ISL9R860S3SL86Z [FAIRCHILD]

Rectifier Diode, 1 Phase, 1 Element, 8A, 600V V(RRM), Silicon, TO-263AB,;
ISL9R860S3SL86Z
型号: ISL9R860S3SL86Z
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Rectifier Diode, 1 Phase, 1 Element, 8A, 600V V(RRM), Silicon, TO-263AB,

文件: 总6页 (文件大小:82K)
中文:  中文翻译
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January 2002  
ISL9R860P2, ISL9R860S2, ISL9R860S3S  
8A, 600V Stealth™ Diode  
General Description  
Features  
• Soft Recovery. . . . . . . . . . . . . . . . . . . .t / t > 2.5  
b
a
The ISL9R860P2, ISL9R860S2 and ISL9R860S3S are  
Stealth™ diodes optimized for low loss performance in  
high frequency hard switched applications. The  
• Fast Recovery . . . . . . . . . . . . . . . . . . . . t < 25ns  
rr  
o
• Operating Temperature . . . . . . . . . . . . . . . 175 C  
Stealth™ family exhibits low reverse recovery current  
(I  
) and exceptionally soft recovery under typical  
RRM  
• Reverse Voltage. . . . . . . . . . . . . . . . . . . . . . 600V  
• Avalanche Energy Rated  
operating conditions.  
This device is intended for use as a free wheeling or  
boost diode in power supplies and other power  
switching applications. The low I  
reduce loss in switching transistors. The soft recovery  
minimizes ringing, expanding the range of conditions  
under which the diode may be operated without the use  
of additional snubber circuitry. Consider using the  
Stealth™ diode with an SMPS IGBT to provide the  
most efficient and highest power density design at  
lower cost.  
Applications  
• Switch Mode Power Supplies  
and short t phase  
RRM  
a
• Hard Switched PFC Boost Diode  
• UPS Free Wheeling Diode  
• Motor Drive FWD  
• SMPS FWD  
Formerly developmental type TA49409.  
• Snubber Diode  
Package  
Symbol  
JEDEC TO-263AB  
JEDEC TO-220AC  
JEDEC STYLE TO-262  
K
ANODE  
CATHODE  
CATHODE  
(FLANGE)  
ANODE  
CATHODE  
CATHODE  
(FLANGE)  
A
CATHODE  
(FLANGE)  
N/C  
ANODE  
Device Maximum Ratings T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Ratings  
600  
Units  
V
V
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
RRM  
V
600  
V
RWM  
V
600  
V
R
I
Average Rectified Forward Current  
8
A
F(AV)  
I
Repetitive Peak Surge Current (20kHz Square Wave)  
16  
A
FRM  
I
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz)  
Power Dissipation  
100  
A
FSM  
P
85  
W
mJ  
˚C  
D
E
Avalanche Energy (1A, 40mH)  
20  
AVL  
T , T  
Operating and Storage Temperature Range  
-55 to 175  
J
STG  
T
Maximum Temperature for Soldering  
L
T
Leads at 0.063in (1.6mm) from Case for 10s  
Package Body for 10s, See Techbrief TB334  
300  
260  
˚C  
˚C  
PKG  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and  
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
©2002 Fairchild Semiconductor Corporation  
ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. B  
Package Marking and Ordering Information  
Device Marking  
R860P2  
Device  
Package  
TO-220AC  
TO-262  
Tape Width  
Quantity  
ISL9R860P2  
ISL9R860S2  
ISL9R860S3S  
ISL9R860S3ST  
-
-
R860S2  
-
-
-
-
R860S3S  
R860S3S  
TO-263AB  
TO-263AB  
24mm  
800  
Electrical Characteristics T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max Units  
Off State Characteristics  
I
Instantaneous Reverse Current  
V
= 600V  
T
T
= 25˚C  
-
-
-
-
100  
1.0  
µA  
mA  
R
R
C
= 125˚C  
C
On State Characteristics  
V
Instantaneous Forward Voltage  
I = 8A  
T
T
= 25˚C  
-
-
2.0  
1.6  
2.4  
2.0  
V
V
F
F
C
= 125˚C  
C
Dynamic Characteristics  
C
Junction Capacitance  
V
= 10V, I = 0A  
-
30  
-
pF  
J
R
F
Switching Characteristics  
t
Reverse Recovery Time  
I = 1A, dI /dt = 100A/µs, V = 30V  
-
-
-
-
-
-
-
-
-
-
-
-
18  
21  
25  
30  
-
ns  
ns  
ns  
A
rr  
F
F
R
I = 8A, dI /dt = 100A/µs, V = 30V  
F
F
R
t
Reverse Recovery Time  
I = 8A,  
28  
rr  
F
dI /dt = 200A/µs,  
I
I
I
Maximum Reverse Recovery Current  
Reverse Recovery Charge  
Reverse Recovery Time  
F
3.2  
50  
-
RRM  
V
= 390V, T = 25˚C  
R
C
Q
-
nC  
ns  
RR  
t
I = 8A,  
77  
-
rr  
F
dI /dt = 200A/µs,  
S
Softness Factor (t /t )  
F
3.  
b
a
V
T
= 390V,  
= 125˚C  
R
C
Maximum Reverse Recovery Current  
Reverse Recovery Charge  
3.4  
150  
53  
-
-
-
A
RRM  
Q
nC  
ns  
RR  
t
Reverse Recovery Time  
I = 8A,  
F
rr  
dI /dt = 600A/µs,  
S
Softness Factor (t /t )  
F
2.  
b
a
V
T
= 390V,  
= 125˚C  
R
C
Maximum Reverse Recovery Current  
Reverse Recovery Charge  
6.5  
195  
500  
-
-
-
A
RRM  
Q
nC  
RR  
dI /dt  
Maximum di/dt during t  
-
A/µs  
M
b
Thermal Characteristics  
R
R
R
R
Thermal Resistance Junction to Case  
-
-
-
-
-
-
1.75 ˚C/W  
θJC  
θJA  
θJA  
θJA  
Thermal Resistance Junction to Ambient TO-220  
Thermal Resistance Junction to Ambient TO-262  
Thermal Resistance Junction to Ambient TO-263  
62  
62  
62  
˚C/W  
˚C/W  
˚C/W  
©2002 Fairchild Semiconductor Corporation  
ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. B  
Typical Performance Curves  
16  
100  
10  
o
175 C  
o
175 C  
14  
12  
10  
8
o
o
150 C  
150 C  
o
25 C  
o
125 C  
o
125 C  
o
100 C  
o
100 C  
6
1
4
o
25 C  
2
0.1  
0
0
0.25 0.5 0.75  
1
1.25 1.5 1.75  
2
2.25 2.5 2.75  
100  
200  
300  
400  
500  
600  
V , FORWARD VOLTAGE (V)  
V
, REVERSE VOLTAGE (V)  
F
R
Figure 1.Forward Current vs Forward Voltage  
Figure 2.Reverse Current vs Reverse Voltage  
80  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VR = 390V, TJ = 125˚C  
tb AT IF = 16A, 8A, 4A  
VR = 390V, TJ = 125˚C  
70  
tb AT dIF/dt = 200A/µs, 500A/µs, 800A/µs  
60  
50  
40  
30  
20  
10  
ta AT dIF/dt = 200A/µs, 500A/µs, 800A/µs  
ta AT IF = 16A, 8A, 4A  
0
0
2
4
6
8
10  
12  
14  
16  
100  
200  
300 400  
500 600  
700 800 900 1000  
IF, FORWARD CURRENT (A)  
dIF/dt, CURRENT RATE OF CHANGE (A/µs)  
Figure 3.t and t Curves vs Forward Current  
Figure a4n.td t Curves vs dI /dt  
a
b
a
b
F
14  
12  
10  
8
11  
10  
9
V
= 390V, T = 125˚C  
J
R
dI /dt = 800A/µs  
F
V
= 390V, T = 125˚C  
J
R
I
= 16A  
F
8
dI /dt = 500A/µs  
F
I
= 8A  
F
7
6
I
= 4A  
6
F
5
dI /dt = 200A/µs  
F
4
4
2
3
2
0
0
2
4
6
8
10  
12  
14  
16  
100  
200  
300  
400  
500  
600  
700  
800  
900 1000  
I , FORWARD CURRENT (A)  
F
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
F
Figure 5.Maximum Reverse Recovery Current vs Figure 6.Maximum Reverse Recovery Current vs  
Forward Current dI /dt  
F
©2002 Fairchild Semiconductor Corporation  
ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. B  
Typical Performance Curves (Continued)  
350  
300  
250  
200  
150  
100  
50  
6
V
= 390V, T = 125˚C  
J
V
= 390V, T = 125˚C  
J
R
R
5
4
3
2
1
I
I
I
= 16A  
= 8A  
= 4A  
F
I
I
= 16A  
F
F
I
= 8A  
F
F
F
= 4A  
400  
100  
200  
300  
500  
600  
700  
800  
900 1000  
100  
200  
300  
400  
500  
600  
700  
800  
900 1000  
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
F
dI /dt, CURRENT RATE OF CHANGE (A/µs)  
F
Figure 7.Reverse Recovery Softness Factor vs  
dI /dt  
Figure 8.Reverse Recovery Charge vs/ddtI  
F
F
1200  
1000  
800  
600  
400  
200  
0
0.1  
1
10  
100  
V
, REVERSE VOLTAGE (V)  
R
Figure 9. Junction Capacitance vs Reverse Voltage  
DUTY CYCLE - DESCENDING ORDER  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
1.0  
0.1  
P
DM  
t
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
1
2
SINGLE PULSE  
10-4  
PEAK T = P x Z  
x R  
+ T  
JA A  
J
DM  
JA  
θ
θ
0.01  
10-5  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION (s)  
Figure 10. Normalized Maximum Transient Thermal Impedance  
©2002 Fairchild Semiconductor Corporation  
ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. B  
Test Circuit and Waveforms  
VGE AMPLITUDE AND  
RG CONTROL dIF/dt  
L
t1 AND t2 CONTROL IF  
dIF  
dt  
t
rr  
IF  
t
t
b
a
DUT  
CURRENT  
SENSE  
0
RG  
+
0.25 IRM  
IRM  
VDD  
VGE  
-
MOSFET  
t1  
t2  
Figure 11. It Test Circuit  
Figure 12.t Waveforms and Definitions  
rr  
rr  
I = 1A  
L = 40mH  
R < 0.1Ω  
VDD = 50V  
E
AVL = 1/2LI2 [VR(AVL)/(VR(AVL) - VDD)]  
VAVL  
Q
1 = IGBT (BVCES > DUT VR(AVL))  
L
R
+
VDD  
CURRENT  
SENSE  
IL  
IL  
Q1  
I
V
VDD  
DUT  
-
t0  
t1  
t2  
t
Figure 13. Avalanche Energy Test Circuit  
Figure 14.Avalanche Current and Voltage  
Waveforms  
©2002 Fairchild Semiconductor Corporation  
ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. B  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
â
SMART START™  
STAR*POWER™  
Stealth™  
VCX™  
FAST  
ACEx™  
Bottomless™  
CoolFET™  
OPTOLOGIC™  
OPTOPLANAR™  
PACMAN™  
FASTr™  
FRFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
GlobalOptoisolator™  
GTO™  
HiSeC™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MicroPak™  
MICROWIRE™  
CROSSVOLT™  
DenseTrench™  
DOME™  
POP™  
Power247™  
PowerTrenchâ  
QFET™  
EcoSPARK™  
E2CMOSTM  
TinyLogic™  
QS™  
EnSignaTM  
TruTranslation™  
UHC™  
QT Optoelectronics™  
Quiet Series™  
SILENTSWITCHERâ  
FACT™  
FACT Quiet Series™  
UltraFETâ  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOT ASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OFANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICESORSYSTEMSWITHOUTTHEEXPRESSWRITTENAPPROVALOFFAIRCHILDSEMICONDUCTORCORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. H4  

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