EGFM205 [FORMOSA]

Chip Effcienct Fast Rectifiers;


型号：	EGFM205
厂家：	FORMOSA MS
描述：	Chip Effcienct Fast Rectifiers
文件：	总7页 (文件大小：72K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip Effcienct Fast Rectifiers

Formosa MS

EGFM201 THRU EGFM205

List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Mechanical data...............................................................................

Maximum ratings .............................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Marking...........................................................................................

Suggested solder pad layout.............................................................

Packing information..........................................................................

Reel packing....................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 1

Chip Effcienct Fast Rectifiers

Formosa MS

EGFM201 THRU EGFM205

2.0A Sufrace Mount

Efficient Fast Rectifiers-50-600V

Package outline

Features

• Batch process design, excellent power dissipation offers

better reverse leakage current and thermal resistance.

SMA

• Low profile surface mounted application in order to

optimize board space.

0.196(4.9)

0.180(4.5)

0.012(0.3) Typ.

• High current & surge capability.

• Low forward dropdown voltage

• Glass passivated chip junction.

• Lead-free parts meet environmental standards of

MIL-STD-19500 /228

0.106(2.7)

0.091(2.3)

• Suffix "-H" indicates Halogen free parts, ex. EGFM201-H.

0.068(1.7)

0.060(1.5)

Mechanical data

0.032(0.8) Typ.

0.032 (0.8) Typ.

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, DO-214AC / SMA

• Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

Dimensions in inches and (millimeters)

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.05 gram

Maximum ratings and Electrical Characteristics (AT T_A=25^oC unless otherwise noted)

MAX.

Symbol

I_O

TYP.

UNIT

MIN.

PARAMETER

CONDITIONS

2.0

Forward rectified current

See Fig.2

I_FSM

Forward surge current

Reverse current

8.3ms single half sine-wave (JEDEC methode)

V_R= V_RRMT_J= 25^OC

5.0

I_R

μA

V_R= V_RRMT_J= 125^OC

100

C_J

^OC

Diode junction capacitance

Storage temperature

f=1MHz and applied 4V DC reverse voltage

+175

-65

T_STG

Operating

temperature

T_J, (^OC)

V_R

(V)

V_F

(V)

V_RMS

(V)

t_rr

(ns)

SYMBOLS

V_RRM

(V)

*1 Repetitive peak reverse voltage

*2 RMS voltage

EGFM201

EGFM202

EGFM203

100

200

100

200

0.875

*3 Continuous reverse voltage

*4 Maximum forward voltage@I_F=2.0A

*5 Maximum Reverse recovery time, note 1

140

-55 to +150

EGFM204

EGFM205

400

600

400

600

1.25

1.75

280

420

Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 2

Rating and characteristic curves (EGFM201 THRU EGFM205)

FIG.1-TYPICAL FORWARD

FIG.2-TYPICAL FORWARD CURRENT

CHARACTERISTICS

DERATING CURVE

2.4

2.0

1.6

1.2

EGFM201~ EGFM203

EGFM204

P.C.B. Mounted on

0.8

0.2" x 0.2" (5 mm x 5 mm)

TJ C

=25 ^O

Copper Pad Areas

0.4

100

125

150

175

0.1

EGFM205

LEAD TEMPERATURE (°C)

pulse width =300us

1% duty cycle

0.01

FIG.4-MAXIMUM NON-REPETITIVE FORWARD

SURGE CURRENT

0.4 0.6 0.8 1.0

1.2 1.4 1.6 1.8 2.0

FORWARD VOLTAGE,(V)

FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE

RECOVERY TIME CHARACTERISTICS

NONINDUCTIVE

10W

NONINDUCTIVE

(

)

(+)

D.U.T.

25Vdc

(approx.)

PULSE

GENERATOR

(NOTE 2)

(

)

(+)

NON-

INDUCTIVE

OSCILLISCOPE

(NOTE 1)

NUMBER OF CYCLES AT 60Hz

NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.

2. Rise Time= 10ns max., Source Impedance= 50 ohms.

FIG.5-TYPICAL JUNCTION CAPACITANCE

trr

+0.5A

-0.25A

-1.0A

1cm

SET TIME BASE FOR

10 / 20ns / cm

.01

.05

100

REVERSE VOLTAGE,(V)

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 3

Chip Effcienct Fast Rectifiers

Formosa MS

EGFM201 THRU EGFM205

Pinning information

Simplified outline

Symbol

Pin1 cathode

Pin2 anode

Marking

Type number

Marking code

EGFM201

EGFM202

EGFM203

EGFM204

EGFM205

E21

E22

E23

E24

E25

Suggested solder pad layout

Dimensions in inches and (millimeters)

PACKAGE

SMA

0.110 (2.80)

0.063 (1.60)

0.087 (2.20)

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 4

Chip Effcienct Fast Rectifiers

Formosa MS

EGFM201 THRU EGFM205

Packing information

unit:mm

Symbol

SMA

Item

Tolerance

Carrier width

0.1

2.0

min

2.0

min

0.5

0.1

0.3

1.0

2.80

5.00

Carrier length

Carrier depth

1.90

Sprocket hole

1.50

13" Reel outside diameter

13" Reel inner diameter

7" Reel outside diameter

7" Reel inner diameter

Feed hole diameter

Sprocket hole position

Punch hole position

Punch hole pitch

330.00

50.00

178.00

62.00

13.00

1.75

5.50

4.00

Sprocket hole pitch

Embossment center

Overall tape thickness

Tape width

4.00

2.00

0.23

12.00

18.00

Reel width

Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 5

Chip Effcienct Fast Rectifiers

Formosa MS

EGFM201 THRU EGFM205

Reel packing

APPROX.

GROSS WEIGHT

COMPONENT

SPACING

INNER

BOX

REEL

DIA,

CARTON

SIZE

BOX

(pcs)

CARTON

(pcs)

REEL

(pcs)

PACKAGE

REEL SIZE

(m/m)

(kg)

(m/m)

4.0

178

330

160,000

120,000

16.0

14.2

SMA

2,000

7,500

20,000 183*155*183

15,000

382*356*392

350*330*360

13"

337*337*37

Suggested thermal profiles for soldering processes

1.Storage environment: Temperature=5^oC~40^oC Humidity=55% 25%

2.Reflow soldering of surface-mount devices

Critical Zone

TL to TP

Ramp-up

Tsmax

Tsmin

Preheat

Ramp-down

t25^oC to Peak

Time

3.Reflow soldering

Profile Feature

Soldering Condition

Average ramp-up rate(T^Lto T^P)

<3^oC/sec

Preheat

-Temperature Min(Tsmin)

-Temperature Max(Tsmax)

-Time(min to max)(t^s)

150^oC

200^oC

60~120sec

Tsmax to T^L

-Ramp-upRate

<3^oC/sec

Time maintained above:

-Temperature(T^L)

-Time(t^L)

217^oC

60~260sec

Peak Temperature(T^P)

255^oC-0/+5^oC

Time within 5^oC of actual Peak

Temperature(t^P)

10~30sec

Ramp-down Rate

<6^oC/sec

Time 25^oC to Peak Temperature

<6minutes

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 6

Chip Effcienct Fast Rectifiers

Formosa MS

EGFM201 THRU EGFM205

High reliability test capabilities

Item Test

Conditions

at 260 5^OC for 10 2sec.

immerse body into solder 1/16" 1/32"

Reference

1. Solder Resistance

MIL-STD-750D

METHOD-2031

at 245 5^OC for 5 sec.

2. Solderability

MIL-STD-202F

METHOD-208

V_R=80% rate at T_J=150^OC for 168 hrs.

Rated average rectifier current at T_A=25^OC for 500hrs.

3. High Temperature Reverse Bias

4. Forward Operation Life

5. Intermittent Operation Life

6. Pressure Cooker

MIL-STD-750D

METHOD-1038

MIL-STD-750D

METHOD-1027

T_A= 25^OC, I_F= I_O

MIL-STD-750D

METHOD-1036

On state: power on for 5 min.

off state: power off for 5 min.

on and off for 500 cycles.

JESD22-A102

15P_SIGat T_A=121^OC for 4 hrs.

MIL-STD-750D

METHOD-1051

-55^OC to +125^OC dwelled for 30 min.

and transferred for 5min. total 10 cycles.

7. Temperature Cycling

8. Forward Surge

MIL-STD-750D

METHOD-4066-2

8.3ms single half sine-wave , one surge.

at T_A=85^OC, RH=85% for 1000hrs.

at 175^OC for 1000 hrs.

MIL-STD-750D

METHOD-1021

9. Humidity

MIL-STD-750D

METHOD-1031

10. High Temperature Storage Life

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-121523

Issued Date

2009/02/10

Revised Date

2010/05/10

Revision

Page.

Page 7

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