SFM56 [FORMOSA]
Chip Super Fast Rectifiers;
| 型号： | SFM56 |
| 厂家： | 
FORMOSA MS |
| 描述： | Chip Super Fast Rectifiers |
| 文件： | 总7页 (文件大小：59K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Super Fast Rectifiers
Formosa MS
SFM51 THRU SFM58
List
1
2
2
2
2
3
4
4
4
5
6
6
7
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 1
Chip Super Fast Rectifiers
Formosa MS
SFM51 THRU SFM58
5.0A Surface Mount Super
Fast Rectifiers-50-600V
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SMC
0.272(6.9)
0.248(6.3)
• Low profile surface mounted application in order to
optimize board space.
0.012(0.3) Typ.
• High current capability.
• Superfast recovery time for switching mode application.
• High surge current capability.
• Glass passivated chip junction.
0.189(4.8)
0.165(4.2)
• Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen free parts, ex. SFM51-H.
Mechanical data
0.098(2.5)
0.075(1.9)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AB / SMC
0.048(1.2) Typ.
0.048 (1.2) Typ.
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
Dimensions in inches and (millimeters)
• Weight : Approximated 0.19 gram
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
MAX.
Symbol
IO
TYP.
UNIT
A
MIN.
PARAMETER
CONDITIONS
5.0
Forward rectified current
See Fig.2
IFSM
125
Forward surge current
Reverse current
A
8.3ms single half sine-wave (JEDEC methode)
VR = VRRM TJ = 25OC
5.0
IR
μA
VR = VRRM TJ = 125OC
100
80
CJ
pF
OC
Diode junction capacitance
Storage temperature
f=1MHz and applied 4V DC reverse voltage
+175
-65
TSTG
Operating
temperature
TJ, (OC)
*5
*1
*3
VR
(V)
*4
VF
(V)
*2
VRMS
(V)
trr
(ns)
SYMBOLS
VRRM
(V)
*1 Repetitive peak reverse voltage
*2 RMS voltage
50
35
50
SFM51
SFM52
SFM53
100
150
200
70
100
150
200
0.95
105
140
210
280
350
*3 Continuous reverse voltage
*4 Maximum forward voltage@IF=5.0A
*5 Maximum Reverse recovery time, note 1
-55 to +150
SFM54
SFM55
SFM56
SFM57
35
300
400
500
600
300
400
500
600
1.25
1.70
SFM58
420
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 2
Rating and characteristic curves (SFM51 THRU SFM58)
FIG.2-TYPICAL FORWARD CURRENT
FIG.1-TYPICAL FORWARD
DERATING CURVE
CHARACTERISTICS
100
6.0
5.0
4.0
3.0
10
2.0
P.C.B. Mounted on
0.32" x 0.32" (8 mm x 8 mm)
Copper Pad Areas
1.0
0
1.0
0
25
50
75
100
125
150
175
LEAD TEMPERATURE (°C)
0.1
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
Tj=25°C
PULSE WIDTH-300 us
2% DUTY CYCLE
0.01
150
125
8.3ms Single Half
T=J 25 C
0.4
0.6
0.8
1.0
1.2
FORWARD VOLTAGE,(V)
1.4 1.6
1.8
Sine Wave
JEDEC method
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
100
75
50
NONINDUCTIVE
W
10W
NONINDUCTIVE
50
25
0
(
)
(+)
D.U.T.
25Vdc
(approx.)
PULSE
GENERATOR
(NOTE 2)
(
)
1
2
5
10
20
50
100
(+)
1W
NON-
INDUCTIVE
OSCILLISCOPE
(NOTE 1)
NUMBER OF CYCLES AT 60Hz
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
FIG.5-TYPICAL JUNCTION CAPACITANCE
140
trr
|
|
|
|
|
|
|
|
+0.5A
120
100
80
0
-0.25A
60
40
20
0
-1.0A
1cm
SET TIME BASE FOR
50 / 10ns / cm
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 3
Chip Super Fast Rectifiers
Formosa MS
SFM51 THRU SFM58
Pinning information
Pin
Simplified outline
Symbol
Pin1 cathode
Pin2 anode
1
2
1
2
Marking
Type number
Marking code
SFM51
SFM52
SFM53
SFM54
SFM55
SFM56
SFM57
SFM58
S51
S52
S53
S54
S55
S56
S57
S58
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SMC
A
B
C
0.189 (4.80)
0.063 (1.60)
0.158 (4.00)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 4
Chip Super Fast Rectifiers
Formosa MS
SFM51 THRU SFM58
Packing information
P0
P1
d
E
F
W
B
A
P
D2
D1
T
C
W1
D
unit:mm
Symbol
SMC
Item
Tolerance
Carrier width
A
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
5.10
7.20
Carrier length
B
Carrier depth
C
2.50
Sprocket hole
d
1.50
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
D
330.00
50.00
178.00
62.00
13.00
1.75
D1
D
D1
D2
E
F
5.50
P
8.00
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
P0
P1
T
4.00
2.00
0.23
W
W1
12.00
18.00
Reel width
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 5
Chip Super Fast Rectifiers
Formosa MS
SFM51 THRU SFM58
Reel packing
COMPONENT
SPACING
INNER
BOX
REEL
DIA,
CARTON
SIZE
APPROX.
GROSS WEIGHT
REEL
(pcs)
BOX
(pcs)
PACKAGE
SMC
REEL SIZE
13"
CARTON
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
(m/m)
3,000
8.0
6,000
337*337*37
330
350*330*360
48,000
17.2
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55% 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25oC to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
150oC
200oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL)
-Time(tL)
217oC
60~260sec
Peak Temperature(TP)
255oC-0/+5oC
Time within 5oC of actual Peak
Temperature(tP)
10~30sec
Ramp-down Rate
<6oC/sec
Time 25oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 6
Chip Super Fast Rectifiers
Formosa MS
SFM51 THRU SFM58
High reliability test capabilities
Item Test
Conditions
at 260 5OC for 10 2sec.
immerse body into solder 1/16" 1/32"
Reference
1. Solder Resistance
MIL-STD-750D
METHOD-2031
at 245 5OC for 5 sec.
2. Solderability
MIL-STD-202F
METHOD-208
VR=80% rate at TJ=150OC for 168 hrs.
Rated average rectifier current at TA=25OC for 500hrs.
3. High Temperature Reverse Bias
4. Forward Operation Life
5. Intermittent Operation Life
6. Pressure Cooker
MIL-STD-750D
METHOD-1038
MIL-STD-750D
METHOD-1027
TA = 25OC, IF = IO
MIL-STD-750D
METHOD-1036
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
JESD22-A102
15PSIG at TA=121OC for 4 hrs.
MIL-STD-750D
METHOD-1051
-55OC to +125OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
7. Temperature Cycling
8. Forward Surge
MIL-STD-750D
METHOD-4066-2
8.3ms single half sine-wave , one surge.
at TA=85OC, RH=85% for 1000hrs.
at 175OC for 1000 hrs.
MIL-STD-750D
METHOD-1021
9. Humidity
MIL-STD-750D
METHOD-1031
10. High Temperature Storage Life
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
DS-121456
Issued Date
2012/11/06
Revised Date
-
Revision
A
Page.
7
Page 7
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