SFH9154 [FAIRCHILD]

Advanced Power MOSFET; 先进的功率MOSFET
SFH9154
型号: SFH9154
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Advanced Power MOSFET
先进的功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总6页 (文件大小:234K)
中文:  中文翻译
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SFH9154  
Advanced Power MOSFET  
FEATURES  
BVDSS = -150 V  
RDS(on) = 0.2   
ID = -18 A  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
Improved Gate Charge  
Extended Safe Operating Area  
150oC Operating Temperature  
Lower Leakage Current : 10 µA (Max.) @ VDS = -150V  
Lower RDS(ON) : 0.140 (Typ.)  
TO-3P  
1
2
3
1.Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Value  
-150  
-18  
Units  
VDSS  
Drain-to-Source Voltage  
V
Continuous Drain Current (TC=25oC)  
Continuous Drain Current (TC=100oC)  
Drain Current-Pulsed  
ID  
A
-11.5  
-72  
IDM  
VGS  
EAS  
IAR  
A
V
Gate-to-Source Voltage  
±30  
1215  
-18  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Total Power Dissipation (TC=25oC)  
Linear Derating Factor  
20.4  
-5.0  
204  
mJ  
V/ns  
W
PD  
TJ , TSTG  
TL  
1.63  
W/oC  
Operating Junction and  
- 55 to +150  
300  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
oC  
Purposes, 1/8from case for 5-seconds  
Thermal Resistance  
Symbol  
RθJC  
Characteristic  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
0.61  
--  
Units  
--  
0.24  
--  
oC/W  
RθCS  
RθJA  
Junction-to-Ambient  
40  
1
P-CHANNEL  
POWER MOSFET  
SFH9154  
Electrical Characteristics (TC=25unless otherwise specified)  
Symbol  
BVDSS  
Characteristic  
Min. Typ. Max. Units  
Test Condition  
V
GS=0V,ID=-250μA  
Drain-Source Breakdown Voltage  
Breakdown Voltage Temp. Coeff.  
Gate Threshold Voltage  
V
V/℃  
V
-150 --  
-- -0.16 --  
-2.0 -- -4.0  
-- -100  
--  
ΔBV/ΔTJ  
VGS(th)  
ID=-250μA  
See Fig 7  
V
V
V
DS=-5V,ID=-250μA  
GS=-30V  
GS=30V  
Gate-Source Leakage , Forward  
Gate-Source Leakage , Reverse  
--  
--  
--  
--  
IGSS  
nA  
--  
--  
100  
-10  
VDS=-150V  
DS=-120V,TC=125℃  
IDSS  
Drain-to-Source Leakage Current  
μA  
V
-- -100  
Static Drain-Source  
On-State Resistance  
Forward Transconductance  
Input Capacitance  
RDS(on)  
VGS=-10V,ID=-9.0A  
VDS=-40V,ID=-9.0A  
--  
0.14 0.2  
gfs  
Ciss  
Coss  
Crss  
td(on)  
tr  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
11  
--  
2290 3000  
VGS=0V,VDS=-25V,f =1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Delay Time  
Rise Time  
600  
300  
45  
400  
200  
20  
pF  
ns  
See Fig 5  
VDD=-75V,ID=-18A,  
90  
40  
RG=6.2Ω  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
170  
90  
80  
See Fig 13  
④ ⑤  
40  
Qg  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain(Miller) Charge  
130  
--  
100  
20  
VDS=-120V,VGS=-10V,  
ID=-18A  
Qgs  
Qgd  
nC  
--  
40  
See Fig 6 & Fig 12 ④ ⑤  
Source-Drain Diode Ratings and Characteristics  
Symbol  
IS  
Characteristic  
Continuous Source Current  
Pulsed-Source Current  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Min. Typ. Max. Units  
Test Condition  
Integral reverse pn-diode  
in the MOSFET  
--  
--  
--  
--  
--  
-18  
-72  
A
ISM  
VSD  
trr  
V
-- -5.0  
TJ=25,IS=-18A,VGS=0V  
TJ=25,IF=-18A  
ns  
μC  
-- 200  
-- 1.5  
--  
--  
Qrr  
diF/dt=100A/μs  
Notes ;  
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature  
L=5mH, IAS=-18A, VDD=-50V, RG=27, Starting TJ =25℃  
ISD-18A, di/dt450A/μs, VDDBVDSS , Starting TJ =25℃  
Pulse Test : Pulse Width = 250μs, Duty Cycle 2%  
Essentially Independent of Operating Temperature  
2
P-CHANNEL  
POWER MOSFET  
SFH9154  
Fig 1. Output Characteristics  
Fig 2. Transfer Characteristics  
2
-V  
10  
GS  
Top :  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
@ Notes :  
1. 250 s Pulse Test  
µ
2
10  
2. T = 25 oC  
C
1
10  
Bottom : 4.5V  
1
10  
150 oC  
25 oC  
@ Notes :  
0
10  
1. V = 0 V  
GS  
2. V = 40 V  
DS  
3. 250 s Pulse Test  
µ
- 55 oC  
4
0
-1  
10  
10  
-1  
0
1
0
2
6
8
10  
10  
10  
10  
-V , Drain-Source Voltage [V]  
-V , Gate-Source Voltage [V]  
GS  
DS  
Fig 3. On-Resistance vs. Drain Current  
Fig 4. Source-Drain Diode Forward Voltage  
0.24  
2
10  
0.20  
0.16  
0.12  
0.08  
V =-10 V  
1
GS  
10  
V =-20 V  
GS  
0
10  
@Notes:  
150oC  
1. V =0V  
GS  
2. 250 sPulseTest  
µ
@Note :T =25oC  
25oC  
J
-1  
10  
0
15  
30  
45  
60  
75  
90  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
-I , Drain Current [A]  
-V , Source-Drain Voltage [V]  
D
SD  
Fig 5. Capacitance vs. Drain-Source Voltage  
Fig 6. Gate Charge vs. Gate-Source Voltage  
5000  
15  
10  
5
C =C +C (C =shorted)  
iss gs gd  
ds  
C =C +C  
oss ds gd  
C =C  
4000  
3000  
2000  
1000  
rss gd  
Ciss  
V =-30V  
DS  
V =-75V  
DS  
V =-120V  
DS  
Coss  
Crss  
@Notes:  
1. V =0 V  
GS  
2. f=1MHz  
@Notes:I = -18A  
D
00  
10  
0
1
0
20  
40  
60  
80  
100  
10  
Q , Total Gate Charge [nC]  
-V , Drain-Source Voltage [V]  
G
DS  
3
P-CHANNEL  
POWER MOSFET  
SFH9154  
Fig 7. Breakdown Voltage vs. Temperature  
Fig 8. On-Resistance vs. Temperature  
1.2  
1.1  
1.0  
0.9  
0.8  
2.0  
1.6  
1.2  
0.8  
@ Notes :  
1. Vgs = -10V  
2. Id = -9A  
@Notes:  
1. V = 0 V  
GS  
2. I =250 A  
µ
D
-75 -50 -25  
0
25  
50  
75  
100 125 150 175  
o
-75 -50 -25  
0
25  
50  
75  
100 125 150 175  
o
T , Junction Temperature [C]  
T , Junction Temperature [C]  
J
J
Fig 9. Max. Safe Operating Area  
Fig 10. Max. Drain Current vs. Case Temperature  
20  
3
10  
OperationinThisArea  
isLimitedby RDS(on)  
2
15  
10  
5
10  
0.1ms  
1ms  
10ms  
DC  
1
10  
@Notes:  
1. T = 25 oC  
C
0
2. T =150 oC  
10  
J
3. SinglePulse  
-1  
0
10  
0
1
2
25  
50  
75  
100  
125  
150  
10  
10  
10  
o
T , Case Temperature [C]  
-V , Drain-Source Voltage [V]  
c
DS  
Fig 11. Thermal Response  
100  
D=0.5  
0.2  
@ Notes :  
10-1  
0.1  
1. Z (t) = 0.61 oC/W Max.  
θ JC  
2. Duty Factor, D = t1/t2  
3. TJM-TC = PDM*Zθ JC(t)  
0.05  
0.02  
0.01  
PDM  
single pulse  
10-2  
10-5  
t1  
t2  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1 , Square Wave Pulse Duration [sec]  
4
P-CHANNEL  
POWER MOSFET  
SFH9154  
Fig 12. Gate Charge Test Circuit & Waveform  
* Current Regulator ”  
VGS  
Same Type  
as DUT  
50KΩ  
Qg  
12V  
200nF  
-10V  
300nF  
VDS  
Qgs  
Qgd  
VGS  
DUT  
R2  
-3mA  
R1  
Charge  
Current Sampling (IG) Current Sampling (ID)  
Resistor Resistor  
Fig 13. Resistive Switching Test Circuit & Waveforms  
RL  
t on  
t off  
Vout  
Vin  
tf  
td(on)  
tr  
td(off)  
VDD  
( 0.5 rated VDS  
)
Vin  
10%  
RG  
DUT  
-10V  
90%  
Vout  
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms  
BVDSS  
1
2
2
LL  
ID  
----  
--------------------  
BVDSS -- VDD  
EAS  
=
LL IAS  
VDS  
t p  
Time  
Vary tp to obtain  
required peak ID  
VDD  
VDS (t)  
RG  
C
VDD  
ID (t)  
DUT  
-10V  
IAS  
BVDSS  
t p  
5
P-CHANNEL  
POWER MOSFET  
SFH9154  
Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
+
VDS  
DUT  
--  
I S  
L
Driver  
VGS  
Compliment of DUT  
RG  
(N-Channel)  
VDD  
VGS  
• dv/dt controlled by G  
• IS controlled by Duty Factor “D”  
Gate Pulse Width  
VGS  
--------------------------  
D =  
Gate Pulse Period  
10V  
( Driver )  
Body Diode Reverse Current  
IRM  
I S  
( DUT )  
di/dt  
IFM , Body Diode Forward Current  
Vf  
VDS  
( DUT )  
Body Diode  
VDD  
Forward Voltage Drop  
Body Diode Recovery dv/dt  
6

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