KLFM130-MS [FORMOSA]

Chip Low Leakage Schottky Barrier Rectifier;


型号：	KLFM130-MS
厂家：	FORMOSA MS
描述：	Chip Low Leakage Schottky Barrier Rectifier
文件：	总7页 (文件大小：63K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip Low Leakage Schottky Barrier Rectifier

Formosa MS

KLFM120-MS THRU KLFM140-MS

List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Mechanical data...............................................................................

Maximum ratings .............................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Marking...........................................................................................

Suggested solder pad layout.............................................................

Packing information..........................................................................

Reel packing....................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 1

Chip Low Leakage Schottky Barrier Rectifier

Formosa MS

KLFM120-MS THRU KLFM140-MS

1.0A Surface Mount Low Leakage

Schottky Barrier Rectifiers - 20V - 40V

Package outline

Features

• Low profile surface mounted application in order to

optimize board space.

SOD-123S

• Extra low reverse leakage current

• High surge capability.

0.154(3.9)

0.138(3.5)

0.018(0.45) Typ.

• Guardring for overvoltage protection.

• Very tiny plastic SMD package.

• Ultra high-speed switching.

0.044(1.1)

0.028(0.7)

0.079(2.0)

0.063(1.6)

• Silicon epitaxial planar chip, metal silicon junction.

• Lead-free parts meet environmental standards of

MIL-STD-19500 /228

0.119(3.0)

0.103(2.6)

• Suffix "-H" indicates Halogen free parts, ex. ΚLFM120-MS-H.

0.009(0.22)

0.007(0.18)

0.040(1.00)

0.036(0.90)

Mechanical data

0.032 (0.8) Typ.

0.032(0.8) Typ.

• Epoxy : UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-123S/MINI SMA

• Terminals :Plated terminals, solderable per MIL-STD-750,

Method 2026

Dimensions in inches and (millimeters)

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.0155 gram

Maximum ratings and Electrical Characteristics (AT T_A=25^oC unless otherwise noted)

MAX.

Symbol

I_O

TYP.

UNIT

MIN.

PARAMETER

CONDITIONS

Forward rectified current

See Fig.1

1.0

Forward surge current

8.3ms single half sine-wave (JEDEC methode)

I_FSM

V_R= V_RRM,T_J= 25^OC

I_R

μA

Reverse current

Diode capacitance

f=1MHz and applied 10V DC reverse voltage

C_J

^OC

Storage temperature

T_STG

+175

-65

Operating

temperature

T_J, (^OC)

V_R

(V)

V_F

(V)

V_RMS

SYMBOLS

V_RRM

(V)

*1 Repetitive peak reverse voltage

*2 RMS voltage

(V)

KLFM120-MS

KLFM130-MS

KLFM140-MS

*3 Continuous reverse voltage @I_R=100μA

*4 Maximum forward voltage@I_F=1.0A

0.50

-55 to +150

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 2

Rating and characteristic curves (KLFM120-MS THRU KLFM140-MS)

FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE

FIG.2-TYPICAL FORWARD

CHARACTERISTICS

1.2

1.0

0.8

0.6

3.0

1.0

0.4

0.2

100

120

140

160

180

200

LEAD TEMPERATURE,(°C)

T_J=25 C

Pulse Width 300us

1% Duty Cycle

0.1

.01

FIG.3-MAXIMUM NON-REPETITIVE FORWARD

SURGE CURRENT

8.3ms Single Half

T_J=25 C

Sine Wave

JEDEC method

.9 1.1 1.3 1.5

FORWARD VOLTAGE,(V)

FIG.5 - TYPICAL REVERSE

CHARACTERISTICS

100

NUMBER OF CYCLES AT 60Hz

FIG.4-TYPICAL DIODE CAPACITANCE

150

125

100

1.0

0.1

f=1MHz

0.01

TJ=25°C

0.001

100

PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)

REVERSE VOLTAGE,(V)

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 3

Chip Low Leakage Schottky Barrier Rectifier

Formosa MS

KLFM120-MS THRU KLFM140-MS

Pinning information

Simplified outline

Symbol

Pin1 cathode

Pin2 anode

Marking

Type number

Marking code

KLFM120-MS

KLFM130-MS

KLFM140-MS

K12

K13

K14

Suggested solder pad layout

Dimensions in inches and (millimeters)

PACKAGE

SOD-123S

0.044 (1.10)

0.040 (1.00)

0.079 (2.00)

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 4

Chip Low Leakage Schottky Barrier Rectifier

Formosa MS

KLFM120-MS THRU KLFM140-MS

Packing information

unit:mm

Symbol

SOD-123S

Item

Tolerance

Carrier width

0.1

2.0

min

2.0

min

0.5

0.1

0.3

1.0

2.00

3.85

1.10

1.50

Carrier length

Carrier depth

Sprocket hole

13" Reel outside diameter

13" Reel inner diameter

7" Reel outside diameter

7" Reel inner diameter

Feed hole diameter

Sprocket hole position

Punch hole position

Punch hole pitch

178.00

62.00

13.00

1.75

3.50

4.00

2.00

0.23

8.00

11.40

Sprocket hole pitch

Embossment center

Overall tape thickness

Tape width

Reel width

Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 5

Chip Low Leakage Schottky Barrier Rectifier

Formosa MS

KLFM120-MS THRU KLFM140-MS

Reel packing

COMPONENT

SPACING

INNER

BOX

REEL

DIA,

CARTON

SIZE

APPROX.

GROSS WEIGHT

PACKAGE

SOD-123S

REEL SIZE

CARTON

(pcs)

REEL

(pcs)

BOX

(pcs)

(m/m)

(kg)

(m/m)

4.0

3,000

30,000

183*123*183

178

382*257*387

240,000

9.5

Suggested thermal profiles for soldering processes

1.Storage environment: Temperature=5^oC~40^oC Humidity=55% 25%

2.Reflow soldering of surface-mount devices

Critical Zone

TL to TP

Ramp-up

Tsmax

Tsmin

Preheat

Ramp-down

t25^oC to Peak

Time

3.Reflow soldering

Profile Feature

Soldering Condition

Average ramp-up rate(T^Lto T^P)

<3^oC/sec

Preheat

-Temperature Min(Tsmin)

-Temperature Max(Tsmax)

-Time(min to max)(t^s)

150^oC

200^oC

60~120sec

Tsmax to T^L

-Ramp-upRate

<3^oC/sec

Time maintained above:

-Temperature(T^L)

-Time(t^L)

217^oC

60~260sec

Peak Temperature(T^P)

255^oC-0/+5^oC

Time within 5^oC of actual Peak

Temperature(t^P)

10~30sec

Ramp-down Rate

<6^oC/sec

Time 25^oC to Peak Temperature

<6minutes

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 6

Chip Low Leakage Schottky Barrier Rectifier

Formosa MS

KLFM120-MS THRU KLFM140-MS

High reliability test capabilities

Item Test

Conditions

at 260 5^OC for 10 2sec.

Reference

1. Solder Resistance

MIL-STD-750D

METHOD-2031

at 245 5^OC for 5 sec.

2. Solderability

MIL-STD-202F

METHOD-208

V_R=80% rate at T_J=150^OC for 168 hrs.

Rated average rectifier current at T_A=25^OC for 500hrs.

3. High Temperature Reverse Bias

4. Forward Operation Life

5. Intermittent Operation Life

6. Pressure Cooker

MIL-STD-750D

METHOD-1038

MIL-STD-750D

METHOD-1027

T_A= 25^OC, I_F= I_O

MIL-STD-750D

METHOD-1036

On state: power on for 5 min.

off state: power off for 5 min.

on and off for 500 cycles.

JESD22-A102

15P_SIGat T_A=121^OC for 4 hrs.

MIL-STD-750D

METHOD-1051

-55^OC to +125^OC dwelled for 30 min.

and transferred for 5min. total 10 cycles.

7. Temperature Cycling

8. Forward Surge

MIL-STD-750D

METHOD-4066-2

8.3ms single half sine-wave , one surge.

at T_A=85^OC, RH=85% for 1000hrs.

at 175^OC for 1000 hrs.

MIL-STD-750D

METHOD-1021

9. Humidity

MIL-STD-750D

METHOD-1031

10. High Temperature Storage Life

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-12164P

Issued Date

2013/12/17

Revised Date

Revision

Page.

Page 7

KLFM130-MS [FORMOSA]

相关型号：

KLFM130-MT

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KLFM140-MHT

KLFM140-MS

KLFM140-MT

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KLH00BGA3

KLH00BXX3

KLH00BXX4

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