FIR7N60AALG [FIRST]
600V N-Channel MOSFET;型号: | FIR7N60AALG |
厂家: | FIRST SEMI |
描述: | 600V N-Channel MOSFET |
文件: | 总9页 (文件大小:4147K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
FIR7N60ABPG/ALG
600V N-Channel MOSFET
Features:
PIN Connection TO-251/252
□ Low Intrinsic Capacitances.
□ Excellent Switching Characteristics.
□ Extended Safe Operating Area.
□ Unrivalled Gate Charge :Qg=25.9nC (Typ.).
□ BVDSS=600V,ID=7A
□ RDS(on) : 1.2Ω (Max) @VG=10V
□ 100% Avalanche Tested
TO‐251
TO‐252
g
Schematic dia ram
D
G
S
Marking Diagram
YAWW
Y
A
= Year
YAWW
FIR7N60ABP
= Assembly Location
= Work Week
FIR7N60AL
WW
= Specific Device Code
FIR7N60ABP/AL
Absolute Maximum Ratings (Ta=25℃ unless otherwise noted)
Symbol
Parameter
Value
600
7.0
Unit
VDSS
Drain-Source Voltage
Drain Current
V
Tj=25℃
ID
A
Tj=100℃
3.2
VGS(TH)
EAS
Gate Threshold Voltage
±30
230
V
Single Pulse Avalanche Energy (note1)
mJ
IAR
PD
Tj
Avalanche Current (note2)
Power Dissipation (Tj=25℃)
Junction Temperature(Max)
Storage Temperature
7.0
50
A
W
℃
℃
150
Tstg
-55~+150
Maximum lead temperature for soldering purpose,1/8” from
case for 5 seconds
TL
300
℃
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
2.50
110
Unit
℃/W
℃/W
RθJC
RθJA
Thermal Resistance,Junction to Case
Thermal Resistance,Junction to Ambient
-
-
REV:1.0
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@ 2018 Copyright By American First Semiconductor
FIR7N60ABPG/ALG
Electrical Characteristics (Ta=25℃ unless otherwise noted)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
ID=250μA,VGS=0
600
-
-
V
Breakdown Voltage Temperature
Coefficient
ID=250μA ,Reference
to 25℃
△BVDSS/△TJ
V/℃
-
VDS=600V, VGS=0V
IDSS
Zero Gate Voltage Drain Current
μA
VDS=480V, Tj=
Gate-body leakage Current,
Forward
Gate-body leakage Current,
Reverse
IGSSF
IGSSR
On Characteristics
VG=
VGS(TH)
RDS(ON)
Date Thresh
Static
O
Dynamic Ch
-
135
16
-
-
-
pF
-
-
-
-
-
-
-
30
80
70
170
140
130
-
Charge
rain Charge
D=300V,ID=7A
RG=25ꢀ (Note 3,4)
nS
81
60
25.9
7
VDS=480V,VGS=10V,
ID=7A (Note 3,4)
-
nC
14.5
-
de Characteristics and Maximum Ratings
Max. Diode Forward Current
Max. Pulsed Forward Current
Diode Forward Voltage
-
-
-
-
-
-
7
28
1.4
-
A
ISM
VSD
Trr
-
-
-
ID=7A
V
IS=7A,VGS =0V
diF/dt=100A/μs
(Note3)
Reverse Recovery Time
320
nS
Qrr
Reverse Recovery Charge
-
2.4
-
μC
Notes : 1, L=17.1mH, IAS=7A, VDD=50V, RG=25ꢀ, Starting TJ =25°C
2, Repetitive Rating : Pulse width limited by maximum junction temperature
3, Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2%
4, Essentially Independent of Operating Temperature
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FIR7N60ABPG/ALG
Typical Characteristics
VGS
Top:
15.0 V
10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
101
100
101
100
150oC
Bottom: 5.0 V
25oC
※
Notes :
1. 250µ s Pulse Test
2. TC = 25
-1
10
℃
-1
10
100
101
VDS, Drain-Source Voltage [V]
Figure 1. On-Reg
3.5
※
Notes :
1. VGS = 0V
25℃
2. 250µ s Pulse Test
2
0.4
0.6
0.8
1.0
1.2
1.4
VSD, Source-Drain voltage [V]
e
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
1200
1000
800
12
10
8
C
iss = Cgs + Cgd (Cds = shorted)
C
oss = C + C
gd
C
rss = Cds
gd
VDS = 120V
VDS = 300V
C
iss
VDS = 480V
6
C
oss
4
※
Notes ;
600
1. VGS = 0 V
C
2. f = 1 MHz
rss
400
2
200
※
Note : ID = 8A
25
0
0
10
0
5
10
15
20
30
-1
0
1
10
10
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
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FIR7N60ABPG/ALG
Typical Characteristics (Continued)
1.2
1.1
1.0
3.0
2.5
2.0
1.5
1.0
0.9
※
Notes :
1. V = 0 V
2. IDG=S 250 µ A
0.8
-100
-50
0
50
100
150
2
T, Junction Temperature [oC]
J
Figure 7. Breakdown Vo
vs Tem
2
10
50
75
100
125
150
TC, Case Temperature [℃]
Figure 10. Maximum Drain Current
vs Case Temperature
D = 0 .5
10 0
0 .2
0 .1
※
N otes
:
0 .0 5
1 0 -1
1. Z
(t)
= 2.6 ℃ /W M ax.
2. DθuJtCy Factor, D =t1/t2
0 .0 2
3. TJM
- TC = P D M * Zθ JC(t)
0 .0 1
PDM
s in g le p u lse
t1
1 0 -2
t2
10 -5
1 0-4
1 0-3
10 -2
10 -1
10 0
10 1
t1, S quare W ave P ulse D uration [sec]
Figure 11-2. Transient Thermal Response Curve for FIR7N60AFG
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FIR7N60ABPG/ALG
Gate Charge Test Circuit & Waveform
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FIR7N60ABPG/ALG
Peak Diode Recovery dv/dt Test Circuit & Waveform
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FIR7N60ABPG/ALG
Unit: mm
Package Dimension
TO-251
m
MM
NOM
SYMBOL
MIN
MAX
A
A2
b
b1
b3
c
2.20
0.97
0.72
0.71
5.23
0.47
0.46
6.00
2.30
1.07
0.78
0.76
5.33
0.53
0.51
6.10
2.38
1.17
0.85
0.81
5.46
0.58
0.56
6.20
c1
D
D1
E
E1
e
5.30REF
6.60
4.83
2.286BSC
16.40
9.40
1.02
1.80
7°
6.50
4.70
6.70
4.92
H
16.10
9.20
0.90
1.70
5°
16.60
9.60
1.25
1.90
9°
L1
L3
L5
1
2
5°
7°
9°
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FIR7N65ABPG/ALG
Package Dimension
TO-252
Unit: mm
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FIR7N60ABPG/ALG
Declaration
z
FIRST reserves the right to change the specifications, the same specifications of products due to different
packaging line mold, the size of the appearance will be slightly different, shipped in kind, without notice!
Customers should obtain the latest version information before ordering, and verify whether the relevant
information is complete and up-to-date.
Any semiconductor product under certain conditions has the possibility of failure or failures the
z
z
responsibility to comply with safety
standards and take safety measures when using FIRST products for systeo
avoid To avoid potential failure risks, which may cause personal injury
Product promotion endless, our company will wholeheartedly pro
ATTACHMENT
Revision History
Date
REV
2018.01.01
1.0
Page 9/9
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