MOC80303S [FAIRCHILD]
Darlington Output Optocoupler, 1-Element, 5300V Isolation, SURFACE MOUNT PACKAGE-6;
| 型号： | MOC80303S |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Darlington Output Optocoupler, 1-Element, 5300V Isolation, SURFACE MOUNT PACKAGE-6 输出元件 光电 |
| 文件： | 总12页 (文件大小：581K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
December 2006
MOC8030-M, MOC8050-M
Photodarlington Optocoupler (No Base Connection)
tm
Features
Description
■ High BV
The MOC8030 and MOC8050 are photodarlington-type
optically coupled optocouplers. The devices have a
gallium arsenide infrared emitting diode coupled with a
silicon darlington phototransistor.
CEO
– Minimum 80V
■ High current transfer ratio
– 300% (MOC8030)
– 500% (MOC8050)
■ No base connection for improved noise immunity
■ Underwriters Laboratory (UL) recognized
File #E90700
■ VDE recognized (file #102915), – add option V
(e.g., MOC8030V)
Applications
■ Appliances, measuring instruments
■ I/O interface for computers
■ Programmable controllers
■ Portable electronics
■ Interfacing and coupling systems of different
potentials and impedance
■ Solid state relays
Packages
Schematic
White Package (-M Suffix)
N/C
ANODE 1
6
6
6
1
1
CATHODE
N/C
COLLECTOR
EMITTER
2
3
5
4
6
1
Black Package (No -M Suffix)
6
6
1
1
6
1
©2006 Fairchild Semiconductor Corporation
MOC8030-M, MOC8050-M Rev. 1.0.1
1
www.fairchildsemi.com
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Symbol
Parameter
Value
Units
TOTAL DEVICE
T
Storage Temperature
Operating Temperature
Lead Solder Temperature
-40 to +150
-40 to +110
260 for 10 sec
250
°C
°C
STG
T
OPR
T
°C
SOL
P
Total Device Power Dissipation @ T = 25°C
mW
mW/°C
D
A
Derate above 25°C
2.94
EMITTER
I
DC/Average Forward Input Current
Reverse Input Voltage
60
3
mA
V
F
V
P
R
D
LED Power Dissipation @ T = 25°C
120
1.41
mW
A
Derate above 25°C
mW/°C
DETECTOR
V
Collector-Emitter Voltage
80
V
mW
CEO
P
Detector Power Dissipation @ T = 25°C
150
1.76
150
D
A
Derate above 25°C
mW/°C
mA
I
Continuous Collector Current
C
2
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MOC8030-M, MOC8050-M Rev. 1.0.1
Electrical Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Symbol
EMITTER
Parameter
Test Conditions
Min.
Typ.*
Max.
Unit
V
Input Forward Voltage
Reverse Leakage Current
DETECTOR
I = 10mA
1.18
2.00
10
V
F
F
I
V = 3.0V
0.001
µA
R
R
BV
BV
Collector-Emitter Breakdown Voltage I = 1.0mA, I = 0
80
5
100
10
V
V
CEO
ECO
C
F
Emitter-Collector Breakdown Voltage I = 100µA, I = 0
E
F
I
Collector-Emitter Dark Current
Capacitance
V
= 60V, I = 0
1
µA
pF
CEO
CE
CE
F
C
V
= 0V, f = 1MHz
8
CE
Transfer Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.*
Max.
Unit
DC CHARACTERISTICS
CTR
Current Transfer Ratio,
Collector to Emitter
I = 10mA,
MOC8030
MOC8050
300
500
%
F
V
= 1.5V
CE
AC CHARACTERISTICS
t
Non-Saturated Turn-on Time I = 5mA, V = 10V,
8.5
37
µS
µS
µS
µS
on
F
CC
R = 100Ω
L
t
Turn-off Time
Rise Time
Fall Time
I = 5mA, V = 10V,
off
F
CC
R = 100Ω
L
t
I = 5mA, V = 10V,
r
F
CC
R = 100Ω
L
t
I = 5mA, V = 10V,
f
F
CC
R = 100Ω
L
Isolation Characteristics
Symbol Characteristic
Test Conditions
Min.
Typ. Max.
Units
V
Input-Output Isolation Voltage
Non ‘-M’, Black Package
‘-M’, White Package
ISO
(1)
f = 60Hz, t = 1 min.
f = 60Hz, t = 1 min.
5300
7500
Vac(rms)
Vac(pk)
Ω
11
R
C
Isolation Resistance
V
= 500VDC
10
ISO
I-O
Isolation Capacitance
Non ‘-M’, Black Package
‘-M’, White Package
ISO
V
= Ø, f = 1MHz
0.5
pF
pF
I-O
0.2
2
Notes:
*Typical values at T = 25°C
A
1. 5300 Vac(rms) for 1 minute equates to approximately 9000 Vac(pk) for 1 second.
3
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MOC8030-M, MOC8050-M Rev. 1.0.1
Typical Performance Curves
Fig. 2 LED Forward Voltage vs. Forward Current
(White Package)
Fig. 1 LED Forward Voltage vs. Forward Current
(Black Package)
1.8
1.8
1.6
1.4
1.2
1.0
0.8
0.6
1.7
1.6
1.5
1.4
T
= -40oC
A
T
A
= -55°C
1.3
1.2
1.1
1.0
T
T
= 25oC
A
A
T
T
= 25°C
A
= 110oC
= 100°C
A
0.1
1
10
I - LED FORWARD CURRENT (mA)
F
100
1
10
100
I
- LED FORWARD CURRENT (mA)
F
Fig. 3 Normalized CTR vs. Forward Current
(Black Package)
Fig. 4 Normalized CTR vs. Forward Current
(White Package)
V
T
= 10V
Normalized to I = 10 mA
CE
F
= 25oC
A
T
= 0oC, 25oC
A
T
= 70oC
= 100oC
= -55oC
A
A
= 0oC, 25oC
T
T
T
= -40oC
T
A
A
A
1
1
T
= 7 oC
0
A
T
= 110oC
A
Normalized to
I = 10mA
F
V
= 5V
o
CE
T
A
= 25 C
0.1
0.1
0.1
1
10
100
0.1
1
10
100
I
- FORWARD CURRENT (mA)
F
I
- FORWARD CURRENT (mA)
F
Fig. 5 Normalized CTR vs. Ambient Temperature
(White Package)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
Normalized to T = 25oC
I
= 10mA
= 10V
F
A
V
CE
-40
-20
0
A
20
40
60
80
100
120
T
- AMBIENT TEMPERATURE (°C)
4
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MOC8030-M, MOC8050-M Rev. 1.0.1
Typical Performance Curves (Continued)
Fig. 6 Turn-on Time vs. Forward Current
(Black Package)
Fig. 7 Turn-on Time vs. Forward Current
(White Package)
1000
1000
100
10
V
T
= 10V
CC
= 25oC
R
= 1kΩ
R
= 1kΩ
L
L
A
V
= 10V
CC
100
10
1
R
= 100Ω
= 10Ω
L
R
= 100Ω
L
R
L
R
= 10Ω
L
1
0.1
0.1
0.1
0.1
1
10
100
1
10
100
I
F
- FORWARD CURRENT (mA)
I
- FORWARD CURRENT (mA)
F
Fig. 8 Turn-off Time vs. Forward Current
Black Package)
Fig. 9 Turn-off Time vs. Forward Current
(White Package)
1000
100
10
V
T
= 10V
CC
= 25oC
A
1000
100
R
= 1 k
L
R
= 1KΩ
L
R
= 100Ω
= 10Ω
L
R
= 100
= 10
L
R
L
10
1
R
L
V
CC
= 10 V
1
0.1
0
1
10
100
1
10
100
I
- FORWARD CURRENT (mA)
I
F
- FORWARD CURRENT (mA)
F
Fig. 10 Normalized Collector-Emitter Current
vs. Collector-Emitter Voltage
(Black Package)
Fig. 11 Normalized Collector-Emitter Current
vs. Collector-Emitter Voltage
(White Package)
16
14
12
10
8
16
14
12
10
8
Normalized to:
Normalized to:
= 25oC
T
A
I
F
= 1 mA
I
= 1 mA, V = 5V
CE
F
V
= 5 V
CE
I
= 10 mA
= 5 mA
F
I
= 10 mA
= 5 mA
F
F
I
F
I
6
6
4
4
I
I
= 2 mA
= 1 mA
I
I
= 2 mA
F
F
2
2
= 1 mA
5
F
F
0
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
6
7
8
9
10
V
CE
- COLLECTOR-EMITTER VOLTAGE (V)
V
- COLLECTOR-EMITTER VOLTAGE (V)
CE
5
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MOC8030-M, MOC8050-M Rev. 1.0.1
Fig. 13 Output Current vs. Ambient Temperature
(Black Package)
Fig. 12 Dark Current vs. Ambient Temperature
(Black and White Package)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
100,000
10,000
1.000
100
Normalized to: TA = 25oC
IF = 10mA
V
= 10V
CE
V
CE = 10V
10
1
0.1
0.01
-60
-40
-20
T
0
40
60
80
100
20
-40
-20
0
20
60
80
100
120
40
- AMBIENT TEMPERATURE (°C)
A
T
A
- AMBIENT TEMPERATURE (°C)
TEST CIRCUIT
WAVE FORMS
VCC = 10V
INPUT PULSE
IC
IF
RL
10%
90%
INPUT
OUTPUT
OUTPUT PULSE
RBE
tr
tf
toff
ton
IF to produce IC = 2 mA
Adjust
Figure 14. Switching Time Test Circuit and Waveforms
6
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MOC8030-M, MOC8050-M Rev. 1.0.1
Black Package (No -M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
PIN 1
ID.
0.350 (8.89)
0.320 (8.13)
0.270 (6.86)
0.240 (6.10)
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.92)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.020 (0.51)
0.154 (3.90)
0.100 (2.54)
MIN
0.016 (0.40)
0.008 (0.20)
0.300 (7.62)
0.022 (0.56)
0.016 (0.41)
0.025 (0.63)
0.020 (0.51)
0° to 15°
TYP
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
0.100 (2.54)
TYP
0.020 (0.50)
0.016 (0.41)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
PIN 1 ID
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.070 (1.78)
0.045 (1.14)
0.030 (0.76)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.004 (0.10)
MIN
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
TYP
0.100 (2.54) TYP
Note:
All dimensions are in inches (millimeters).
7
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MOC8030-M, MOC8050-M Rev. 1.0.1
White Package (-M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.100 (2.54)
0.015 (0.38)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
0.020 (0.50)
0.016 (0.41)
0.020 (0.50)
0.016 (0.41)
15°
0.100 (2.54)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.014 (0.36)
0.010 (0.25)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Note:
All dimensions are in inches (millimeters).
8
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MOC8030-M, MOC8050-M Rev. 1.0.1
Ordering Information
Black Package
(No Suffix)
White Package
(-M Suffix)
Option
.S
.SD
S
SR2
T
Surface Mount Lead Bend
Surface Mount; Tape and reel
0.4" Lead Spacing
.W
.300
.300W
.3S
V
VDE 0884
TV
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape & Reel
SV
SR2V
.3SD
Marking Information
1
2
1
2
6
MOC8030
V XX YY K
MOC8030
6
V X YY Q
5
3
4
5
3
4
Black Package, No Suffix
White Package, -M Suffix
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
One or two digit year code
4
• Two digits for black package parts, e.g., ‘03’
• One digit for white package parts, e.g., ‘3’
5
6
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
9
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MOC8030-M, MOC8050-M Rev. 1.0.1
Tape Dimensions
Black Package, No Suffix
12.0 0.1
4.0 0.1
4.85 0.20
Ø1.55 0.05
1.75 0.10
4.0 0.1
0.30 0.05
7.5 0.1
16.0 0.3
9.55 0.20
13.2 0.2
Ø1.6 0.1
10.30 0.20
User Direction of Feed
0.1 MAX
White Package, -M Suffix
12.0 0.1
2.0 0.05
4.5 0.20
Ø1.5 MIN
1.75 0.10
4.0 0.1
0.30 0.05
11.5 1.0
24.0 0.3
9.1 0.20
21.0 0.1
Ø1.5 0.1/-0
10.1 0.20
User Direction of Feed
0.1 MAX
Note:
All dimensions are in millimeters.
10
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MOC8030-M, MOC8050-M Rev. 1.0.1
Reflow Soldering Profile
Black Package, No Suffix
300
250
215°C, 10–30 s
225 C peak
200
150
Time above 183°C, 60–150 sec
Ramp up = 3C/sec
100
50
0
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
White Package, -M Suffix
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
20
33 Sec
0
0
60
120
180
270
360
Time (s)
11
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MOC8030-M, MOC8050-M Rev. 1.0.1
FAIRCHILD SEMICONDUCTOR TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
FACT Quiet Series™
GlobalOptoisolator™
GTO™
OCX™
SILENT SWITCHER®
SMART START™
SPM™
UniFET™
UltraFET®
VCX™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
OCXPro™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
HiSeC™
I2C™
Stealth™
Wire™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
ISOPLANAR™
LittleFET™
Power247™
PowerEdge™
PowerSaver™
PowerTrench®
QFET®
EcoSPARK™
E2CMOS™
EnSigna™
FACT®
TCM™
MICROCOUPLER™
MicroFET™
MicroPak™
TinyBoost™
TinyBuck™
FAST®
QS™
FASTr™
QT Optoelectronics™ TinyPWM™
FPS™
MICROWIRE™
MSX™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
TinyPower™
TinyLogic®
FRFET™
MSXPro™
TINYOPTO™
TruTranslation™
UHC®
Across the board. Around the world.™
The Power Franchise®
ScalarPump™
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Definition
Formative or In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I21
12
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MOC8030-M, MOC8050-M Rev. 1.0.1
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SI9137LG
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SI9122E
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