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FT6163L-35FMLF [FORCE]

Ultra High Speed 8K x 9 Static Cmos Rams;
FT6163L-35FMLF
型号： FT6163L-35FMLF
厂家： Force Technologies    Force Technologies
描述：

Ultra High Speed 8K x 9 Static Cmos Rams
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FT6163/FT6163L  
Ultra High Speed 8K x 9  
Static Cmos Rams  
FEATURES  
Data Retention with 2.0V Supply, 10 µA Typical  
Full CMOS, 6T Cell  
Current (FT6163L Military)  
High Speed (Equal Access and Cycle Times)  
– 25/35ns (Commercial)  
Common I/O  
– 25/35/45ns (Military)  
Fully TTL Compatible Inputs and Outputs  
Low Power Operation (Commercial/Military)  
Standard Pinout (JEDEC Approved)  
– 28-Pin 300 mil DIP, SOJ  
– 28-Pin 350 x 550 mil LCC  
– 28-Pin CERPACK  
Output Enable and Dual Chip Enable Control  
Functions  
Single 5V±10% Power Supply  
DESCRIPTION  
Accesstimesasfastas25nanosecondsareavailable,per-  
mittinggreatlyenhancedsystemoperatingspeeds.CMOS  
is used to reduce power consumption in both active and  
standbymodes.  
TheFT6163andFT6163Lare73,728-bitultrahigh-speed  
staticRAMsorganisedas8Kx9.TheCMOSmemoriesre-  
quire no clocks or refreshing and have equal access and  
cycle times. Inputs are fully TTL-compatible. The RAMs  
operate from a single 5V±10% tolerance power supply.  
Withbatterybackup,dataintegrityismaintainedforsupply  
voltages down to 2.0V. Current drain is 10 µA from a 2.0V  
supply.  
The FT6163 and FT6163L are available in 28-pin 300 mil  
DIP and SOJ, 28-pin 350 x 550 mil LCC, and 28-pin  
CERPACKpackagesprovidingexcellentboardleveldensi-  
ties.  
FUNCTIONAL BLOCK DIAGRAM  
PIN CONFIGURATIONS  
DIP (P5, C5), SOJ (J5)  
CERPACK (F4) SIMILAR  
LCC (L5  
REV 1.2  
1/13  
2008  
FT6163/FT6163L  
MAXIMUM RATINGS(1)  
Symbol  
Parameter  
Value  
Unit  
Symbol  
Parameter  
Value  
Unit  
TBIAS  
Temperature Under  
Bias  
–55 to +125  
°C  
VCC  
Power Supply Pin with  
Respect to GND  
–0.5 to +7  
V
TSTG  
PT  
Storage Temperature  
Power Dissipation  
DC Output Current  
–65 to +150  
°C  
W
Terminal Voltage with  
Respect to GND  
(up to 7.0V)  
–0.5 to  
VCC +0.5  
VTERM  
TA  
V
1.0  
50  
IOUT  
mA  
Operating Temperature –55 to +125 °C  
RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE  
Ambient  
Temperature  
Ambient  
Temperature  
Grade(2)  
GND  
VCC  
5.0V ± 10%  
Grade(2)  
GND  
VCC  
Military  
–55 to +125°C  
0V  
5.0V ± 10%  
Commercial 0°C to +70°C  
0V  
DC ELECTRICAL CHARACTERISTICS  
Over recommended operating temperature and supply voltage(2)  
FT6163  
FT6163L  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
VCC+0.5  
0.8  
Min  
Max  
VCC+0.5  
0.8  
VIH  
Input High Voltage  
2.2  
–0.5(3)  
2.2  
–0.5(3)  
V
V
V
V
V
V
VIL  
Input Low Voltage  
VHC  
VLC  
VCD  
VOL  
CMOS Input High Voltage  
CMOS Input Low Voltage  
VCC–0.2 VCC+0.5 VCC–0.2 VCC+0.5  
–0.5(3)  
0.2  
–1.2  
0.4  
–0.5(3)  
0.2  
–1.2  
0.4  
Input Clamp Diode Voltage VCC = Min., IIN = –18 mA  
Output Low Voltage  
(TTL Load)  
IOL = +8 mA, VCC = Min.  
IOLC = +100 µA, VCC = Min.  
IOH = –4 mA, VCC = Min.  
IOHC = –100 µA, VCC = Min.  
VOLC  
VOH  
VOHC  
ILI  
Output Low Voltage  
(CMOS Load)  
0.2  
0.2  
V
V
Output High Voltage  
(TTL Load)  
2.4  
2.4  
Output High Voltage  
(CMOS Load)  
VCC–0.2  
VCC–0.2  
V
Input Leakage Current  
VCC = Max.  
VIN = GND to VCC  
Mil.  
Com’l.  
–10  
–5  
+10  
+5  
–5  
+5  
µA  
µA  
N/A  
N/A  
ILO  
Output Leakage Current  
VCC = Max., CE = VIH,  
VOUT= GND to VCC  
Mil.  
Com’l.  
–10  
–5  
+10  
+5  
–5  
+5  
N/A  
N/A  
CAPACITANCES(4)  
(VCC = 5.0V, TA = 25°C, f = 1.0MHz)  
Symbol  
Parameter  
Conditions Typ. Unit  
pF  
Symbol  
Parameter  
Conditions Typ. Unit  
pF  
COUT  
Output Capacitance VOUT = 0V  
7
CIN  
Input Capacitance VIN = 0V  
5
Notes:  
1. Stresses greater than those listed under MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only  
and functional operation of the device at these or any other conditions  
above those indicated in the operational sections of this specification  
is not implied. Exposure to MAXIMUM rating conditions for extended  
periods may affect reliability.  
2. Extended temperature operation guaranteed with 400 linear feet per  
minute of air flow.  
3. Transient inputs with VIL and IIL not more negative than –3.0V and  
–100mA, respectively, are permissible for pulse widths up to 20ns.  
4. This parameter is sampled and not 100% tested.  
REV 1.2  
2/13  
2008  
FT6163/FT6163L  
POWER DISSIPATION CHARACTERISTICS  
Over recommended operating temperature and supply voltage(2)  
FT6163  
FT6163L  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
Min  
Max  
ICC  
Dynamic Operating  
Current – 25  
VCC = Max., f = Max.,  
Outputs Open  
Mil.  
Com’l.  
—
—
145  
125  
—
—
145  
N/A  
mA  
ICC  
ISB  
Dynamic Operating  
Current – 35, 45  
VCC = Max., f = Max.,  
Outputs Open  
Mil.  
Com’l.  
—
—
120  
95  
—
—
120  
N/A  
mA  
mA  
Standby Power Supply  
Current (TTL Input Levels) CE2 ≤ VIL, VCC = Max.,  
CE1 ≥ VIH or  
Mil.  
Com’l.  
—
—
40  
35  
—
—
40  
N/A  
f = Max., Outputs Open  
ISB1  
Standby Power Supply  
Current  
(CMOS Input Levels)  
CE1 ≥ VHC or  
Mil.  
Com’l.  
—
—
20  
18  
—
—
1
N/A  
mA  
CE2 ≤ VLC, VCC = Max.,  
f = 0, Outputs Open,  
VIN ≤ VLC or VIN ≥ VHC  
n/a = Not Applicable  
DATA RETENTION CHARACTERISTICS (FT6163L, Military Temperature Only)  
Typ.*  
VCC=  
2.0V  
Max  
VCC=  
2.0V  
Symbol  
Parameter  
Test Condition  
Min  
Unit  
3.0V  
3.0V  
VDR  
VCC for Data Retention  
Data Retention Current  
2.0  
V
ICCDR  
10  
15  
200  
300  
µA  
CE1 ≥ VCC – 0.2V or  
CE2 ≤ 0.2V, VIN ≥ VCC – 0.2V  
or VIN ≤ 0.2V  
tCDR  
Chip Deselect to  
Data Retention Time  
0
ns  
ns  
†
§
tR  
Operation Recovery Time  
tRC  
*TA = +25°C  
§tRC = Read Cycle Time  
†This parameter is guaranteed but not tested.  
DATA RETENTION WAVEFORM  
REV 1.2  
3/13  
2008  
FT6163/FT6163L  
AC ELECTRICAL CHARACTERISTICS—READ CYCLE  
(VCC = 5V ± 10%, All Temperature Ranges)(2)  
-25  
-35  
-45  
Symbol  
Parameter  
Unit  
Min Max Min Max Min Max  
tRC  
tAA  
tAC  
Read Cycle Time  
25  
35  
45  
ns  
ns  
ns  
Address Access Time  
25  
25  
35  
35  
45  
45  
Chip Enable  
Access Time  
tOH  
tLZ  
Output Hold from  
Address Change  
3
3
3
3
3
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Chip Enable to  
Output in Low Z  
tHZ  
Chip Disable to  
Output in High Z  
10  
13  
15  
18  
20  
20  
tOE  
tOLZ  
tOHZ  
tPU  
tPD  
Output Enable  
Low to Data Valid  
Output Enable  
Low to Low Z  
3
0
3
0
3
0
Output Enable  
High to High Z  
12  
20  
15  
20  
20  
25  
Chip Enable to  
Power Up Time  
Chip Disable to  
Power Down Time  
READ CYCLE NO. 1 (OE CONTROLLED)(5)  
Notes:  
8. Transition is measured ± 200mV from steady state voltage prior to  
change, with loading as specified in Figure 1. This parameter is  
sampled and not 100% tested.  
5. WE is HIGH for READ cycle.  
6. CE1 is LOW, CE2 is HIGH and OE is LOW for READ cycle.  
7. ADDRESS must be valid prior to, or coincident with CE1 transition  
LOW and CE2 transition HIGH.  
REV 1.2  
4/13  
2008  
FT6163/FT6163L  
READ CYCLE NO. 2 (ADDRESS CONTROLLED)(5,6)  
READ CYCLE NO. 3 (CE1, CE2 CONTROLLED)(5,7,10)  
Notes:  
9. READ Cycle Time is measured from the last valid address to the first  
transitioning address.  
10. Transitions caused by a chip enable control have similar delays  
irrespective of whether CE1 or CE2 causes them.  
REV 1.2  
5/13  
2008  
FT6163/FT6163L  
AC CHARACTERISTICS—WRITE CYCLE  
(VCC = 5V ± 10%, All Temperature Ranges)(2)  
-25  
-35  
-45  
Symbol  
tWC  
Parameter  
Unit  
ns  
Min Max Min Max Min Max  
Write Cycle Time  
25  
18  
35  
25  
45  
33  
tCW  
Chip Enable  
ns  
Time to End of Write  
tAW  
Address Valid to  
End of Write  
18  
25  
33  
ns  
tAS  
Address Set-up Time  
Write Pulse Width  
Address Hold Time  
0
18  
0
0
20  
0
0
25  
0
ns  
ns  
ns  
ns  
tWP  
tAH  
tDW  
Data Valid to End  
of Write  
13  
15  
20  
tDH  
tWZ  
Data Hold Time  
0
3
0
5
0
5
ns  
ns  
Write Enable to  
Output in High Z  
10  
14  
18  
tOW  
Output Active  
ns  
from End of Write  
WRITE CYCLE NO. 1 (WE CONTROLLED)(11)  
Notes:  
11. CE1 and WE must be LOW, and CE2 HIGH for WRITE cycle.  
12. OE is LOW for this WRITE cycle to show tWZ and tOW  
.
13. If CE1 goes HIGH, or CE2 goes LOW, simultaneously with WE  
HIGH, the output remains in a low impedance state.  
14. Write Cycle Time is measured from the last valid address to the first  
transitioning address.  
REV 1.2  
6/13  
2008  
FT6163/FT6163L  
TIMING WAVEFORM OF WRITE CYCLE NO. 2 (CE CONTROLLED)(11)  
AC TEST CONDITIONS  
TRUTH TABLE  
Mode  
CE1 CE2 OE WE  
I/O  
Power  
Input Pulse Levels  
GND to 3.0V  
Standby  
Standby  
H
X
X
L
X
X
X
X
High Z Standby  
High Z Standby  
Input Rise and Fall Times  
Input Timing Reference Level  
Output Timing Reference Level  
Output Load  
3ns  
1.5V  
DOUT  
Disabled  
1.5V  
L
L
L
H
H
H
H
L
H
H
L
High Z Active  
See Figures 1 and 2  
Read  
Write  
DOUT  
DIN  
Active  
Active  
X
Figure 1. Output Load  
Figure 2. Thevenin Equivalent  
* including scope and test fixture.  
Note:  
Because of the ultra-high speed of the FT6163/L, care must be taken  
when testing this device; an inadequate setup can cause a normal  
functioning part to be rejected as faulty. Long high-inductance leads that  
cause supply bounce must be avoided by bringing the VCC and ground  
planes directly up to the contactor fingers. A 0.01 µF high frequency  
capacitor is also required between VCC and ground. To avoid signal  
reflections, proper termination must be used; for example, a 50Ω test  
environment should be terminated into a 50Ω load with 1.73V (Thevenin  
Voltage) at the comparator input, and a 116Ω resistor must be used in  
series with DOUT to match 166Ω (Thevenin Resistance).  
REV 1.2  
7/13  
2008  
FT6163/FT6163L  
ORDERING INFORMATION  
FT6163  
FT6163L  
L
XX  
X
X
X
M5004  
SELECTION GUIDE  
The FT6163/L is available in the following temperature, speed and package options. The FT6163L is  
only available over the military temperature range.  
Speed  
Temperature  
Range  
Package  
Plastic DIP  
35  
45  
25  
Commercial  
-35PC  
-35JC  
N/A  
-25PC  
-25JC  
-25CM  
-25LM  
-25FM  
Plastic SOJ  
Side Brazed DIP  
LCC  
N/A  
Miliitary  
Temperature  
-35CM  
-35LM  
-35FM  
-35CMB  
-35LMB  
-35FMB  
-45CM  
-45LM  
-45FM  
-45CMB  
-45LMB  
-45FMB  
CERPACK  
Military  
Processed*  
Side Brazed DIP  
-25CMB  
-25LMB  
LCC  
-25FMB  
CERPACK  
* Military temperature range with MIL-STD-883 M5004  
N/A = Not available  
REV 1.2  
8/13  
2008  
FT6163/FT6163L  
SOJ SMALL OUTLINE IC PACKAGE  
Pkg #  
J5  
# Pins  
28 (300 mil)  
Symbol  
Min  
Max  
0.148  
-
0.020  
0.011  
0.730  
A
A1  
b
C
D
0.120  
0.078  
0.014  
0.007  
0.700  
e
E
E1  
E2  
Q
0.050 BSC  
0.335 BSC  
0.292 0.300  
0.267 BSC  
0.025  
-
RECTANGULAR LEADLESS CHIP CARRIER  
Pkg #  
# Pins  
Symbol  
A
L5  
28  
Min  
Max  
0.060  
0.050  
0.022  
0.342  
0.075  
0.065  
0.028  
0.358  
A1  
B1  
D
D1  
D2  
D3  
E
0.200 BSC  
0.100 BSC  
-
0.358  
0.560  
0.540  
E1  
E2  
E3  
e
h
j
0.400 BSC  
0.200 BSC  
-
0.558  
0.050 BSC  
0.040 REF  
0.020 REF  
L
L1  
L2  
0.045  
0.045  
0.075  
0.055  
0.055  
0.095  
ND  
NE  
5
9
REV 1.2  
9/13  
2008  
FT6163/FT6163L  
SIDE BRAZED DUAL IN-LINE PACKAGE  
Pkg #  
C5  
# Pins  
28 (300 mil)  
Symbol  
Min  
-
0.014  
0.045  
0.008  
-
Max  
A
b
b2  
C
D
E
0.225  
0.026  
0.065  
0.018  
1.485  
0.310  
0.240  
eA  
e
0.300 BSC  
0.100 BSC  
L
0.125  
0.200  
Q
S1  
S2  
0.015  
0.005  
0.005  
0.070  
-
-
CERPACK CERAMIC FLAT PACKAGE  
Pkg #  
F4  
# Pins  
28  
Symbol  
Min  
0.060  
0.015  
0.004  
-
Max  
A
b
c
D
E
e
0.090  
0.022  
0.009  
0.730  
0.380  
0.330  
0.050 BSC  
k
L
Q
S
S1  
0.005  
0.018  
0.370  
0.045  
0.085  
-
0.250  
0.026  
-
0.005  
REV 1.2  
10/13  
2008  
FT6163/FT6163L  
PLASTIC DUAL IN-LINE PACKAGE  
Pkg #  
P5  
# Pins  
28 (300 mil)  
Symbol  
Min  
-
Max  
0.210  
-
0.023  
0.070  
0.014  
1.400  
0.300  
0.380  
A
A1  
b
b2  
C
D
E1  
E
0.014  
0.045  
0.008  
1.345  
0.270  
0.300  
e
0.100 BSC  
eB  
L
α
-
0.430  
0.150  
15°  
0.115  
0°  
REV 1.2  
11/13  
2008  
FT6163/FT6163L  
REVISIONS  
DOCUMENT NUMBER:  
DOCUMENT TITLE:  
SRAM120  
FT6163/FT6163L ULTRA HIGH SPEED 8K x 9 STATIC CMOS RAMS  
ORIG. OF  
CHANGE  
ISSUE  
REV.  
DESCRIPTION OF CHANGE  
DATE  
ORIG  
1997  
M.S  
New Data Sheet  
1
Oct-05  
Jul-06  
M.S  
M.S  
M.S  
Change logo to Pyramid  
1.1  
1.2  
Added Lead-Free Designation  
June-08  
Updated SOJ package information and data sheet review  
REV 1.2  
12/13  
2008  
Ashley Crt, Henley,  
Marlborough, Wilts, SN8 3RH UK  
Tel: +44(0)1264 731200  
Fax:+44(0)1264 731444  
E-mail  
sales@forcetechnologies.co.uk  
www.forcetechnologies.co.uk  
Unless otherwise stated in this SCD/Data sheet, Force Technologies Ltd reserve the right to make changes, without notice, in the products, Includ  
-ing circuits, cells and/or software, described or contained herein in order to improve design and/or performance. Force Technologies resumes no  
responsibility or liability for the use of any of these products, conveys no licence or any title under patent, copyright, or mask work to these  
products, and makes no representation or warranties that that these products are free f rom patent, copyright or mask work infringement, unless  
otherwise specified.  
Life Support Applications  
Force Technologies products are not designed for use in life support appliances, devices or systems where malfunction of a Force Technologies  
product can reasonably be expected to result in a personal injury. Force Technologies customers using or selling Force Technologies products  
for use in such applications do so at their own risk and agree to fully indemnify Force Technologies for any damages resulting from such  
improper use or sale.  
Copyright Force Technologies Ltd 2010  
All trademarks acknowledged  
REV 1.2  
13/13  
2008  

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