= 30A  
= 15A  
F
F
I
F
200  
400  
600  
800  
1000  
1200  
200  
400  
600  
800  
1000  
1200  
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
F
F
Figure 7. Reverse Recovery Softness Factor vs  
Figure 8. Reverse Recovery Charge vs dI /dt  
F
dI /dt  
F
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
-14  
-16  
-18  
-20  
-22  
400  
350  
300  
250  
200  
f = 1MHZ  
I
= 30A, V = 780V, dI /dt = 500A/µs  
F
R
F
I
RM(REC)  
t
RR  
0.03  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
V
, REVERSE VOLTAGE (V)  
o
R
T
, CASE TEMPERATURE ( C)  
C
Figure 9. Junction Capacitance vs Reverse Voltage  
Figure 10. Maximum Reverse Recovery Current  
and t vs Case Temperature  
rr  
35  
30  
25  
20  
15  
10  
5
0
60  
70  
80  
90  
100  
110  
120  
130  
140  
150  
TC, CASE TEMPERATURE (oC)  
Figure 11. DC CURRENT DERATING CURVE  
©2002 Fairchild Semiconductor Corporation  
ISL9R30120G2 Rev. A  
Typical Performance Curves (Continued)  
DUTY CYCLE - DESCENDING ORDER  
0.5  
0.2  
1.0  
0.1  
0.05  
0.02  
0.01  
PDM  
0.1  
t1  
t2  
NOTES:  
DUTY FACTOR: D = t1/t2  
SINGLE PULSE  
10-4  
PEAK TJ = PDM x Z JA x R JA + TA  
θ
θ
0.01  
10-5  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION (s)  
Figure 12. Normalized Maximum Transient Thermal Impedance  
Test Circuit and Waveforms  
VGE AMPLITUDE AND  
RG CONTROL dIF/dt  
L
t1 AND t2 CONTROL IF  
dIF  
dt  
t
rr  
IF  
t
t
b
a
DUT  
CURRENT  
SENSE  
0
RG  
+
0.25 IRM  
IRM  
VDD  
VGE  
-
MOSFET  
t1  
t2  
Figure 13. t Test Circuit  
Figure 14. t Waveforms and Definitions  
rr  
rr  
I = 1A  
L = 40mH  
R < 0.1  
V
DD = 50V  
EAVL = 1/2LI2 [VR(AVL)/(VR(AVL) - VDD)]  
1 = IGBT (BVCES > DUT VR(AVL)  
VAVL  
Q
)
L
R
+
VDD  
CURRENT  
SENSE  
IL  
IL  
Q1  
I
V
VDD  
DUT  
-
t0  
t1  
t2  
t
Figure 15. Avalanche Energy Test Circuit  
Figure 16. Avalanche Current and Voltage  
Waveforms  
©2002 Fairchild Semiconductor Corporation  
ISL9R30120G2 Rev. A  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarksꢀ  
â
â
SILENT SWITCHER  
SMARTSTART™  
SPM™  
STAR*POWER™  
Stealth™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
UHC™  
UltraFET  
VCX™  
FAST  
ACEx™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DenseTrench™  
DOME™  
MICROWIRE™  
OPTOLOGIC  
OPTOPLANAR™  
PACMAN™  
POP™  
â
â
FASTr™  
FRFET™  
GlobalOptoisolator™  
GTO™  
HiSeC™  
Power247™  
I2C™  
â
EcoSPARK™  
PowerTrench  
E2CMOSTM  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MicroPak™  
QFET™  
QS™  
QT Optoelectronics™  
Quiet Series™  
EnSignaTM  
TinyLogic™  
TruTranslation™  
FACT™  
FACT Quiet Series™  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGNꢀ FAIRCHILD  
DOES NOTASSUMEANY LIABILITYARISING OUT OF THEAPPLICATION OR USE OFANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERSꢀ  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATIONꢀ  
As used herein:  
1ꢀ Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
userꢀ  
2ꢀ A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectivenessꢀ  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product developmentꢀ Specifications may change in  
any manner without noticeꢀ  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later dateꢀ  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
designꢀ  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specificationsꢀ Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve designꢀ  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductorꢀ  
The datasheet is printed for reference information onlyꢀ  
Revꢀ H5  

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