SFM28-B [FORMOSA]
2.0A Surface Mount Super Fast Rectifiers-50-600V; 2.0A表面贴装超快速整流器- 50-600V
| 型号： | SFM28-B |
| 厂家： | 
FORMOSA MS |
| 描述： | 2.0A Surface Mount Super Fast Rectifiers-50-600V |
| 文件： | 总7页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Silicon Rectifier
Formosa MS
SFM21-B THRU SFM28-B
List
1
2
2
2
2
3
4
4
4
5
6
6
7
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 1
Chip Silicon Rectifier
Formosa MS
SFM21-B THRU SFM28-B
2.0A Surface Mount Super
Package outline
Fast Rectifiers-50-600V
Features
SMB
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
0.213(5.4)
0.197(5.0)
0.016(0.4) Typ.
• Low profile surface mounted application in order to
optimize board space.
• High current capability.
0.142(3.6)
0.126(3.2)
• Superfast recovery tim for switching mode application.
• High surge current capability.
• Glass passivated chip junction.
• Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen free parts, ex. SFM21-B-H.
Mechanical data
0.075(1.9)
0.067(1.7)
0.032(0.8) Typ.
0.032 (0.8) Typ.
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AA / SMB
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.09 gram
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
MAX.
Symbol
TYP.
UNIT
A
MIN.
PARAMETER
CONDITIONS
IO
2.0
Forward rectified current
Ambient temperature = 50OC
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
IFSM
50
Forward surge current
A
VR = VRRM TJ = 25OC
VR = VRRM TJ = 125OC
5.0
IR
µA
Reverse current
100
CJ
pF
OC
Diode junction capacitance
Storage temperature
f=1MHz and applied 4V DC reverse voltage
25
+175
-65
TSTG
Operating
*5
*1
*3
*4
*2
VRMS
(V)
VR
VF
trr
SYMBOLS
VRRM
(V)
temperature
TJ, (OC)
(V)
(V)
(ns)
*1 Repetitive peak reverse voltage
*2 RMS voltage
50
35
50
SFM21-B
SFM22-B
SFM23-B
100
150
200
70
100
150
200
0.95
105
140
210
280
350
*3 Continuous reverse voltage
*4 Maximum forward voltage@IF=2.0A
*5 Reverse recovery time, note 1
-55 to +150
SFM24-B
SFM25-B
SFM26-B
SFM27-B
35
300
400
500
600
300
400
500
600
1.25
1.70
SFM28-B
420
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 2
Rating and characteristic curves (SFM21-B THRU SFM28-B)
FIG.2-TYPICAL FORWARD CURRENT
DERATING CURVE
FIG.1-TYPICAL FORWARD
CHARACTERISTICS
10
1.0
.1
2.4
2.0
1.6
1.2
0.8
0.4
0
0
25
50
75
100
125
150
175
AMBIENT TEMPERATURE (°C)
TJ=25 C
Pulse Width 300us
1% Duty Cycle
.01
.001
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
40
30
20
10
0
1.6 1.8
.4
.6
.8
1.0 1.2 1.4
FORWARD VOLTAGE,(V)
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
8.3ms Single Half
TJ=25 C
Sine Wave
50
W
10W
NONINDUCTIVE
NONINDUCTIVE
JEDEC method
(
)
(+)
D.U.T.
25Vdc
(approx.)
PULSE
GENERATOR
(NOTE 2)
50
1
5
10
100
(
)
(+)
NUMBER OF CYCLES AT 60Hz
1W
NON-
INDUCTIVE
OSCILLISCOPE
(NOTE 1)
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
FIG.5-TYPICAL JUNCTION CAPACITANCE
70
trr
60
50
40
|
|
|
|
|
|
|
|
+0.5A
0
-0.25A
30
20
10
0
-1.0A
1cm
SET TIME BASE FOR
50 / 10ns / cm
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 3
Chip Silicon Rectifier
Formosa MS
SFM21-B THRU SFM28-B
Pinning information
Pin
Simplified outline
Symbol
Pin1 cathode
Pin2 anode
1
2
1
2
Marking
Type number
Marking code
SFM21-B
SFM22-B
SFM23-B
SFM24-B
SFM25-B
SFM26-B
SFM27-B
SFM28-B
S21
S22
S23
S24
S25
S26
S27
S28
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SMB
A
B
C
0.142 (3.60)
0.059 (1.50)
0.118 (3.00)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 4
Chip Silicon Rectifier
Formosa MS
SFM21-B THRU SFM28-B
Packing information
P0
P1
d
E
F
W
B
A
P
D2
D1
T
C
W1
D
unit:mm
Symbol
SMB
Item
Tolerance
Carrier width
A
B
C
d
D
D1
D
D1
D2
E
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.74
2.24
Carrier length
Carrier depth
Sprocket hole
1.50
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
330.00
50.00
178.00
62.00
13.00
1.75
5.50
8.00
4.00
2.00
F
P
P0
P1
T
W
W1
0.23
12.00
18.00
Reel width
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
Page.
7
E
Page 5
Chip Silicon Rectifier
Formosa MS
SFM21-B THRU SFM28-B
Reel packing
COMPONENT
SPACING
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
APPROX.
REEL
(pcs)
BOX
(pcs)
PACKAGE
SMB
REEL SIZE
13"
CARTON
(pcs)
GROSS WEIGHT
(kg)
(m/m)
4,000
8.0
8,000
337*337*37
330
350*330*360
64,000
16.9
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25oC to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
150oC
200oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL)
-Time(tL)
217oC
60~260sec
Peak Temperature(TP)
255oC-0/+5oC
Time within 5oC of actual Peak
Temperature(tP)
10~30sec
Ramp-down Rate
<6oC/sec
Time 25oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 6
Chip Silicon Rectifier
Formosa MS
SFM21-B THRU SFM28-B
High reliability test capabilities
Item Test
1. Solder Resistance
Conditions
Reference
MIL-STD-750D
METHOD-2031
at 260±5OC for 10±2sec.
immerse body into solder 1/16"±1/32"
at 245±5OC for 5 sec.
2. Solderability
MIL-STD-202F
METHOD-208
VR=80% rate at TJ=150OC for 168 hrs.
Rated average rectifier current at TA=25OC for 500hrs.
3. High Temperature Reverse Bias
4. Forward Operation Life
5. Intermittent Operation Life
6. Pressure Cooker
MIL-STD-750D
METHOD-1038
MIL-STD-750D
METHOD-1027
TA = 25OC, IF = IO
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
15PSIG at TA=121OC for 4 hrs.
-55OC to +125OC dwelled for 30 min.
7. Temperature Cycling
8. Thermal Shock
MIL-STD-750D
METHOD-1051
and transferred for 5min. total 10 cycles.
0OC for 5 min. rise to 100OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
8.3ms single half sine-wave superimposed
on rated load, one surge.
9. Forward Surge
MIL-STD-750D
METHOD-4066-2
at TA=85OC, RH=85% for 1000hrs.
at 175OC for 1000 hrs.
10. Humidity
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
MIL-STD-750D
METHOD-1031
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121430
Issued Date
2008/02/10
Revised Date
2011/07/22
Revision
E
Page.
7
Page 7
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