MCT6S [FAIRCHILD]

DUAL PHOTOTRANSISTOR OPTOCOUPLERS; 双通道光电晶体管光电耦合器
MCT6S
型号: MCT6S
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

DUAL PHOTOTRANSISTOR OPTOCOUPLERS
双通道光电晶体管光电耦合器

晶体 光电 晶体管 光电晶体管
文件: 总8页 (文件大小:512K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
DESCRIPTION  
The MCT6X Optocouplers have two channels for density applications. For four  
channel applications, two-packages fit into a standard 16-pin DIP socket. Each  
channel is an NPN silicon planar phototransistor optically coupled to a gallium  
arsenide infrared emitting diode.  
8
1
FEATURES  
Two isolated channels per package  
Two packages fit into a 16 lead DIP socket  
Choice of three current transfer ratios  
8
8
1
1
Underwriters Laboratory (U.L.) recognized File E90700  
SCHEMATIC  
APPLICATIONS  
ANODE  
EMITTER  
1
8
AC Line/Digital Logic - isolate high voltage transients  
Digital Logic/Digital Logic - Eliminate spurious grounds  
Digital Logic/AC Triac Control - isolate high voltage transients  
Twisted pair line receiver - Eliminate ground loop feedthrough  
Telephone/Telegraph line receiver - isolate high voltage transients  
High Frequency Power Supply Feedback Control - Maintain floating grounds and  
transients  
CATHODE  
CATHODE  
COLLECTOR  
COLLECTOR  
2
3
4
7
6
5
ANODE  
EMITTER  
Relay contact monitor - isolate floating grounds and transients  
Power supply monitor - Isolate transients  
Equivalent Circuit  
ABSOLUTE MAXIMUM RATINGS  
Rating  
EMITTER (Each channel)  
Symbol  
Value  
Unit  
Forward Current - Continuous  
Forward Current - Peak (PW = 1µs, 300pps)  
Reverse Voltage  
I
60  
3
mA  
A
F
I (pk)  
F
V
3.0  
V
R
LED Power Dissipation @ T = 25°C  
100  
1.3  
mW  
mW/°C  
A
P
D
Derate above 25°C (Total Input)  
DETECTOR (Each channel)  
Collector Current - Continuous  
I
30  
mA  
C
Detector Power Dissipation @ T = 25°C  
Derate above 25°C  
150  
2.0  
mW  
mW/°C  
A
P
D
TOTAL DEVICE  
Storage Temperature  
T
-55 to +150  
-55 to +100  
°C  
°C  
°C  
STG  
Operating Temperature  
Lead Solder Temperature (wave solder)  
T
OPR  
T
250 for 10 sec  
SOL  
Total Device Power Dissipation @ T = 25°C  
Derate above 25°C  
400  
5.33  
mW  
mW/°C  
A
P
D
© 2003 Fairchild Semiconductor Corporation  
Page 1 of 8  
10/20/04  
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specified.)  
A
INDIVIDUAL COMPONENT CHARACTERISTICS  
Parameter  
Test Conditions Symbol  
Min  
Typ**  
Max  
Unit  
EMITTER  
Input Forward Voltage  
Reverse Voltage  
(I = 20 mA)  
V
1.2  
25  
1.5  
10  
V
V
F
F
(I = 10 µA)  
V
3.0  
R
R
Reverse Current  
(V = 5 V)  
I
0.001  
50  
µA  
pF  
R
R
Junction Capacitance  
DETECTOR  
(V = 0 V, f = 1 MHz)  
C
J
F
Collector-Emitter Breakdown Voltage  
Emitter-Collector Breakdown Voltage  
Collector-Emitter Dark Current  
Capacitance  
(I = 1.0 mA, I = 0)  
BV  
BV  
30  
6
85  
13  
5
V
V
C
F
CEO  
ECO  
(I = 100 µA, I = 0)  
E
F
(V = 10 V, I = 0)  
I
CEO  
100  
nA  
pF  
CE  
F
(V = 0 V, f = 1 MHz)  
C
8
CE  
CE  
TRANSFER CHARACTERISTICS  
AC Characteristic  
SWITCHING TIMES  
Test Conditions Symbol  
Min  
Typ**  
Max  
Units  
Non-Saturated Turn-on Time  
Non-Saturated Turn-off Time  
(R = 100 , I = 2 mA, V = 10 V)  
t
2.4  
2.4  
µs  
µs  
L
C
CC  
on  
(R = 100 , I = 2 mA, V = 10 V)  
t
L
C
CC  
off  
TRANSFER CHARACTERISTICS  
DC Characteristic  
Test Conditions Symbol  
Min  
Typ**  
Max  
Units  
Current Transfer Ratio, Collector-Emitter  
MCT6  
(I = 10 mA, V = 10 V)  
20  
50  
F
CE  
CTR  
MCT61  
%
V
(I = 5 mA, V = 5 V)  
F
CE  
MCT62  
100  
Saturation Voltage  
(I = 16 mA, I = 2 mA)  
V
0.15  
0.40  
F
C
CE(sat)  
ISOLATION CHARACTERISTICS  
Characteristic  
Test Conditions Symbol  
Min  
Typ**  
Max  
Units  
Input-Output Isolation Voltage  
Isolation Resistance  
(I 1 µA, t = 1 min.)  
V
R
C
5300  
Vac(rms)  
I-O  
ISO  
ISO  
ISO  
11  
(V = 500 VDC)  
10  
I-O  
Isolation Capacitance  
(f = 1 MHz)  
0.5  
pf  
** All typicals at TA = 25°C  
© 2003 Fairchild Semiconductor Corporation  
Page 2 of 8  
10/20/04  
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
Normalized CTR vs. Ambient Temperature  
Normalized CTR vs. Forward Current  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
V
T
= 5.0V  
Normalized to  
= 10 mA  
CE  
= 25˚C  
I
F
A
1.4  
I
= 5 mA  
F
1.2  
1.0  
0.8  
0.6  
0.4  
I
= 10 mA  
F
Normalized to  
= 10 mA  
I
= 20 mA  
F
I
F
T
= 25˚C  
A
0.0  
0
5
10  
15  
20  
-75  
-50  
-25  
0
25  
50  
75  
100 125  
I
F
- FORWARD CURRENT (mA)  
T
A
- AMBIENT TEMPERATURE (˚C)  
Dark Current vs. Ambient Temperature  
101  
V
CE  
= 10 V  
100  
10-1  
10-2  
10-3  
10-4  
10-5  
10-6  
0
25  
50  
75  
100  
125  
T
A
- AMBIENT TEMPERATURE (˚C)  
© 2003 Fairchild Semiconductor Corporation  
Page 3 of 8  
10/20/04  
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
Switching Speed vs. Load Resistor  
LED Forward Voltage vs. Forward Current  
1.8  
1000  
I
V
T
= 10 mA  
F
1.7  
1.6  
1.5  
1.4  
= 10 V  
CC  
= 25˚C  
A
100  
10  
1
T
T
off  
T
f
T
T
= 55˚C  
= 25˚C  
A
A
1.3  
1.2  
1.1  
1.0  
on  
T
r
T
= 100˚C  
A
0.1  
0.1  
1
10  
100  
1
10  
IF - LED FORWARD CURRENT (mA)  
100  
R-LOAD RESISTOR (k)  
Collector-Emitter Saturation Voltage vs Collector Current  
100  
T
A
= 25˚C  
10  
1
I
F
= 2.5 mA  
0.1  
0.01  
0.001  
I
F
= 10 mA  
I = 20 mA  
F
I
F
= 5 mA  
0.01  
0.1  
1
10  
I
C - COLLECTOR CURRENT (mA)  
© 2003 Fairchild Semiconductor Corporation  
Page 4 of 8  
10/20/04  
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
Package Dimensions (Through Hole)  
Package Dimensions (Surface Mount)  
0.390 (9.91)  
0.370 (9.40)  
PIN 1  
ID.  
PIN 1  
ID.  
0.270 (6.86)  
0.250 (6.35)  
0.270 (6.86)  
0.250 (6.35)  
0.390 (9.91)  
0.370 (9.40)  
0.070 (1.78)  
0.045 (1.14)  
0.300 (7.62)  
TYP  
0.070 (1.78)  
0.045 (1.14)  
0.020 (0.51) MIN  
0.200 (5.08)  
0.140 (3.55)  
0.020 (0.51)  
MIN  
0.016 (0.41)  
0.008 (0.20)  
0.154 (3.90)  
0.120 (3.05)  
0.045 [1.14]  
0.022 (0.56)  
0.016 (0.41)  
0.022 (0.56)  
0.016 (0.41)  
15° MAX  
0.016 (0.40)  
0.008 (0.20)  
0.315 (8.00)  
MIN  
0.300 (7.62)  
TYP  
0.100 (2.54)  
TYP  
0.100 (2.54) TYP  
0.405 (10.30)  
MIN  
Lead Coplanarity : 0.004 (0.10) MAX  
Package Dimensions (0.4"Lead Spacing)  
Recommended Pad Layout for  
Surface Mount Leadform  
PIN 1  
ID.  
0.070 (1.78)  
0.270 (6.86)  
0.250 (6.35)  
0.060 (1.52)  
0.390 (9.91)  
0.370 (9.40)  
0.100 (2.54)  
0.295 (7.49)  
0.415 (10.54)  
0.070 (1.78)  
0.045 (1.14)  
0.030 (0.76)  
0.004 (0.10) MIN  
0.200 (5.08)  
0.140 (3.55)  
0.154 (3.90)  
0.120 (3.05)  
0.022 (0.56)  
0.016 (0.41)  
0° to 15°  
0.016 (0.40)  
0.008 (0.20)  
0.400 (10.16)  
TYP  
0.100 (2.54) TYP  
NOTE  
All dimensions are in inches (millimeters)  
© 2003 Fairchild Semiconductor Corporation  
Page 5 of 8  
10/20/04  
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
ORDERING INFORMATION  
Order  
Option  
Entry  
Description  
Identifier  
S
.S  
.SD  
.W  
Surface Mount Lead Bend  
Surface Mount; Tape and reel  
0.4” Lead Spacing  
SD  
W
MARKING INFORMATION  
1
2
MCT6  
6
V XX YY T1  
5
3
4
Definitions  
1
2
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option – See order entry table)  
3
4
5
6
Two digit year code, e.g., ‘03’  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
© 2003 Fairchild Semiconductor Corporation  
Page 6 of 8  
10/20/04  
DUAL PHOTOTRANSISTOR  
OPTOCOUPLERS  
MCT6  
MCT61  
MCT62  
Carrier Tape Specifications  
12.0 0.1  
4.0 0.1  
4.90 0.20  
Ø1.55 0.05  
1.75 0.10  
0.30 0.05  
4.0 0.1  
7.5 0.1  
16.0 0.3  
13.2 0.2  
10.30 0.20  
Ø1.6 0.1  
10.30 0.20  
User Direction of Feed  
0.1 MAX  
NOTE  
All dimensions are in inches (millimeters)  
Reflow Profile  
300  
250  
200  
150  
100  
50  
215C, 10–30 s  
225C peak  
Time above 183C, 60–150 sec  
Ramp up = 3C/sec  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
Time (Minute)  
• Peak reflow temperature: 225C (package surface temperature)  
• Time of temperature higher than 183C for 60–150 seconds  
• One time soldering reflow is recommended  
© 2003 Fairchild Semiconductor Corporation  
Page 7 of 8  
10/20/04  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
ACEx™  
Power247™  
PowerEdge™  
PowerSaver™  
PowerTrench  
QFET  
Stealth™  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
MSXPro™  
OCX™  
OCXPro™  
FAST  
FASTr™  
FPS™  
FRFET™  
GlobalOptoisolator™  
GTO™  
ActiveArray™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DOME™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
QS™  
QT Optoelectronics™ TinyLogic  
HiSeC™  
I2C™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
TINYOPTO™  
TruTranslation™  
UHC™  
i-Lo™  
ImpliedDisconnect™  
FACT Quiet Series™  
UltraFET  
OPTOLOGIC  
OPTOPLANAR™  
PACMAN™  
POP™  
SILENT SWITCHER VCX™  
SMART START™  
SPM™  
Across the board. Around the world.™  
The Power Franchise  
ProgrammableActive Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY  
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY  
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT  
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. I13  

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