MOCD207D1VM [FAIRCHILD]

Transistor Output Optocoupler, 2-Element, 2500V Isolation, LEAD FREE, PLASTIC, SOIC-8;


型号：	MOCD207D1VM
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	Transistor Output Optocoupler, 2-Element, 2500V Isolation, LEAD FREE, PLASTIC, SOIC-8
文件：	总9页 (文件大小：255K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

April 2009

MOCD207M, MOCD208M

Dual Channel Phototransistor Small Outline Surface

Mount Optocouplers

Features

■ Dual channel optocoupler

Description

The MOCD207M/MOCD208M consist of two silicon

phototransistors optically coupled to two GaAs infrared

LEDs. These devices are constructed in a small outline

surface mount package which conforms to the standard

SOIC-8 footprint.

■ Convenient plastic SOIC-8 surface mountable

package style

■ Two channels in one compact surface mount package

■ Closely matched current transfer ratios to minimize

unit-to-unit variation

■ Minimum V

of 70 volts guaranteed

(BR)CEO

■ Standard SOIC-8 footprint, with 0.050” lead spacing

■ Compatible with dual wave, vapor phase and IR reﬂow

soldering

■ High input-output isolation of 2500 Vac (rms)

guaranteed

■ Meets U.L. regulatory requirements, ﬁle #E90700,

volume 2

Applications

■ Feedback control circuits

■ Interfacing and coupling systems of different

potentials and impedances

■ General purpose switching circuits

■ Monitor and detection circuits

Schematic

Package

COLLECTOR 1

ANODE 1

CATHODE 1 2

ANODE 2 3

7 EMITTER 1

6 COLLECTOR 2

EMITTER 2

CATHODE 2

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

Absolute Maximum Ratings ^{(T = 25°C unless otherwise speciﬁed)}

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Rating

Value

Unit

EMITTER

Forward Current – Continuous

1.0

6.0

I (pk)

Forward Current – Peak (PW = 100µs, 120pps)

Reverse Voltage

LED Power Dissipation @ T = 25°C

Derate above 25°C

0.8

mW/°C

DETECTOR

Collector-Emitter Voltage

Collector-Base Voltage

CEO

CBO

ECO

Emitter-Collector Voltage

Collector Current-Continuous

7.0

150

Detector Power Dissipation @ T = 25°C

150

Derate above 25°C

1.76

mW/°C

TOTAL DEVICE

(1, 2)

Input-Output Isolation Voltage

2500

Vac(rms)

ISO

(f = 60Hz, 1 min. Duration)

Total Device Power Dissipation @ T = 25°C

250

Derate above 25°C

2.94

mW/°C

Ambient Operating Temperature Range

Storage Temperature Range

-40 to +100

-40 to +125

260

°C

stg

Lead Soldering Temperature (1/16” from case,

10 sec. duration)

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

(3)

Electrical Characteristics (T = 25°C unless otherwise speciﬁed)

Symbol

EMITTER

Parameter

Test Conditions

Device

Min. Typ.* Max.

Unit

Input Forward Voltage

Reverse Leakage Current

Capacitance

I = 30mA

All

1.25 1.55

0.001 100

= 6.0V

µA

DETECTOR

Collector-Emitter Dark Current

= 10V, T = 25°C

All

1.0

µA

CEO

= 10V, T = 100°C

Collector-Emitter Breakdown

Voltage

= 100µA

100

(BR)CEO

Emitter-Collector Breakdown

Voltage

I = 100µA

All

7.0

(BR)CEO

Collector-Emitter Capacitance

f = 1.0 MHz, V = 0V

7.0

COUPLED

CTR

Current Transfer Ratio,

Collector to Emitter

I = 10mA, V = 5V

MOCD207M 100

MOCD208M 40

MOCD207M 34

MOCD208M 13

All

200

125

(4)

I = 1mA, V = 5V

Collector-Emitter Saturation

Voltage

= 2.0mA, I = 10mA

0.4

µs

CE (sat)

Turn-On Time

Turn-Off Time

Rise Time

= 2.0mA, V = 10V,

All

3.0

2.8

1.6

2.2

R = 100Ω

= 2.0mA, V = 10V,

µs

off

R = 100Ω

= 2.0mA, V = 10V,

µs

R = 100Ω

Fall Time

= 2.0mA, V = 10V,

µs

R = 100Ω

(1)(2)

Isolation Surge Voltage

f = 60Hz, t = 1 min.,

All

2500

Vac(rms)

ISO

≤ 2µA

I-O

(2)

Isolation Resistance

= 500V

All

Ω

ISO

I-O

(2)

Isolation Capacitance

= 0V, f = 1MHz

0.2

ISO

*Typical values at T = 25°C

Note:

1. Input-Output Isolation Voltage, V , is an internal device dielectric breakdown rating.

ISO

2. For this test, Pins 1, 2, 3 and 4 are common and Pins 5, 6, 7 and 8 are common.

3. Always design to the speciﬁed minimum/maximum electrical limits (where applicable).

4. Current Transfer Ratio (CTR) = I /I x 100%.

C F

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

Typical Performance Curves

Fig. 2 Output Curent vs. Input Current

Fig. 1 LED Forward Voltage vs. Forward Current

1.8

1.7

1.6

1.5

1.4

= 5V

NORMALIZED TO I_F= 10mA

= -55°C

= 25°C

1.3

1.2

1.1

1.0

0.1

= 100°C

100

I_F- LED FORWARD CURRENT (mA)

0.01

0.1

100

Fig. 3 Output Current vs. Ambient Temperature

I_F- LED INPUT CURRENT (mA)

Fig. 4 Output Current vs. Collector - Emitter Voltage

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

I_F= 10mA

NORMALIZED TO T_A= 25

NORMALIZED TO V_CE= 5V

0.1

-80

-60

-40

-20

100

120

T_A- AMBIENT TEMPERATURE (^oC)

V_CE- COLLECTOR -EMITTER VOLTAGE (V)

Fig. 5 Dark Current vs. Ambient Temperature

10000

1000

100

V_CE=10V

0.1

100

T_A- AMBIENT TEMPERATURE (^oC)

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

Package Dimensions

8-pin SOIC Surface Mount

0.164 (4.16)

0.144 (3.66)

0.202 (5.13)

0.182 (4.63)

0.010 (0.25)

0.006 (0.16)

0.143 (3.63)

0.123 (3.13)

0.021 (0.53)

0.011 (0.28)

0.244 (6.19)

0.224 (5.69)

0.008 (0.20)

0.003 (0.08)

0.050 (1.27) Typ.

Lead Coplanarity: 0.004 (0.10) MAX

Recommended Pad Layout

0.024 (0.61)

0.060 (1.52)

0.275 (6.99)

0.155 (3.94)

0.050 (1.27)

Dimensions in inches (mm).

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

Ordering Information

Option Order Entry Identiﬁer

Description

VDE Approved

Tape & Reel (500 units per reel), 16mm width carrier tape

D1V

VDE Approved, Tape & Reel (500 units per reel), 16mm width carrier tape

Tape & Reel (2500 units per reel), 16mm width carrier tape

D2V

VDE Approved, Tape & Reel (2500 units per reel), 16mm width carrier tape

Tape & Reel (2500 units per reel), 12mm width carrier tape

R2V

VDE Approved, Tape & Reel (2500 units per reel), 12mm width carrier tape

Marking Information

D207

X YY S

Deﬁnitions

Fairchild logo

Device number

VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

One digit year code, e.g., ‘3’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

Carrier Tape Speciﬁcations

8.0 ± 0.10

2.0 ± 0.05

3.50 ± 0.20

Ø1.5 MIN

0.30 MAX

4.0 ± 0.10

1.75 ± 0.10

5.5 ± 0.05

12.0 ± 0.3

8.3 ± 0.10

5.20 ± 0.20

Ø1.5 ± 0.1/-0

6.40 ± 0.20

0.1 MAX

User Direction of Feed

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

Reﬂow Proﬁle

Max. Ramp-up Rate = 3°C/S

Max. Ramp-down Rate = 6°C/S

260

240

220

200

180

160

140

120

100

Tsmax

Preheat Area

Tsmin

120

Time 25°C to Peak

240

360

Time (seconds)

Proﬁle Freature

Pb-Free Assembly Proﬁle

150°C

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

200°C

Time (t ) from (Tsmin to Tsmax)

60–120 seconds

3°C/second max.

217°C

Ramp-up Rate (t to t )

Liquidous Temperature (T )

Time (t ) Maintained Above (T )

60–150 seconds

260°C +0°C / –5°C

30 seconds

Peak Body Package Temperature

Time (t ) within 5°C of 260°C

Ramp-down Rate (T to T )

6°C/second max.

8 minutes max.

Time 25°C to Peak Temperature

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

PowerTrench^®

PowerXS™

The Power Franchise^®

Auto-SPM™

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Current Transfer Logic™

EcoSPARK^®

EfficentMax™

EZSWITCH™*

™*

F-PFS™

FRFET^®

Global Power Resource^SM

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Programmable Active Droop™

QFET^®

TinyBoost™

TinyBuck™

QS™

Quiet Series™

RapidConfigure™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

™

Saving our world, 1mW/W/kW at a time™

SmartMax™

TinyWire™

TriFault Detect™

TRUECURRENT™*

µSerDes™

SMART START™

SPM^®

MicroPak™

MillerDrive™

MotionMax™

Motion-SPM™

OPTOLOGIC^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS™

SyncFET™

Fairchild^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

UHC^®

Ultra FRFET™

UniFET™

VCX™

VisualMax™

XS™

OPTOPLANAR^®

FAST^®

FastvCore™

FETBench™

PDP SPM™

Power-SPM™

Sync-Lock™

FlashWriter^®

FPS™

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR

CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain life,

and (c) whose failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be reasonably

expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.

Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,

and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of

counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are

listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have

full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.

Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide

any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our

customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status

Definition

Datasheet contains the design specifications for product development. Specifications may change in

any manner without notice.

Advance Information

Preliminary

Formative / In Design

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

First Production

Full Production

Not In Production

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes

at any time without notice to improve the design.

No Identification Needed

Obsolete

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I40

MOCD207M, MOCD208M Rev. 1.0.6

www.fairchildsemi.com

MOCD207D1VM [FAIRCHILD]

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